This is a continuation of U.S. Ser. No. 09/568,584 filed May 11, 2000, now U.S. Pat. No. 6,478,936 and claims priority to U.S. Ser. No. 09/511,278 filed Feb. 23, 2000 and U.S. Ser. No. 09/607,567 filed Jun. 29, 2000, which is a divisional of U.S. Ser. No. 09/201,929 filed Dec. 1, 1998, now U.S. Pat. No. 6,176,992, all incorporated herein by reference.
Number | Name | Date | Kind |
---|---|---|---|
3328273 | Creutz et al. | Jun 1967 | A |
3779887 | Gildone | Dec 1973 | A |
3959089 | Watts | May 1976 | A |
4430173 | Boudot et al. | Feb 1984 | A |
4610772 | Palnik | Sep 1986 | A |
4948474 | Miljkovic | Aug 1990 | A |
4954142 | Carr et al. | Sep 1990 | A |
4975159 | Dahms | Dec 1990 | A |
5024735 | Kadija | Jun 1991 | A |
5084071 | Nenadic et al. | Jan 1992 | A |
5171412 | Talieh et al. | Dec 1992 | A |
5256565 | Bernhardt et al. | Oct 1993 | A |
5354490 | Yu et al. | Oct 1994 | A |
5429733 | Ishida | Jul 1995 | A |
5516412 | Andricacos et al. | May 1996 | A |
5558568 | Talieh et al. | Sep 1996 | A |
5692947 | Talieh et al. | Dec 1997 | A |
5755859 | Brusic et al. | May 1998 | A |
5770095 | Sasaki et al. | Jun 1998 | A |
5773364 | Farkas et al. | Jun 1998 | A |
5807165 | Uzoh et al. | Sep 1998 | A |
5833820 | Dubin | Nov 1998 | A |
5840629 | Carpio | Nov 1998 | A |
5858813 | Scherber et al. | Jan 1999 | A |
5863412 | Ichinose et al. | Jan 1999 | A |
5897375 | Watts et al. | Apr 1999 | A |
5922091 | Tsai et al. | Jul 1999 | A |
5930669 | Uzoh | Jul 1999 | A |
5933753 | Simon et al. | Aug 1999 | A |
5954997 | Kaufman et al. | Sep 1999 | A |
5985123 | Koon | Nov 1999 | A |
6004880 | Liu et al. | Dec 1999 | A |
6027631 | Broadbent | Feb 2000 | A |
6071388 | Uzoh | Jun 2000 | A |
6074544 | Reid et al. | Jun 2000 | A |
6103085 | Woo et al. | Aug 2000 | A |
6106378 | Perlov et al. | Aug 2000 | A |
6113759 | Uzoh | Sep 2000 | A |
6132587 | Jorne et al. | Oct 2000 | A |
6136163 | Cheung et al. | Oct 2000 | A |
6176992 | Talieh | Jan 2001 | B1 |
6193859 | Contolini et al. | Feb 2001 | B1 |
6244942 | Zuniga | Jun 2001 | B1 |
6297155 | Simpson et al. | Oct 2001 | B1 |
6299741 | Sun et al. | Oct 2001 | B1 |
6413388 | Uzoh et al. | Jul 2002 | B1 |
6413403 | Lindquist et al. | Jul 2002 | B1 |
6478936 | Volodarsky et al. | Nov 2002 | B1 |
6482307 | Ashjaee et al. | Nov 2002 | B2 |
6676822 | Talieh | Jan 2004 | B1 |
20010017258 | Ishida et al. | Aug 2001 | A1 |
20010041526 | Perlove et al. | Nov 2001 | A1 |
Number | Date | Country |
---|---|---|
2008664 | Sep 1971 | DE |
4324330 | Mar 1994 | DE |
WO 0026443 | May 2000 | WO |
Entry |
---|
J.M. Steigerwald, R. Zirpoli, S.P. Murarka, D. Price and R.J. Gutman, “Pattern Geometry Effects in the Chemical-Mechanical Polishing of Inlaid Copper Structures”, Oct. 1994, p. 2842-2848. |
Alan C. West , Chin-Chang Cheng and Brett C. Baker, “Pulse Reverse Copper Electrodeposition in High Aspect Ratio Trenches and Vias”, Sep. 1998, p. 3070-3073. |
Robert C. Contolini, Anthony F. Bernhardt and Steven Mayer, “Electrochemical Planarization for Multilevel Metallization”, Sep. 1994, p. 2503-2510. |
C. Madore, M. Matlosz and D. Landolt, “Blocking Inhibitors in Catholic Leveling”, I. Theoretical Analysis, Dec. 1997, p. 3927-3942. |
M. Rubinstein, “Tampongalvanisieren in der Praxis, Teil I.”GALVANOTECHNIK, vol. 79, No. 10, Sep. 2000. |
Joseph M. Steigerwald et al., “Chemical Mechanical Planarization of Microelectronic Materials”, A Wiley-Interscience Publication, 1997, by John Wiley & Sons, Inc. pp. 212-222. |
Robert D. Mikkola et al., “Investigation of the Roles of the Additive Components for Second Generation Copper Electroplating Chemistries Used for Advanced Interconnect Metalization”, 2000 IEEE, IEEE Electron Devices Society, pp. 117-119. |
Number | Date | Country | |
---|---|---|---|
Parent | 09/568584 | May 2000 | US |
Child | 10/251377 | US |