Number | Name | Date | Kind |
---|---|---|---|
3935349 | Terai et al. | Jan 1976 | |
3985629 | Kimura | Oct 1976 | |
4406757 | Huang | Sep 1983 | |
4439287 | Birkle et al. | Mar 1984 | |
4478689 | Loch | Oct 1984 | |
4481083 | Ball et al. | Nov 1984 | |
4507179 | Yoshida et al. | Mar 1985 | |
4539146 | Melody | Sep 1985 | |
4589925 | Young | May 1986 | |
4606796 | Hanazima | Aug 1986 |
Entry |
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F. A. Lowenheim, Electroplating, McGraw--Hill Book Co., New York, 1978, pp. 146-147, 452-463. |
IBM Technical Disclosure Bulletin, vol. 23, No. 8, Jan. 1981, pp. 3854-3856, A. Homola et al. |