Patent Application
20230223709
The present disclosure relates generally to the field of telecommunication devices, and more specifically, to an antenna device, an array of antenna devices, and a base station that includes one or more antenna devices.
In recent times, the rapid development of various wireless communication systems can be attributed to the development of innovative antenna technologies including diversity antennae, reconfigurable antennae and so forth. Such systems operate within different frequency bands and consequently require separate radiating elements for each frequency band. Typically, to provide dedicated antennae for such systems, a plurality of antennae may be required at each site. Thus, there exists a dire need for a compact antenna as a single structure capable of servicing all required frequency bands. Despite an increase in the number of required frequency bands as well as an increase in the number of users (i.e. terrestrial mobile users), there is a limitation associated with the number of antennae that can be installed in a specific sector. Typically, there is a strict requirement of one antenna per sector (in some cases, at most two antennae per sector). Moreover, there are limitations associated with a size of a given antenna that can be installed at installation sites. For example, in order to facilitate certain activities related to telecommunication services, such as site acquisition or reuse of current mechanical support structures at the installation sites, it is expected that the form factor and the wind-load of any new antennae that are to be installed should be similar and comparable to existing antennae.
In certain scenarios, neither network densification (i.e. addition of new sites) may be allowed nor installation of any additional conventional antennae at the installation sites. Moreover, a significant increase in the size (i.e. dimensions) of the conventional antenna is also not preferred or allowed. Thus, in such scenarios, it becomes technically challenging to design and develop an adequate antenna structure without increasing complexity. Currently, certain attempts have been made to design and develop an antenna device which may integrate one or more radiators and operate in one or more frequency bands. However, conventional antenna devices have a technical problem of high structural complexity, which also increases the complexity in manufacturing of such conventional antenna devices. In an example, a conventional antenna device may have two radiators (e.g. dual-band radiators) integrated into one conventional antenna device. However, such conventional antenna device needs multiple probes to feed current to the radiators. Such probes may be required to be soldered to a printed circuit board (PCB), thereby increasing the number of parts and the complexity of the conventional antenna device. Typically, some conventional antenna devices employ several coaxial cables to feed current to the different radiators of the conventional antenna device, thereby significantly increasing the complexity. Moreover, such conventional antenna devices are resource intensive, i.e. require greater manpower, skill or effort and time for installation thereof. Typically, an increased number of parts results in more contact points, and to further electrically couple such contact points, a greater number of soldering joints are required. Additionally, for conventional antenna devices operating with more than one frequency band, a glitch-less and interference-free communication always remain a challenge.
Therefore, in light of the foregoing discussion, there exists a need to overcome the aforementioned drawbacks associated with conventional antenna devices.
The present disclosure seeks to provide an antenna device, an array of antenna devices, and a base station that includes one or more antenna devices. The present disclosure seeks to provide a solution to the existing problem of structural and manufacturing complexities and installation efforts associated with conventional antenna devices. An aim of the present disclosure is to provide a solution that overcomes at least partially the problems encountered in the prior art and provide an improved antenna device that is easily installable and having lower structural and manufacturing complexities. Further, the antenna device of the present disclosure can operate within multiple frequency bands having improved performance.
The object of the present disclosure is achieved by the solutions provided in the enclosed independent claims. Advantageous implementations of the present disclosure are further defined in the dependent claims.
In a first aspect, the present disclosure provides an antenna device comprising a base plate having a substantially planar shape. The antenna device also comprises a first radiator configured to radiate a first electromagnetic signal in a first frequency band. The first radiator has a substantially planar shape parallel to the base plate. The antenna device further comprises a first balun extending along a first axis between the base plate and the first radiator. The first axis is perpendicular to the base plate and the first radiator. The first balun is arranged to support the first radiator. The antenna device also comprises a second radiator configured to radiate a second electromagnetic signal in a second frequency band. The second radiator has one or more planar structures extending along the first axis and arranged between the base plate and the first radiator.
The antenna device of the present disclosure is a low profile, light weight, compact antenna device that integrates more frequency bands and maintains a small form factor. The antenna device is compact in size and has lower complexity (i.e. the structural and manufacturing complexities) as compared to a conventional antenna device. For example, the antenna device does not use parts, like probes or cables, to connect feeding lines, thereby reducing the overall complexity for the antenna device. Further, the architecture of the antenna device allows integration of a high band antenna element and a low band antenna element on a single printed circuit board (PCB), i.e. on the base plate. Correspondingly, the high band and low band antenna elements have their feeding lines printed or etched on the PCB. Consequently, the number of soldering joints required for the installation of the antenna device are reduced. Furthermore, the architecture of the antenna device is suitable for implementation of further split architectures in multi-band antenna devices, i.e. having more than two frequency bands. Moreover, the relative positioning of the radiating elements (such as the first radiator, the second radiator) simplifies the arrangement of the antenna device by having a lower number of moving parts and hence having a more compact design or structural integrity. Thereby, reducing the overall structural and manufacturing complexities associated with the antenna device, which in turn reduces the installation effort in terms of time and cost and from a labor perspective. In an example, for the installation of the antenna device, initially the second radiator (integrated with the first balun) is soldered to the base plate and thereafter the first radiator is soldered to the first balun.
In an implementation form, the second radiator is integrally formed with the first balun.
The second radiator is formed as a monolithic structure with the first balun, thereby reducing the number of moving parts and the soldering joints of the antenna device. This in turn provides compactness and improved structural integrity to the antenna device.
In a further implementation form, the second radiator comprises a grounding capacitor arranged for capacitive grounding of the second radiator.
In a further implementation form, the grounding capacitor is formed from a conductive path extending across one or more of the planar structures of the second radiator.
The grounding capacitor act as a filter for the high frequency feed in the antenna device, i.e. to avoid any resonance in the multi-band. Typically, the grounding capacitor enables reduced electric field susceptibility (that may be caused due to the high frequency feed), which in turn reduces interference on the output signals of the antenna device. In other words, the grounding capacitor enables the antenna device to perform glitch-less and interference free communication. Further, by virtue of using the grounding capacitor as a conductive path, the overall complexity of the antenna device is also reduced.
In a further implementation form, a second balun is integrally formed with the second radiator.
The second radiator is formed as a monolithic structure with the second balun, thereby reducing the number of moving parts and the soldering joints of the second radiator. Typically, the integrated second balun provides overall compactness and improved structural integrity to the antenna device.
In a further implementation form, the second radiator is formed from any one of a printed circuit board, a board with metal foil deposit, a folded metal sheet or a molded interconnect device.
The implementation of the second radiator in such a manner makes the antenna device compact and reduces the structural complexity and installation effort.
In a further implementation form, the first balun is formed in a cross configuration of two intersecting planar structures.
The cross configuration of the first balun enables effective support of the first radiator on the first balun. Moreover, the cross configuration of the first balun simplifies the connection with the feeding lines and further enables the first radiator to be free of any features, such as any slots, connections, and the like. This enables improved performance of the antenna device in terms of signal interference and provides a capability to the antenna device to accommodate one or more radiators below the first radiator without degrading the performance.
In a further implementation form, the first balun comprises one or more feed lines for the first radiator.
The feed lines for the first radiator are integrated with the first balun, to preclude a need for separate feed lines for the first radiator, which reduces structural complexity for the antenna device. This also helps in reducing installation effort.
In a further implementation form, the second radiator comprises a plurality of radiating arms, each including a first part extending radially outwards away from the first axis, and a second part extending from the outer extent of the first part in a direction parallel to the first axis.
The radiating arms of the second radiator, including the first part and the second part, form a bent L-shaped structure and enables a compact arrangement of the radiating arms in the second radiator, and significantly contributes to reduce the overall size of the antenna device. The radiating arms are arranged in the planar structures of the second radiator which allows the second radiator to occupy a smaller footprint with reduced scattering effect on the first radiator.
In a further implementation form, the first radiator comprises one or more co-planar structures.
The one or more co-planar structures form a single planar structure for the first radiator, which allows the first radiator to be effectively supported by the cross configuration of the first balun. Further, the planar structure of the first radiator holds its functional components thereon in a single plane, which reduces overall functional, structural and manufacturing complexity associated with the first radiator.
In a further implementation form, at least the base plate and the first radiator are formed from a printed circuit board.
The base plate and the first radiator formed from the printed circuit board reduces the overall manufacturing complexity and installation for the antenna device. Also, this enables reduced overall complexity associated with the designing of the antenna device required to operate in more than one frequency band.
In a further implementation form, the second frequency band does not overlap with the first frequency band.
The second frequency band does not overlap with the first frequency band to avoid interference or scattering impact of the signals during operation of the antenna device.
In a further implementation form, the second frequency band is higher than the first frequency band.
The second frequency band is higher than the first frequency band to enable the antenna device to operate in two different frequency bands or a dual-band configuration of the antenna device. This makes the antenna device of the present disclosure efficient, such that instead of two different antenna devices, the same antenna device can be used for specific tasks or locations where signals of two different frequency bands are to be transmitted and/or received by the antenna device.
In a further implementation form, each of the first radiator and the second radiator is dual polarized.
The dual polarized first and second radiators enable the antenna device to operate at two different polarization orientations simultaneously. The dual polarized aspect enables achieving polarization diversity, which can increase the capacity and reduce the installation costs. Typically, this is because the use of dual polarization can reduce multipath fading and double the utilization rate of the frequency spectrum.
In a further implementation form, each radiator comprises four radiating elements arranged at +/- 45 degrees.
The arrangement of the four radiating elements at +/- 45 degrees enables similar radiating directions for the first and second radiations.
In a further implementation form, a radiating directions of the first radiator and the second radiator are parallel to the first axis.
By virtue of a radiating direction of the first radiator and the second radiator parallel to the first axis, the directivity of the antenna device is improved.
In a second aspect, the present disclosure provides an array of antenna devices, the array comprising one or more antenna devices of the first aspect.
The array of antenna devices of the second aspect achieves all the advantages and effects of the antennae device of the first aspect.
In a further implementation form, the array of antenna devices comprise one or more additional antenna devices configured to radiate a third electromagnetic signal in a third frequency band different from the first frequency band and the second frequency band.
The use of one or more additional devices in conjunction with the antenna device allows the antenna device to operate in multiple frequency bands (i.e. more than two frequency bands). This enables an improved overall capability of the antenna device and allows the antenna device to accommodate one or more antenna devices around itself without degrading the performance thereof.
In a third aspect, the present disclosure provides a base station comprising one or more antenna devices according to the first aspect.
The base station, of the third aspect, having the one or more antenna devices of the first aspect achieves all the advantages and effects of the antenna device of the first aspect.
It will be appreciated that all implementation forms discussed hereinabove can be combined. It has to be noted that all devices, elements, circuitry, units and means described in the present application could be implemented in the software or hardware elements or any kind of combination thereof. All steps which are performed by the various entities described in the present application as well as the functionalities described to be performed by the various entities are intended to mean that the respective entity is adapted to or configured to perform the respective steps and functionalities. Even if, in the following description of specific embodiments, a specific functionality or step to be performed by external entities is not reflected in the description of a specific detailed element of that entity which performs that specific step or functionality, it should be clear to a skilled person that these methods and functionalities can be implemented in respective software or hardware elements, or any kind of combination thereof. It will be appreciated that features of the present disclosure are susceptible to being combined in various combinations without departing from the scope of the present disclosure as defined by the appended claims.
Additional aspects, advantages, features and objects of the present disclosure are made apparent from the drawings and the detailed description of the illustrative implementations construed in conjunction with the appended claims that follow.
The summary above, as well as the following detailed description of illustrative embodiments, is better understood when read in conjunction with the appended drawings. For the purpose of illustrating the present disclosure, exemplary constructions of the disclosure are shown in the drawings. However, the present disclosure is not limited to specific methods and instrumentalities disclosed herein. Moreover, those in the art will understand that the drawings are not to scale. Wherever possible, like elements have been indicated by identical numbers.
Embodiments of the present disclosure will now be described, by way of example only, with reference to the following diagrams wherein:
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In the accompanying drawings, an underlined number is employed to represent an item over which the underlined number is positioned or an item to which the underlined number is adjacent. A non-underlined number relates to an item identified by a line linking the non-underlined number to the item. When a number is non-underlined and accompanied by an associated arrow, the non-underlined number is used to identify a general item at which the arrow is pointing.
The following detailed description illustrates embodiments of the present disclosure and ways in which they can be implemented. Although some modes of carrying out the present disclosure have been disclosed, those skilled in the art would recognize that other embodiments for carrying out or practicing the present disclosure are also possible.
In an embodiment, the co-planar structures 112A-D are placed adjacent to one another. For example, the co-planar structures 112A-D are arranged in a grid formation and adjacent to one another such that the co-planar structures 112A-D collectively form a rectangular planar structure. Further, each of the co-planar structures 112A-D comprises one or more radiating elements, such as radiating terminals 116. In an example, each of the co-planar structures 112A-D includes a plurality of radiating terminals (for example, four or six radiating elements). For example, the co-planar structure 112A is shown to include the six radiating terminals 116, and similarly the other co-planar structures 112C-D includes six radiating terminals. The radiating terminals 116 are arranged on peripheral areas of each of the co-planar structures 112A-D. Specifically, the radiating terminals 116 are arranged on a peripheral area of the rectangular planar structure constituted together by the co-planar structures 112A-D. The radiating terminals 116 are essentially two identical conductive elements such as co-planar metal cables or metal rods or metal plates. In an example, the radiating terminals 116 are metal traces on a printed circuit board (PCB). Therefore, it will be understood that each of the co-planar structures 112A-D is a PCB. Further, the two conductive elements of each of the radiating terminals 116 are placed in a direction opposite to each other. It will be appreciated that the number of radiating elements and their orientations in the co-planar structures 112A-D may be varied without limiting the scope of the present disclosure.
According to an embodiment, the antenna device 100 of the present disclosure may also be termed as a radiating element, a radiating device, or an antenna element. The antenna device 100 is typically used for telecommunication. For example, the antenna device 100 may be used in a wireless communication system. Further, the antenna device 100 may be used alone or collectively as an array of such antenna devices in the communication system. Examples of such wireless communication system includes, but is not limited to, a base station (such as an Evolved Node B (eNB), a gNB, and the like), a repeater device, a customer premise equipment, and other customized telecommunication hardware.
The first radiator 104 is configured to radiate a first electromagnetic signal in a first frequency band. It will be evident that the first electromagnetic signal is radiated when the antenna device 100 is in operation. The ‘electromagnetic signal’ includes signal propagation by simultaneous periodic variations of electric and magnetic field intensity, which includes radio waves, microwaves, infrared, light, ultraviolet, X-rays, and gamma rays. The electromagnetic signal must occupy a range of frequencies carrying most of its energy, called its bandwidth. A frequency band may represent one communication channel or be subdivided into various frequency bands as per implementation, such as a first frequency band, a second frequency band and so forth. In an example, the first frequency band may be defined by a frequency range, i.e. 690 MHz to 960 MHz.
In accordance with an embodiment, the first radiator 104 may be a dipole antenna. The “dipole antenna” refers to the class of antennae producing a radiation pattern approximating that of an elementary electric dipole with a radiating structure supporting a line current so energized that the current has only one node at each end. In the present disclosure the aspect of a dipole antenna is defined or realized by radiating terminals 116 of the co-planar structures 112A-D. Generally, the dipole antenna (i.e. the radiating terminals 116) is defined by the two identical conductive elements of equal length, which are oriented end-to-end with a feedline (such as a metal wire for electrical connection) connected between them. Generally, the size of each conductive element is approximately a quarter of the wavelength of the desired frequency of operation.
In accordance with an embodiment, as shown in
As explained herein above, the antenna device 100 includes more than one radiator, such as the first and second radiators 104, 106. In such embodiments, electromagnetic signals are radiated concurrently by different radiators operating in different frequency bands (e.g. a high frequency band and a low frequency band). The first radiator 104 is a low band radiator, wherein the first frequency band corresponds to a lower frequency band as compared to a frequency band (such as the second frequency band) in which the second radiator 106 operates.
The second radiator 106 is configured to radiate a second electromagnetic signal in a second frequency band. The second radiator 106 comprises one or more planar structures, such as a first planar structure 114A, a second planar structure 114B, a third planar structure 114C, and a fourth planar structure 114D (collectively referred to as planar structures 114A-D). The planar structures 114A-D extend along the first axis X and are arranged between the base plate 102 and the first radiator 104. Further, as shown, the length of the planar structures 114A-D (along the first axis X) is less as compared to a length of the first balun 108, therefore the planar structures 114A-D are spaced apart from the first radiator 104 (particularly, from the co-planar structures 112A-D). Further, as shown, the planar structures 114A-D are coupled to the base plate 102. In an example, each the planar structures 114A-D includes at least one connecting tab, for example one or two connecting tabs, extending from the planar structures 114A-D, and the base plate 102 includes corresponding holes for receiving the at least one connecting tab therethrough for allowing snap-fit coupling between the planar structures 114A-D and the base plate 102. Alternatively, the planar structures 114A-D and the base plate 102 may be connected using connectors, such as brackets and screws, or may be integrally coupled to each other. The planar structures 114A-D are also coupled to the first balun 108, which is explained in greater detail herein later.
According to an embodiment, the planar structures 114A-D may be configured to have a rectangular shape. However, it is obvious that the shape of the planar structures 114A-D may vary without limiting the scope of the disclosure. For example, the planar structures 114A-D may be configured to have a square, an oval or any polygonal shape.
In one embodiment, the second radiator 106 is formed from any one of a printed circuit board, a board with a metal foil deposit, a folded metal sheet or a molded interconnect device. Typically, the planar structures 114A-D of the second radiator 106 may be formed using a printed circuit board (PCB), which may include at least the feed lines, radiating lines, impedance matching lines and so forth. In an example, the second radiator 106 (i.e. the planar structures 114A-D) may be implemented as a single layer printed circuit board, a multi-layer printed circuit board, a flexible PCB or a flexi-rigid PCB. Further, the second radiator 106 may be a formed using a folded metal sheet such as a metallic sheet of copper, aluminum, iron and the like. Furthermore, the second radiator 106 may be formed using a board or plate with a metal foil deposit. The board using the metal foil deposit is formed using metallization achieved by printing of conductive traces or pathways onto one or both sides of the board. The board can be a thermoplastic part, metallic board, semiconductor sheet and the like. Moreover, the printing of the conductive traces is performed using at least one of aerosol jet, inkjet, or screen printing. Moreover, the second radiator 106 may be formed using a molded interconnect device. The molded interconnect device refers to an injection molded thermoplastic part integrated with an electrical network. The molded interconnect device (MID) employs a thermoplastic substrate having an integrated electrical circuitry by metallization. The MIDs include at least the circuit board, housing, connectors, and connecting cables merged into one fully functional, compact device.
In will be apparent that the antenna device 100 is primarily made of PCBs, i.e. the base plate 102, the first radiator 104, the second radiator 106 and the first balun 108 all are typically made of PCBs. In an example, such PCBs may be multilayer printed circuit boards. Further, such multilayer PCBs may be arranged with filtering devices and power combiners to distribute power to different radiators.
According to an embodiment, the planar structures 114A-D of the second radiator 106 are arranged in a manner between the base plate 102 and the first radiator 104 such that the radiating electromagnetic signals (such as the first electromagnetic signal, the second electromagnetic signal) of each of the two radiators (i.e. the first radiator 104 and the second radiator 106) does not interfere with one another during operation. Notably, each of the planar structures 114A-D comprises the radiating element (will be explained later in greater detail) of the second radiator 106. Each of the planar structures 114A-D are arranged perpendicular to one another for enabling 180 degrees out of phase radiation. Moreover, the second radiator 106 includes dipole metallization for each of the planar structures 114A-D extending along the first balun 108. The ‘dipole metallization’ refers to the conductive coating or metallic deposit over the non-metallic surface. The metal of the conductive coating or metallic deposit includes at least one of, but is not limited to, copper, stainless steel, aluminum, galvanized steel, silicon and other such metals. Typically, each of the planar structures 114A-D acts as the high frequency radiating parts of the second radiator 106, which is explained in greater detail herein later.
According to an embodiment, the base plate 102 is a flat metal sheet or metal plate or a printed circuit board for supporting one or more elements of the antenna device 100 (such as the first balun 108 or the second radiator 106). The base plate 102 may be implemented as a single layer printed circuit board, or as a multi-layer printed circuit board such as double layer PCB, multi-layer PCB. Additionally, the base plate 102 may be a flexible PCB or a flexi-rigid PCB. Further, the base plate 102 may be formed using a folded metal sheet such as a metallic sheet of copper, aluminum, iron and the like. Furthermore, the base plate 102 may be formed using a board or plate with a metal foil deposit thereon. In an embodiment, the metal foil deposit in the base plate 102 may be formed using metallization achieved by printing or etching of conductive traces or pathways onto the surface of the board. The board can be a thermoplastic part, metallic board, semiconductor sheet and the like. The base plate 102 comprises the electrical circuitry of the antenna device including, but not limited to, the feed lines, the feeding nodes and similar electrical components.
As shown, the first balun 108 extends along the first axis X between the base plate 102 and the first radiator 104. The first axis X is perpendicular to the base plate 102 and the first radiator 104, and the first balun 108 is arranged to support the first radiator 104 thereon. The first balun 108 also supports the second radiator 106. According to an embodiment, the second radiator 106 is integrally formed with the first balun 108. The first balun 108 extends perpendicular to the base plate 102 to form a monolithic structure with the second radiator 106. For example, the second radiator 106 may be coupled with the first balun 108 via integral molding process. Optionally, the second radiator 106 may be detachably coupled to the first balun 108.
As shown, the first balun 108 is formed in a cross configuration of two intersecting planar structures, i.e. the first and second intersecting planar structures 120A, 120B, arranged orthogonal to each other. The first and second intersecting planar structures 120A, 120B are formed integrally with the planar structures 114A-D of the second radiator 106. In an embodiment, the first balun 108 includes slots or cut-outs (not shown) configured to accommodate at least a connecting portion extending from each of the planar structures 114A-D, allowing snap-fit coupling therebetween. Alternatively, the planar structures 114A-D may include slots or cut-outs and the first balun 108 may include a complementary connecting portion extending to enable snap-fit coupling therebetween. Additionally, the first balun 108 may be coupled to the planar structures 114A-D using brackets, screws and so forth. As shown, the first and third planar structures 112A-C are coupled to the first intersecting structure 120A, and the second and fourth planar structures 112B-D are coupled to the second intersecting structure 120B.
According to an embodiment, the first balun 108 of the antenna device 100 is a balancing unit configured to convert an unbalanced signal to a balanced signal. In operation, the first balun 108 provides a balanced signal as an output for the radiating terminals 116. It will be appreciated that the first balun 108, at an elementary level, is realized by means of metal deposition on the first and second intersecting planar structures 120A, 120B. In other words, the first and second intersecting planar structures 120A, 120B are PCBs having metal deposition therein, which allows the first balun 108 to provide the balanced signal as the input for the radiating terminals 116. Typically, the first balun 108 is operable to provide currents in equal magnitude and in opposite phase to the radiating terminals 116. The first balun 108 may also include one or more electrical components or electrical connections or feed lines having a certain amount of capacitance and inductance leading to a frequency wherein the electrical reactance caused by self-inductance and self-capacitance of the first balun 108 are in a state of resonance. It will be appreciated the first balun 108 may operate at the resonant frequency or at frequency greater or lower than the resonant frequency.
It will be appreciated that the radiators (such as the first radiator 104, the second radiator 106) operate at a given value of impedance or reactance of the electrical network for communicating input and output signals. Impedance matching of the antenna device 100 is necessary to avoid signal losses and glitches during operation. Herein, the grounding capacitor of the antenna device 100 is employed to perform antenna matching.
In an embodiment, the second frequency band does not overlap with the first frequency band. In other words, the first frequency band may be different from the second frequency band, and the difference therebetween may be substantial or non-substantial. Thus, the antenna device 100 is a dual band antenna device, i.e. configured to radiate electromagnetic signals in two frequency bands concurrently. In an example, any two frequency bands may be selected from the following ranges, such as from 690-960 MHz and 1.4 GHz -2.2 GHz, which may be radiated concurrently. Further, the first radiator 104 and the second radiator 106 may radiate electromagnetic signals in two frequency bands concurrently, and the two different frequency bands in operating range of mm Wave frequencies, or a combination thereof.
In an embodiment, the second frequency band is higher than the first frequency band, i.e. operating range of the second frequency band is higher than the first frequency band. Accordingly, the first radiator 104 operates in a lower frequency band and the second radiator 106 operates in higher frequency band. For example, the first radiator 104 may be operable in a range of 690-960 MHz and the second radiator 106 may be operable in a range of 1.4 GHz -2.2 GHz.
According to an embodiment, each of the first radiator 104 and the second radiator 106 is dual polarized. The term dual polarized means, each of the first radiator 104 and the second radiator 106 can respond to both horizontally and vertically polarized radio waves simultaneously. For example, each of the first radiator 104 and the second radiator 106 can transmit or receive both horizontally and vertically (i.e. along two directions perpendicular to each other) polarized radio waves simultaneously. In other words, each of the first radiator 104 and the second radiator 106 includes a pair of orthogonal radiation modes, which can be excited by a separate port in a single configuration. Further, the aspect of dual polarization allows the possibility to the first and second radiators 104, 106 to simultaneously function either as a transmitter or as a receiver, which increases communication channel capacity.
In an embodiment, each radiator, i.e. the first radiator 104 and the second radiator 106 comprises four radiating terminals arranged at +/- 45 degrees. The term ‘radiating element’ refers to a unit of the antenna device 100 configured to radiate or receive electromagnetic signals. As shown in
The radiating terminals are arranged at +/- 45 degrees. As mentioned herein above, the four co-planar structures 112A-D and the four planar structures 114A-D are considered as the radiating terminal, therefore the co-planar structures 112A-D are arranged at +/- 45 degrees to each other, and similarly the planar structures 114A-D are arranged at +/- 45 degrees to each other. Typically, for the first radiator 104 to be dual polarized, the co-planar structures 112A-D are arranged at +45 degrees and at -45 degrees to the first axis X (shown in
In accordance with an embodiment, a radiating direction of the first radiator104 and the second radiator 106 is parallel to the first axis X. The term ‘radiating direction’ refers to a direction in which electromagnetic signals are propagated (i.e. sent or received) by the antenna device 100. As shown, the first radiator 104 (i.e. the co-planar structures 112A-D) is arranged along a plane perpendicular to the first axis X, and considering the antenna device 100 to be held in an upright direction (as shown in
In accordance with an embodiment, by virtue of having the first and second radiators 104, 106 arranged on the same printed circuit board, i.e. the base plate 102, the complexity (i.e. the structural as well as the manufacturing complexity) and size of the antenna devices 100 is significantly reduced. Moreover, such a compact arrangement of the first and second radiators 104, 106 on the same printed circuit board does not degrade the performance of any radiator and provides a capability to the antenna device 100 to concurrently support an increased number of frequency bands, which may help in increasing userbase.
Referring now to
In an embodiment, the feeding arrangement 200, particularly, the first to fourth feed lines 204, 208, 216, 220, and the feed lines connectors 204A-B, 210A-B, 218 and 222 are made of a conductive material such as copper or aluminum. Beneficially, the first to fourth feed lines 204, 208, 216, 220 and the feed lines connectors 204A-B, 210A-B, 218 and 222 are laid on the base plate 102 to simplify the structural complexity of the antenna device 100. This precludes the need of additional components for the feeding arrangement 200, which can cause an undesirable intersection while providing electrical energy to the first radiator 104 and the second radiator 106. For example, additional components, such as co-axial cables, flex circuit traces, conductive housing structures, springs, screws, welded connections, solder joints, brackets, metal plates, or other conductive structures.
It will be apparent that the first balun 108 comprises one or more feed lines (not shown) for the first radiator 104. Each of the one or more feed lines is a conductive track (e.g. a metal wiring or track) laid on the first balun 108 for providing required electrical energy or signal to the first radiator 104. As shown in
Referring now to
According to an embodiment, the second radiator 106 comprises a grounding capacitor arranged for capacitive grounding of the second radiator. Further, the grounding capacitor is formed from a conductive path extending across one or more of the planar structures 114A-D (shown in
The grounding capacitors 308A-D are operable to ground unwanted high frequency signals via capacitive coupling. Typically, the capacitive coupling of the grounding capacitors 308A-D refers to providing a low impendence path for grounding the unwanted high frequency signals. Typically, the grounding capacitors 308A-D serve to reduce electric field susceptibility (that may be caused due to the high frequency feed), which in turn reduces interference on the output signals of the antenna device 100. For example, the grounding capacitors 308A-D act as a filter for the high frequency feed in the antenna device 100, i.e. to avoid any resonance in the multi-band. In other words, the grounding capacitors 308A-D enable the antenna device 100 to perform glitch-less and interference free communication.
According to an embodiment, a second balun is integrally formed with the second radiator 106. As shown in
Referring back to
According to an embodiment, each of the feed lines 204, 208 (best shown in
In an embodiment, the Radio-Frequency (RF) performance of the antenna device 100 may be read in light with various performance parameters, such as Voltage Standing Wave Ratio (VSWR) parameter and beam width. In an example, the simulation result for the RF performance for the first radiator 104 of the antenna device 100 may include the following results: VSWR < 1.5 from 690 MHz to 960 MHz, and Horizontal 3 dB beam width = 65° + 3°. Further, the simulation result for the RF performance for the second radiator 106 may include the following results: VSWR < 1.53 from 1427 MHz to 1535 MHz, with peak value of 2 at 1427 MHz, horizontal 3 dB beam width 60° at 1427 MHz and 58° at 2200 MHz.
Referring now to
The antenna devices 402, 404 and 406 are configured to radiate a third electromagnetic signal in a third frequency band different from the first frequency band and the second frequency band. Typically, the antenna devices 402, 404 and 406 are configured to radiate electromagnetic signals in a frequency band different from the first and the second frequency bands of the first and second radiators 104, 106, respectively. In an example, the third frequency band may be higher than the second frequency band. For example, the third frequency band may include a range of 1.6 GHz to 2.7 GHz. Accordingly, the antenna device 400 is configured to operate within multiple frequency bands (i.e., even more than two frequency bands) for example the first, second and third frequency band without causing any interference in such operating bands. The multi-band configuration enables a smaller footprint of antenna device 400 and allows integration of such a configuration in a multi-band environment, wherein a third frequency band can be placed without degrading the radiation and coupling performance. It will be appreciated that the antenna device 400 is a low-profile antenna, easy to assemble and has low coupling between different frequency bands. Further, the antenna device 400 is not limited to any specific combination of frequency bands. For example, one, two or more than two frequency bands of the antenna device 400 may operate together, having multiple (such as a high, a medium and a low) frequency bands interleaved between the first, second and third electromagnetic signals.
According to an embodiment, the simulation result for the RF performance for the antenna devices 402, 404 and 406 (such as the third radiators) of the antenna device 100 may include the following results: VSWR < 1.53 from 1695 MHz to 2700 MHz, with peak value of 2.26 at 1890 MHz.
Referring now to
In another embodiment, the array 500 of antenna devices may comprise a plurality of antenna devices, such as the antenna device 100 and the antenna device 400 (shown and explained in conjunction with
Referring now to
In an embodiment, the base station 600 may include an array of antenna devices (e.g. the array 500 of antenna devices, shown and explained in conjunction with
Modifications to embodiments of the present disclosure described in the foregoing are possible without departing from the scope of the present disclosure as defined by the accompanying claims. Expressions such as “including”, “comprising”, “incorporating”, “have”, “is” used to describe and claim the present disclosure are intended to be construed in a non-exclusive manner, namely allowing for items, components or elements not explicitly described also to be present. Reference to the singular is also to be construed to relate to the plural. The word “exemplary” is used herein to mean “serving as an example, instance or illustration”. Any embodiment described as “exemplary” is not necessarily to be construed as preferred or advantageous over other embodiments and/or to exclude the incorporation of features from other embodiments. The word “optionally” is used herein to mean “is provided in some embodiments and not provided in other embodiments”. It is appreciated that certain features of the present disclosure, which are, for clarity, described in the context of separate embodiments, may also be provided in combination in a single embodiment. Conversely, various features of the invention, which are, for brevity, described in the context of a single embodiment, may also be provided separately or in any suitable combination or as suitable in any other described embodiment of the disclosure.
This application is a continuation of International Application No. PCT/EP2020/075613, filed on Sep. 14, 2020, the disclosure of which is hereby incorporated by reference in its entirety.
| Number | Date | Country | |
|---|---|---|---|
| Parent | PCT/EP2020/075613 | Sep 2020 | WO |
| Child | 18182662 | US |
