Claims
- 1. A curable precursor composition comprising:a) from about 30 to about 60 weight percent of an oligomeric aminoplast resin having on average at least one pendant α,β-unsaturated carbonyl group per oligomeric unit; b) from about 70 to about 40 weight percent of a thermoplastic polyamide miscible in said aminoplast resin, the weight percents being based on the total resin content; and c) a sufficient amount of a catalyst for the curable oligomeric aminoplast resin having on average at least one pendant α,β-unsaturated carbonyl group per oligomeric unit, said catalyst being stable at temperature of mixing of the components.
- 2. The composition of claim 1, wherein the thermoplastic polyamide has a melting point in the range of from about 95° C. to about 150° C. as measured by DSC.
- 3. The composition of claim 1, wherein the thermoplastic polyamide has a melt flow rate of from 10 to 90 g/10 min at 160° C.
- 4. The composition of claim 1, wherein the catalyst is a photocatalyst.
- 5. The composition of claim 1, wherein the composition is a molten mixture or a melt-processable solid.
- 6. The composition of claim 1, wherein the oligomeric aminoplast resin having on average at least one pendant α,β-unsaturated carbonyl group per oligomeric unit is an acrylamidomethyl-novolak resin.
- 7. The composition of claim 1 further comprising acrylamidomethyl-phenol.
CROSS REFERENCE TO RELATED APPLICATION
This application is a divisional of U.S. application Ser. No. 09/218,387, filed Dec. 22, 1998, now U.S. Pat. No. 6,239,049.
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