1. Field of the Invention
The present invention relates to an antenna device in which a slot antenna which excites a radiation slot formed in a metal plate and a circuit board having high frequency circuits connected to the slot antenna through a power feeding member are integrally formed, and more particularly, to a structure of the power feeding member.
2. Description of the Related Art
In this type of an antenna device, power feeding is implemented by forming a radiation slot in a metal case which covers a circuit board, thus allowing the case to function as a slot antenna. Therefore, the antenna device is suitable for a vehicle because miniaturization and cost reduction can be easily achieved.
FIG. 5 is a perspective view of a slot antenna according to the related art (for example, see JP-A-2003-218629 (page 2, FIG. 5). This slot antenna is constructed such that a radiation slot 2 is formed in an upper plate 1a of a case member 1 made of a conductive metal plate so as to be excited. The radiation slot 2 is formed of an elongated aperture having a straight shape. Power feeding points 3 and 4 are set on the upper plate 1a at a substantially middle portion of the radiation slot 2. One of the power feeding points 3 and 4 is connected to a power feeding circuit, and the other is connected to a ground. While a power is being fed, a high frequency current flows along the periphery of the radiation slot 2, thus exciting the radiation slot 2 with a predetermined frequency.
In the slot antenna according to the above-described related art, the case member 1 can be used as a shield case which covers a circuit board (not shown) by disposing the upper plate 1a above the circuit board having high frequency circuits such as a low noise amplification circuit. Thus, the power feeding points 3 and 4 are electrically connected to a land on the circuit board through a power feeding member such as a power feeding pin, so that a compact antenna device can be realized by making the slot antenna and the circuit board into one unit.
However, in the antenna device having the above-mentioned structure, in order to electrically connect the power feeding points 3 and 4 of the upper plate 1a to the land on the circuit board, the power feeding member should be soldered to each of those places. Thus, solder connection work is not only complicated but also may cause connection defects due to excessively strong stress applied on a soldered portion of the power feeding member, when displacement is generated in a relative position between the upper plate 1a and the circuit board. In particular, when this type of an antenna device is mounted in a vehicle, displacement may easily occur in the relative position between the upper plate 1a and the circuit board due to thermal expansion which is caused by external vibration and temperature changes. Thus, for example, whenever the distance between the upper plate 1a and the circuit board increases and decreases, strong stress is applied on the soldered portion of the power feeding member, thus causing soldering crack to easily occur.
The present invention has been finalized in view of the drawbacks inherent in the antenna device according to the related art, and it is an object of the present invention to provide an antenna device which can prevent connection defects of a power feeding member, thus improving reliability.
In order to solve the above-mentioned problem, according to an aspect of the invention, an antenna device includes a circuit board on which high frequency circuits are disposed, a conductive metal plate which is disposed to face the circuit board and in which radiation slots are formed, and a power feeding member which is formed of a band-shaped metal piece extending from the metal plate and of which a front end thereof is soldered to the high frequency circuits. A hinge-shaped bent portion is formed between a base end and the front end of the power feeding member.
In this way, when the power feeding member is formed of a band-shaped metal piece extending from the metal plate in which the radiation slots are formed, and a hinge-shaped bent portion is formed in the power feeding member in advance, although displacement is generated in a relative position between the metal plate (the base end side of the power feeding member) and the circuit board (the front end side of the power feeding member) by external vibration and thermal expansion, the displacement can be absorbed by elasticity of the bent portion or the like. Thus, stress applied on the soldered portion of the front end of the power feeding member is decreased, thus preventing soldering cracks from being generated. In addition, since the base end side of the power feeding member is continuous to the metal plate, soldering is not required. Therefore, poor soldering connection of the power feeding member due to external vibration and thermal expansion can be effectively prevented. Thus, assembly efficiency can be improved because soldering connection work in the power feeding member can be made simple.
In the antenna device having the above-mentioned structure, for example, a portion extending from the base end of the power feeding member to the bent portion thereof is formed of a horizontal portion which extends along a bent line or a curved line which is substantially parallel to the circuit board. Further, a portion extending from the bent portion of the power feeding member to the front and thereof is formed of a drooping portion which extends along a line which is substantially vertical to the circuit board. In this case, if a thickwise direction of the drooping portion is set as an X direction, a direction which is parallel to the circuit board and orthogonal to the X direction is set as a Y direction, and a direction vertical to the circuit board is set as a Z-direction, since the power feeding member has sufficient elasticity with respect to external force opening and closing the hinge-shaped bent portion, although displacement is generated in a relative position between the base end and the front end of the power feeding member in the X direction or the Z direction, the power feeding member easily responds to the displacement. Further, with respect to displacement in the Y-direction, the power feeding member can correspond to the displacement by using torsion of the horizontal portion which extends along the bent line or the curved line. Therefore, although displacement is generated in the relative position between the base end and the front end of the power feeding member in any of the X, Y, and Z directions by external vibration and thermal expansion, stress applied on a soldered portion of the power feeding member can be decreased.
In addition, in the antenna device having the above-mentioned structure, when the metal plate is an upper plate of a shield case which covers the circuit board, the number of components and assembly processes can be decreased because a slot antenna also serves as a shield case, thereby obtaining a small-sized and inexpensive antenna device. In this case, before a reflow soldering process of mounting various chip components constituting high frequency circuits on the circuit board, the shield case is mounted on the circuit board such that the front end of the power feeding member is mounted on cream solder of a land. Thus, complex soldering connection work is not required for the power feeding member because the power feeding member can be collectively subjected to reflow soldering together with the various chip components.
Hereinafter, an embodiment of the invention will be described with reference to the accompanying drawings.
An antenna device 10 shown in
The power feeding member 14 is formed by bending a portion of the pressed upper shield case 13, and has an appearance shown in
In this way, the antenna device 10 has a band-shaped metal piece serving as the power feeding member 14, and the band-shaped metal piece extends from the upper plate 13a in which the radiation slots 16 and 17 are formed. In the power feeding member 14, the horizontal portion 14a which is substantially parallel to the circuit boards 11 is connected to the drooping portion 14c which is substantially vertical to the circuit board 11 at the bent portion 14b such that a connecting portion between them is formed in a hinge shape. Thus, although displacement is generated in a relative position between the upper plate 13a (the base end side of the power feeding member 14) and the circuit board 11 (the front end side of the power feeding member 14) by external vibration and thermal expansion, the displacement can be absorbed by elasticity of the bent portion 14b or the like. That is, if a thickwise direction of the drooping portion 14c is set as an X direction, a direction which is parallel to the circuit board 11 and orthogonal to the X direction is set as a Y direction, and a direction vertical to the circuit board 11 is set as a Z direction, since the power feeding member 14 has sufficient elasticity with respect to external force opening and closing the bent portion 14b, even though the displacement is generated in a relative position between the base end and the front end of the power feeding member 14 in the X or Z direction, the power feeding member 14 easily responds to the displacement. Further, with respect to displacement in the Y direction, the power feeding member 14 can respond to the displacement by using torsion of the horizontal portion 14a. Therefore, although displacement is generated in the relative position between the base end and the front end of the power feeding member 14 in any of the X, Y, and Z directions by external vibration and thermal expansion, stress applied on a soldered portion located at the front end side of the power feeding member 14 can be decreased, thus preventing soldering cracks or the like from being generated. In addition, since the base end side of the power feeding member 14 is continuous to the upper plate 13a, soldering does not need to be performed to the continuous portion. For this reason, the antenna device 10 can effectively prevent poor soldering connection of the power feeding member 14 due to external vibration and thermal expansion, thus improving reliability.
In addition, in this antenna device 10, the upper shield case 13 functions as a slot antenna. Thus, the number of components and assembly processes can be decreased, and miniaturization and cost reduction can be easily enhanced. Assembly efficiency can be further improved by the following method. Before a reflow soldering process for mounting various chip components constituting high frequency circuits on the circuit board 11, the upper shield case 13 is mounted on the circuit board 11 such that the front end of the power feeding member 14 is mounted on cream solder of the land 18. Thus, complex soldering connection work is not required for the power feeding member 14 because the power feeding member 14 can be collectively subjected to reflow soldering together with the various chip components, which further improves assembly efficiency.
Further, in the above-described embodiment, although the horizontal portion 14a of the power feeding member 14 extends along a bent line formed in an L-shape which is substantially parallel to the circuit board 11, the horizontal portion 14a may extends along a curved line which is substantially parallel to the circuit board 11. Furthermore, in the above-described embodiment, the circularly polarized wave slot antenna in which a pair of the radiation slots 16 and 17 are formed has been described. However, the present invention relates to the structure of a power feeding member, and the invention may be applied to a linearly polarized wave slot antenna.
The power feeding member 14 shown in
The antenna device of the invention is constructed such that the power feeding member is formed by extending the band-shaped metal piece having a hinge-shaped bent portion from the metal plate in which the radiation slots are formed, and the front end of the power feeding member is soldered to the land of the circuit board. Thus, although displacement is generated in a relative position between the slot antenna and the circuit board by external vibration and thermal expansion, the displacement can be absorbed by elasticity of the bent portion or the like, thereby decreasing the stress applied on the soldered portion of the power feeding member. For this reason, poor soldering connection of the power feeding member can be effectively prevented, so that reliability can be improved. In addition, assembly efficiency can be improved because soldering connection work in the power feeding member can be made simple.
Number | Date | Country | Kind |
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2004-297736 | Oct 2004 | JP | national |