1. Field of the Invention
The present invention relates to antennae used in wireless communication, adjustment methods for such antennae, and electronic devices in which such antennae are implemented.
2. Description of the Related Art
In recent years, electronic devices such as personal computers that are provided with wireless communication functionality, such as wireless LAN or Bluetooth®, are becoming widespread. Wireless communication over wireless LAN, Bluetooth, and so on is carried out using radio waves in, for example, the 2.5 GHz band, the 5 GHz band, or the like. A personal computer provided with such wireless communication functionality integrates an antenna for wireless communication; various types of antennae are used depending on the model of the computer, such as a dipole antenna, a helical antenna, a slot antenna, an inverted-F antenna, and so on.
Due to reductions in the sizes of electronic devices, it is becoming necessary to implement these various types of antennae in areas having limited amounts of space, and there is also a demand for reductions in the costs thereof. As a result, attempts are being made to reduce costs by implementing antennae as patterned shapes upon the boards of wireless module chips, rather than implementing the antennae separately.
However, in the case where an antenna is implemented in an electronic device such as a personal computer, the frequency characteristics of the antenna change depending on the components that are located in the periphery of the antenna. There is thus a problem in that the frequency characteristics obtained when the antenna is in a standalone state differ from the frequency characteristics obtained when the antenna is implemented. Thus far, configurations have been such that changes in the frequency characteristics of an antenna occurring due to the antenna being implemented in an electronic device are absorbed by the antenna. For example, desired frequency characteristics are achieved for an antenna when the antenna is implemented by using various methods, such as adjusting the shape of the antenna.
U.S. Pat. No. 5,483,249 discloses a technique for adjusting a resonation frequency by changing the position of a through-hole in order to adjust the length of the short stub portion of a radiating element that functions as a cavity resonator. The adjustment of the resonation frequency is carried out by changing the length of the stub that configures part of the radiating element.
Japanese Patent Laid-Open No. 09-162642 discloses a technique for adjusting a resonation frequency, in which multiple stubs having free ends are formed connected to a microstrip line-type resonator in advance, and are shorted through soldering in a state in which opening patterns are formed in the vicinities of the ends of the stubs; the resonating frequency is then adjusted by changing the capacities of the stubs connected to the resonator. Likewise, the adjustment of the resonation frequency is carried out by changing the length of the stub that configures part of the radiating element.
However, with the stated past methods of bringing a change in the frequency characteristics of an antenna, occurring when the antenna is implemented, in line with desired characteristics by adjusting the shape of the antenna, the environment in which the antenna is implemented differs depending on the type of electronic device, and thus the change in frequency characteristics occurring when the antenna is implemented is not always the same. There is thus a problem in that the same antenna cannot be used in different types of electronic devices.
The present invention provides a technique for enabling the same antenna to be used in different types of electronic devices while improving the reflection characteristics when the antenna is implemented.
According to one aspect of the present invention, there is provided an antenna used in wireless communication, comprising: a dielectric substrate; a ground conductor portion arranged upon the dielectric substrate; an antenna element including a radiating conductor portion arranged upon the dielectric substrate opposite to the ground conductor portion, a shorted conductor portion that connects the radiating conductor portion and the ground conductor portion, and a power supply unit adapted to supply a high-frequency current to the radiating conductor portion; and an open conductor portion connected at high frequencies to the ground conductor portion, wherein the open conductor portion is connected to the dielectric substrate so as to protrude by a predetermined length from the location of the ground conductor portion in a diagonal direction from the location where the ground conductor portion and the shorted conductor portion are connected.
According to one aspect of the present invention, there is provided an adjustment method for an antenna used in wireless communication, the antenna including: a ground conductor portion arranged upon a dielectric substrate; an antenna element including a radiating conductor portion arranged upon the dielectric substrate opposite to the ground conductor portion, a shorted conductor portion that connects the radiating conductor portion and the ground conductor portion, and a power supply unit adapted to supply a high-frequency current to the radiating conductor portion; and an open conductor portion connected at high frequencies to the ground conductor portion, and the adjustment method comprising: adjusting an input reflectance coefficient of the antenna element by changing a predetermined length by which the open conductor portion protrudes from the location of the ground conductor portion in a diagonal direction from the location where the ground conductor portion and the shorted conductor portion are connected in accordance with the length of the ground conductor portion in the direction in which the shorted conductor portion faces the ground conductor portion.
Further features of the present invention will be apparent from the following description of exemplary embodiments with reference to the attached drawings.
Exemplary embodiments of the present invention will now be described in detail with reference to the drawings. It should be noted that the relative arrangement of the components, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless it is specifically stated otherwise.
(First Embodiment)
The antenna element 101 is a typical inverted-F antenna, and includes a shorted conductor portion 100, a power supply point 102, and a radiating conductor portion 103. The shorted conductor portion 100 connects the radiating conductor portion 103 and the ground conductor portion 105. The power supply point 102 is a power supply unit that supplies a high-frequency signal (a high-frequency current) to the antenna element 101 at a single point. The radiating conductor portion 103 is arranged opposite to the ground conductor portion 105 with a space provided therebetween. This space may be constant, and in such a case the radiating conductor portion 103 and the ground conductor portion 105 are arranged parallel to each other. Meanwhile, the end that is opposite to the point where the radiating conductor portion 103 and the shorted conductor portion 100 are connected is an open end 111 that is open at high frequencies to the power supply point 102. The dielectric substrate 104 is a board for implementing the antenna element 101, and electronic components such as integrated chips and the like are provided thereupon in addition to the aforementioned constituent elements. The ground conductor portion 105 has an electric length that is less than or equal to ¼ the wavelength of a usage frequency. The ground conductor portion 105 is formed upon the dielectric substrate as a conductive pattern, as a plate-shaped metal sheet, or the like. In the example shown in
The attachment position of the open conductor portion 106 is, when viewed from the shorted conductor portion 100 provided in the antenna element 101, a position that is in the diagonal direction of the ground conductor portion 105 (an end portion position), as indicated by the broken-line arrow A. Grounding is carried out through the attachment hole 107 using a screw or the like. The connector 110 is a connector for supplying signals to the main body of the electronic device or the wireless module chip 109.
Here, it is generally necessary for the electric length of the ground conductor portion 105 on the dielectric substrate 104 (that is, the length in the direction that opposes the radiating conductor portion 103) to be greater than or equal to λ/4 in order to cause the antenna element 101 to resonate with a sufficient reflectance coefficient in an operating frequency. Here, λ indicates the wavelength of the center frequency in the operating frequency band.
In other words, normally, if an electrical length greater than or equal to λ/4 cannot be secured for the ground portion 105 on the dielectric substrate 104 on which the antenna element 101 is implemented, sufficient input reflection characteristics cannot be obtained for the antenna element 101.
For example, assuming a wireless LAN having a usage frequency band of 2 GHz, and assuming 2.45 GHz for the center frequency of the usage frequency band, λ/4 is approximately 30 mm. Sufficient reflection characteristics can be attained for the antenna element 101 accordingly, if Lb is a length greater than or equal to 30 mm. However, in the case where, for example, only approximately 18 mm can be ensured for Lb, reflection characteristics as indicated by the two-sided arrow in the Smith chart in
VSWR (voltage standing wave ratio) and RL (return loss) exist as indicators of reflection characteristics, and closer distances from the center in the Smith chart indicate better reflection characteristics. A VSWR that is less than 2.0 and a RL less than −9.5 dB are normally required for the reflection characteristics of an antenna. A relationship between the voltage standing wave ratio VSWR and the return loss RL is illustrated hereinafter.
fl, fc, and fu in
Operations carried out when the open conductor portion 106 is attached to the dielectric substrate 104 will be described with reference to
Operations carried out when the open conductor portion 106 is attached to the dielectric substrate 104 will be described with reference to
Operations carried out when the open conductor portion 106 is attached to the dielectric substrate 104 will be described with reference to
As described thus far, the length Ls of the open conductor portion 106 is changed in accordance with the length Lb of the ground conductor portion 105 on the dielectric substrate 104. For example, the length Ls of the open conductor portion 106 is changed in an inverse proportion to the length Lb of the ground conductor portion 105 on the dielectric substrate 104. As a result, when the wavelength of the usage frequency is taken as λ, even in the case where a length of greater than or equal to λ/4 cannot be ensured for the length Lb of the ground conductor portion 105 upon the dielectric substrate 104, adjusting the length of Ls in accordance with the length of Lb makes it possible to improve the input reflection characteristics of the antenna element 101 without changing the pattern of the antenna element 101, changing the matching element, and so on.
Next, changes in the input reflection characteristics of the antenna element 101 in the case where the attachment angle of the open conductor portion 106 relative to the dielectric substrate 104 has been changed will be described with reference to
In
Next, operations carried out when the open conductor portion 106 is attached in a 5 GHz band will be described with reference to
The respective points in the Smith chart shown in
Operations carried out when the open conductor portion 106 is attached to the dielectric substrate 104 will be described with reference to
The respective points in the Smith chart shown in
Next, operations carried out when the open conductor portion 106 is attached to the dielectric substrate 104 will be described with reference to
The respective points in the Smith chart shown in
Next, changes in the input reflection characteristics of the antenna element 101 in a 5 GHz band in the case where the attachment angle of the open conductor portion 106 relative to the dielectric substrate 104 has been changed will be described with reference to
In Table 5, it can be seen that when the angle θ is 0°, the open conductor portion 106 overlaps with the ground conductor portion 105, and the state is equivalent to a state in which the open conductor portion 106 is not present. Accordingly, there is a high reflectance from the input of the antenna element 101, resulting in an RL of −7.0 dB; it is thus not possible to ensure conditions in which the VSWR is less than 2.0 (the RL is less than −9.5 dB). However, it can be seen that the reflection characteristics are improved by increasing the angle θ. Based on Table 5, it can be seen that if the range of the angle θ corresponds to 30°<θ<180°, the conditions where the VSWR is less than 2.0 are fulfilled.
Although the above descriptions discuss the configuration in which the adjustment of the angle θ and the adjustment of the length Ls of the open conductor portion 106 are carried out separately, it should be noted that the condition in which the antenna element 101 reflectance coefficient has a VSWR of less than 2.0 may be fulfilled by adjusting both the angle θ and the length Ls of the open conductor portion 106.
As described thus far, the input reflection characteristics of the antenna element 101 are improved by setting the open conductor 106 to a desired length in accordance with the length of the ground portion 105 in the dielectric substrate 104.
Next, working examples of cases in which the same antenna is used across multiple different devices will be described.
In the case where the dielectric substrates are implemented in devices as described here, favorable reflection characteristics are not obtained for the antenna elements that are implemented on the respective dielectric substrates. Because the dielectric substrate ground length differs for each device in which the antenna is implemented, it is necessary to change the pattern length of the antenna element for each device, change the matching element for each device, or the like.
In such a case, the reflection characteristics of the antenna element can be improved by adjusting the length of the open conductor, which is a feature of the present invention, on a device-by-device basis, in accordance with the length of the ground portion of the dielectric substrate implemented in the device, as has been described thus far.
Furthermore, the dielectric substrate 104 shown in
Accordingly, the adjustment of the reflection characteristics of the antenna is carried out by sliding the open conductor that protrudes from the end of the dielectric substrate 502 in the direction of the arrow, thereby changing the length Ls.
As a result, the reflection characteristics are adjusted to the optimal reflection characteristics by changing the length Ls of the open conductor that protrudes from the ground end portion of the dielectric substrate in accordance with the ground length of the dielectric substrate 502 that is implemented in that particular type of device.
As described thus far, according to the present invention, the reflection characteristics of an antenna element can be improved without changing the shape of the antenna element, changing the matching element, and so on, which makes it possible to obtain favorable characteristics in different models of devices using the same antenna. It is therefore extremely easy to manufacture and manage the antenna, which also makes it possible to reduce costs.
(Second Embodiment)
According to the present invention, it is possible to use the same antenna across different models of electronic devices, while improving the reflection characteristics obtained when the antenna is in an implemented state.
(Other Embodiments)
Aspects of the present invention can also be realized by a computer of a system or apparatus (or devices such as a CPU or MPU) that reads out and executes a program recorded on a memory device to perform the functions of the above-described embodiments, and by a method, the steps of which are performed by a computer of a system or apparatus by, for example, reading out and executing a program recorded on a memory device to perform the functions of the above-described embodiments. For this purpose, the program is provided to the computer for example via a network or from a recording medium of various types serving as the memory device (e.g., computer-readable storage medium).
While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.
This application claims the benefit of Japanese Patent Application Nos. 2010-273018 filed on Dec. 7, 2010 and 2011-219566 filed on Oct. 3, 2011, which are hereby incorporated by reference herein in their entirety.
Number | Date | Country | Kind |
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2010-273018 | Dec 2010 | JP | national |
2011-219566 | Oct 2011 | JP | national |
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7026999 | Umehara et al. | Apr 2006 | B2 |
7755545 | Takei et al. | Jul 2010 | B2 |
7777682 | Yagi | Aug 2010 | B2 |
7796086 | Coskun et al. | Sep 2010 | B2 |
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Number | Date | Country |
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07-193419 | Jul 1995 | JP |
09-162642 | Jun 1997 | JP |
Number | Date | Country | |
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20120139803 A1 | Jun 2012 | US |