ANODE TITANIUM BASKET AND CONTINUOUS ELECTROPLATING APPARATUS INCLUDING THE SAME

Information

  • Patent Application
  • 20250207291
  • Publication Number
    20250207291
  • Date Filed
    December 19, 2024
    7 months ago
  • Date Published
    June 26, 2025
    25 days ago
Abstract
An anode titanium basket and a continuous electroplating apparatus including the same are provided. The continuous electroplating apparatus includes an electroplating tank, an anode titanium basket, a rotating conductive roller set, and a power supply. The electroplating tank has an electroplating solution accommodation space. The anode titanium basket is disposed in the electroplating solution accommodation space and includes an accommodation space and a channel. The accommodation space consists of a first surface, a second surface, and a side surface. The channel includes a first channel opening penetrating through the first surface and a second channel opening corresponding to the first channel opening and penetrating through the second surface. The rotating conductive roller set corresponds to the first channel opening and the second channel opening. The power supply is disposed outside the electroplating tank and is electrically connected to the rotating conductive roller set and the anode titanium basket.
Description
TECHNICAL FIELD

The present disclosure relates to an anode titanium basket and a continuous electroplating apparatus including the same, and, in particular, to the improved anode titanium basket and the continuous electroplating apparatus including the same.


BACKGROUND

Current metal composite wires are often prepared by using a continuous electroplating apparatus to increase the yield of the metal composite wires. In a continuous electroplating apparatus, however, the plate electrode will dissolve during the electroplating process, causing inconsistent spacing between the cathode and the anode, thereby reducing the uniformity of the electric field distribution and resulting in irregular thickness of the electroplated layer. Furthermore, the flow field distribution of the electroplating solution in the electroplating tank is also uneven, which aggravates the problem of uneven deposition. In addition, because the electroplating solution includes phosphorus-containing chemicals, such as phosphates, the electroplating process will produce a large amount of phosphate metal salt waste and a large amount of wastewater, resulting in problems of high expenses associated with chemical usages, high waste treatment costs, and large carbon emissions.


Therefore, although existing anode titanium baskets and continuous electroplating apparatuses including the same have gradually met their intended uses, they have not yet fully met the requirements in all respects. Therefore, there are still some issues to overcome.


SUMMARY

In some embodiments of the present disclosure, a continuous electroplating apparatus is provided. The continuous electroplating apparatus includes an electroplating tank, an anode titanium basket, a rotating conductive roller set, and a power supply. The electroplating tank has an outlet end, an inlet end, and an electroplating solution accommodation space located between the outlet end and the inlet end. The anode titanium basket is disposed in the electroplating solution accommodation space, wherein the anode titanium basket includes an accommodation space and a channel. The accommodation space consists of a first surface, a second surface opposite to the first surface, and a side surface connecting the first surface and the second surface of the anode titanium basket. The channel includes a first channel opening penetrating through the first surface and a second channel opening corresponding to the first channel opening and penetrating through the second surface. The rotating conductive roller set is disposed at the outlet end and the inlet end of the electroplating tank and corresponding to the first channel opening and the second channel opening of the channel. The power supply is disposed outside the electroplating tank and electrically connected to the rotating conductive roller set and the anode titanium basket.


In some embodiments of the present disclosure, an anode titanium basket is provided. The anode titanium basket includes an accommodation space and a channel. The accommodation space consists of a first surface, a second surface opposite to the first surface, and a side surface connecting the first surface and the second surface of the anode titanium basket. The channel includes a first channel opening penetrating through the first surface and a second channel opening penetrating through the second surface, and the channel penetrates through the accommodation space.


In some other embodiments of the present disclosure, a method for preparing a metal composite wire using a continuous electroplating apparatus is provided. The method for preparing the metal composite wire includes providing an electroplating solution in an electroplating solution accommodation space. The electroplated object is provided on the rotating conductive roller set, and the electroplated object is continuously driven through the channel by the rotating conductive roller set, wherein the electroplated object is formed of steel or carbon steel. The power supply is used to provide power to the rotating conductive roller set and the anode titanium basket, so that the electroplating solution forms a metal composite layer on the surface of the electroplated object.


In some other embodiment of the present disclosure, a metal composite wire is provided. The metal composite wire include a core wire and a metal composite layer. The core wire is formed of steel or carbon steel. The metal composite layer covers the surface of the core wire, wherein the metal composite layer includes a metal layer and a plurality of lubricating powders dispersed in the metal layer.


The anode titanium basket and the continuous electroplating apparatus including the same, the metal composite wire and method of preparing the same of the present disclosure may be applied in various types of electroplating apparatus and preparing method of wire. In order to make the features and advantages of some embodiments of the present disclosure more understandable, some embodiments of the present disclosure are listed below in conjunction with the accompanying drawings, and are described in detail as follows.





BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure can be more fully understood from the following detailed description when read in conjunction with the accompanying drawings. It should be noted that, according to the standard practice in the industry, the various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity.



FIG. 1A is a schematic diagram of a continuous electroplating apparatus according to an embodiment of the present disclosure.



FIG. 1B is a partial schematic diagram of a continuous electroplating apparatus according to an embodiment of the present disclosure.



FIG. 2A is a schematic diagram of a titanium anode basket according to an embodiment of the present disclosure.



FIGS. 2B to 2G are partial schematic diagrams of a titanium anode basket according to an embodiment of the present disclosure, respectively.



FIG. 2H is a schematic three-dimensional view of a titanium anode basket according to an embodiment of the present disclosure.



FIGS. 2I and 2J are schematic diagrams of the usage of a titanium anode basket according to an embodiment of the present disclosure.



FIG. 2K is a schematic three-dimensional view of a titanium anode basket according to an embodiment of the present disclosure.



FIG. 3 is a schematic side view of a continuous electroplating apparatus according to an embodiment of the present disclosure.



FIGS. 4A and 4B are schematic diagrams of a flow distribution plate of a spraying unit of a continuous electroplating apparatus according to an embodiment of the present disclosure, respectively.



FIGS. 5A to 5F are surface morphology diagrams of a metal composite layer according to an embodiment of the present disclosure, respectively.



FIG. 5G is a surface morphology diagram of a metal composite layer according to a comparative example of the present disclosure.



FIGS. 6A and 6B are EDS analysis diagrams of a metal composite layer according to an embodiment of the present disclosure, respectively.



FIGS. 7A to 7F are schematic appearance views of a metal composite wire according to an embodiment of the present disclosure, respectively.



FIGS. 8A and 8B are schematic appearance views of a metal composite wire according to an embodiment of the present disclosure, respectively.



FIGS. 9A and 9B are SEM analysis diagrams of a metal composite wire according to an embodiment of the present disclosure, respectively.





DETAILED DESCRIPTION

The continuous electroplating apparatus of the present disclosure may include an anode titanium basket, and the anode titanium basket may have a channel penetrating through the accommodation space of the anode titanium basket. Therefore, when the electroplated object is continuously passed through the channels of the anode titanium basket, the channels may provide a surrounding electric field in a manner that surrounds the electroplated object. That is, the channel may be an electroplated object channel through which the plated object passes. Accordingly, the electric field uniformity, the flow field uniformity, the deposition uniformity, the deposition rate, the reliability of the electroplated object, and/or the process margin of using the continuous electroplating apparatus to prepare the metal composite wire may be improved. Furthermore, the metal composite wire of the present disclosure may include lubricating powder that provides a self-lubricating effect, thereby eliminating the need for phosphorus-containing chemicals in the electroplating solution. Accordingly, the waste, the usage water, the chemical costs, the waste treatment costs, and/or carbon emissions may be reduced.


Various embodiments of the present disclosure will be described in detail below. It should be understood that the following description provides many different embodiments for implementing various aspects of some embodiments of the present disclosure. The specific elements and arrangements described below are merely to clearly describe some embodiments of the present disclosure. Of course, these are only used as examples rather than limitations of the present disclosure. Furthermore, similar or corresponding reference numerals may be used in different embodiments to designate similar or corresponding elements in order to clearly describe the present disclosure. However, the use of these similar or corresponding reference numerals is only for the purpose of simply and clearly description of some embodiments of the present disclosure, and does not imply any correlation between the different embodiments or structures discussed.


It should be understood that relative terms, such as “lower”, “bottom”, “higher”, or “top” may be used in various embodiments to describe the relative relationship of one element of the drawings to another element. It will be understood that if the apparatus in the drawings were turned upside down, elements described on the “lower” side would become elements on the “upper” side. The embodiments of the present disclosure can be understood together with the drawings, and the drawings of the present disclosure are also regarded as a portion of the disclosure. Furthermore, when it is mentioned that a first material layer is located on or over a second material layer, it may include the embodiment which the first material layer and the second material layer are in direct contact and the embodiment which the first material layer and the second material layer are not in direct contact with each other, that is one or more layers of other materials is between the first material layer and the second material layer. However, if the first material layer is directly on the second material layer, it means that the first material layer and the second material layer are in direct contact. In addition, it should be understood that ordinal numbers such as “first”, “second”, and the like used in the description and claims are used to modify elements and are not intended to imply and represent the element(s) have any previous ordinal numbers, and do not represent the order of a certain element and another element, or the order of the manufacturing method, and the use of these ordinal numbers is only used to clearly distinguished an element with a certain name and another element with the same name. The claims and the specification may not use the same terms, for example, a first element in the specification may be a second element in the claim.


In some embodiments of the present disclosure, terms related to bonding and connection, such as “connect”, “interconnect”, “bond”, and the like, unless otherwise defined, may refer to two structures in direct contact, or may also refer to two structures not in direct contact, that is there is another structure disposed between the two structures. Moreover, the terms related to bonding and connection can also include embodiments in which both structures are movable, or both structures are fixed. Furthermore, the terms “electrically connected” or “electrically coupled” include any direct and indirect means of electrical connection.


Herein, the terms “approximately”, “about”, and “substantially” generally mean within 10%, within 5%, within 3%, within 2%, within 1%, or within 0.5% of a given value or range. The given value is an approximate value, that is, “approximately”, “about”, and “substantially” can still be implied without the specific description of “approximately”, “about”, and “substantially”. The phrase “a range between a first value and a second value” or “a first value˜a second value” means that the range includes the first value, the second value, and other values in between. Furthermore, any two values or directions used for comparison may have certain tolerance. If the first value is equal to the second value, it implies that there may be a tolerance within about 10%, within 5%, within 3%, within 2%, within 1%, or within 0.5% between the first value and the second value.


Certain terms may be used throughout the specification and claims in the present disclosure to refer to specific elements. In the following description and claims, terms such as “including” and “having” are open-ended words, so they should be interpreted as meaning “including but not limited to . . . ”. Therefore, when the terms “including” and/or “having” is used in the description of the present disclosure, it designates the presence of corresponding features, regions, steps, operations, and/or elements, but does not exclude the presence of one or more corresponding features, regions, steps, operations, and/or elements. Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by a person of ordinary skills in the art. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having meanings consistent with the relevant art and the background or context of the present disclosure, and should not be interpreted in an idealized or overly formal manner, unless otherwise defined in the embodiments of the present disclosure.


Herein, the respective directions are not limited to three axes of the rectangular coordinate system, such as the X-axis, the Y-axis, and the Z-axis, and may be interpreted in a broader sense. For example, the X-axis, the Y-axis, and the Z-axis may be perpendicular to each other, or may represent different directions that are not perpendicular to each other, but the present disclosure is not limited thereto. For convenience of description, hereinafter, the X-axis direction is the first direction D1 (length direction), the Y-axis direction is the second direction D2 (width direction), and the Z-axis direction is the third direction D3 (depth or height direction). In some embodiments, the extending direction of the electroplated object is the first direction D1.


Referring to FIG. 1A, which is a schematic diagram of a continuous electroplating apparatus 1 according to an embodiment of the present disclosure. In some embodiments, the continuous electroplating apparatus 1 may include an electroplating tank 10, an anode titanium basket 20, a rotating conductive roller set 30, and a power supply 40. In some embodiments, the continuous electroplating apparatus 1 may perform continuous electroplating on the electroplated object 60.


As shown in FIG. 1A, in some embodiments, the electroplating tank 10 may have an outlet end 101, an inlet end 103, and a electroplating solution accommodation space 105 located between the outlet end 101 and the inlet end 103. In some embodiments, the electroplating solution accommodation space 105 may be used to accommodate the electroplating solution. In some embodiments, the electroplating tank 10 may include a sub-tank 107 and a main tank 109, and the sub-tank 107 may be fluidly connected to the main tank 109. In some embodiments, the electroplating tank 10 may include a conductive support frame 111, and the conductive support frame 111 may be disposed on a top surface of the electroplating tank 10. In some embodiments, the conductive support frame 111 may be in connected with the sub-tank 107. In some embodiments, the conductive support frame 111 may include a metal frame. In some embodiments, the metal frame may be a grid-shaped metal frame, and each grid in the grid-shaped metal frame may be in connected with different anode titanium baskets 20 to control the distance between adjacent anode titanium baskets 20 to be consistent.


As shown in FIG. 1A, in some embodiments, the anode titanium basket 20 may be disposed in the electroplating solution accommodation space 105 of the electroplating tank 10. In some embodiments, the anode titanium basket 20 may include an accommodation space 201 and a channel 203. In some embodiments, in the first direction D1, the channel 203 may penetrate through the accommodation space 201. In some embodiments, one end of the channel 203 may have a first channel opening 203O1 and the other end of the channel 203 may have a second channel opening 203O2. Therefore, the electroplated object 60 may pass through the channel 203, that is, pass through the first channel opening 203O1 and the second channel opening 203O2 in sequence. In some embodiments, the electroplated object 60 may continuously pass through one or more channels 203 at a drawing speed. In some embodiments, the drawing speed of the electroplated object 60 may be 1˜1000 centimeters per minute (cm/min). For example, the drawing speed of the electroplated object 60 may be 1 cm/min, 10 cm/min, 100 cm/min, 250 cm/min, 500 cm/min, 750 cm/min, 1000 cm/min, or any value or any range of values between the aforementioned values, but the present disclosure is not limited thereto. The drawing speed of the electroplated object 60 may be the rate of passing through the channel 203. Since the anode titanium basket 20 may have channel 203, the flow field uniformity of the electroplating solution may be improved, thereby improving the deposition rate, deposition uniformity, and/or reliability.


As shown in FIG. 1A, in some embodiments, the anode titanium basket 20 may further include a conductive hook 205, and the conductive hook 205 may be disposed on the top surface of the anode titanium basket 20. Therefore, the anode titanium basket 20 may be hung on the conductive support frame 111 of the electroplating tank 10 through the conductive hook 205, so that the anode titanium basket 20 is disposed in the electroplating solution accommodation space 105. In other words, the anode titanium basket 20 with the conductive hook 205 may be electrically connected to the electroplating tank 10 with the conductive support frame 111. In some embodiments, a soluble metal material may be placed in the accommodation space 201 of the anode titanium basket 20, and the soluble metal material may be used to supplement metal ions in the electroplating solution. For example, the soluble metal material may include zinc (Zn) particles. In some embodiments, when the electroplating solution is accommodated in the electroplating solution accommodation space 105, a portion of the anode titanium basket 20 may be exposed outside the electroplating solution, and the channel 203 may be covered by the electroplating solution to ensure the deposition uniformity of the electroplated object 60 penetrating through the channel 203.


As shown in FIG. 1A, in some embodiments, the rotating conductive roller set 30 may be disposed at the outlet end 101 and the inlet end 103 of the electroplating tank 10. In some embodiments, the rotating conductive roller set 30 may include a roller set. In some embodiments, the roller set may include three rollers, two rollers are disposed above the electroplated object 60 and one roller is disposed below the electroplated object 60, but the present disclosure is not limited thereto. In some embodiments, the roller set of the rotating conductive roller set 30 may include a transport roller and a conductive roller, wherein the transport roller may be in contact with the electroplated object 60 but is electrically isolated, and the conductive roller may be in contact with the electroplated object 60 and is electrically connect with the electroplated object 60. For example, the transport roller may include polymers such as plastic. For example, the conductive roller may include a conductive material, such as metal. For example, the roller set may include two transport rollers and one conductive roller, but the present disclosure is not limited thereto. In some embodiments, the transport roller may be disposed above the electroplated object 60, and the conductive roller may be disposed below the electroplated object 60, but the present disclosure is not limited thereto. Since the roller set of the rotating conductive roller set 30 may be in direct contact with the electroplated object 60, there may be scratches on the surface of the electroplated metal composite layer extending along the transporting direction of the electroplated object 60. In some embodiments, the rotating conductive roller set 30 may correspond to the first channel opening 203O1 and the second channel opening 203O2 of the channel 203. Therefore, the rotating conductive roller set 30 may adjust the position at which the electroplated object 60 is transferred to the electroplating tank 10. For example, the rotating conductive roller set 30 may physically separate the electroplated object 60 and the channel 203 of the anode titanium basket 20, for example, by spacing a distance from each other to avoid a short circuit between the electroplated object 60 and the anode titanium basket 20.


As shown in FIG. 1A, in some embodiments, the power supply 40 may be disposed outside the electroplating tank 10. In some embodiments, the power supply 40 may electrically connect the rotating conductive roller set 30 and the anode titanium basket 20. In some embodiments, the anode titanium basket 20 with the conductive hook 205 and the electroplating tank 10 with the conductive support frame 111 may be jointly and electrically connected to the positive electrode of the power supply 40, and the conductive roller of the rotating conductive roller set 30 may be electrically connected to the negative electrode of the power supply 40.


As shown in FIG. 1A, in some embodiments, the continuous electroplating apparatus 1 may further include a spraying unit 50. In some embodiments, the spraying unit 50 may be disposed in the electroplating solution accommodation space 105 to improve the flow field uniformity of the electroplating solution in the electroplating solution accommodation space 105. In some embodiments, the spraying unit 50 may further include a flow distribution plate 501. In some embodiments, in the third direction D3, the flow distribution plate 501 may be disposed below the anode titanium basket 20. In some embodiments, the normal direction of the flow distribution plate 501 (for example, the third direction D3) may be perpendicular to the normal direction of the anode titanium basket 20 (for example, the first direction D1). In some embodiments, the flow distribution plate 501 may be disposed in the sub-tank 107 and does not dispose in the main tank 109. Therefore, the flow distribution plate 501 may further improve the flow field uniformity of the electroplating solution.


As shown in FIG. 1A, in some embodiments, the spraying unit 50 may further include a pump 503 disposed in the main tank 109. In some embodiments, the spraying unit 50 may be driven by the driving force provided from the pump 503 to introduce the electroplating solution in the main tank 109 into the sub-tank 107. In some embodiments, after the electroplating solution introduced by the spraying unit 50 flows into the sub-tank 107 through the flow distribution plate 501, the pump 503 circulating spray the electroplating solution back into the main tank 109 with an electroplating solution spraying flow rate of ≥30 liters/minute (L/min). For example, the electroplating solution spraying flow rate may be 30 L/min, 35 L/min, 40 L/min, 45 L/min, 50 L/min, 100 L/min, 500 L/min, 1000 L/min or greater, or any value or any range of values between the aforementioned values, but the present disclosure is not limited thereto.


As shown in FIG. 1A, in some embodiments, the continuous electroplating apparatus 1 may further include an electroplated object positioning component 113. In some embodiments, the electroplated object positioning component 113 may be disposed in the electroplating solution accommodation space 105 and disposed on both sides of the channel 203. Therefore, the position of the electroplated object 60 may be adjusted by the electroplated object positioning component 113. The electroplated object positioning component 113 and the rotating conductive roller set 30 may jointly position the electroplated object 60. For example, the electroplated object 60 and the channel 203 of the anode titanium basket 20 may be physically separated to avoid a short circuit between the electroplated object 60 and the anode titanium basket 20.


As shown in FIG. 1A, in some embodiments, the rotating conductive roller set 30 may further include a high-pressure air component 301 to prevent the electroplating solution from outflowing from the electroplating solution accommodation space 105 when the electroplating solution is contained in the electroplating solution accommodation space 105. In some embodiments, the high-pressure air component 301 may include a compressed air bottle to spray high-pressure air. In some embodiments, the high-pressure air component 301 may be disposed at the outlet end 101 and the inlet end 103 of the electroplating tank 10. Wherein, the high-pressure air component 301 located at the inlet end 103 of the electroplating tank 10 may remove contaminants on the electroplated object 60, and the high-pressure air component 301 located at the outlet end 101 of the electroplating tank 10 may remove the electroplating solution or other impurities remaining on the electroplated object 60 after the electroplating process.


Accordingly, when the electroplated object 60 continuously passing through the channel 203 of the anode titanium basket 20, the channel 203 may provide a surrounding electric field surrounding the electroplated object 60. In other words, the channel 203 of the anode titanium basket 20 may be considered a tubular electrode. Accordingly, the electric field uniformity, the flow field uniformity, the deposition rate, the deposition uniformity, the reliability of the electroplated object and/or the process margin of using the continuous electroplating apparatus to prepare the metal composite wire may be improved. Compared with traditional plate electrodes, which have the limitation that the electric field is uneven due to uneven distribution of electric lines, the electric lines of the present disclosure are evenly distributed.


Referring to FIG. 1B, which is a partial schematic diagram of a continuous electroplating apparatus 1 according to an embodiment of the present disclosure. For ease of explanation, some components are omitted. As shown in FIG. 1B, in some embodiments, the sub-tank 107 may include an inner tank 107A and an outer tank 107B, and the inner tank 107A may be disposed in the outer tank 107B. In some embodiments, the inner tank 107A may be fluidly connected to the outer tank 107B. In some embodiments, in the third direction D3, the height of the outer tank 107B may be greater than the height of the inner tank 107A. Therefore, the electroplating solution introduced through the spraying unit 50 may flow into the inner tank 107A of the sub-tank 107 through the flow distribution plate 501, then overflow to the outer tank 107B of the sub-tank 107, and flow back to the main tank 109. In some embodiments, along the first flow direction FD1, the electroplating solution in the main tank 109 may enter the inner tank 107A of the sub-tank 107. When the inner tank 107A of the sub-tank 107 is filled with the electroplating solution, the electroplating solution may overflow into the outer tank 107B of the sub-tank 107 along the second flow direction FD2. Then, along the third flow direction FD3, the electroplating solution in the outer tank 107B of the sub-tank 107 will flow back to the main tank 109 for recycling. In other words, the electroplating solution enters and leaves the sub-tank not through the same tank in the sub-tank, but through the inner tank and the outer tank of the sub-tank, respectively. Accordingly, since the sub-tank 107 of the present disclosure may include the inner tank 107A and the outer tank 107B, the flow field uniformity may be further improved.


In some embodiments, the method of preparing the metal composite wire using the aforementioned continuous electroplating apparatus 1 may include the following steps.


Step 1: The electroplating solution may be provided in the electroplating solution accommodation space 105. In some embodiments, the continuous electroplating apparatus 1 may be set up, and then the electroplating solution is provided in the electroplating solution accommodation space 105 of the electroplating tank 10. In some embodiments, the electroplating solution may include a metal salt and a plurality of lubricating powders dispersed in the metal salt. In some embodiments, the electroplating solution may substantially exclude phosphorus-containing compounds to avoid generating phosphate metal salt waste. In some embodiments, the metal salt may include Zn metal or Sn metal. In some embodiments, the metal salt may be 60˜75 g/L zinc chloride as the main metal salt. For example, the concentration of zinc chloride may be 60 g/L, 65 g/L, 70 g/L, 75 g/L, or any value or any range of values between the aforementioned values, but the present disclosure is not limited thereto. In some embodiments, the particle size of the lubricating powder may be 0.5˜2.0 μm. In some embodiments, the plurality of lubricating powders may include MoS2, WS2, ZrO2, TiO2, or CeO2. In some embodiments, the content of the plurality of lubricating powders in the electroplating solution may be about 5˜105 g/L. For example, the content of the plurality of lubricating powders in the electroplating solution may be 5 g/L, 15 g/L, 25 g/L, 35 g/L, 45 g/L, 55 g/L, 65 g/L, 75 g/L, 85 g/L, 95 g/L, 105 g/L, or any value or any range of values between the aforementioned values, but the present disclosure is not limited thereto.


In some embodiments, the electroplating solution may further include 10−3˜10−1 mmol/L of surfactant. Wherein, the surfactant may be a cationic surfactant. The cationic surfactant may be a quaternary amine salt cationic surfactant, such as hexadecyl trimethyl ammonium bromide·cetyltrimethylammonium bromide (CTAB). In some embodiments, the surfactant is mixed with the lubricating powders to modify the surface of the lubricating powders. Next, the modified lubricating powders and the metal salt are mixed to obtain the electroplating solution. Wherein, by modifying the surface of the lubricating powders with surfactants, the dispersion of the lubricating powders may be improved and the agglomeration of the lubricating powders may be avoided.


In some embodiments, the electroplating solution may further include 200˜230 g/L potassium chloride to improve the conductivity of the electroplating solution. In some embodiments, the electroplating solution may further include a boric acid-free pH buffer agent of 15˜30 mL/L, a wetting agent of 20˜30 mL/L, and a grain refiner of 0.5˜2 mL/L. In some embodiments, the boric acid-free pH buffer agent may include glycine, hydroxybutanedioic acid, hexanedioic acid, other suitable boric acid-free pH buffer agent or a combination thereof. In some embodiments, the wetting agent may include non-ionic surfactants, such as polyethylene glycol-based non-ionic surfactants. The wetting agent may include Triton X100, polyoxyethylene lauryl ether, polyoxyethylene glycerol, other suitable nonionic surfactants, or a combination thereof. Wherein, the wetting agent may reduce the surface tension of the electroplating solution and promote the adhesion of the metal composite layer. In some embodiments, the grain refiner may include heterocyclic aldehydes, ketones such as benzylideneacetone, other suitable grain refiners, or a combination thereof. In some embodiments, the pH value of the electroplating solution may be 4.5˜5.5. In some embodiments, the temperature of the electroplating solution may be less than 50° C. and the electroplating solution may be used without additional heating process. For example, the temperature of the electroplating solution may be 10° C., 15° C., 20° C., 25° C., 30° C., or any value or any range of values between the aforementioned values, but the present disclosure is not limited thereto.


Next, in some embodiments, the soluble metal material may be placed in the accommodation space 201 of the anode titanium basket 20. For example, a plurality of zinc particles may be placed in the accommodation space 201 of the anode titanium basket 20 to supplement the metal ions precipitated from the electroplating solution during the electroplating process. Then, the conductive hook 205 of the anode titanium basket 20 that has accommodated the soluble metal material is hung on the conductive support frame 111, so that the anode titanium basket 20 that has accommodated the soluble metal material is placed in the electroplating solution accommodation space 105. For example, the conductive hook 205 of the anode titanium basket 20 that have accommodated the soluble metal material is hung on the rib of the grid-shaped frame of the conductive support frame 111. For example, the anode titanium basket 20 may be placed in the inner tank 107A of the sub-tank 107.


Then, in some embodiments, the pump 503 in the spraying unit 50 may be started to use the driving force provided by the pump 503 to introduce the electroplating solution in the main tank 109 into the sub-tank 107, for example, into the inner tank 107A of the sub-tank 107. In some embodiments, the electroplating solution may pass through the flow distribution plate 501 to evenly flow in the inner tank 107A of the sub-tank 107, and the electroplating solution may soak the anode titanium baskets 20 and flow between adjacent anode titanium baskets 20. When the inner tank 107A of the sub-tank 107 is filled with the electroplating solution, the electroplating solution may overflow into the outer tank 107B of the sub-tank 107. Then, the electroplating solution may flow between a tank wall of the inner tank 107A and a tank wall of the outer tank 107B, and flow back into the main tank 109 to complete a flow cycle of the electroplating solution. In some embodiments, the electroplating solution may be circulated multiple times according to the requirements of the electroplating process.


Step 2: The electroplated object 60 may be provided on the rotating conductive roller set 30, and the electroplated object 60 may be driven by the rotating conductive roller set 30 to continuously pass through the channel 203 of the anode titanium basket 20. In some embodiments, the electroplated object 60 may be formed by steel or carbon steel. For example, the electroplated object 60 may be a steel wire or a carbon steel wire. In some embodiments, as shown in FIG. 1A, the electroplated object 60 may be sequentially driven by the rotating conductive roller set 30 on the left side to pass through the inlet end 103, and then continuously pass through the channel 203 of the anode titanium basket 20, and exit via the outlet end 101 and be driven by the rotating conductive roller set 30 on the right side. In some embodiments, when the electroplated object 60 is provided on the rotating conductive roller set 30, the high-pressure air component 301 may be activated simultaneously to remove impurities on the electroplated object 60.


Step 3: The power supply 40 may be used to provide power to the rotating conductive roller set 30 and the anode titanium basket 20, so that the electroplating solution forms a metal composite layer on the surface of the electroplated object 60, thereby obtaining a metal composite wire. In some embodiments, the current density (unit: Ampere per square decimetre (ASD)) may be 2.5˜10. For example, the current density may be 2.5, 5, 7.5, 10, or any value or any range of values between the aforementioned values, but the present disclosure is not limited thereto. In some embodiments, the electroplating time may be 5˜ 100 minutes. For example, the electroplating time may be 5 minutes, 10 minutes, 20 minutes, 30 minutes, 40 minutes, 50 minutes, 100 minutes, or any value or any range of values between the aforementioned values, but the present disclosure is not limited thereto. In some embodiments, the deposition rate of the metal composite layer may be greater than or equal to 0.5 um/min. For example, the deposition rate of the metal composite layer may be 0.5 um/min, 1 um/min, 1.5 um/min, 2 um/min, 2.5 um/min or greater, or any value or any range of values between the aforementioned values, but the present disclosure is not limited thereto. In some embodiments, the film thickness of the metal composite layer may be 5˜50 μm. For example, the film thickness of the metal composite layer may be 5 μm, 10 μm, 15 μm, 20 um, 25 μm, 30 um, 35 μm, 40 um, 45 μm, 50 μm, or any value or any range of values between the aforementioned values, but the present disclosure is not limited thereto.


In some embodiments, the metal composite wire may include a core wire and a metal composite layer formed on a surface of the core wire. For example, the electroplated object 60 may serve as the core wire of the metal composite wire. Since the electroplated object 60 is formed of steel or carbon steel, the core wire is formed of steel or carbon steel. In some embodiments, the metal composite layer may cover the surface of the core wire, and the metal composite layer may include a metal layer and a plurality of lubricating powders dispersed in the metal layer. In some embodiments, the metal layer may include Zn metal or Sn metal, and the plurality of lubricating powders may include MoS2, WS2, ZrO2, TiO2, or CeO2. In some embodiments, the metal composite layer may be a Zn—MoS2 layer. In some embodiments, based on the total weight of the metal composite layer being 100 wt %, the plurality of lubricating powders account for about 5˜50 wt % of the metal composite layer. For example, the plurality of lubricating powders may account for 5 wt %, 10 wt %, 15 wt %, 20 wt %, 25 wt %, 30 wt %, 35 wt %, 4 0 wt %, 45 wt %, 50 wt %, or any value or any range of values between the aforementioned values, but the present disclosure is not limited thereto. In some embodiments, the friction coefficient of the metal composite layer may be less than or equal to 0.2 to meet the shaping processing requirements for wire drawing with cold forging. For example, the friction coefficient of the metal composite layer may be 0.2, 0.15, 0.1, 0.09, 0.08, 0.07, 0.06, 0.05, or any value or any range of values between the aforementioned values, but the present disclosure is not limited thereto. In some embodiments, the friction coefficient of the lubricating powder itself may be 0.04˜0.05. For example, the friction coefficient of the lubricating powder may be 0.04, 0.045, 0.05, or any value or any range of values between the aforementioned values, but the present disclosure is not limited thereto Therefore, the friction coefficient of the metal composite layer may be substantially greater than or equal to the friction coefficient of the lubricating powder itself.


In some embodiments, during the electroplating process, the exhaust element 701 may be activated to perform exhaustion. In some embodiments, during the electroplating process, the control element 705 may be activated to adjust parameters of the electroplating process. In some embodiments, during the electroplating process, the storage element 707 may be activated to store the electroplated metal composite wire.


Referring to FIG. 2A, which is a schematic diagram of an anode titanium basket 20 according to an embodiment of the present disclosure. In some embodiments, the accommodating space 201 of the anode titanium basket 20 may be consisting of a first surface 201S1, a second surface 201S2 corresponding to the first surface 201S1, and a side surface 201S3 connecting the first surface 201S1 and the second surface 201S2 of the anode titanium basket 20. In some embodiments, in the first direction D1, the first surface 201S1 and the second surface 201S2 are opposite to each other. In some embodiments, the first surface 201S1, the second surface 201S2, and the side surface 201S3 may include nets to circulate the electroplating solution and allow the soluble metal material to replenish the metal ions of the electroplating solution. In some embodiments, the net may be a net woven from titanium metal. In some embodiments, the mesh of the net may be a rhombus, a parallelogram, a rectangle, a square, or other suitable shapes, but the present disclosure is not limited thereto.


As shown in FIG. 2A, in some embodiments, the width of the anode titanium basket 20 in the second direction D2 may be smaller than the height of the anode titanium basket 20 in the third direction D3, but the present disclosure is not limited thereto. In some embodiments, the ratio of the width of the anode titanium basket 20 to the height of the anode titanium basket 20 (the width of the anode titanium basket 20/the height of the anode titanium basket 20) may be 0.25˜0.8. For example, the ratio of the width of the anode titanium basket 20 to the height of the anode titanium basket 20 is 0.25, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, or any value or any range of values between the aforementioned values, but the present disclosure is not limited thereto. In some embodiments, the width and height of the anode titanium basket 20 may be adjusted according to requirements.


As shown in FIG. 2A, in some embodiments, the width of the anode titanium basket 20 in the second direction D2 may be greater than the length of the anode titanium basket 20 in the first direction D1, but the present disclosure is not limited thereto. In some embodiments, the ratio of the width of the anode titanium basket 20 to the length of the anode titanium basket 20 (the width of the anode titanium basket 20/the length of the anode titanium basket 20) may be 2˜7. For example, the ratio of the width of the anode titanium basket 20 to the length of the anode titanium basket 20 is 2, 3, 4, 5, 6, 7, or any value or any range of values between the aforementioned values, but the present disclosure is not limited thereto. In some embodiments, the width and length of the anode titanium basket 20 may be adjusted according to requirements.


In some embodiments, the channel 203 of the anode titanium basket 20 may include a first channel opening 203O1 penetrating through the first surface 201S1 and a second channel opening 203O2 penetrating through the second surface 201S2. In some embodiments, in the first direction D1, the second channel opening 203O2 may correspond to the first channel opening 203O1. As shown in FIG. 2A, in some embodiments, the first channel opening 203O1a may correspond to the second channel opening 203O2a, the first channel opening 203O1b may correspond to the second channel opening 203O2b, and the first channel opening 203O1c may correspond to the second channel opening 203O2c. In some embodiments, the first channel openings 203O1d, 203O1e, 203O1f, and 203O1g may respectively correspond to different second channel openings (not shown). As shown in FIG. 2A, in some embodiments, the electroplated object 60 is physically separated from the channel 203 of the anode titanium basket 20, and the distances between any point on the surface of the electroplated object 60 passing through the channel 203 to the channel 203 may be substantially the same. Therefore, the short circuit may be avoided and the deposition uniformity may be improved.


In some embodiments, the channel 203 may further include a side surface 203S connecting the first channel opening 203O1 and the second channel opening 203O2, and the side surface 203S may be a net to circulate the electroplating solution and allow the soluble metal material to replenish the metal ions of the electroplating solution. In some embodiments, the net may be a net woven from titanium metal. In some embodiments, the mesh of the net may be a rhombus, a parallelogram, a rectangle, a square or other suitable shapes, but the present disclosure is not limited thereto.


In some embodiments, the conductive hook 205 of the anode titanium basket 20 may be disposed on the second surface 201S2, but the present disclosure is not limited thereto. In other embodiments (not shown), the conductive hook 205 of the anode titanium basket 20 may be disposed on the first surface 201S1.


As shown in FIG. 2A, in some embodiments, the anode titanium basket 20 may include a plurality of channels 203, and the plurality of channels 203 may be distributed on the anode titanium basket 20 at equal or unequal distances. In some embodiments, the number of channels 203 may be adjusted according to the requirements. In some embodiments, the number of channels 203 may be 1˜100, but the present disclosure is not limited thereto. For example, the number of channels 203 may be 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 25, 50, 75, 100, or any value or any range of values between the aforementioned values, but the present disclosure is not limited thereto. In some embodiments, the first channel opening 203O1, the second channel opening 203O2 or a combination thereof of the channel 203 may include a circle, an ellipse, a rectangle, a polygon, or other suitable shapes, but the present disclosure is not limited thereto. In some embodiments, the shape of the first channel opening 203O1, the second channel opening 203O2, or a combination thereof of the channel 203 may correspond to the cross-sectional shape of the electroplated object 60.


Referring to FIG. 2B, which is a partial schematic diagram of an anode titanium basket 20 according to an embodiment of the present disclosure. In some embodiments, the first channel opening 203O1, the second channel opening 203O2, or a combination thereof of the channel 203 may include a circular opening, and the diameter of the circular opening is 3˜5 times the diameter of the electroplated object 60 passing through the circular opening. For example, the first channel opening 203O1 or the second channel opening 203O2 may be a circular opening, and the diameter of the circular opening may be 3 times, 3.5 times, 4 times, 4.5 times, or 5 times the diameter of the electroplated object 60, or any value or any range of values between the aforementioned values, but the present disclosure is not limited thereto. In some embodiments, the diameter of the electroplated object 60 may be 1˜100 mm, but the present disclosure is not limited thereto. For example, the diameter of the electroplated object 60 may be 1 mm, 5 mm, 10 mm, 25 mm, 50 mm, 75 mm, 100 mm, or any value or any range of values between the aforementioned values, but the present disclosure is not limited thereto. In some embodiments, the diameter of the circular opening may be 3˜500 mm, but the present disclosure is not limited thereto. For example, the diameter of the circular opening may be 3 mm, 15 mm, 30 mm, 75 mm, 150 mm, 225 mm, 300 mm, or any value or any range of values between the aforementioned values, but the present disclosure is not limited thereto.


Referring to FIG. 2C, which is a partial schematic diagram of an anode titanium basket 20 according to an embodiment of the present disclosure. As shown in FIG. 2C, in some embodiments, the anode titanium basket 20 may further include a first portion 20P1 and a second portion 20P2, and the first portion 20P1 is detachably connected to the second portion 20P2. Therefore, the anode titanium basket 20 may be a combined-type anode titanium basket. In some embodiments, the first portion 20P1 may have a first recess 20R1, the second portion 20P2 may have a second recess 20R2, and the first recess 20R1 and the second recess 20R2 may be combined to form the channel 203. For example, the first portion 20P1 may have a semicircular first recess 20R1, and the second portion 20P2 may have a semicircular second recess 20R2, so the first recess 20R1 and the second recess 20R2 may be combined to form the channel 203 with a circular opening. In other embodiments (not shown), the first recess 20R1 or the second recess 20R2 may have a U-shape, a C-shape, or other suitable shapes, but the present disclosure is not limited thereto. In other embodiments (not shown), the first portion 20P1 may have a plurality of first recesses 20R1, the second portion 20P2 may have a plurality of second recesses 20R2, and the plurality of first recesses 20R1 and the plurality of second recesses 20R1 may be combined to form a plurality of channels 203. In this embodiment, the plurality of channels 203 may be arranged sequentially along the third direction D3. Accordingly, since the anode titanium basket 20 may be the combined-type anode titanium basket, it may facilitate continuous execution of the electroplating process. Specifically, when replacing the anode titanium basket, the combined-type anode titanium basket may be disassembled, so that there is no need to cut the electroplated object 60. As a result, the production time may be reduced, the handling costs may be reduced, and/or the deposition rates during a fixed period may be increased.


Referring to FIG. 2D, which is a partial schematic diagram of an anode titanium basket 20 according to an embodiment of the present disclosure. In some embodiments, the channel 203 may further include a connection openings 203C. In some embodiments, the connection opening 203C may penetrate through the side surface 201S3 of the anode titanium basket 20 and connect the first channel opening 203O1 and the second channel opening 203O2. In some embodiments, when the anode titanium basket 20 has the connection opening 203C, the entire anode titanium basket 20 may be U-shaped, C-shaped, or other shapes with openings. In some embodiments, the opening direction of the connection opening 203C may be in a direction opposite to the third direction D3, but the present disclosure is not limited thereto. Accordingly, since the anode titanium basket 20 may include the connection opening, it may facilitate the continuous execution of the electroplating process. Specifically, when replacing the anode titanium basket, the electroplated object 60 may be taken out from the connection opening, so that there is no need to cut the electroplated object 60. As a result, the production time may be reduced, the handling costs may be reduced, and/or the deposition rates during a fixed period may be increased.


Referring to FIG. 2E, which is a partial schematic diagram of an anode titanium basket 20 according to an embodiment of the present disclosure. In some embodiments, the opening direction of the connection opening 203C may be a direction opposite to the second direction D2. In other embodiments (not shown), the opening direction of the connection opening 203C may be the second direction D2, the third direction D3, or other suitable directions, but the present disclosure is not limited thereto.


Referring to FIG. 2F, which is a partial schematic diagram of an anode titanium basket 20 according to an embodiment of the present disclosure. In some embodiments, the continuous electroplating apparatus 1 may include a plurality of anode titanium baskets 20, and the anode titanium baskets 20 may all include the same channels 203. In some embodiments, the plurality of anode titanium baskets 20 may include a first anode titanium basket 20A, a second anode titanium basket 20B, and a third anode titanium basket 20C. In some embodiments, in the first direction D1, the first anode titanium basket 20A may be disposed between the second anode titanium basket 20B and the third anode titanium basket 20C. In some embodiments, in the first direction D1, the distance between the first anode titanium basket 20A and the second anode titanium basket 20B or the distance between the first anode titanium basket 20A and the third anode titanium basket 20C may be 1˜60 cm, but the present disclosure is not limited thereto. For example, the distance may be 1 cm, 3 cm, 6 cm, 9 cm, 10 cm, 20 cm, 30 cm, 40 cm, 50 cm, 60 cm, or any value or any range of values between the aforementioned values, but the present disclosure is not limited thereto. Accordingly, by adjusting the distance between adjacent anode titanium baskets, the difference between surface current densities corresponding to the electroplated object passing through different anode titanium baskets may be smaller, thereby improving deposition uniformity. Specifically, when the distance between adjacent anode titanium baskets is too small, the flow field uniformity of the electroplating solution is insufficient. When the distance between adjacent anode titanium baskets is too large, the electric field uniformity is insufficient and the surface current densities of the electroplated object is greatly different, resulting in insufficient deposition uniformity at different locations of the surface of the electroplated object.


As shown in FIG. 2F, in some embodiments, the first channel opening 203O1 and the second channel opening 203O2 of the channel 203 of the first anode titanium basket 20A are circular openings that are not connected to each other. The first channel opening 203O1 and the second channel opening 203O2 of the channel 203 of the second anode titanium basket 20B are circular openings connected to each other by a connection opening 203C penetrating through the side surface 201S3 of the second anode titanium basket 20B. The first channel opening 203O1 and the second channel opening 203O2 of the channel 203 of the third anode titanium basket 20C are circular openings connected to each other by a connection opening 203C penetrating through the side surface 201S3 of the third anode titanium basket 20C. In some embodiments, the opening direction of the connection opening 203C of the second anode titanium basket 20B may be the same as or different from the opening direction of the connection opening 203C of the third anode titanium basket 20C. Accordingly, the arrangement of the anode titanium basket may be adjusted according to different electric field requirements. For example, the electric field of the anode titanium basket 20 close to the connection opening 203C may be smaller than the electric field of the anode titanium basket 20 away from the connection opening 203C, so the deposition rate of the electroplated object 60 close to the connection opening 203C may be smaller than the deposition rate of the electroplated object 60 away from the connection opening 203C.


Referring to FIG. 2G, which is a partial schematic diagram of an anode titanium basket 20 according to an embodiment of the present disclosure. As shown in FIG. 2G, in some embodiments, the first channel opening 203O1 and the second channel opening 203O2 of the channel 203 of the first anode titanium basket 20A are circular openings connected to each other by a connection opening 203C penetrating through the side surface 201S3 of the first anode titanium basket 20A. Wherein, the opening direction of the connection opening 203C of the first anode titanium basket 20A is the third direction D3. The first channel opening 203O1 and the second channel opening 203O2 of the channel 203 of the second anode titanium basket 20B are circular openings connected to each other by a connection opening 203C penetrating through the side surface 201S3 of the second anode titanium basket 20B. Wherein, the opening direction of the connection opening 203C of the second anode titanium basket 20B is a direction opposite to the third direction D3. The first channel opening 203O1 and the second channel opening 203O2 of the channel 203 of the third anode titanium basket 20C are circular openings connected to each other by a connection opening 203C penetrating through the side surface 201S3 of the third anode titanium basket 20C. Wherein, the opening direction of the connection opening 203C of the third anode titanium basket 20C is the direction opposite to the third direction D3. That is, the connection opening 203C of the second anode titanium basket 20B and the connection opening 203C of the third anode titanium basket 20C are in the same opening direction. In other embodiments (not shown), the electroplating tank may include M groups of anode titanium baskets. When each group of anode titanium baskets may include N anode titanium baskets, the opening directions of adjacent connection openings 203C may be spaced (360/N) degrees. For example, when each group of anode titanium baskets includes four anode titanium baskets, the opening directions of adjacent connection openings 203C may be spaced 90 degrees.


Accordingly, when the opening directions of the connection openings 203C of adjacent anode titanium baskets are different, the electric field uniformity may be improved. For example, the electric field of the anode titanium basket 20 close to the connection opening 203C may be smaller than the electric field of the anode titanium basket 20 away from the connection opening 203C. Therefore, when the opening directions of the connection openings of adjacent anode titanium baskets are oriented in different directions, the electric field may be prevented from being concentrated at a specific location, thereby improving the electric field uniformity.


Referring to FIG. 2H, which is a schematic three-dimensional view of an anode titanium basket according to an embodiment of the present disclosure. Wherein, the anode titanium basket 20 shown in FIG. 2H is a schematic three-dimensional view of an integrated-type anode titanium basket 20 shown in FIG. 2B. In some embodiments, in the first direction D1, the second channel opening 203O2 may correspond to the first channel opening 203O1. In some embodiments (not shown), the anode titanium basket 20 as shown in FIG. 2H may further include a connection opening 203C.


Referring to FIGS. 21 and 2J, which are schematic diagrams of the usage of an anode titanium basket according to an embodiment of the present disclosure. Wherein, FIG. 2I is a schematic diagram of the usage of the anode titanium basket 20 in FIG. 2H, and FIG. 2J is a partial schematic diagram of FIG. 2I. In some embodiments, when the electroplated object 60, such as the core wire, passing through the anode titanium basket 20, the side wall 203S of the channel 203 are nets, and the net surrounds the electroplated object 60. For example, the net on the side wall 203S is a net woven from titanium metal. Accordingly, the electric field uniformity may be improved. Compared with the anode titanium basket without the side wall 203S (only the first channel opening 203O1 and the second channel opening 203O2 are provided), the electric field uniformity of the anode titanium basket with the side wall 203S is higher.


Referring to FIG. 2K, which is a schematic three-dimensional view of an anode titanium basket according to an embodiment of the present disclosure. The anode titanium basket 20 shown in FIG. 2K is a schematic three-dimensional view of the combined-type anode titanium basket 20 shown in FIG. 2C. In some embodiments, the soluble metal material may be placed in the accommodation space 201 of the first portion 20P1 and the accommodation space 201 of the second portion 20P2 of the anode titanium basket 20, respectively. The first recess 20R1 of the first portion 20P1 and the second recess 20R2 of the second portion 20P2 may be combined to form the channel 203.


Referring to FIG. 3, which is a schematic side view of a continuous electroplating apparatus 1 according to an embodiment of the present disclosure. In some embodiments, the continuous electroplating apparatus 1 may further include a drain pipe 505 to discharge waste water. In some embodiments, the continuous electroplating apparatus 1 may further include an exhaust element 701 and an exhaust pipe 703 connected to the exhaust element 701, to discharge exhaust gas. In some embodiments, the continuous electroplating apparatus 1 may further include a control component 705 to adjust parameters of the electroplating process. In some embodiments, the control element 705 may include a controller, but the present disclosure is not limited thereto. In some embodiments, the continuous electroplating apparatus 1 may further include a storage element 707. For example, the storage element 707 may include a reel. For example, the storage element 707 may include wire boxes to store wires. In other embodiments (not shown), in the third direction D3, the main tank 109 may be disposed directly below the sub-tank 107 to reduce pipeline bends and facilitate the transportation of the electroplating solution.


Referring to FIG. 4A, which is a schematic diagram of the flow distribution plate 501 of the spraying unit 50 of the continuous electroplating apparatus 1 according to an embodiment of the present disclosure. In some embodiments, the flow distribution plate 501 may have a plurality of conical holes 5011 disposed on a bottom plate 5013. In some embodiments, the plurality of conical holes 5011 may protrude from the bottom plate 5013. In some embodiments, in the third direction D3, the top surfaces of the plurality of conical holes 5011 may be higher than the top surface of the bottom plate 5013. In some embodiments, the plurality of conical holes 5011 may be arranged in an array. In some embodiments, each of the plurality of conical holes 5011 may have an outlet port O1 and an inlet port O2, and the area of the outlet port O1 may be smaller than the area of the inlet port O2. In other words, the flow rate of the electroplating solution may be increased after the electroplating solution enters the flow distribution plate 501 via the inlet port O2, flows through the conical hole 5011, and flows out of the flow distribution plate 501 through the outlet port O1. Therefore, the flow field uniformity of the electroplating may be improved, thereby improving deposition rate and reliability.


As shown in FIG. 4A, in some embodiments, the diameter of the outlet port O1 of the conical hole 5011 may be 3˜10 mm. For example, the diameter of the outlet port O1 may be 3 mm, 4 mm, 5 mm, 6 mm, 7 mm, 8 mm, 9 mm, 10 mm, or any value or any range of values between the aforementioned values, but the present disclosure is not limited thereto. In some embodiments, the total area of all the conical holes 5011 may account for approximately 50˜70% of the total area of the flow distribution plate 501. In some embodiments, the total area of the plurality of conical holes 5011 may be regarded as the total area of the plurality of outlet ports O1. For example, the total area of the plurality of conical holes 5011 may account for 50%, 55%, 60%, 65%, 70% of the total area of the flow distribution plate 501, or any value or any range of values between the aforementioned values, but the present disclosure is not limited thereto. Accordingly, by adjusting the diameter and area of the outlet port O1, the flow field uniformity of the electroplating solution is improved, thereby improving the deposition rate and reliability.


As shown in FIG. 4A, in some embodiments, each of the plurality of conical holes 5011 may have a side wall S connecting the outlet port O1 and the inlet port O2. In some embodiments, the side wall S of the flow distribution plate 501 may be inclined at an angle of 30˜60 degrees. In other words, the angle between the side wall S and the bottom plate 5013 may be 30˜60 degrees. For example, the side wall S of the flow distribution plate 501 may be inclined at 30 degrees, 35 degrees, 40 degrees, 45 degrees, 50 degrees, 55 degrees, 60 degrees, or any value or any range of values between the aforementioned values, but the present disclosure is not limited thereto. Accordingly, by adjusting the inclined angle of the side wall S of the flow distribution plate 501, the flow field uniformity of the electroplating solution is improved, thereby improving the deposition rate and reliability.


Referring to FIG. 4B, which is a schematic diagram of the flow distribution plate 501 of the spraying unit 50 of the continuous electroplating apparatus 1 according to an embodiment of the present disclosure. In some embodiments, the top surfaces of the plurality of conical holes 5011 may be aligned with the top surface of the bottom plate 5013 to reduce the thickness of the flow distribution plate 501. Therefore, the apparatus size of the continuous electroplating apparatus 1 may be reduced.


The following examples are used to illustrate. In the following, the anode titanium basket 20 may be a combined-type anode titanium basket as shown in FIG. 2C as an example, but the present disclosure is not limited thereto. In some embodiments, the continuous electroplating apparatus 1 includes six combined-type anode titanium baskets 20, and each anode titanium basket 20 has one channel 203.


In the electroplating solution, the metal salt may be 67 g/L zinc chloride, the lubricating powder may be MoS2 with a particle size of 0.1˜2.0 μm, the surfactant may be CTAB, and the concentration of CTAB is 10−1˜10−5 mmol/L. The pH value of the electroplating solution may be 5. The electroplated object 60 may be a steel wire. Wherein, the electroplated object 60 may pass through six channels 203 continuously. The diameter of the electroplated object 60 is 10 mm, and the diameter of the circular opening is 30 mm. The drawing speed of the electroplated object 60 is 10 cm/min. The electroplating solution spraying flow rate is 30 L/min. The remaining parameters are shown in Table 1, and the analysis results are shown in FIGS. 5A to 5G. Wherein, the test parameters of friction coefficient are as follows: the upper loading weight (200±2.5 g)±wire weight (about 80 g), the test speed is 150 mm/minute, and the test distance is 150 mm.
















TABLE 1











MoS2 in









EDS








analysis



content of MoS2
concentration
current

surface
of metal



in electroplating
of CTAB
density
electroplating
roughness
composite
friction


ex.
solution (g/L)
(mmol/L)
(ASD)
time (sec)
Ra (um)
layer (%)
coefficient






















1
45
10−1
5
600
1.77~5.16
17~33
0.066


2
65
10−1
5
600
1.17~1.45
20~40
0.061


3
85
10−1
5
600
0.92~0.98
25~48
0.052


4
45
10−1
7.5
400
4.10~8.02
17~38
0.071


5
65
10−1
7.5
400
2.41~4.99
29~40
0.060


6
85
10−1
7.5
400
0.75~0.85
37~47
0.052












Comparative example: Using
0.67~1.48
not
0.135



phosphate saponification film process

applicable










Referring to FIGS. 5A to 5F, they are surface morphology diagrams (that is, the scanning electron microscope (SEM) analysis images) of the metal composite layer according to an embodiment of the present disclosure, respectively. Wherein, FIGS. 5A to 5F correspond to examples (ex.) 1˜6, respectively. Referring to FIG. 5G, which is a surface morphology diagram (SEM analysis image) of the metal composite layer according to the comparative example of the present disclosure. Wherein, FIG. 5G corresponds to a comparative example using a phosphate saponification film process.


It should be noted that since the friction coefficient is related to the properties of the contact surface, the rougher the surface of the metal composite layer, the greater the friction coefficient. Compared with the comparative example, the friction coefficients of examples 1˜6 are lower. When the concentration of lubricating powder in the electroplating solution is higher, the friction coefficient of the metal composite layer is lower, indicating better lubricity. Wherein, the friction coefficients of examples 3 and 6 are 0.052, which are the smallest. When the concentration of MoS2 is 45 g/L, the surface roughness of the metal composite layer of example 4 with high current density is greater than the surface roughness of the metal composite layer of example 1 with low current density. When the concentration of MoS2 is 85 g/L, whether the current density is 5 ASD or 7.5 ASD, it has a lower friction coefficient.


Referring to FIGS. 6A and 6B, which are EDS analysis diagrams of a metal composite layer according to an embodiment of the present disclosure, respectively. Wherein, FIGS. 6A and 6B are the energy-dispersive X-ray spectroscopy (EDS) analysis diagrams of examples 1 and 6, respectively. As shown in FIGS. 6A and 6B, it is confirmed that the metal composite layer includes Zn, Mo, MoS, and the like.


Referring to FIGS. 7A to 7F, which are schematic appearance views of a metal composite wire according to an embodiment of the present disclosure, respectively. The parameters can be shown in Table 2. Wherein, FIGS. 7A to 7D show the schematic appearance views of examples 7 to 10, respectively, and FIGS. 7E and 7F show the schematic appearance views of examples 1 and 2, respectively.
















TABLE 2











MoS2 in









EDS








analysis



content of MoS2
concentration
current

surface
of metal



in electroplating
of CTAB
density
electroplating
roughness
composite
friction


ex.
solution (g/L)
(mmol/L)
(ASD)
time (sec)
Ra (um)
layer (%)
coefficient






















7
5
10−5
5
600
1.39~5.71
3~8
0.154


8
20
10−4
5
600
1.45~4.99
 7~15
0.099


9
45
10−3
2.5
1200
1.80~3.69
10~20
0.093


10
45
10−2
5
600
1.92~5.30
14~25
0.082









As shown in FIGS. 7A to 7F, when the concentration of CTAB is higher, the appearance of the metal composite wire is smoother and has refined appearance. When the concentration of MoS2 increases and the current density increases, the appearance of the Zn—MoS2 composite coated layer of the metal composite wire becomes smoother, more refined, and has better color uniformity. Specifically, in example 7, when the concentration of CTAB in the electroplating solution is 10−5 mmol/L, the dispersibility of the lubricating powder in the electroplating solution is poor, resulting in a low content of lubricating components in the metal composite layer. The coating appearance of the metal composite layer (as shown in FIG. 7A) is also poor, so the friction coefficient is as high as 0.154. In example 8, by increasing the content of lubricating powder and slightly increasing the concentration of CTAB as a surfactant, although the friction coefficient can be reduced to 0.099, the coating appearance of the metal composite layer is still uneven (as shown in FIG. 7B). In examples 10 to 12, while continuously increasing the concentration of the lubricating powder and the surfactant in the electroplating solution, when the coating appearance of the metal composite layer was visually observed (as shown in FIGS. 7D to 7F), the color uniformity of coating appearance shows an improvement trend. Therefore, simultaneously increasing the concentration of the lubricating powder and the surfactant of the electroplating solution can improve the coating appearance and the lubricity of the metal composite layer. For example, according to the above results, the concentration of CTAB can be 10−1˜10−3 mmol/L to improve the coating appearance and the lubricity of the metal composite layer.


Referring to FIGS. 8A and 8B, which are schematic appearance views of a metal composite wire according to an embodiment of the present disclosure, respectively. Wherein, FIGS. 8A and 8B are the schematic appearance views of examples 3 and 11, respectively. Referring to FIGS. 9A and 9B also, which are SEM analysis diagrams of a metal composite wire according to an embodiment of the present disclosure, respectively. Wherein, FIGS. 9A and 9B are the SEM analysis diagrams of examples 3 and 11, respectively. The relevant parameters and analysis results are shown in Table 3 and FIGS. 8A, 8B, 9A, and 9B. The tubular electrode of example 3 is a titanium basket with the channel. Compared with example 3, example 11 only changed the anode electrode to plate electrodes disposed at both ends of the electroplating solution accommodation space.
















TABLE 3






content of



thickness





MoS2 in
current

anode
of metal



electroplating
density
electroplating
electrode
composite
deposition
Current


ex.
solution (g/L)
(ASD)
time (sec)
configuration
layer (um)
uniformity
efficiency






















3
85
5
600
tubular
14.8~15.2
high
high






electrode


11
85
5
600
plate
11.4~13.3
low
low






electrode









Compared with example 11 shown in FIGS. 8B and 9B, example 3 shown in FIGS. 8A and 9A has a refined appearance, and the thickness of the metal composite layer is thicker and more uniform. Therefore, it should be noted that under the same current conditions, the deposition uniformity and current efficiency of the tubular electrode are higher than that of the flat electrode.


In other embodiments, a wire drawing test is performed on the aforementioned examples 1 to 10. Wherein, the test parameters of the wire drawing test are as follows: the material of the wire drawing dies is tungsten carbide, and the wire drawing speed is 8 mm/sec. It should be noted that there is no fracture in all examples 1˜10, and after re-analysis with EDS and X-ray fluorescence spectrometer (XRF), it should be noted that examples 1˜10 still include Zn and MoS2. Therefore, the metal composite layer of the metal composite wire of the present disclosure has good ductility and lubricity.


Accordingly, the anode titanium basket of the present disclosure may include a channel for the electroplated object to continuously pass through, in order to improve the electric field uniformity, the flow field uniformity, the deposition uniformity, the deposition rate, the reliability of the electroplated object, and/or the process margin of using the continuous electroplating apparatus to prepare the metal composite wire. The anode titanium basket may include different types of channels, such as a combined-type anode titanium basket including a first portion and a second portion and/or an integrated-type anode titanium basket further including a connection opening to be suitable for different electroplating conditions.


The continuous electroplating apparatus of the present disclosure may further include an electroplating tank. Wherein, the electroplating tank may include a sub-tank and a main tank, and the sub-tank may include an inner tank and an outer tank. Therefore, the relative position of the inner tank, the outer tank, and the main tank can be adjusted to improve the flow field uniformity, the deposition uniformity, the deposition rate of the electroplating solution, and/or the reliability of the electroplated object. The continuous electroplating apparatus of the present disclosure may further include a spraying unit. Wherein, the spraying unit may include a flow distribution plate, and by adjusting the size, the position, the slope, the area, and other parameters of the flow distribution plate, the flow field uniformity, the deposition uniformity, the deposition rate of the electroplating solution, and/or the reliability of the electroplated object may be improved.


The metal composite wire and the method of preparing the same of the present disclosure may include lubricating powders to provide self-lubricating properties without using phosphorus-containing chemicals. Accordingly, the waste, the usage water, the chemical costs, the waste treatment costs, and/or carbon emissions may be reduced.


It should be understood that, in the following embodiments, features in several different embodiments may be replaced, recombined, and bonded to complete other embodiments without departing from the spirit of the present disclosure. The features of the various embodiments can be used in any combination as long as they do not violate the spirit of the present disclosure or conflict with each other. The scope of the present disclosure is not limited to the process, machine, manufacturing, material composition, device, method, and step in the specific embodiments described in the specification. A person of ordinary skill in the art will understand current and future processes, machine, manufacturing, material composition, device, methods, and steps from the content disclosed in some embodiments of the present disclosure, as long as the current or future processes, machine, manufacturing, material composition, device, method, and step performs substantially the same functions or obtain substantially the same results as the present disclosure. Therefore, the scope of the present disclosure includes the abovementioned process, machine, manufacturing, material composition, device, method, and steps. It is not necessary for any embodiment or claim of the present disclosure to achieve all of the objects, advantages, and/or features disclosed herein.


The foregoing outlines features of several embodiments of the present disclosure, so that a person of ordinary skill in the art may better understand the aspects of the present disclosure. A person of ordinary skill in the art should appreciate that, the present disclosure may be readily used as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. A person of ordinary skill in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the present disclosure.

Claims
  • 1. A continuous electroplating apparatus, comprising: an electroplating tank having an outlet end, an inlet end, and an electroplating solution accommodation space located between the outlet end and the inlet end;an anode titanium basket disposed in the electroplating solution accommodation space, wherein the anode titanium basket comprises: an accommodation space, wherein the accommodation space consists of a first surface, a second surface opposite to the first surface, and a side surface connecting the first surface and the second surface of the anode titanium basket; anda channel comprising a first channel opening penetrating through the first surface and a second channel opening corresponding to the first channel opening and penetrating through the second surface;a rotating conductive roller set disposed at the outlet end and the inlet end of the electroplating tank and corresponding to the first channel opening and the second channel opening of the channel; anda power supply disposed outside the electroplating tank and electrically connected to the rotating conductive roller set and the anode titanium basket.
  • 2. The continuous electroplating apparatus as claimed in claim 1, further comprising: a spraying unit disposed in the electroplating solution accommodation space.
  • 3. The continuous electroplating apparatus as claimed in claim 2, wherein the spraying unit further comprises: a flow distribution plate disposed below the anode titanium basket, wherein a normal direction of the flow distribution plate is perpendicular to a normal direction of the anode titanium basket.
  • 4. The continuous electroplating apparatus as claimed in claim 3, wherein the flow distribution plate has a plurality of conical holes arranged in an array, each of the conical holes has an outlet port and an inlet port, and an area of the outlet port is smaller than an area of the inlet port.
  • 5. The continuous electroplating apparatus as claimed in claim 3, wherein the electroplating tank further comprises: a sub-tank; anda main tank fluidly connected to the sub-tank,wherein the flow distribution plate is disposed in the sub-tank.
  • 6. The continuous electroplating apparatus as claimed in claim 5, wherein the sub-tank further comprises: an inner tank; andan outer tank, wherein the inner tank is disposed in the outer tank, and a height of the outer tank is greater than a height of the inner tank,wherein an electroplating solution introduced through the spraying unit flows into the inner tank of the sub-tank through the flow distribution plate, overflows to the outer tank of the sub-tank, and flows back to the main tank.
  • 7. The continuous electroplating apparatus as claimed in claim 1, wherein the anode titanium basket comprises a plurality of the channels, and the plurality of the channels are distributed in the anode titanium basket at equal or unequal distances.
  • 8. The continuous electroplating apparatus as claimed in claim 1, wherein the channel further comprises: a connection opening penetrating through the side surface of the anode titanium basket and connecting the first channel opening and the second channel opening.
  • 9. The continuous electroplating apparatus as claimed in claim 1, wherein the anode titanium basket further comprises: a first portion having a first recess; anda second portion having a second recess,wherein the first recess and the second recess are combined to form the channel.
  • 10. An anode titanium basket, comprising: an accommodation space, wherein the accommodation space consists of a first surface, a second surface opposite to the first surface, and a side surface connecting the first surface and the second surface of the anode titanium basket; anda channel comprising a first channel opening penetrating through the first surface and a second channel opening penetrating through the second surface, and the channel penetrating through the accommodation space.
  • 11. The anode titanium basket as claimed in claim 10, wherein the anode titanium basket comprises a plurality of the channels, and the plurality of the channels are distributed in the anode titanium basket at equal or unequal distances.
  • 12. The anode titanium basket as claimed in claim 10, wherein the first channel opening, the second channel opening, or a combination thereof comprises a circular opening.
  • 13. The anode titanium basket as claimed in claim 12, wherein a diameter of the circular opening is 3 to 5 times a diameter of an electroplated object passing through the circular opening.
  • 14. The anode titanium basket as claimed in claim 10, further comprising: a first portion having a first recess; anda second portion having a second recess,wherein the first recess and the second recess are combined to form the channel.
  • 15. The anode titanium basket as claimed in claim 10, wherein the channel further comprises: a connection opening penetrating through the side surface of the anode titanium basket and connecting the first channel opening and the second channel opening.
  • 16. The anode titanium basket as claimed in claim 10, wherein the anode titanium basket is provided as a plurality of the anode titanium baskets, and the plurality of the anode titanium baskets comprise the same channels.
  • 17. The anode titanium basket as claimed in claim 16, wherein the plurality of the anode titanium baskets comprises a first anode titanium basket and a second anode titanium basket, the first channel opening and the second channel opening of the channel of the first anode titanium basket are circular openings that are not connected to each other, andthe first channel opening and the second channel opening of the channel of the second anode titanium basket are circular openings connected to each other by a connection opening penetrating through the side surface of the second anode titanium basket.
  • 18. The anode titanium basket as claimed in claim 17, wherein the plurality of the anode titanium baskets further comprises a third anode titanium basket, the first channel opening and the second channel opening of the channel of the third anode titanium basket are circular openings connected to each other by a connection opening penetrating through the side surface of the third anode titanium basket,the first anode titanium basket is disposed between the second anode titanium basket and the third anode titanium basket, andthe connection opening of the second anode titanium basket and the connection opening of the third anode titanium basket in the same opening direction.
  • 19. The anode titanium basket as claimed in claim 16, wherein the plurality of the anode titanium baskets comprise a first anode titanium basket and a second anode titanium basket, the first channel opening and the second channel opening of the channel of the first anode titanium basket are circular openings connected to each other by a connection opening penetrating through the side surface of the first anode titanium basket,the first channel opening and the second channel opening of the channel of the second anode titanium basket are circular openings connected to each other by a connection opening penetrating through the side surface of the second anode titanium basket, andthe connection opening of the first anode titanium basket and the connection opening of the second anode titanium basket have different opening directions.
  • 20. The anode titanium basket as claimed in claim 19, wherein the plurality of the anode titanium baskets further comprises a third anode titanium basket, the first channel opening and the second channel opening of the channel of the third anode titanium basket are circular openings connected to each other by a connection opening penetrating through the side surface of 5 the third anode titanium basket,the first anode titanium basket is disposed between the second anode titanium basket and the third anode titanium basket, andthe connection opening of the second anode titanium basket and the connection opening of the third anode titanium basket have in same opening direction.
Priority Claims (1)
Number Date Country Kind
113143972 Nov 2024 TW national
CROSS REFERENCE TO RELATED APPLICATIONS

The present application is based on, and claims priority from, U.S. Provisional Application Ser. No. 63/612,502, filed on Dec. 20, 2023, and Taiwan Patent Application Serial Number 113143972, filed on Nov. 15, 2024, the disclosure of which are hereby incorporated by reference herein in their entirety.

Provisional Applications (1)
Number Date Country
63612502 Dec 2023 US