This application is based upon and claims the benefit of priority from Japanese Patent Application No. 2023-124491, filed on Jul. 31, 2023; the entire contents of which are incorporated herein by reference.
Embodiments described herein relate generally to an antenna device and a method for manufacturing the same.
For example, it is desired to improve the characteristics of an antenna device.
According to one embodiment, an antenna device includes a first structure, a second structure, a third structure, a signal line, a first resin member, and a first intermediate member. The first structure includes a first insulating member, a first conductive layer, and a first connecting conductive member. The first connecting conductive member pierces the first insulating member along a first direction. The first connecting conductive member includes a first cylindrical portion along the first direction. The first connecting conductive member is electrically connected to the first conductive layer. The second structure includes a second insulating member, a second conductive layer, and a second connecting conductive member. The second connecting conductive member pierces the second insulating member along the first direction. The second connecting conductive member is electrically connected to the second conductive layer. At least a part of the second insulating member is provided between the second conductive layer and the first conductive layer. At least a part of the first insulating member is provided between the second insulating member and the first conductive layer. The signal line is provided between the second insulating member and the first insulating member. The first resin member includes a first resin region and a second resin region. The first resin region is provided between the first structure and the second structure. The second resin region is provided in at least a part of a first space in the first cylindrical portion. The third structure includes a third insulating member and a third conductive layer. The first structure is provided between the second structure and the third structure in the first direction. A first gap is provided between the first structure and the third structure. The first intermediate member is provided between the first structure and the third structure, and in contact with the first structure and the third structure.
Various embodiments are described below with reference to the accompanying drawings.
The drawings are schematic and conceptual; and the relationships between the thickness and width of portions, the proportions of sizes among portions, etc., are not necessarily the same as the actual values. The dimensions and proportions may be illustrated differently among drawings, even for identical portions.
In the specification and drawings, components similar to those described previously or illustrated in an antecedent drawing are marked with like reference numerals, and a detailed description is omitted as appropriate.
As shown in
The first structure 10 includes a first insulating member 11, a first conductive layer 12, and a first connecting conductive member 13. The first connecting conductive member 13 pierces the first insulating member 11 along a first direction D1. The first connecting conductive member 13 includes a first cylindrical portion 13c extending in the first direction D1. The first connecting conductive member 13 is electrically connected to the first conductive layer 12.
The second structure 20 includes a second insulating member 21, a second conductive layer 22, and a second connecting conductive member 23. The second connecting conductive member 23 pierces the second insulating member 21 along the first direction D1. The second connecting conductive member 23 is electrically connected to the second conductive layer 22.
For example, at least a part of the second insulating member 21 is provided between the second conductive layer 22 and the first conductive layer 12. At least a part of the first insulating member 11 is provided between the second insulating member 21 and the first conductive layer 12.
The signal line 40 is provided between the second insulating member 21 and the first insulating member 11. The first resin member 41 includes a first resin region 41a and a second resin region 41b. The first resin region 41a is provided between the first structure 10 and the second structure 20. The second resin region 41b is provided in at least a part of a first space SP1 in the first cylindrical portion 13c. The first resin region 41a and the second resin region 41b may be continuous with each other. The boundaries between these regions can be clear or undefined. For example, the first resin region 41a is provided between the first insulating member 11 and the second insulating member 21.
The first structure 10 is provided between the second structure 20 and the third structure 30 in the first direction D1. The third structure 30 includes a third insulating member 31 and a third conductive layer 32. As shown in
The first intermediate member 51 is provided between the first structure 10 and the third structure 30. The first intermediate member 51 is in contact with the first structure 10 and the third structure 30.
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In the embodiment, the signal line 40 is provided between the first conductive layer 12 and the second conductive layer 22 in the first direction D1. These conductive layers are capacitively coupled via the first connecting conductive member 13 and the second connecting conductive member 23. Alternatively, these conductive layers may be electrically connected via the first connecting conductive member 13 and the 10 second connecting conductive member 23.
For example, the first resin member 41 is provided between the first structure 10 and the second structure 20. The first resin member 41 fixes the mutual positions of the structures. The first resin member 41 may function as, for example, an adhesive layer. For example, a resin material that will become the first resin member 41 is inserted between these structures, and pressure is applied to these structures so that they approach each other. The distance between these structures becomes the desired distance. At this time, the resin material existing between these structures can flow out into the first space SP1 in the first cylindrical portion 13c of the first connecting conductive member 13, for example. At this time, the first gap G1 is provided between the first structure 10 and the third structure 30. The air existing in the first space SP1 can flow out through the first gap G1.
With this configuration, the resin material that becomes the first resin member 41 can be spread thinly and uniformly between these structures. It is possible to suppress the formation of voids in the resin material in the first space SP1.
A part of the resin material that will become the first resin member 41 (second resin region 41b) enters the first cylindrical portion 13c. Thereby, the first resin member 41 being thin and uniform is obtained. For example, the distance between the first connecting conductive member 13 and the second connecting conductive member 23 can be controlled stably and with high accuracy. Capacitive coupling or electrical connection between these connecting conductive members can be stably obtained. By the stable coupling or connection, stable radio wave radiation can be obtained. According to the embodiment, it is possible to provide an antenna device with improved characteristics.
For example, when the resin member includes voids, the volume of the voids changes due to changes in temperature, etc., and the structure is likely to be distorted. In the structure, the structure and properties may become unstable. In the embodiments, voids are suppressed. Thereby, it becomes easy to obtain a stable structure and properties. For example, it becomes easier to obtain higher reliability.
As shown in
The first conductive layer 12, the signal line 40, and the second conductive layer 22 function as a stripline 55, for example. The stripline 55 corresponds to, for example, a triplate line. The stripline 55 efficiently radiates radio waves based on the supplied electrical signals.
Power is supplied to the third conductive layer 32 from the stripline 55 via the slot 120. The antenna device 110 is, for example, a slot-coupled patch antenna. In the antenna device 110, the stripline 55 serves as a feed line.
In a stripline-fed patch antenna, an unnecessary parallel plate mode occurs inside the stripline 55 (for example, in a region overlapping with the third conductive layer 32). The parallel plate mode propagates between two conductive layers included in the stripline 55. Parallel plate mode propagation causes power leakage and reduces antenna efficiency.
In the embodiment, by the first connecting conductive member 13 and the second connecting conductive member 23, current (high frequency current) can to flow between the first conductive layer 12 and the second conductive layer 22. This suppresses the parallel plate mode.
As described above, in the embodiment, the distance between the first connecting conductive member 13 and the second connecting conductive member 23 can be uniformly shortened with high accuracy. Thereby, the high frequency current can flow between the first connecting conductive member 13 and the second connecting conductive member 23 with high efficiency. Parallel plate mode can be suppressed more effectively. According to the embodiment, power leakage can be suppressed more effectively. High antenna efficiency can be obtained. An antenna device with improved characteristics can be provided.
For example, the second resin region 41b is provided in the first space SP1. Thereby, the contact area between the first resin member 41 and the first connecting conductive member 13 can be increased. It becomes easy to obtain high mechanical strength.
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In the embodiment, the first space SP1 is connected to the first gap G1. The air existing in the first space SP1 can flow out through the first gap G1. The generation of voids is suppressed.
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In the antenna device 110, the first intermediate member 51 may bond the first structure 10 and the third structure 30. The first intermediate member 51 may include, for example, a conductive material or an insulating material.
The first resin member 41 may include a resin material and a plurality of fillers. By providing the plurality of fillers, the distance between the first structure 10 and the second structure 20 can be controlled more stably. It becomes easy to obtain high mechanical strength. It becomes to obtain high thermal stability.
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In the antenna device 111, the signal line 40 is fixed to the second insulating member 21. Also in the antenna device 111, for example, capacitive coupling or electrical connection between the first connecting conductive member 13 and the second connecting conductive member 23 can be stably obtained. An antenna device with improved characteristics can be provided.
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In the antenna device 111 and the antenna device 112, voids and the like are also suppressed. It becomes easy to obtain stable structure and properties. It becomes easier to obtain higher reliability. Power leakage caused by parallel plate mode can be effectively suppressed. High antenna efficiency can be obtained.
The second embodiment relates to a method for manufacturing the antenna device.
As shown in
The first structure 10 includes the first insulating member 11, the first conductive layer 12, and the first connecting conductive member 13. The first connecting conductive member 13 pierces the first insulating member 11 along the first direction D1. The first connecting conductive member 13 includes the first cylindrical portion 13c extending in the first direction D1. The first connecting conductive member 13 is electrically connected to the first conductive layer 12.
The second structure 20 includes the second insulating member 21, the second conductive layer 22, and the second connecting conductive member 23. The second connecting conductive member 23 pierces the second insulating member 21 along the first direction D1. The second connecting conductive member 23 is electrically connected to the second conductive layer 22. At least a part of the second insulating member 21 is provided between the second conductive layer 22 and the first conductive layer 12. At least a part of the first insulating member 11 is provided between the second insulating member 21 and the first conductive layer 12. One of the first structure 10 or the second structure 20 includes the signal line 40. The signal line 40 is provided between the second insulating member 21 and the first insulating member 11.
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According to the embodiment, the first resin member 41 being thin and uniform can be formed. Formation of voids in the first resin member 41 is suppressed.
The manufacturing method according to the embodiment may further include bonding the first structure 10 and the third structure 30. As shown in
In the embodiment, an electrode can be formed in the first cylindrical portion 13c by, for example, forming a hole in the first insulating member 11 and forming a conductive film on the side face of the hole. The holes can be formed by mechanical grinding, laser irradiation, or the like. The conductive film can be formed, for example, by plating. In the embodiments, the conductive layer can be formed by any method.
The embodiments may include the following Technical proposals:
An antenna device, comprising:
The antenna device according to Technical proposal 1, wherein
The antenna device according to Technical proposal 1 or 2, wherein
The antenna device according to Technical proposal 1 or 2, wherein
The antenna device according to any one of Technical proposals 1-4, wherein
The antenna device according to any one of Technical proposals 1-5, wherein
The antenna device according to any one of Technical proposals 1-4, wherein
The antenna device according to any one of Technical proposals 1-7, wherein
The antenna device according to any one of Technical proposals 1-8, wherein
The antenna device according to any one of Technical proposals 1-9, wherein
The antenna device according to Technical proposal 10, wherein
The antenna device according to Technical proposal 10 or 11, wherein
The antenna device according to any one of Technical proposals 1-11, wherein
The antenna device according to any one of Technical proposals 1-13, wherein
The antenna device according to any one of Technical proposals 1-14, wherein
The antenna device according to any one of Technical proposals 1-15, wherein
The antenna device according to any one of Technical proposals 1-16, wherein
The antenna device according to Technical proposal 17, wherein
A method for manufacturing an antenna device, the method comprising:
The method for manufacturing the antenna device according to Technical proposal 19, further comprising:
According to the embodiment, it is possible to provide an antenna device whose characteristics can be improved, and a method for manufacturing the same.
In the specification of the application, “perpendicular” and “parallel” refer to not only strictly perpendicular and strictly parallel but also include, for example, the fluctuation due to manufacturing processes, etc. It is sufficient to be substantially perpendicular and substantially parallel.
Hereinabove, exemplary embodiments of the invention are described with reference to specific examples. However, the embodiments of the invention are not limited to these specific examples. For example, one skilled in the art may similarly practice the invention by appropriately selecting specific configurations of components included in the antenna devices such as insulating members, conductive layers, connecting conductive members, signal lines, resin members, etc., from known art. Such practice is included in the scope of the invention to the extent that similar effects thereto are obtained.
Further, any two or more components of the specific examples may be combined within the extent of technical feasibility and are included in the scope of the invention to the extent that the purport of the invention is included.
Moreover, all antenna devices and methods for manufacturing the same practicable by an appropriate design modification by one skilled in the art based on the antenna devices and the methods for manufacturing the same described above as embodiments of the invention also are within the scope of the invention to the extent that the purport of the invention is included.
Various other variations and modifications can be conceived by those skilled in the art within the spirit of the invention, and it is understood that such variations and modifications are also encompassed within the scope of the invention.
While certain embodiments have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the inventions. Indeed, the novel embodiments described herein may be embodied in a variety of other forms; furthermore, various omissions, substitutions and changes in the form of the embodiments described herein may be made without departing from the spirit of the inventions. The accompanying claims and their equivalents are intended to cover such forms or modifications as would fall within the scope and spirit of the invention.
Number | Date | Country | Kind |
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2023-124491 | Jul 2023 | JP | national |