The present disclosure relates to the technical field of antennas, and in particular to an antenna assembly and an electronic device.
With the progress of science and technology, wireless communication technology is applied in most electronic devices. A wireless data transmission function in electronic devices needs supports of radio frequency equipment. A performance of the radio frequency equipment directly determines a communication mode capable of being supported by electronic devices and the strength stability of received signals.
As a unit for receiving and transmitting electromagnetic waves in radio frequency equipment, antennas cannot efficiently radiate electromagnetic waves in a whole electronic device due to interferences of a power supply, a display screen, a communication module on a main board, cables and other equipment. Meanwhile, electromagnetic waves of omnidirectional radiation of the antenna will also interfere with a performance of display screen and cause the display screen to flash, or interfere with other electronic devices in the electronic equipment.
In a conventional technology, interference sources other than antenna are mostly shielded, such as a power supply, a main board, a transmission module and other equipment. However, an interference noise will also interfere with a coaxial transmission line between the antenna and a radio frequency chip, or the interference noise will reflect and refract through a metal rear cover of the whole machine, and finally affect the antenna, which cannot fundamentally solve the problem that the antenna is interfered by radiation, and adding a metal shielding cover to the equipment other than the antenna will also increase assembly cost.
An objective of embodiments of the present disclosure is to provide an antenna assembly and an electronic device, so as to solve a problem that the prior art cannot fundamentally solve problems of radiation interference to the antenna and high assembly cost.
In order to achieve this objective, embodiments of the present disclosure adopt the following technical solution:
A first aspect provides an antenna assembly, comprising:
In a second aspect, an embodiment of the present disclosure provides an electronic device, the electronic device includes a display screen, a frame arranged around the display screen, and an antenna assembly according to the first aspect, the antenna assembly is located in the electronic device and connected with the frame, wherein a surface of the dielectric substrate in the antenna assembly without the metal shielding cover faces the frame.
For the antenna assembly of embodiments of the present disclosure, the antenna unit and the radio frequency chip are arranged on the same dielectric substrate and are provided with a metal shielding cover. Firstly, the metal shielding cover is arranged on the surface of the dielectric substrate facing away from the antenna unit and covers the antenna unit, which can isolate, through the metal shielding cover, electromagnetic interference to the antenna unit caused by other electronic equipment of the electronic device. Secondly, the antenna unit and the radio frequency chip are arranged on the same dielectric substrate, which avoids the use of a coaxial cable to connect the antenna unit and the radio frequency chip, thereby fundamentally solving the problem of electromagnetic interference to the antenna unit and ensuring the radiation performance of the antenna unit. Thirdly, the metal shielding cover is arranged on the surface of the dielectric substrate facing away from the antenna unit, and after the antenna assembly is installed on the electronic device, the electromagnetic wave radiated by the antenna unit to a direction of the metal shielding cover is shielded by the metal shielding cover, and the electromagnetic wave radiated by the antenna unit radiates to the outside of the electronic device. Thus, the electromagnetic wave radiated by the antenna unit will not interfere with the display screen and cause the display screen to flash, nor will it interfere with other electronic equipment inside the electronic device. Finally, other electronic equipment in electronic devices does not need to be equipped with shielding covers, which reduces the manufacturing cost of electronic device.
The present disclosure will be described in further detail hereinafter according to the accompanying drawings and embodiments.
In drawings:
1. Dielectric substrate, 2. Antenna unit, 21. First antenna unit, 211. First feeding stub, 212. First short-circuited stub, 213. First stub; 214. L-shaped stub, 215. First parasitic stub, 22. Second antenna unit, 221. Main body; 222. Second short-circuited stub, 223. Second feeding stub, 224. Second stub, 225. Third stub, 226. Second parasitic stub, 227. Fourth stub, 228. L-shaped fed, 23. Third antenna unit, 24. Fourth antenna unit, 3. Metal shielding cover, 4. Radio frequency chip, 41. First radio frequency chip, 42. Second radio frequency chip, 5. Coplanar waveguide transmission line, 51. First coplanar waveguide fed, 52. First coplanar waveguide ground plane, 53. Second coplanar waveguide fed, 54. Second coplanar waveguide ground plane, 55. Third coplanar waveguide fed, 56. Fourth coplanar waveguide fed, 6. Shielding ground plane, 7. Ground plane, 8. Metal via, 100. Electronic device, 101. Display screen, 102. Frame, 1021. Lower frame, 10211. Pocket hole, 103. Antenna assembly, 104. Decorative part.
In order to make clearer the technical problems to be solved, the technical solutions to be adopted and the technical effects to be achieved by the present disclosure, the technical solutions of embodiments of the present disclosure will be further described in detail hereinafter in combination with the accompanying drawings. The described embodiments are only a part of embodiments of the present disclosure, not all of the embodiments of the present disclosure. Based on the embodiments of the present disclosure, all other embodiments obtained by those skilled in the art without creative work belong to the claimed scope of the present disclosure.
In the description of the present disclosure, unless otherwise specified and limited, the terms “connected with,” “connected,” and “fixed” should be interpreted broadly. For example, they can be fixedly connected, detachably connected, or integrated. Or, it can be a mechanical connection or an electrical connection. Or, it can be directly connected or indirectly connected through an intermediate medium. Or, it can be the connection between two components or the interaction relationship between two components. For those skilled in the art, the concrete meaning of the above-mentioned terms in the present disclosure can be understood under concrete circumstances.
In the present disclosure, unless expressly stipulated and defined otherwise, a first feature being “above” or “below” a second feature may include that the first feature directly contacts with the second feature, or may include that the first feature does not directly contact with the second feature, rather than contact through another feature therebetween. Moreover, the first feature being “above,” “over,” or “on” the second feature may include that the first feature is directly above and obliquely above the second feature, or simply means that the level of the first feature is higher than that of the second feature. The first feature being “below,” “under,” and “underneath” the second feature includes that the first feature is directly below and obliquely below the second feature, or simply means that the level of the first feature is smaller than that of the second feature.
As shown in
Thereinto, the dielectric substrate 1 may be a PCB board of the antenna assembly, the antenna unit 2 may be a unit that radiates electromagnetic waves, and the antenna unit 2 may be a metal sheet with a preset shape printed on the surface of the dielectric substrate 1, for example, a copper sheet with various shapes printed on the surface of the dielectric substrate 1. Thereinto, the antenna unit 2 may be electrically connected with the radio frequency chip 4 through a transmission line. For example, an electrical connection between the antenna unit 2 and the radio frequency chip 4 is realized through a transmission line printed on the dielectric substrate 1. The metal shielding cover 3 can be a cover body obtained by stamping a plate of metal materials such as stainless steel and galvanized steel. The metal shielding cover 3 can cover the antenna unit 2 and is provided with an opening for the antenna unit 2 to radiate and receive electromagnetic waves.
As shown in
For the antenna assembly of embodiments of the present disclosure, the antenna unit and the radio frequency chip are arranged on the same dielectric substrate and are provided with a metal shielding cover. Firstly, the metal shielding cover is arranged on the surface of the dielectric substrate facing away from the antenna unit and covers the antenna unit, which can isolate, through the metal shielding cover, electromagnetic interference to the antenna unit caused by other electronic equipment of the electronic device. Secondly, the antenna unit and the radio frequency chip are arranged on the same dielectric substrate, which avoids the use of a coaxial cable to connect the antenna unit and the radio frequency chip, thereby fundamentally solving the problem of electromagnetic interference to the antenna unit and ensuring the radiation performance of the antenna unit. Thirdly, the metal shielding cover is arranged on the surface of the dielectric substrate facing away from the antenna unit, and after the antenna assembly is installed on the electronic device, the electromagnetic wave radiated by the antenna unit to a direction of the metal shielding cover is shielded by the metal shielding cover, and the electromagnetic wave radiated by the antenna unit radiates to the outside of the electronic device. Thus, the electromagnetic wave radiated by the antenna unit will not interfere with the display screen and cause the display screen to flash, nor will it interfere with other electronic equipment inside the electronic device. Finally, other electronic equipment in electronic devices does not need to be equipped with shielding covers, which reduces the manufacturing cost of electronic device.
In an embodiment of the present disclosure, the number of antenna units 2 can be one or more, and the antenna unit 2 and the radio frequency chip 4 can be connected through a microstrip transmission line or a coplanar waveguide transmission line, wherein the microstrip transmission line can be suitable for a circuit with a relatively narrow bandwidth of the microwave band, and the circuit structure of the microstrip transmission line is simple, which is insensitive to the processing technology and the thickness and thickness difference of copper layer, and has a low manufacturing cost. The grounded coplanar waveguide transmission line has a good anti-interference performance and relatively low radiation loss in high frequency band, and is able to achieve good suppression of high order modes, which makes the grounded coplanar waveguide transmission line suitable for transmission in high frequency band of 30 GHz and above.
In one embodiment, the microstrip transmission line or the coplanar waveguide transmission line can be further provided with an impedance matching circuit, for example, a it-type matching circuit. By arranging the impedance matching circuit, a frequency of the antenna assembly can be adjusted after the frequency deviation, and furthermore, the antenna assembly can be matched with an active device so as to enhance the overall radiation performance of the antenna assembly.
In another embodiment, the antenna unit 2 and the radio frequency chip 4 can be arranged on different surfaces of the dielectric substrate 1, and the radio frequency chip 4 can be connected with the transmission line through a metal via, which can make full use of the space on both surfaces of the dielectric substrate 1 to arrange the radio frequency chip 4 and the antenna unit 2, thereby reducing an area of the dielectric substrate 1, and being applicable to a scene where the space of the whole electronic device is limited, so that the antenna unit 2 and the radio frequency chip 4 cannot be arranged on the same surface of the dielectric substrate 1.
Obviously, the antenna unit 2 and the radio frequency chip 4 can also be arranged on the same surface of the dielectric substrate 1. Pins of the radio frequency chip 4 can be directly connected with the transmission line without arranging a metal via on the dielectric substrate 1, which reduces the manufacturing cost of the dielectric substrate 1, and meanwhile, it is also applicable to a scene where the antenna unit 2 and the radio frequency chip 4 are arranged on the same surface of the dielectric substrate 1 due to a limited space on the whole electronic device. In practical application, those skilled in the art can arrange the antenna unit 2 and the radio frequency chip 4 on the same surface or on different surfaces according to the actual needs, which is not limited by the embodiment of the present disclosure.
In practical application, the metal shielding cover 3 can be connected with the dielectric substrate 1 by welding, buckle, locking screw, etc. In one embodiment, the contact surface between the metal shielding cover 3 and the dielectric substrate 1 can further be provided with conductive fabric so as to improve the electromagnetic shielding performance of the metal shielding cover 3.
In an embodiment, a distance from a bottom portion of the metal shielding cover 3 to the antenna unit 2 is equal to one fourth of a wavelength of the electromagnetic wave radiated by the antenna unit 2. As shown in
Hereinafter, a structure of the antenna unit 2 and a routing of the transmission line in the embodiment of the present disclosure will be described by taking an example in which the number of antenna units 2 are two and a coplanar waveguide transmission line serves as the transmission line.
As shown in
As shown in
As shown in
It should be noted that when the first radio frequency chip 41 and the antenna unit 2 are arranged on the same surface of the dielectric substrate 1, the pins of the first radio frequency chip 41 can be directly connected with the first coplanar waveguide fed 51 and the second coplanar waveguide fed 53. When the first radio frequency chip 41 and the antenna unit 2 are arranged on different surfaces of the dielectric substrate 1, the pins of the first radio frequency chip 41 can be connected with the first coplanar waveguide fed 51 and the second coplanar waveguide fed 53 through a metal via.
As shown in
It should be noted that although the structure of the first antenna unit 21 is illustrated in combination with
As shown in
In
As shown in
It should be noted that although the structure of the second antenna unit 22 is illustrated in combination with
As shown in
Although the above example illustrates the structure of the antenna unit 2 and the structure and routing of the transmission line, in which the antenna unit 2 includes two antenna units and the transmission line is a coplanar waveguide transmission line, in practical application, those skilled in the art can, according to actual needs, set the number of antenna units 2, design antenna units with different structures, and lay out different transmission lines. The embodiments of the present disclosure do not limit the number and structure of antenna units, nor do they limit the structure and routing mode of transmission lines.
The antenna assembly of an embodiment of the present disclosure includes the first antenna unit 21, the second antenna unit 22, the third antenna unit 23, the fourth antenna unit 24, the first radio frequency chip 41, and the second radio frequency chip 42. The second radio frequency chip 42 is located on the side of the first radio frequency chip 41 away from the first antenna unit 21. The third antenna unit 23 and the fourth antenna unit 24 are located on the side of the second radio frequency chip 42 away from the first radio frequency chip 41, and the third antenna unit 23 is located between the second radio frequency chip 42 and the fourth antenna unit 24. For one thing, the antenna assembly includes a first group of antennas units (the first antenna unit 21 and the second antenna unit 22) and a second group of antenna units (the third antenna unit 23 and the fourth antenna unit 24), which can realize a wireless Access Point (AP) function. Moreover, there are two radio frequency chips (the first radio frequency chip 41 and the second radio frequency chip 42) between the first group of antennas units (the first antenna unit 21 and the second antenna unit 22) and the second group of antenna units (the third antenna unit 23 and the fourth antenna unit 24). The distance between the two groups of antennas is large, the isolation of the two groups of antennas is high, and the area of the whole antenna assembly is small.
The antenna assembly of an embodiment of the present disclosure includes the first antenna unit 21, the second antenna unit 22, the third antenna unit 23, the fourth antenna unit 24, the first radio frequency chip 41, and the second radio frequency chip 42. The second radio frequency chip 42 is located on the side of the first radio frequency chip 41 away from the first antenna unit 21. The third antenna unit 23 and the fourth antenna unit 24 are located between the second radio frequency chip 42 and the first radio frequency chip 41. For one thing, the antenna assembly includes a first group of antennas units (the first antenna unit 21 and the second antenna unit 22) and a second group of antenna units (the third antenna unit 23 and the fourth antenna unit 24), which can realize a wireless AP function. Moreover, by increasing a distance between the first group of antennas units (the first antenna unit 21 and the second antenna unit 22) and the second group of antenna units (the third antenna unit 23 and the fourth antenna unit 24), the isolation of the two groups of antennas is increased, and the area of the dielectric substrate is increased, which is applicable to a scene where the installation space of antenna assembly is not limited.
As shown in
Specifically, the display screen 101 can be one of LCD, LED, OLED, and other displays. The frame 102 can be a frame surrounding the periphery of the display screen 101. The frame 102 has a certain thickness in the direction perpendicular to the direction of the display screen 101, so that the antenna assembly 103 can be installed on the frame 102. In an embodiment, the number of antenna assemblies 103 can be one or more.
In the electronic device of embodiments of the present disclosure, the antenna unit and the radio frequency chip of the antenna assembly are arranged on the same dielectric substrate, and a metal shielding cover is provided, the antenna assembly is located in the electronic device and connected with the frame, and a surface of the dielectric substrate in the antenna assembly without the metal shielding cover faces the frame. Firstly, the metal shielding cover is arranged on the surface of the dielectric substrate facing away from the antenna unit and covers the antenna unit, which can isolate, through the metal shielding cover, electromagnetic interference to the antenna unit caused by other electronic equipment of the electronic device. Secondly, the antenna unit and the radio frequency chip are arranged on the same dielectric substrate, which avoids the use of a coaxial cable to connect the antenna unit and the radio frequency chip, thereby fundamentally solving the problem of electromagnetic interference to the antenna unit and ensuring the radiation performance of the antenna unit. Thirdly, the metal shielding cover is arranged on the surface of the dielectric substrate facing away from the antenna unit, and after the antenna assembly is installed on the electronic device, the electromagnetic wave radiated by the antenna unit to a direction of the metal shielding cover is shielded by the metal shielding cover, and the electromagnetic wave radiated by the antenna unit radiates to the outside of the electronic device. Thus, the electromagnetic wave radiated by the antenna unit will not interfere with the display screen and cause the display screen to flash, nor will it interfere with other electronic equipment inside the electronic device. Finally, other electronic equipment in electronic devices does not need to be equipped with shielding covers, which reduces the manufacturing cost of electronic device.
Further, the number of antenna units in the antenna assembly can be one or more, the antenna unit and the radio frequency chip can be arranged on the same surface or different surfaces of the dielectric substrate, and the electronic device can select the antenna assembly according to the installation space, radiation performance, and radiation direction of the antenna assembly.
As shown in
The antenna assembly of the embodiment of the present disclosure is located in the lower frame of the electronic device, and the surface of the dielectric substrate 1 in the antenna assembly without a metal shield faces the bottom surface of the lower frame. For one thing, the lower frame has enough installation space to facilitate the installation of the antenna assembly. For another, the lower frame of the electronic device is closer to the user, and the antenna assembly is located in the lower frame with a wide radiation area, which improves the performance of the wireless network of electronic devices.
In one embodiment, the electronic device 100 further includes a decorative part 104. The decorative part 104 covers the pocket hole 10211 to prevent the pocket hole 10211 from directly exposing the dielectric substrate 1 of the antenna assembly 103, so that the electronic device 100 has a good appearance.
In the explanation of this description, the description with reference to the terms “embodiment,” “example,” etc. means that the concrete feature, structure, material. or characteristic described in conjunction with the embodiment or example is included in at least one embodiment or example of the present application. In this description, the schematic representation of the above-mentioned terms does not necessarily refer to the same embodiment or example.
In addition, it should be understood that although this description is described in accordance with the implementations, each implementations may include more than one technical solution. This description in the present application is only for clarity of the device, those skilled in the art should regard the description as a whole, and the technical solutions in the various embodiments can also be appropriately combined to form other implementations that can be understood by those skilled in the art.
The technical principle of the present disclosure is described above in combination with concrete embodiments. These descriptions are only for the purpose of explaining the principles of the present disclosure and cannot be interpreted in any way as limiting the claimed scope of the present disclosure. Based on the explanation herein, those skilled in the art can associate other concrete embodiments of the present disclosure without creative labor, which will fall within the claimed scope of the present disclosure.
The present application is a continuation of International Application No. PCT/CN2020/128393, filed on Nov. 12, 2020, which is incorporated herein by reference in its entirety.
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10074904 | Tomonari | Sep 2018 | B2 |
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20190267718 | Rajagopalan | Aug 2019 | A1 |
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20210351503 | Miyagawa | Nov 2021 | A1 |
Number | Date | Country |
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203339295 | Dec 2013 | CN |
207460737 | Jun 2018 | CN |
110828978 | Feb 2020 | CN |
210865410 | Jun 2020 | CN |
210926315 | Jul 2020 | CN |
0346125 | Dec 1989 | EP |
Entry |
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A Short Circuit Multi-frequency Space Micro-strip Antenna—CN203339295 U, Chen et al. (Year: 2013). |
Number | Date | Country | |
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20220320724 A1 | Oct 2022 | US |
Number | Date | Country | |
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Parent | PCT/CN2020/128393 | Nov 2020 | WO |
Child | 17846308 | US |