The present invention relates to an antenna device used in wireless technology, and in particular to an antenna device with a surface antenna pattern formed by film coating on the casing of an electronic device.
It is well known that an antenna is the key element to transmit/receive (transceive) microwaves in wireless technology such as wireless communication and wireless data transfer, where the antenna transforms electrical currents generated by a transmitter into microwaves and transmits the microwaves in free space. The antenna also captures microwaves and transforms them into electrical currents, which are then processed by a receiver. As a result, the characteristics of the antenna deeply affect the application of the wireless technology, and the antenna is one of the factors that determine the quality of the wireless technology.
Among numerous kinds of electronic devices utilizing wireless signal transceiving, the structure, material and dimension of the antennas used by such devices are not entirely the same. A good antenna not only matches the features of the electronic devices and enhances the quality of the transceiving of a wireless signal, but also reduces the manufacturing costs of the electronic devices.
There are various types of antenna devices in the market for electronic devices. Some of the antenna devices are simple in structure, like dipole antennas, flat antennas and PIFA antennas; some are more complicated in structure, like antenna arrays and smart antennas.
As shown in
Conventionally, the antenna is mounted to a predetermined position at the casing of the electronic device. Although some antennas are designed to be embedded in the electronic devices, these antennas are manufactured separately and then mounted to predetermined positions inside the electronic devices and electrically connected to the circuit boards of the electronic devices. Such production processes are not only troublesome, but also increase the manufacturing costs and time. Furthermore, after assembling the antennas to the electronic devices, it is needed to adjust the antennas in order to optimize the performance of the antennas.
Thus, it is desired to provide an antenna device that is integrally formed on the casing of the electronic device to simplify the manufacturing processes and reduces the manufacturing cost and time.
A primary object of the present invention, therefore, is to provide an integrally formed antenna device which is simple in structure.
Another object of the present invention is to provide an antenna device with a surface antenna pattern formed by film coating technology. The film coating technology may comprise dip coating, electroplating and sputtering. The surface antenna pattern is formed either on the external surface or on the internal surface of the casing of the electronic device.
A further object of the present invention is to provide an antenna device comprising a surface antenna pattern and an antenna coupling element. The surface antenna pattern is inductively coupled with the antenna coupling element, and thereby wireless signals is transmitted from the surface antenna pattern through the antenna coupling element to the electronic device.
To realize the above objects, the present invention provides an antenna device with a surface antenna pattern formed on a casing of an electronic device by film coating technology. In the preferred embodiment, the surface antenna pattern may be arranged either on an external surface or on an internal surface of the casing of the electronic device. The surface antenna pattern is either directly connected to a signal feeding line or connected to a signal feeding line through a signal guiding passage. In an embodiment, a recess is formed on the external surface of the casing and then a surface antenna pattern is coated to the recess by film coating.
Preferably, the antenna device further comprises an antenna coupling element arranged at the internal surface of the casing, in opposite to the surface antenna pattern. The antenna coupling element is inductively coupled with the surface antenna pattern for transceiving the signals to the electronic device.
In comparison with the conventional technologies, the present invention provides an antenna device which is directly formed on the casing. The antenna device is not manufactured separately. Accordingly, it is not needed to assemble the antenna device to the electronic device and it is not needed to adjust the antenna device. Advantageously, the manufacturing cost and time can be saved. In the present invention, the signals transceived by the surface antenna pattern can be transmitted by inductively coupling with an antenna coupling element to the electronic device.
These and other objects, features and advantages of the invention will be apparent to those skilled in the art, from a reading of the following brief description of the drawings, the detailed description of the preferred embodiment, and the appended claims.
The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein:
With reference to the drawings and in particular to
The surface antenna pattern 3 is formed at a predetermined position at an external surface 211 of the display module casing 21 by film coating technology which may comprise dip coating, electroplating, sputtering and any coating techniques.
In a preferred embodiment, the electronic device 2 is a portable personal computer (i.e. a notebook), comprising a motherboard 23 mounted to an internal space of the main body casing 22. The motherboard 23 has an antenna module 231 which is electrically connected to the antenna pattern 3 by an antenna signal feeding line 26. The internal surface 212 of the display module casing 21 defines an inner space for the mounting of a LCD display screen 24. An anti-EMI plate 25 is disposed between the display module casing 21 and the LCD display screen 24.
The surface antenna pattern 3 coated at the external surface 211 of the display module casing 21 is electrically connected to the antenna module 231 through the antenna signal feeding line 26. The wireless signals transceived by the surface antenna pattern 3 is transmitted through the antenna signal feeding line 26 to the motherboard 23 at the main body casing 22.
As shown, the surface antenna pattern 3 is coupled to the antenna signal feeding line 26 through a signal guiding passage 27. The signal guiding passage 27 comprises a signal feeding end 27a and a connecting end 27b. The signal feeding end 27a is electrically connected to the surface antenna pattern 3. The connecting end 27b passes through the display module casing 21 to the inner surface 212 of the display module casing 21, and is electrically connected with the signal feeding line 26. Through the signal feeding line 26, the wireless signals transceived by the surface antenna pattern 3 is transmitted to the electronic device 2. The signal guiding passage 27 may be formed by electroplating an electrically conductive material, e.g. tin, to a through-hole arranged at the display module casing 21. Alternatively, the signal guiding passage 27 may be formed of an electrically conductive material e.g. an electric wire for connecting the surface antenna pattern 3 to the signal feeding line 26.
The antenna coupling element 3a is inductively coupled with the surface antenna pattern 3 (with no direct wire connection) for transceiving wireless signals. The wireless signals received by the surface antenna pattern 3 are transmitted through the antenna coupling element 3a and the antenna signal feeding line 26 to the antenna module 231 of the electronic device 2; the signals from the electronic device 2 are transmitted through the antenna module 231, the antenna signal feeding line 26 and the antenna coupling element 3a to the surface antenna pattern 3 where the signals are sent out wirelessly.
From the above statement, the present invention directly forms a surface antenna pattern on the casing of an electronic device by film coating accompanying a direct wire connection or a coupling feeding. Further, the present invention can be adapted into a wide range of electronic devices when used in different fields of application.
While the invention has been described in connection with what is presently considered to the most practical and preferred embodiments, it is to be understood that the invention is not to be limited to the disclosed embodiments, but on the contrary, is intended to cover various modifications and equivalent arrangement included within the spirit and scope of the appended claims.
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