The fire and sparkle of diamond is a result of the high index of refraction, the high dispersion and the angle of the cut on the back surface. The ideal ratios of diameter and depth have been established and result in back surfaces that have an angle between them of approximately forty two degrees. For some types of stones, a round brilliant cut provides angles that tend to reflect light back out the top of the stone. Diamonds that lack depth generally have cuts that result in back surfaces that fail to achieve desired reflection, and hence lack some of the fire and sparkle that thicker cut stones achieve.
In the following description, reference is made to the accompanying drawings that form a part hereof, and in which is shown by way of illustration specific embodiments which may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention, and it is to be understood that other embodiments may be utilized and that structural, logical and electrical changes may be made without departing from the scope of the present invention. The following description of example embodiments is, therefore, not to be taken in a limited sense, and the scope of the present invention is defined by the appended claims.
The fire and sparkle of a gemstone, such as a diamond is a result of the high index of refraction, the high dispersion and the angle of the cut on the back surface. The ideal ratios of diameter and depth have been established and result in back surfaces of approximately ninety eight degrees. An ideal round brilliant diamond cut is illustrated in PRIOR ART
In various embodiments, one or more angles are determined for a back side groove on one or more backside facets of a cut diamond to obtain an increase in brilliance of the cut diamond. The backside grooves are formed to create sub facets on one or more backside facets of the cut diamond in accordance with the determined one or more angles. In one embodiment, as shown in
Given a diamond crystal of 1 cm square, such a crystal will weigh 1.7 carats per millimeter of thickness. For an ideal cut diamond brilliant, the crystal would need to 7 mm thick and would yield a 3 ct stone. If however, the stone were 3 mm thick and cut with inverted back facets—the groove described above, it would be over 3 ct in weight and as beautiful as the round brilliant. The advantages become quite compelling when considering stones of one inch square wherein the weight is 10 carats per mm of thickness. Therein, a stone of 3 mm thickness would weigh 30 ct and yield a cut stone of 25 carats. The value of a cut stone depends, in part, on it's weight and brilliance with heavier and more brilliant stones having higher value.
In one embodiment, a plate of single crystal chemical vapor deposition (CVD) grown diamond may be used to provide raw diamond for cutting into various shapes. As indicated above, a round brilliant cut diamond may be obtained, but the overall size of such a cut diamond will be limited by the thickness of the plate. In one embodiment, a laser may be used to cut the plate into a desired shape, such as a rectangle or circle or other desired shape.
The resulting cut diamond may be further cut by laser to obtain one of the classic cuts, such as a rose cut, emerald cut or other known cut. New cuts of diamond may also be used.
In one embodiment, the grooves may be cut by the use of a polishing or grinding wheel, which may have a “V” shape to it. The angle of the V shape of the groove and orientation of the groove on the surface of each backside facet may be varied to obtain sub facets that result in the sub facets having an angle with respect to a top surface of the cut diamond of approximately 41°. Other angles may be used as desired. In some embodiments, multiple different grinding wheels with different angles may be used to cut grooves in facets as a function of the angle of the facet being cut with respect to the top surface of the diamond. Multiple grooves may be cut simultaneously by using a grinding or polishing wheel with multiple V-shaped protrusions. The grinding or polishing wheel surface geometry may be tailored to create the desired number, depth, spacing, and angle of the groove(s). In further embodiments, grooves may be cut in back side facets to obtain desired angles with respect to other surfaces of the diamond, such as surfaces adjacent to the top surface (sometimes referred to as the table) of the diamond. As used herein the top surface of the diamond is a primary surface that is viewable when the diamond is mounted in a setting or other device. The top surface may also be faceted in some embodiments, or generally flat. Backside surfaces or facets are basically opposite the top surface.
In one embodiment, the grooves are cut approximately 100 um deep. The apex of the groove, where sides of the grooves meet, need not be a sharp angle. It may be somewhat rounded in some embodiments, which may actually result in maintaining the integrity and durability of the diamond. Multiple such grooves may be cut in selected backside facets. In various embodiments, the grooves are spaced as closely as possible to ensure more light is reflected back out the top surface of the diamond. The density of the grooves may be limited to ensure that the resulting diamond is not too brittle. Thus, mechanical considerations may limit the type and density of the grooves in some embodiments.
The use of such grooves on selected back side facets allows very flat stones to be made that may approach, reach, or exceed the brilliance of classical brilliant cut stones. While the cuts are described as being made to diamonds formed using CVD processes, which may be single crystalline in structure, the grooves may also be used in natural stones. One benefit of using thin diamond slabs while obtaining desired brilliance is that the weight of the resulting stone may be less than that of a similar looking stone having a regular brilliant cut. The extra weight added by the additional depth of the stone to obtain a brilliant cut may not be desired for some jewelry, such as earings.
A grinding wheel has been described for making the cuts. Other methods may be used in further embodiments, such as selective etching, laser or yet other devices.
In one embodiment, one or more grooves 410 may be formed to create a retro reflector out of a diamond 400 as shown in cross section in
The Abstract is provided to comply with 37 C.F.R. §1.72(b) to allow the reader to quickly ascertain the nature and gist of the technical disclosure. The Abstract is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.
This application claims priority to U.S. Provisional Application Ser. No. 61/051,884, filed May 9, 2008, the entire disclosure of which is incorporated by reference herein.
Number | Date | Country | |
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61051884 | May 2008 | US |