The present disclosure relates to an antenna device.
An antenna device according to the present disclosure is designed to be connected to a printed-circuit board having a feeding part and a board ground. The antenna device includes a feed antenna, an antenna ground having a plate shape, an artificial magnetic conductor having a plate shape and being formed between the feed antenna and the antenna ground, a first connection connecting the feed antenna with the feeding part by passing through the antenna ground and the artificial magnetic conductor, and a second connection connecting the antenna ground with the board ground. The artificial magnetic conductor is not connected to the first connection and the second connection.
The antenna device according to the present disclosure can be readily mounted on an electronic device.
Hereinafter, exemplary embodiments will be described in detail with reference to the drawings as appropriate. However, more detailed description than necessary will be omitted in some cases. For example, the detailed description of well known matters and repeated description of substantially the same configuration may be omitted. This is to avoid the following description from being unnecessarily redundant, and to facilitate understanding of those skilled in the art.
Note that the attached drawings and the following description are provided for those skilled in the art to fully understand the present disclosure, and are not intended to limit the subject matter as described in the appended claims.
A first exemplary embodiment will now be described with reference to
An antenna device according to the first exemplary embodiment is an antenna for use in 2.4 GHz band applications such as Bluetooth (registered trademark) and Wireless Fidelity (Wi-Fi) networks. The antenna device can be applied to various electronic devices.
In the following description, antenna device 100 is a dipole antenna, for example. The dipole antenna is made from a multilayer substrate having a plurality of layers. The dipole antenna has a pattern that is formed on a surface of the dipole antenna by etching or other technique applied to metallic foil of the surface. The layers are each made of copper foil, glass epoxy or other material.
With reference to
Conductor (feed antenna) 2 and conductor (parasitic antenna) 3 are disposed on front side 1a of substrate 1 and have the same (identical) shapes, as show in
In the description herein, a z-axis is equivalent to a longitudinal direction of antenna device 100. A y-axis is equivalent to a transverse direction of antenna device 100 and perpendicular to the z-axis. An x-axis is equivalent to a thickness direction of antenna device 100 and perpendicular to an yz-plane. Via 4 and via 6 are disposed at substantially middle positions in the y-axis direction of substrate 1 and are symmetric with respect to a center of substrate 1 along the z-axis. Via 5 need only be disposed at a position where via 5 is not in contact with conductors 2 and 3, and may be disposed near via 4, for example.
Vias 4 and 6 will now be described in detail.
With reference to
Via 4 serves to supply electric power for driving conductor 2 as an antenna and is used to electrically connect conductor 2 on front side 1a of substrate 1 with a feeding part in an electronic device. Via 4 (i.e., the first connection) is not electrically connected to either AMC 7 or antenna ground 8.
Meanwhile, via 6 (i.e., the third connection) serves to connect conductor 3 with a ground and is used to electrically connect conductor 3 on the front side 1a of substrate 1 with a ground in the electronic device. Unlike via 4, via 6 is electrically connected to both AMC 7 and the antenna ground 8.
A relationship between a thickness of antenna device 100 and a frequency band will be described below.
The antenna device must be kept tuned to a certain frequency bandwidth to serve as an antenna for use in 2.4 GHz band applications such as Bluetooth (registered trademark) and Wi-Fi networks, for example. Generally, the frequency bandwidth that the antenna device is compatible with narrows with a reduction in thickness of AMC 7 and antenna ground 8. Thus, these layers are recommended to be as thick as possible in terms of antenna characteristics. On the other hand, an increase in the thickness of AMC 7 and antenna ground 8 causes antenna device 100 to get larger. To achieve a balance between keeping antenna device 100 tuned to the frequency bandwidth and downsizing antenna device 100, both AMC 7 and antenna ground 8 need to be connected with a ground. Specifically, if antenna device 100 works in the 2.4 GHz band at a transmission rate of 100 Mbps, for example, the thickness of antenna device 100 needs to be larger than 5 mm unless both AMC 7 and antenna ground 8 are connected with a ground. However, if both AMC 7 and antenna ground 8 are connected with the ground, the thickness of AMC 7 and antenna ground 8 can come down to a range between 1 mm and 2 mm and the thickness of antenna device 100 can thus come down to 5 mm or smaller. For this reason, in this exemplary embodiment as described above, via 6 is electrically connected to AMC 7 and antenna ground 8.
Antenna device 100 is disposed on printed-circuit board 10 of the electronic device and is connected to the feedpoint and the ground on printed-circuit board 10 of the electronic device by way of back side 1b of substrate 1 to serve a purpose of the electronic device. Since the existence of a metal or any influence in proximity to antenna device 100 may cause a deviation in frequency and a reduction in communication performance, it is preferable that antenna device 100 be connected to printed-circuit board 10 by way of back side 1b.
Via 5 (i.e., the second connection) will now be described in detail.
With reference to
With reference to
With reference to
AMC 7a includes hollows provided at positions that via 4 and via 5 pass through, respectively. These hollows respectively constitute holes 4a, 5a that have larger vertical cross sections (yz-cross sections) than the vertical cross sections of via 4 and via 5. Vias 4 and 5 are inserted through the hollows such that AMC 7a is not connected to vias 4 and 5. The yz-cross sections of holes 4a, 5a are each shaped into a square. Each side of the square has a length that is longer than respective diameters of vias 4 and 5.
In common with AMC 7a, antenna ground 8 includes a hollow provided at a position that via 4 passes through. The hollow constitutes hole 4b that has a larger vertical cross section (a yz-cross section) than the vertical cross section of via 4. Via 4 is inserted through the hollow such that antenna ground 8 is not connected to via 4. The yz-cross section of hole 4b is shaped into a square. Each side of the square has a length that is longer than every diameter of via 4.
In
Gap L1 between conductors 2 and 3 is wider than gap L2 between AMCs 7a and 7b. This is because a function of AMC 7 is put to full use only if conductors 2 and 3 are disposed over AMCs 7a and 7b such that gap L1 covers the whole of gap L2.
With reference to
With reference to
With reference to
In this exemplary embodiment, the absolute gain represents a gain obtained with a hypothetical antenna set to a reference antenna device. The PAG is an average gain determined from data on gains obtained in all measured directions.
The PAG in
The dipole antenna of the comparative example differed from the dipole antenna of this exemplary embodiment in terms of connection made by via 6. Specifically, via 6 in the comparative example was not connected to AMC 7 and antenna ground 8 but was connected only to a ground on a substrate of an electrical apparatus.
From the viewpoint of overall antenna radiation efficiency, as illustrated in
As illustrated in
As illustrated in
As described above, antenna device 100 according to this exemplary embodiment can come down in thickness while ensuring a predetermined capability. In addition, antenna device 100 can be readily mounted on an electronic device or other apparatus because antenna device 100 can be connected to the feeding part and the ground on printed-circuit board 10 by way of back side 1b.
In the exemplary embodiments described above, the dipole antenna and the monopole antenna are taken as examples to illustrate technique disclosed in this patent application. However, the technique may be illustrated using any of other antennas such as inverted-L antennas and inverted-F antennas.
In the exemplary embodiments described above, the antennas are for use in the 2.4 GHz band. The antennas may be designed to operate at other frequencies.
In the exemplary embodiments described above, the antenna devices are each made from a multilayer substrate. However, the antenna device may have any other configuration with proviso that the antenna, AMC 7, and antenna ground 8 are stacked in order. For example, an air layer may be put between conductors 2 and 3, and AMC 7.
The above exemplary embodiments are an illustration of the technique of the present disclosure. Therefore, various changes, replacements, additions, or omissions may be made to the exemplary embodiments within the scope of claims or their equivalents.
An antenna according to the present disclosure can be readily mounted on an electronic device. Thus, the antenna for use in wireless equipment can be applied to various apparatuses such as personal computers (PCs), portable devices, and traveling objects (e.g. vehicles, buses, and airplanes).
Number | Date | Country | Kind |
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2015-169942 | Aug 2015 | JP | national |
Number | Name | Date | Kind |
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7042419 | Werner | May 2006 | B2 |
7405698 | de Rochemont | Jul 2008 | B2 |
7760154 | Sekine | Jul 2010 | B2 |
20030197658 | Lilly | Oct 2003 | A1 |
20150263426 | Hsu | Sep 2015 | A1 |
20160020648 | Contopanagos | Jan 2016 | A1 |
Number | Date | Country |
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2015-070542 | Apr 2015 | JP |
Entry |
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International Search Report of PCT application No. PCT/JP2016/003823 dated Sep. 20, 2016. |
Number | Date | Country | |
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20180183142 A1 | Jun 2018 | US |
Number | Date | Country | |
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Parent | PCT/JP2016/003823 | Aug 2016 | US |
Child | 15897223 | US |