Claims
- 1. A method of using an aluminophosphate compound to decrease surface roughness, said method comprising:
providing a precursor to an aluminophosphate compound, said precursor comprising aluminum ions and phosphate esters in a fluid medium; applying said precursor medium to a substrate, said substrate having a first surface roughness value; and treating said applied medium for a time and at a temperature sufficient to provide a substantially amorphous aluminophosphate compound on said substrate, wherein the surface of said substrate is planarized and has a second roughness value decreased compared to said first surface roughness value.
- 2. The method of claim 1 wherein said surface roughness value is decreased at least by about 3-fold.
- 3. The method of claim 1 wherein said medium is applied by a process selected from dip-coating, spraying, flow-coating and spin-coating.
- 4. The method of claim 1 wherein said treated substrate has a friction coefficient less than about 0.2.
- 5. The method of claim 4 wherein said substrate is selected from a bearing and a gear.
- 6. The method of claim 1 wherein a biaxially-textured component is deposited on said aluminophosphate compound.
- 7. The method of claim 6 wherein said component is selected from magnesium oxide, yttria, and a yttria stabilized zirconia.
- 8. The method of claim 7 wherein an electromagnetic component is deposited on said textured component.
- 9. The method of claim 8 wherein said electromagnetic component is a superconducting YBCO layer.
- 10. The method of claim 1 wherein said treated substrate is exposed to an environment inducing condition selected from oxidation and corrosion.
- 11. The method of claim 1 wherein said substrate is selected from a steel, a nickel-based alloy, a superalloy, titanium, a titanium-based alloy, niobium, a niobium-based alloy, molybdenum and a molybdenum-based alloy.
- 12. The method of claim 1 wherein said substrate is selected from silicon, aluminum oxide, enamel, mullite, a glass, fused silica, a silica-based refractory and a ceramic.
- 13. A composite comprising a substrate, a substantially amorphous aluminophosphate compound and an organic component attached to said aluminophosphate compound.
- 14. A composite of claim 13 wherein said organic component comprises a biomolecule.
- 15. The composite of claim 14 wherein said biomolecule is selected from a polypeptide, a polynucleotide and a protein.
- 16. The composite of claim 13 wherein said substrate is a soda-lime glass.
- 17. The composite of claim 13 wherein said substrate is silicon.
- 18. The composite of claim 13 wherein said substrate is a metal implant component.
- 19. The composite of claim 13 wherein said substrate is a ceramic implant component.
- 20. The composite of claim 13 wherein said aluminophosphate compound is attached to a DNA component.
- 21. The composite of claim 13 wherein said organic component is attached to said aluminophosphate compound with a molecular linker component.
- 22. The composite of claim 21 wherein said linker component is polylysine.
- 23. The composite of claim 13 wherein said aluminophosphate compound comprises a functional group capable of bonding to at least one of said organic component and a linker component.
- 24. A substantially amorphous composition comprising an aluminophosphate compound and an antimicrobial component.
- 25. The composition of claim 24 wherein the ratio of said antimicrobial component to said aluminophosphate component ranges from about 0.1:1 to about 1:1.
- 26. The composition of claim 24 wherein said antimicrobial component is selected from silver, copper, zinc and iron ions.
- 27. The composition of claim 24 wherein said composition is a component of a composite.
- 28. The composition of claim 27 wherein said composite further comprises a substrate selected from a glass, a metal, an alloy, and a ceramic.
- 29. The composition of claim 24 comprising an organic component.
- 30. The composition of claim 29 wherein said organic component is selected from a fatty acid and a silane compound.
Parent Case Info
[0001] This application claims priority benefit from provisional application serial Nos. 60/436,063 and 60/436,066, each filed on Dec. 23, 2002 and incorporated herein by reference in its entirety; U.S. application Ser. No. 10/627,194 filed Jul. 23, 2003 from prior provisional application serial No. 60/398,265 filed Jul. 24, 2002; U.S. application Ser. No. 10/642,069 filed Aug. 14, 2003 from prior provisional application serial No. 60/403,470 filed Aug. 14, 2002; U.S. application Ser. No. 10/362,869 filed Feb. 21, 2003 from prior PCT application no. PCT/US01/41790 filed Aug. 20, 2001; and U.S. application Ser. No. 10/266,832 filed Oct. 8, 2002 as a continuation of application Ser. No. 09/644,495 filed Aug. 23, 2000 and issued as U.S. Pat. No. 6,461,415 on Oct. 8, 2002—each of which is incorporated herein by reference in its entirety.
[0002] The United States government has certain rights to this invention pursuant to Grant Nos. F49620-00-C-0022 and F49620-01-C-0014 from AFOSR (Air Force Office of Scientific Research) and DE-FG02-01ER83149, from the Department of Energy each to Applied Thin Films, Inc.
Provisional Applications (2)
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Number |
Date |
Country |
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60436063 |
Dec 2002 |
US |
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60436066 |
Dec 2002 |
US |