This application claims priority to Chinese Patent Application No. 202210305981.5 filed Mar. 25, 2022, the disclosure of which is incorporated herein by reference in its entirety.
Embodiments of the present application relate to the field of signal processing technology, for example, a resonator, a filter, and a multiplexer.
Filters are widely used in integrated circuits. A filter in a traditional integrated circuit has the following drawback: The space in the integrated circuit for placing the filter is limited, making it difficult to improve the performance of the filter. A resonator is a basic unit in the design of a filter. That is, a filter may include multiple resonators. In general, a resonator is a two-port device. Exemplarily,
When a filter includes multiple resonators, the resonators may be connected to each other in series or in parallel.
The present application provides a resonator, a filter, and a multiplexer to improve the filtering effect of the resonator and save the occupation space of the resonator.
Embodiments of the present application provide a resonator. The resonator includes an LC resonant unit and an embedded resonant unit.
The LC resonant unit includes a resonant element. The resonant element includes a first portion, a second portion, and an interface between the first portion and the second portion. The first portion is connected to the second portion through the interface. The embedded resonant unit is embedded in the LC resonant unit through the interface.
Optionally, the resonant element is an inductive element. The interface is disposed in a middle of the inductive element. The inductive element is divided into the first portion and the second portion through the interface.
Optionally, the resonant element includes at least a first capacitive element and a second capacitive element. The first capacitive element and the second capacitive element are connected in series and form the interface at a serial connection point. The first capacitive element serves as the first portion. The second capacitive element serves as the second portion.
Optionally, the interface includes a first interface and a second interface. The embedded resonant unit is connected in series between the first interface and the second interface.
Optionally, a first end of the embedded resonant unit is connected to the interface. A second end of the embedded resonant unit is connected to a reference potential end.
Optionally, the resonant element in the LC resonant unit is same as or different from a resonant element in the embedded resonant unit.
Optionally, the embedded resonant unit at least includes an inductive element and/or a capacitive element, or the embedded resonant unit includes at least one of a surface acoustic wave (SAW) resonator and a film bulk acoustic resonator (FBAR).
Embodiments of the present application further provide a filter including the resonator described in embodiments of the present application.
Embodiments of the present application further provide a multiplexer including the filter described in embodiments of the present application.
The present application is described below in conjunction with drawings and embodiments. It is to be understood that specific embodiments described herein are intended to illustrate the present application and not to limit the present application. Additionally, it is to be noted that only part, not all, of structures related to the present application are illustrated in the drawings.
It is to be noted that
According to the technical solutions in the embodiments, the interface is disposed on the resonant element in the LC resonant unit so that the embedded resonant unit is connected to the LC resonant unit through the interface. In this case, the LC resonant unit and the embedded resonant unit can filter the input signals simultaneously, guaranteeing the filtering performance of the resonator. Moreover, an element in the embedded resonant unit and an element in the LC resonant unit form a new resonant unit so that the input signals are filtered through the new resonant unit. Therefore, the filtering effect of the resonator is improved, a number of signal transmission zeros of the resonator is increased, and further the filtering performance of the resonator is improved.
Exemplarily,
The resonant element 111 may be an inductive element. The interface D is disposed in the middle of the inductive element so that the inductive element can be divided into the first portion 111A and the second portion 111B through the interface D. Then the embedded resonant unit 120 is connected in the interface D so that the embedded resonant unit 120 is embedded in the LC resonant unit 110 through the interface D on the inductive element. Moreover, an element in the embedded resonant unit 120 and an element in the LC resonant unit 110 form a new resonant unit so that input signals are filtered through the new resonant unit. Therefore, the filtering effect of the resonator is improved, a number of signal transmission zeros of the resonator is increased, and further the filtering performance of the resonator is improved. Moreover, the first portion 111A of the inductive element is connected to the second portion 111B of the inductive element through the interface D so that the entire inductive value of the inductive element is unchanged, guaranteeing the performance of the resonator and facilitating the design of the resonator.
Exemplarily, the inductive element may be an inductor. The inductor and the capacitive element are in the LC resonant unit 110 and are connected in parallel. Then one inductor may be designed in the design of the LC resonant unit 110. Moreover, the interface D is formed in the middle of the inductor for embedding the embedded resonant unit 120, thereby reducing the entire occupation space of the inductor and the embedded resonant unit 120 and thus saving the occupation space of the resonator. Exemplarily, in the forming of the inductor, when the inductor is a three-dimensional inductor structure, the inductor includes at least two conductive layers. Multiple conductive layers are electrically connected to each other to form the inductor. In this case, the interface D may be disposed at a junction between the different conductive layers. When the inductor is a two-dimensional inductor structure, the inductor may include multiple coils. The interface D may be disposed at a junction between different coils.
When the interface D is disposed in the middle of the inductive element, the embedded resonant unit 120 may be connected to the LC resonant unit 110 in series or in parallel.
With continued reference to
The embedded resonant unit 120 may be connected to the LC resonant unit 110 in series. In this case, the first interface D1 is connected to a first end of the embedded resonant unit 120. The second interface D2 is connected to a second end of the embedded resonant unit 120. The first portion 111A is connected to the second portion 111B through the embedded resonant unit 120. The entire inductive value of the first portion 111A and the second portion 111B is a sum of the inductive value of the first portion 111A and the inductive value of the second portion 111B. That is, the entire inductive value of the first portion 111A and the second portion 111B is unchanged. Moreover, through an embedded connection to the embedded resonant unit 120, an element in the embedded resonant unit 120 and an element in the LC resonant unit 110 form a new resonant unit so that the input signals are filtered through the new resonant unit. Therefore, the filtering effect of the resonator is improved, a number of signal transmission zeros of the resonator is increased, and further the filtering performance of the resonator is improved.
Exemplarily,
The embedded resonant unit 120 may also be accessed to the resonator in a parallel connection manner. That is, the first end of the embedded resonant unit 120 is connected to the interface D, and the second end of the embedded resonant unit 120 is connected to the reference potential end V1. In this case, the first portion 111A is connected to the second portion 111B through the interface D. The entire inductive value of the first portion 111A and the second portion 111B is still unchanged. Moreover, through an embedded connection to the embedded resonant unit 120, an element in the embedded resonant unit 120 and an element in the LC resonant unit 110 form a new resonant unit so that the input signals are filtered through the new resonant unit. Therefore, the filtering effect of the resonator is improved, a number of signal transmission zeros of the resonator is increased, and further the filtering performance of the resonator is improved. Exemplarily, the reference potential end V1 may be a reference ground or an input of another reference potential.
It is to be noted that the embedded resonant unit 120 may also be connected to another circuit or element through the reference potential end V1 to improve the filtering performance of the resonator. Exemplarily, the second end of the embedded resonant unit 120 may be connected to another resonator to form a filter to improve the filtering performance of the filter.
As shown in
When the first capacitive element C11 and the second capacitive element C12 are connected in series and the interface D is formed at the series connection point, the embedded resonant unit 120 may also be connected to the LC resonant unit 110 in series or in parallel. When the embedded resonant unit 120 and the LC resonant unit 110 are connected in series, the interface D may include the first interface and the second interface, the embedded resonant unit 120 is connected in series between the first interface and the second interface, and the first capacitive element C11 is connected to the second capacitive element C12 through the embedded resonant unit 120. When the embedded resonant unit 120 and the LC resonant unit 110 are connected in parallel, the first end of the embedded resonant unit 120 is connected to the interface D, and the second end of the embedded resonant unit 120 is connected to the reference potential end.
On the basis of the preceding multiple technical solutions, the resonant element in the LC resonant unit 110 is the same as or different from a resonant element in the embedded resonant unit 120.
The resonant element in the LC resonant unit 110 may be set to be the same as or different from the resonant element in the embedded resonant unit 120 according to the performance requirements of the resonator. When the resonant element in the LC resonant unit 110 is the same as the resonant element in the embedded resonant unit 120, the resonant element in the embedded resonant unit 120 includes only inductive elements and capacitive elements, and the number and connection relationship of inductive elements and capacitive elements are the same as the number and connection relationship of inductive elements and capacitive elements in the LC resonant unit 110. That is, the LC resonant unit 110 is entirely the same as the embedded resonant unit 120. When the resonant element in the LC resonant unit 110 is different from the resonant element in the embedded resonant unit 120, the embedded resonant unit 120 may include an element other than inductive elements and capacitive elements. Alternatively, the number and/or connection relationship of inductive elements and capacitive elements are different from the number and/or connection relationship of inductive elements and capacitive elements in the LC resonant unit 110.
On the basis of the preceding multiple technical solutions, the embedded resonant unit 120 at least includes an inductive element and/or a capacitive element. Alternatively, the embedded resonant unit 120 includes at least one of a surface acoustic wave resonator and a film bulk acoustic resonator.
The embedded resonant unit 120 may include resonant elements of multiple types as long as the performance requirements of the resonator are met. Exemplarily, the embedded resonant unit 120 may include just an inductive element or a capacitive element. In this case, the inductive element or capacitive element may serve as a special resonant element to be embedded in the LC resonant unit 110. Alternatively, the embedded resonant unit 120 may include both an inductive element and a capacitive element. In this case, the embedded resonant unit 120 is an LC resonator. In other embodiments, the embedded resonant unit 120 may further include at least one of a surface acoustic wave (SAW) resonator or a film bulk acoustic resonator (FBAR).
Embodiments of the present application further provide a filter. The filter includes the resonator provided in any embodiment of the present application.
The filter includes at least the resonator provided in any embodiment of the present application and thus has the effect of the resonator, which is not repeated here. Additionally, the filter may also include other filter circuits for improving the filtering function of the filter. Exemplarily, other filter circuits may be low pass filter circuits, high pass filter circuits, or band pass filter circuits, which is not limited in embodiments of the present application.
Embodiments of the present application also provide a multiplexer.
With continued reference to
It is to be noted that the multiplexer may also include other filter circuits connected in series between the first end IN and any second end. Other filter circuits may be low pass filter circuits, high pass filter circuits, or band pass filter circuits, which is not limited in embodiments of the present application.
| Number | Date | Country | Kind |
|---|---|---|---|
| 202210305981.5 | Mar 2022 | CN | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/CN2022/136904 | 12/6/2022 | WO |