The present disclosure relates generally to an antenna assembly.
Antennas can be used to facilitate wireless communication between devices. It can be desirable for antennas to operate with a high antenna radiation efficiency to improve wireless communication between devices. Antennas may need to be incorporated into a variety of different types of devices to provide for wireless communication. With the advance of medical device technology, antennas are being incorporated into a variety of different medical devices, such as implanted devices, such as small, implanted devices.
Aspects and advantages of embodiments of the present disclosure will be set forth in part in the following description, or may be learned from the description, or may be learned through practice of the embodiments.
One example embodiment of the present disclosure is directed to an antenna assembly. The antenna assembly includes a circuit board having a communication circuit. The antenna assembly further includes an antenna at least partially surrounding the circuit board. The antenna assembly further includes a conductive epoxy coupled to the antenna to establish an electrical connection between the communication circuit and the antenna.
Another example embodiment of the present disclosure is directed to a medical device. The medical device includes a housing. The medical device further includes an antenna assembly disposed in the housing. The antenna assembly includes a circuit board having a communication circuit. The antenna assembly further includes an antenna at least partially surrounding the circuit board. The antenna assembly further includes a conductive epoxy coupled to the antenna to establish an electrical connection between the communication circuit and the antenna.
These and other features, aspects and advantages of various embodiments will become better understood with reference to the following description and appended claims. The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the present disclosure and, together with the description, serve to explain the related principles.
Detailed discussion of embodiments directed to one of ordinary skill in the art are set forth in the specification, which refers to the appended figures, in which:
Reference now will be made in detail to embodiments, one or more examples of which are illustrated in the drawings. Each example is provided by way of explanation of the embodiments, not limitation of the present disclosure. In fact, it will be apparent to those skilled in the art that various modifications and variations can be made to the embodiments without departing from the scope or spirit of the present disclosure. For instance, features illustrated or described as part of one embodiment can be used with another embodiment to yield a still further embodiment. Thus, it is intended that aspects of the present disclosure cover such modifications and variations. As used herein, the use of the term “about” in conjunction with a numerical value is intended to refer to within 10% of the numerical value.
Example aspects of the present disclosure are directed to an antenna assembly for use in, for instance, a medical device, such as an implanted medical device, such as a dental implant. Integrating antennas into devices that are worn or placed near a human body can pose challenges due to degradation of RF signals by the human body. Due to the small nature of medical devices, connecting an antenna to communication circuitry on a printed circuit board may pose challenges. For instance, due to the small nature of certain medical devices (e.g., devices having a longest dimension of less than about 20 mm), using solder to connect an antenna to a printed circuit board may be difficult as the solder may be exposed to other components of the device, leading to anomalies and malfunctioning of the device.
According to example embodiments of the present disclosure, an antenna assembly may include an antenna. The antenna may be a laser direct structuring (LDS) antenna, a stamped metal antenna, or other suitable antenna. The antenna may have a shape such that the antenna is disposed around a peripheral portion of the device. The antenna may be disposed at least partially around a printed circuit board, such as around at least 90% of the printed circuit board, such as at least 80% of the printed circuit board, such as at least 75% of the printed circuit board. The printed circuit board may include a communication circuit (e.g., transmission line, transceiver, receiver, transmitter, front end module, matching circuit, etc.) to facilitate communication of information over the antenna. At least a portion of the antenna may be co-planar with the printed circuit board.
In some embodiments, the antenna may be coupled to the communication circuitry using a metal contact. In some embodiments, the metal contact may be an L-shaped metal contact. The L-shaped metal contact may have a first leg and a second leg. In some embodiments, the first leg may have a longer length dimension (e.g., long dimension) relative to the second leg. Alternatively, the first leg may have a shorter length dimension relative to the second leg, or a length dimension that is the same as the length dimension of the second leg. The second leg of the L-shaped metal contact may be coupled to or on the printed circuit board. The first leg of the L-shaped metal contact may extend to the antenna.
The antenna may be coupled to the metal contact using a conductive epoxy. In some examples, the housing of the device (e.g., medical device) may include a cavity or recess. The cavity or recess may accommodate the conductive epoxy to couple the antenna to the metal contact. The conductive epoxy may be, for instance, an electrically conductive epoxy adhesive. The conductive epoxy may include, for instance, conductive fillers (e.g., particles, flakes) in an epoxy matrix. The conductive fillers may be, for instance, silver or other metal or electrically conductive material.
The conductive epoxy may couple the L-shaped metal contact to the antenna to establish an electrical connection between the communication circuit and the antenna. The electrical connection, in some embodiments, may be a solder free connection.
In some embodiments, the antenna may be coupled extend at least partially through the circuit board. For instance, the antenna may extend at least partially into a recess (e.g., a through hole) defined in the printed circuit board. The recess (e.g., through hole) may include a conductive epoxy to establish an electrical connection between the antenna and a communication circuit on the circuit board.
Referring now to
In some embodiments, housing 150 has a length 150.1 (e.g., long dimension) of less than about 20 mm. As shown in
Antenna assembly 100 further includes an antenna 110. While antenna 110 is depicted in
Antenna assembly 100 may further include a conductive epoxy 130. Conductive epoxy 130 may be coupled to antenna 110 to establish an electrical connection between circuit board 120 (e.g., communication circuit of circuit board 120) and antenna 110. The conductive epoxy 130 may be, for instance, an electrically conductive epoxy adhesive. The conductive epoxy 130 may include, for instance, conductive fillers (e.g., particles, flakes) in an epoxy matrix. The conductive fillers may be, for instance, silver or other metal or electrically conductive material. In some embodiments, antenna 110 may be coupled to the communication circuitry of the circuit board 120 using a contact 140 (e.g., metal contact, L-shaped metal contact).
As shown in
Referring now to
As previously described, a portion of antenna 110 may be co-planar with the printed circuit board 120. In some embodiments, antenna 110 may be defined as including a first portion 113 and a second portion 115. As shown in
Referring now to
As shown in
Antenna assembly 500 further includes an antenna 510. While antenna 510 is depicted in
Antenna assembly 500 further includes a conductive epoxy 530. Conductive epoxy 530 may be coupled to antenna 510 to establish an electrical connection between circuit board 520 (e.g., communication circuit of circuit board 520) and antenna 510. The conductive epoxy 530 may be, for instance, an electrically conductive epoxy adhesive. The conductive epoxy 530 may include, for instance, conductive fillers (e.g., particles, flakes) in an epoxy matrix. The conductive fillers may be, for instance, silver or other metal or electrically conductive material.
In some embodiments, housing 150, along with antenna assembly 500, may be a medical device, such as an implanted medical device, such as a dental implant. As such,
Referring now to
Referring now to
One example embodiment of the present disclosure is directed to an antenna assembly. The antenna assembly includes a circuit board having a communication circuit. The antenna assembly further includes an antenna at least partially surrounding the circuit board. The antenna assembly further includes a conductive epoxy coupled to the antenna to establish an electrical connection between the communication circuit and the antenna.
In some examples, the antenna is an LDS antenna.
In some examples, the antenna assembly further includes an L-shaped metal contact extending between the circuit board and the antenna, wherein the conductive epoxy is coupled to the L-shaped metal contact.
In some examples, the L-shaped metal contact comprises a first leg and a second leg, the first leg having a longer length than the second leg.
In some examples, the second leg is on the circuit board.
In some examples, the first leg extends to the antenna.
In some examples, the antenna is a stamped metal antenna.
In some examples, at least a portion of the antenna extends at least partially through the circuit board in a recess defined in the circuit board.
In some examples, the conductive epoxy is disposed at least partially in the recess.
In some examples, the recess is a through hole extending entirely through the circuit board.
In some examples, the antenna assembly is disposed in a housing.
In some examples, the housing is associated with a medical device.
In some examples, the housing is associated with a dental implant.
In some examples, the housing has a long dimension of less than about 20 mm.
Another example embodiment of the present disclosure is directed to a medical device. The medical device includes a housing. The medical device further includes an antenna assembly disposed in the housing. The antenna assembly includes a circuit board having a communication circuit. The antenna assembly further includes an antenna at least partially surrounding the circuit board. The antenna assembly further includes a conductive epoxy coupled to the antenna to establish an electrical connection between the communication circuit and the antenna.
In some examples, the medical device is an implanted medical device.
In some examples, the medical device is a dental implant.
In some examples, the housing has a long dimension of less than about 20 mm.
In some examples, the antenna is an LDS antenna.
In some examples, the antenna is a stamped metal antenna.
While the present subject matter has been described in detail with respect to specific example embodiments thereof, it will be appreciated that those skilled in the art, upon attaining an understanding of the foregoing may readily produce alterations to, variations of, and equivalents to such embodiments. Accordingly, the scope of the present disclosure is by way of example rather than by way of limitation, and the subject disclosure does not preclude inclusion of such modifications, variations and/or additions to the present subject matter as would be readily apparent to one of ordinary skill in the art.
The present application is based on and claims priority to U.S. Provisional Application 63/506,488 having a filing date of Jun. 6, 2023, which is incorporated by reference herein.
Number | Date | Country | |
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63506488 | Jun 2023 | US |