Claims
- 1. A polymerizable composition, curable through gaps of twenty mils or more, comprising a polymerizable acrylate ester monomer selected from the group consisting of monofunctional acrylate esters and polyacrylate esters having the formula ##EQU11## wherein R.sup.2 is a radical selected from the group consisting of hydrogen, halogen and alkyl of from 1 to about 4 carbon atoms; q is an integer equal to at least 1; and X is an organic radical containing at least two carbon atoms and having a total bonding capacity of q plus 1; at least 0.1% of a hydroperoxide polymerization initiator capable of polymerizing said monomer in the substantial absence of oxygen, a cure-through-gap agent consisting of a combination of;
- a. a substituted thiourea of the formula ##EQU12## wherein A is hydrogen or ##EQU13## and b. about 0.1% to about 5% by weight of the composition of an acid having a pKA of less than about 6 and soluble in the mixture of acrylate ester monomer and hydroperoxide initiator.
- 2. The composition of claim 1 wherein the acrylate ester monomer has a molecular weight of at least about 130 and the polymerization initiator is a hydroperoxide containing up to about 18 carbon atoms.
- 3. A two-part polymerizable composition, curable through gaps of twenty mils or more, consisting essentially of:
- A. a first part comprising a mixture of a polymerizable acrylate ester monomer selected from the group consisting of monofunctional acrylate esters and polyacrylate esters having the formula ##EQU14## wherein R.sup.2 is a radical selected from the group consisting of hydrogen, halogen and alkyl of from 1 to about 4 carbon atoms; q is an integer equal to at least 1; and X is an organic radical containing at least two carbon atoms and having a total bonding capacity of q plus 1; and a hydroperoxy polymerization initiator capable of polymerizing said monomer in the substantial absence of oxygen;
- B. as a cure-through-gap agent a second part comprising the combination of a substituted thiourea of the formula ##EQU15## wherein A is hydrogen or ##EQU16## and C. about 0.1% to about 5% by weight of the composition of an acid having a pKA of less than about 6 in admixture with either (A) or (B).
- 4. The composition of claim 3 wherein the substituted thiourea has one of the following formulae:
- a. ##EQU17## wherein each of R.sup.6, R.sup.7 and R.sup.8 is a hydrocarbon group containing up to about 10 carbon atoms, and R.sup.5 is hydrogen or R.sup.8 ;
- b. ##EQU18## where each B is a difunctional chain completing a heterocyclic ring containing up to about 14 carbon atoms; and
- c. ##EQU19## wherein R.sup.5, R.sup.8 and B are as defined above.
- 5. The composition of claim 4 wherein the hydroperoxide polymerization initiator comprises from about 0.1% to about 10% by weight of the polymerizable composition.
- 6. The composition of claim 5 wherein q is equal to from 1 to about 4.
- 7. A two-part polymerizable composition, curable through gaps of 20 mils or more, consisting essentially of:
- A. a first part comprising a polymerizable acrylate ester monomer having a molecular weight of at least about 130 and selected from the group consisting of monofunctional acrylate esters and polyacrylate esters having the formula ##EQU20## wherein R.sup.2 is a radical selected from the group consisting of hydrogen, halogen and alkyl of from 1 to about 4 carbon atoms; q is an integer equal to at least 1; and X is an organic radical containing at least two carbon atoms and having a total bonding capacity of q plus 1; from about 0.1% to about 10% by weight of a hydroperoxide polymerization initiator capable of polymerizing said monomer in the substantial absence of oxygen; and
- B. as a cure-through-gap agent a second part comprising the combination of a solvent solution of a substituted thiourea having one of the formulae;
- a. ##EQU21## wherein each of R.sup.6, R.sup.7 and R.sup.8 is a hydrocarbon group containing up to about 10 carbon atoms, and R.sup.5 is hydrogen or R.sup.8 ;
- b. ##EQU22## where each B is a difunctional chain completing a heterocyclic ring containing up to about 14 carbon atoms; and
- c. ##EQU23## wherein R.sup.5, R.sup.8 and B are as defined above, and about 0.1% to about 5% by weight of the composition of an acid having a pKA of less than about 6.
- 8. The composition of claim 7 wherein the substituted thiourea is tetramethyl thiourea.
- 9. A process for sealing or bonding substrates which comprises:
- A. applying to at least one of said substrates a primer composition, capable of curing the composition of part (B) through gaps of twenty mils or more, comprising a mixture of a substituted thiourea of the formula ##EQU24## wherein A is hydrogen or ##EQU25## and about 0.1% to about 5% of an organic acid having a pKA less than about 6;
- B. applying to at least one of said substrates a polymerizable composition comprising a polymerizable acrylate ester monomer selected from the group consisting of monofunctional acrylate esters and polyacrylate esters having the formula ##EQU26## wherein R.sup.2 is a radical selected from the group consisting of hydrogen, halogen and alkyl of from 1 to about 4 carbon atoms; q is an integer equal to at least 1; and X is an organic radical containing at least two carbon atoms and having a total bonding capacity of q plus 1; and from about 0.1% to about 10% by weight of a hydroperoxide polymerization initiator capable of polymerizing said monomer in the substantial absence of oxygen;
- C. and thereafter placing said substrates in an abutting relationship until the polymerizable composition has hardened sufficiently to seal or bond said substrates.
- 10. The process of claim 9 wherein the substituted thiourea has one of the formulae:
- a. ##EQU27## wherein each of R.sup.6, R.sup.7 and R.sup.8 is a hydrocarbon group containing up to about 10 carbon atoms, and R.sup.5 is hydrogen or R.sup.8 ;
- b. ##EQU28## where each B is a difunctional chain completing a heterocyclic ring containing up to about 14 carbon atoms; and
- c. ##EQU29## wherein R.sup.5, R.sup.8 and B are as defined above.
- 11. A process for sealing or bonding substrates which comprises:
- A. applying to at least one of said substrates a primer composition, capable of curing the composition of part (B) through gaps of 20 mils or more, comprising a mixture of a substituted thiourea of the formula ##EQU30## wherein A is hydrogen or ##EQU31## B. applying to at least one of said substrates a polymerization composition comprising a polymerizable acrylate ester monomer selected from the group consisting of monofunctional acrylate esters and polyacrylate esters having the formula ##EQU32## wherein R.sup.2 is a radical selected from the group consisting of hydrogen, halogen and alkyl of from 1 to about 4 carbon atoms; q is an integer equal to at least 1; and X is an organic radical containing at least two carbon atoms and having a total bonding capacity of q plus 1; from about 0.1% to about 10% by weight of a hydroperoxide polymerization initiator capable of polymerizing said monomer in the substantial absence of oxygen; and about 0.1% to about 5% of an organic acid having a pKA less than about 6;
- C. and thereafter placing said substrates in an abutting relationship until the polymerizable composition has hardened sufficiently to seal or bond said substrates.
CROSS REFERENCE TO RELATED APPLICATION
This application is a continuation-in-part of copending application Ser. No. 323,689, filed Jan. 15, 1973, now abandoned.
US Referenced Citations (5)
Continuation in Parts (1)
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Number |
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323689 |
Jan 1973 |
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