Patent Grant
12176633
This application claims the benefit under 35 USC 119(a) of Korean Patent Application No. 10-2021-0194181 filed in the Korean Intellectual Property Office on Dec. 31, 2021, the entire disclosure of which are incorporated herein by reference for all purposes.
The present disclosure relates to a multi-band antenna device.
The development of wireless communication systems has greatly changed our lifestyles over the past 20 years. An advanced mobile system with a gigabit per second data speed may be desired to support potential wireless applications such as multimedia devices, the Internet of Things, and intelligent transportation systems.
In a case of 5G communication, the frequency bands allocated for each country are different, and in some countries more than two bands are used, so the need for a multi-band antenna that may transmit and receive RF signals of multiple bands with one antenna is increasing.
When the multi-band antennas are stacked and formed in the height direction, the vertical structure of the antenna becomes complicated, and when forming the antenna, it may be desired to stack a plurality of dielectric layers and form a plurality of vias in a plurality of dielectric layers, thereby complicating the manufacturing process and increasing the manufacturing cost.
In addition, the multi-band antennas may be formed by dividing a low-band antenna and a high-band antenna and arranged them in the horizontal direction, however, as the low-band antenna and the high-band antenna are formed through different manufacturing processes, the manufacturing process becomes complicated and manufacturing costs may be high.
This Summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.
In one general aspect, an antenna device includes: a first dielectric layer; a second dielectric layer disposed on the first dielectric layer; a third dielectric layer disposed on the second dielectric layer; a first antenna including a first feed via passing through the first dielectric layer and a first antenna patch disposed on a first surface of the first dielectric layer; and a second antenna including a second feed via passing through the first dielectric layer and a second antenna patch disposed on the first surface of the first dielectric layer, wherein the dielectric constant of the second dielectric layer is lower than the dielectric constant of the first dielectric layer and the dielectric constant of the third dielectric layer, and the second dielectric layer has a cavity overlapping the second antenna patch.
The dielectric constant of the third dielectric layer may be higher than the dielectric constant of the first dielectric layer.
The second dielectric layer may include an adhesive material.
The second dielectric layer may include a polymer.
The thickness of the second dielectric layer may be smaller than the thickness of the first dielectric layer and the thickness of the third dielectric layer.
The first antenna may further include a third antenna patch overlapping the first antenna patch, and the third antenna patch may be disposed on a first surface of the third dielectric layer, and the first surface of the first dielectric layer and the first surface of the third dielectric layer may face each other with the second dielectric layer interposed therebetween.
The first antenna may further include a fourth antenna patch overlapping the first antenna patch, and the fourth antenna patch may be disposed on a second surface of the third dielectric layer opposing the first surface of the third dielectric layer.
The area of the third antenna patch and the area of the fourth antenna patch may be smaller than the area of the first antenna patch.
The area of the third antenna patch may be smaller than the area of the fourth antenna patch.
The area of the third antenna patch may be smaller than the area of the second antenna patch.
The first antenna may be configured to transmit and receive an RF signal of the first bandwidth, and the second antenna may be configured to transmit and receive an RF signal of a second bandwidth higher than the first bandwidth.
The antenna device may further include a plurality of connections disposed on a second surface of the first dielectric layer opposing the first surface of the first dielectric layer.
In another general aspect, an antenna device includes: a first antenna including a first dielectric layer and a second dielectric layer, a third dielectric layer disposed between the first dielectric layer and the second dielectric layer, a first feed via passing through the first dielectric layer, a first feed patch disposed on the first dielectric layer, and a radiating patch disposed in the second dielectric layer; and a second antenna including the first dielectric layer, the second dielectric layer, a second feed via passing through the first dielectric layer, a second feed patch disposed on the first dielectric layer, and a cavity formed in the third dielectric layer disposed on the second feed patch.
The radiating patch of the first antenna may include: a first radiating patch disposed in the first surface of the second dielectric layer and facing the first feed patch via the third dielectric layer therebetween; and a second radiating patch disposed in the second surface facing the first surface of the second dielectric layer.
A size of the first radiating patch may be smaller than a size of the first feed patch and a size of the second radiating patch.
A size of the first feed patch may be larger than a size of the second feed patch.
The antenna device may further include a plurality of connections disposed under the first dielectric layer.
Other features and aspects will be apparent from the following detailed description, the drawings, and the claims.
Throughout the drawings and the detailed description, the same reference numerals refer to the same or like elements. The drawings may not be to scale, and the relative size, proportions, and depiction of elements in the drawings may be exaggerated for clarity, illustration, and convenience.
The following detailed description is provided to assist the reader in gaining a comprehensive understanding of the methods, apparatuses, and/or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatuses, and/or systems described herein will be apparent after an understanding of the disclosure of this application. For example, the sequences of operations described herein are merely examples, and are not limited to those set forth herein, but may be changed as will be apparent after an understanding of the disclosure of this application, with the exception of operations necessarily occurring in a certain order. Also, descriptions of features that are known after understanding of the disclosure of this application may be omitted for increased clarity and conciseness.
The features described herein may be embodied in different forms, and are not to be construed as being limited to the examples described herein. Rather, the examples described herein have been provided merely to illustrate some of the many possible ways of implementing the methods, apparatuses, and/or systems described herein that will be apparent after an understanding of the disclosure of this application.
Throughout the specification, when an element, such as a layer, region, or substrate, is described as being “on,” “connected to,” or “coupled to” another element, it may be directly “on,” “connected to,” or “coupled to” the other element, or there may be one or more other elements intervening therebetween. In contrast, when an element is described as being “directly on,” “directly connected to,” or “directly coupled to” another element, there can be no other elements intervening therebetween.
As used herein, the term “and/or” includes any one and any combination of any two or more of the associated listed items.
Although terms such as “first,” “second,” and “third” may be used herein to describe various members, components, regions, layers, or sections, these members, components, regions, layers, or sections are not to be limited by these terms. Rather, these terms are only used to distinguish one member, component, region, layer, or section from another member, component, region, layer, or section. Thus, a first member, component, region, layer, or section referred to in examples described herein may also be referred to as a second member, component, region, layer, or section without departing from the teachings of the examples.
Spatially relative terms such as “above,” “upper,” “below,” and “lower” may be used herein for ease of description to describe one element's relationship to another element as shown in the figures. Such spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, an element described as being “above” or “upper” relative to another element will then be “below” or “lower” relative to the other element. Thus, the term “above” encompasses both the above and below orientations depending on the spatial orientation of the device. The device may also be oriented in other ways (for example, rotated 90 degrees or at other orientations), and the spatially relative terms used herein are to be interpreted accordingly.
The terminology used herein is for describing various examples only, and is not to be used to limit the disclosure. The articles “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms “comprises,” “includes,” and “has” specify the presence of stated features, numbers, operations, members, elements, and/or combinations thereof, but do not preclude the presence or addition of one or more other features, numbers, operations, members, elements, and/or combinations thereof.
Due to manufacturing techniques and/or tolerances, variations of the shapes shown in the drawings may occur. Thus, the examples described herein are not limited to the specific shapes shown in the drawings, but include changes in shape that occur during manufacturing.
The features of the examples described herein may be combined in various ways as will be apparent after an understanding of the disclosure of this application. Further, although the examples described herein have a variety of configurations, other configurations are possible as will be apparent after an understanding of the disclosure of this application.
Further, in this specification, the phrase “on a plane” means viewing a target portion from the top, and the phrase “on a cross-section” means viewing a cross-section formed by vertically cutting a target portion from the side.
In addition, in the specification, when referring to “connected to”, this does not only mean that two or more constituent elements are directly connected to, but also that two or more constituent elements are electrically connected through other constituent elements as well as being indirectly connected to and being physically connected to, or it may mean that they are referred to by different names according to a position or function, but are integrated.
Throughout the specification, a pattern, a via, a plane, a line, and an electrical connection structure may include metal materials (e.g., conductive materials such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof), and may be formed according to a plating method such as CVD (chemical vapor deposition), PVD (Physical Vapor Deposition), sputtering, a subtractive method, an additive method, an SAP (Semi-Additive Process), and an MSAP (Modified Semi-Additive Process).
Throughout the specification, the dielectric layer and/or insulation layer is may be implemented with FR4, an LCP (Liquid Crystal Polymer), an LTCC (Low Temperature Co-fired Ceramic), a thermosetting resin such as an epoxy resin, a thermal baking resin such as a polyimide, or a resin in which these resins are impregnated into a core material such as glass fiber, glass cloth, and glass fabric along with inorganic fillers, a prepreg, an Ajinomoto build-up film (ABF), FR-4, BT (Bismaleimide Triazine), a photosensitive insulating (PhotoImageable Dielectric: PID) resin, a general copper clad laminate (CCL), or a glass or ceramic (ceramic)-based insulating material.
Throughout the specification, the RF signal may have a format according to Wi-Fi (IEEE 802.11 family, etc.), WiMAX (IEEE 802.16 family, etc.), IEEE 802.20, LTE (long term evolution), Ev-DO, HSPA, HSDPA, HSUPA, EDGE, GSM, GPS, GPRS, CDMA, TDMA, DECT, Bluetooth, 3G, 4G, 5G, and other arbitrary wireless and wired protocols designated later, but is not limited thereto.
Hereinafter, various embodiments and variations are described in detail with reference to accompanying drawings.
An antenna device 1000, according to an embodiment, is described with reference to
Referring to
The first antenna 100a and the second antenna 100b may include a dielectric layer 110, feed vias 111a, 111b, 112a, and 112b, and antenna patches 21a, 21b, 31a, and 41a disposed at the dielectric layer 110, and connections 11a, 11b, 12a, 12b, and 13 disposed under the dielectric layer 110.
The first antenna 100a and the second antenna 100b of the antenna 100 may be disposed on the sides of each other along the first direction DR1.
The dielectric layer 110 of the first antenna 100a and the second antenna 100b may include a first dielectric layer 110a, a second dielectric layer 110b, and a third dielectric layer 110c extending in the first direction DR1 and the second direction DR2, and sequentially disposed along a third direction DR3 perpendicular to the first direction DR1 and the second direction DR2.
Dielectric constants of the first dielectric layer 110a, the second dielectric layer 110b, and the third dielectric layer 110c may differ. For example, the dielectric constant of the first dielectric layer 110a and the third dielectric layer 110c may be larger than the dielectric constant of the second dielectric layer 110b disposed between the first dielectric layer 110a and the third dielectric layer 110c, and the dielectric constant of the third dielectric layer 110c may be larger than the dielectric constant of the first dielectric layer 110a.
The second dielectric layer 110b may include a different material from a material of the first dielectric layer 110a and the third dielectric layer 110c. For example, the second dielectric layer 110b may have adhesiveness to increase the bonding force between the first dielectric layer 110a and the third dielectric layer 110c. For example, the second dielectric layer 110b may include a ceramic material having a lower dielectric constant than that of the first dielectric layer 110a and the third dielectric layer 110c, or may have high flexibility such as an LCP (Liquid Crystal Polymer) or a polyimide, or may include a material such as an epoxy resin or Teflon to have strong durability and high adhesion, while the second dielectric layer 110b may include a polymer having adhesive properties.
The thickness of the first dielectric layer 110a and the third dielectric layer 110c may be greater than the thickness of the second dielectric layer 110b.
The first dielectric layer 110a may have a first surface 110a1 and a second surface 110a2 facing each other along the third direction DR3, and the third dielectric layer 110c may have a first surface 110c1 and a second surface 110c2 facing each other along the third direction DR3, while the first surface 110a1 of the first dielectric layer 110a may face the first surface 110c1 of the third dielectric layer 110c.
The first antenna 100a may include the first feed via 111a and the second feed via 111b penetrating the first dielectric layer 110a, the first antenna patch 21a disposed at the first surface 110a1 of the first dielectric layer 110a, the second antenna patch 31a facing the first antenna patch 21a and disposed at the first surface 110c1 of the third dielectric layer 110c, and the third antenna patch 41a disposed at the second surface 110c2 of the third dielectric layer 110c and overlapping the first antenna patch 21a and the second antenna patch 31a along the third direction DR3.
The first antenna patch 21a, the second antenna patch 31a, and the third antenna patch 41a may include a metal layer of a flat polygonal plate shape having a constant area. For example, the first antenna patch 21a, the second antenna patch 31a, and the third antenna patch 41a may have a quadrangle shape, but are not limited thereto, and the first antenna patch 21a, the second antenna patch 31a, and the third antenna patch 41a may have a polygon shape, or various shapes such as a circle shape.
The first antenna patch 21a may be fed from the first feed via 111a and the second feed via 111b. The first antenna patch 21a may be a feed patch.
The second antenna patch 31a and third antenna patch 41a are spaced apart along the third direction DR3, and the second antenna patch 31a and third antenna patch 41a may have a same or different area as the first antenna patch 21a. For example, the second antenna patch 31a and the third antenna patch 41a may have a smaller area than the first antenna patch 21a, and the second antenna patch 31a may have a smaller area than the third antenna patch 41a. In addition, the second antenna patch 31a may have a smaller area than the fourth antenna patch 21b of the second antenna 100b, to be described later.
The second antenna patch 31a and the third antenna patch 41a may be electromagnetically coupled to the first antenna patch 21a, and may be radiating patches. The second antenna patch 31a and third antenna patch 41a may improve the gain or bandwidth of the first antenna patch 21a by focusing the RF signal in the third direction DR3.
The second antenna 100b may include a third feed via 112a and a fourth feed via 112b passing through the first dielectric layer 110a, and a fourth antenna patch 21b disposed on the first surface 110a1 of the first dielectric layer 110a.
The second dielectric layer 110b may have a first cavity 121 overlapping the fourth antenna patch 21b of the second antenna 100b. The first cavity 121 may be an air cavity filled with air, whereby the dielectric constant of the second dielectric layer 110b may be smaller than that of the first dielectric layer 110a and the third dielectric layer 110c. The length of the boundary portion between the first dielectric layer 110a and the second dielectric layer 110b having different dielectric constants may be increased by the first cavity 121.
Of the dielectric layer 110 of the second antenna 100b, as the second dielectric layer 110b having a smaller dielectric constant than the first dielectric layer 110a and the third dielectric layer 110c has the first cavity 121, a dielectric constant interface is formed between the layers having the different dielectric constants, and the radiation pattern of the second antenna 100b may be changed by this dielectric constant interface. In this way, the gain of the second antenna 100b may be increased by changing the radiation pattern of the second antenna 100b by adjusting the dielectric constant interface in the dielectric layer 110 of the second antenna 100b.
The first cavity 121 of the second dielectric layer 110b may have a circular planar shape, but is not limited thereto, and may have a polygonal planar shape.
In addition, by making the dielectric constant of the uppermost third dielectric layer 110c along the third direction DR3 larger than the dielectric constant of the first dielectric layer 110a, the directivity of the first antenna 100a and the second antenna 100b may be increased.
A plurality of connections 11a, 11b, 12a, 12b, and 13 may be disposed in the second surface 110a2 of the first dielectric layer 110a.
Among a plurality of connections 11a, 11b, 12a, 12b, and 13, the first connection 11a and the second connection 11b may be connected to the first feed via 111a and the second feed via 111b, and the third connection 12a and the fourth connection 12b may be connected to the third feed via 112a and the fourth feed via 112b. A plurality of fifth connections 13 may be attached to the first dielectric layer 110a.
A plurality of connections 11a, 11b, 12a, 12b, and 13 may have a structure such as a solder ball, a pin, a land, or a pad.
The antenna device 1000 may further include a connection substrate 200 disposed under the antenna 100, and the antenna 100 may be connected to the connection substrate 200 through a plurality of connections 11a, 11b, 12a, 12b, and 13.
The connection substrate 200 may include a ground plane 201 and a plurality of metal layers 202 and 203.
The first feed via 111a and the second feed via 111b, and the third feed via 112a and the fourth feed via 112b, may receive an electrical signal from an electronic device disposed under the connection substrate 200.
The first antenna 100a may be fed from the first feed via 111a and the second feed via 111b to transmit and receive the RF signal in the first band, and the second antenna 100b may be fed from the third feed via 112a and the fourth feed via 112b to transmit and receive the RF signals in the second band.
The first antenna 100a may transmit/receive a first polarized RF signal of the first bandwidth according to the electromagnetic signal fed through the first feed via 111a, and the first antenna 100a may transmit/receive a second polarized RF signal of the first bandwidth according to the electromagnetic signal fed through the second feed via 111b.
The second antenna 100b may transmit/receive the first polarized RF signal of the second bandwidth according to the electromagnetic signal fed through the third feed via 112a, and may transmit/receive the second polarized RF signal of the second bandwidth according to the electromagnetic signal fed through the fourth feed via 112b.
The center frequency of the first bandwidth may be lower than a center frequency of the second bandwidth, the first polarized wave may be a horizontally polarized wave, and the second polarized wave may be a vertically polarized wave. For example, the range of the first bandwidth may be about 24 GHz to about 30 GHz, and the range of the second bandwidth may be about 37 GHz to about 50 GHz.
Referring to
According to the antenna device 1000 according to the present embodiment, the first antenna 100a and the second antenna 100b that transmit and receive the RF signals of the different bandwidths may be formed together to be disposed next to each other along the first direction DR1, which is the horizontal direction, by using the same dielectric layer 110, compared to a case of integrating the dual band antenna in the vertical direction, the structure of the antenna 100 is not complicated. Hence, the manufacturing process is easy compared to the case of separately forming two antennas of different bandwidths. The manufacturing process is not complicated; thus, the cost may be lowered.
According to the antenna device 1000 according to the present embodiment, the dielectric constant of the third dielectric layer 110c may be formed larger than the dielectric constant of the first dielectric layer 110a of the dielectric layer 110, and the dielectric constant of the second dielectric layer 110b of the dielectric layer 110 may be formed smaller than the dielectric constant of the first dielectric layer 110a and the third dielectric layer 110c. Through this, the dielectric constant of the dielectric layers disposed between the first antenna patch 21a, the second antenna patch 31a, and the third antenna patch 41a of the first antenna 100a may be changed, and the first antenna 100a may increase the bandwidth of the first antenna 100a for transmitting/receiving the RF signal of the first bandwidth by including the second antenna patch 31a and the third antenna patch 41a overlapping the first antenna patch 21a. The second antenna 100b may have the first cavity 121 at the second dielectric layer 110b overlapping the fourth antenna patch 21b, the length of the boundary between the first dielectric layer 110a and the second dielectric layer 110b having the different dielectric constants may be increased by the first cavity 121, and accordingly, the gain of the second antenna 100b may be increased by changing the radiation pattern of the second antenna 100b.
The antenna device 1001, according to another embodiment, is described with reference to
Referring to
The antenna device 1001, according to the present embodiment, may include the first antenna 100a and the second antenna 100b, and the first antenna 100a and the second antenna 100b may include the dielectric layer 110, the feed vias 111a, 111b, 112a, and 112b and the antenna patches 21a, 21b, 31a, and 41a disposed in the dielectric layer 110, and the connections 11a, 11b, 12a, 12b, 13, and 13a disposed under the dielectric layer 110.
The first antenna 100a may include the first feed via 111a and the second feed via 111b penetrating the first dielectric layer 110a, the first antenna patch 21a disposed in the first surface 110a1 of the first dielectric layer 110a, the second antenna patch 31a facing the first antenna patch 21a and disposed in the first surface 110c1 of the third dielectric layer 110c, and the third antenna patch 41a disposed in the second surface 110c2 of the third dielectric layer 110c and overlapping the first antenna patch 21a and the second antenna patch 31a according to the third direction DR3.
The first antenna patch 21a may be fed from the first feed via 111a and the second feed via 111b. The first antenna patch 21a may be a feed patch.
The second antenna patch 31a and the third antenna patch 41a may be electromagnetically coupled to the first antenna patch 21a, and may be radiating patches.
The second antenna 100b may include the third feed via 112a and the fourth feed via 112b passing through the first dielectric layer 110a, and the fourth antenna patch 21b disposed in the first surface 110a1 of the first dielectric layer 110a.
The second dielectric layer 110b may have the first cavity 121 overlapping the fourth antenna patch 21b of the second antenna 100b, and may increase the gain of the second antenna 100b by changing the radiation pattern of the second antenna 100b by adjusting the dielectric constant of the interface in the dielectric layer 110 of the second antenna 100b.
The antenna device 1001, according to the present embodiment, may further include a shield pattern 22 disposed between the first antenna 100a and the second antenna 100b and a shield via 113 connected to the shield pattern 22.
The shield via 113 and the shield pattern 22 may be connected to the ground plane 201.
The shield pattern 22 is disposed between the first antenna patch 21a of the first antenna 100a and the fourth antenna patch 21b of the second antenna 100b to increase the degree of the isolation between the first antenna 100a and the second antenna 100b.
Among a plurality of connections 11a, 11b, 12a, 12b, 13, and 13a, the first connection 11a and the second connection 11b may be connected to the first feed via 111a and the second feed via 111b, and the third connection 12a and the fourth connection 12b may be connected to the third feed via 112a and the fourth feed via 112b. A plurality of fifth connections 13 may be attached to the first dielectric layer 110a, the sixth connection 13a may be connected to the shield via 113, and the shield via 113 may be connected to the ground plane 201 through the sixth connection 13a.
The antenna device 1001 may further include a connection substrate 200 disposed under the antenna 100, and the antenna 100 may be connected to the connection substrate 200 through a plurality of connections 11a, 11b, 12a, 12b, 13, and 13a.
The connection substrate 200 may include a ground plane 201 and a plurality of metal layers 202 and 203.
The first antenna 100a may transmit and receive the first polarized RF signal of the first bandwidth according to the electromagnetic signal fed through the first feed via 111a, and the first antenna 100a may receive the second polarized RF signal of the first bandwidth RF signal according to the electromagnetic signal fed through the second feed via 111b.
The second antenna 100b may transmit/receive the first polarized RF signal of the second bandwidth according to the electromagnetic signal fed through the third feed via 112a, and may transmit/receive the second polarized RF signal of the second bandwidth according to the electromagnetic signal fed through the fourth feed via 112b.
The center frequency of the first bandwidth may be lower than the center frequency of the second bandwidth, the first polarization wave may be the horizontal polarization wave, and the second polarization wave may be the vertical polarization wave. For example, the range of the first bandwidth may be about 24 GHz to about 30 GHz, and the range of the second bandwidth may be about 37 GHz to about 50 GHz.
According to the antenna device 1001 according to the present embodiment, as the first antenna 100a and the second antenna 100b that transmit and receive the RF signals of the different bandwidths may be formed together by using the same dielectric layer 110 to position them next to each other along the first direction DR1, which is the horizontal direction, compared to the case of integrating the dual band antenna in the vertical direction, the structure of the antenna 100 is not complicated, so the manufacturing process is easy, and compared to the case of separately forming two antennas with the different bandwidths, the manufacturing process is not complicated, so the manufacturing cost may be lowered.
The antenna device 1001, according to the present embodiment, further includes the shield via 113 connected to the shield pattern 22 and the shield pattern 22 is disposed between the first antenna 100a and the second antenna 100b, so the degree of the isolation between the first antenna 100a and the second antenna 100b may increase.
According to the embodiment described above, many features of the antenna device 1000 apply to the antenna device 1001 according to the present embodiment.
The antenna device 1002, according to another embodiment, is described with reference to
Referring to
The antenna device 1002, according to the present embodiment, includes the first antenna 100a and the second antenna 100b, and the first antenna 100a and the second antenna 100b may include the dielectric layer 110, and the feed vias 111a, 111b, 112a, and 112b and the antenna patches 21a, 21b, 31a, and 41a disposed in the dielectric layer 110 and a plurality of connections 11a, 11b, 12a, 12b, and 13 disposed under the dielectric layer 110.
The first antenna 100a may include the first feed via 111a and the second feed via 111b passing through the first dielectric layer 110a, the first antenna patch 21a disposed in the first surface 110a1 of the first dielectric layer 110a, the second antenna patch 31a facing the first antenna patch 21a and disposed in the first surface 110c1 of the third dielectric layer 110c, and the third antenna patch 41a disposed in the second surface 110c2 of the third dielectric layer 110c and overlapping the first antenna patch 21a and the second antenna patch 31a along the third direction DR3.
The first antenna patch 21a may be fed from the first feed via 111a and the second feed via 111b. The first antenna patch 21a may be a feed patch.
The second antenna patch 31a and the third antenna patch 41a may be electromagnetically coupled to the first antenna patch 21a, and may be radiating patches.
The second antenna 100b may include the third feed via 112a and the fourth feed via 112b passing through the first dielectric layer 110a, and the fourth antenna patch 21b disposed in the first surface 110a1 of the first dielectric layer 110a.
The second dielectric layer 110b may have the first cavity 121 that overlaps with the fourth antenna patch 21b of the second antenna 100b, and may greatly increase the gain of the second antenna 100b by adjusting the dielectric constant of the interface in the dielectric layer 110 of the second antenna 100b to change the radiation pattern of the second antenna 100b.
According to the present embodiment, the second dielectric layer 110b of the antenna device 1002 may further have the second cavity 122 overlapping the first antenna patch 21a of the first antenna 100a.
The second cavity 122 of the second dielectric layer 110b may change the radiation pattern of the first antenna 100a by adjusting the dielectric constant interface in the dielectric layer 110 of the first antenna 100a to increase the gain of the first antenna 100a.
Among a plurality of connections 11a, 11b, 12a, 12b, and 13, the first connection 11a and the second connection 11b may be connected to the first feed via 111a and the second feed via 111b, and the third connection 12a and the fourth connection 12b may be connected to the third feed via 112a and the fourth feed via 112b. A plurality of fifth connections 13 may be attached to the first dielectric layer 110a.
The antenna device 1002 may further include the connection substrate 200 disposed under the antenna 100, and the antenna 100 may be connected to the connection substrate 200 through a plurality of connections 11a, 11b, 12a, 12b, and 13.
The connection substrate 200 may include a ground plane 201 and a plurality of metal layers 202 and 203.
The first antenna 100a may transmit/receive the first polarized RF signal of the first bandwidth according to the electromagnetic signal fed through the first feed via 111a, and the first antenna 100a may transmit/receive the second polarized RF signal of the first bandwidth RF signal according to the electromagnetic signal fed through the second feed via 111b.
The second antenna 100b may transmit/receive the first polarized RF signal of the second bandwidth according to the electromagnetic signal fed through the third feed via 112a, and transmit/receive the second polarized RF signal of the second bandwidth according to the electromagnetic signal fed through the fourth feed via 112b.
The center frequency of the first bandwidth may be lower than the center frequency of the second bandwidth, the first polarization wave may be a horizontally polarized wave, and the second polarization may be a vertically polarized wave. For example, the range of the first bandwidth may be about 24 GHz to about 30 GHz, and the range of the second bandwidth may be about 37 GHz to about 50 GHz.
According to the antenna device 1002 according to the present embodiment, since the first antenna 100a and the second antenna 100b that transmit and receive the RF signals of the different bandwidths may be formed together using the same dielectric layer 110 to position them next to each other along the first direction DR1, which is the horizontal direction, compared to the case of integrating the dual band antenna in the vertical direction, the structure of the antenna 100 is not complicated, so the manufacturing process is easy, and compared to the case of separately forming two antennas with the different bandwidths, the manufacturing process is not complicated, so the manufacturing cost may be lowered.
The second dielectric layer 110b of the antenna device 1002, according to the present embodiment, may further have the second cavity 122 overlapping the first antenna patch 21a of the first antenna 100a, and the second cavity 122 of the second dielectric layer 110b may change the radiation pattern of the first antenna 100a by adjusting the dielectric constant of the interface in the dielectric layer 110 of the first antenna 100a to increase the gain of the first antenna 100a.
According to the embodiments described above, many features of the antenna devices 1000 and 1001 are applicable to the antenna device 1002 according to the present embodiment.
The antenna device 1003, according to another embodiment, is described with reference to
Referring to
The antenna device 1003, according to the present embodiment, includes the first antenna 100a and the second antenna 100b, and the first antenna 100a and the second antenna 100b may include the dielectric layer 110, and the feed vias 111a, 111b, 112a, and 112b and the antenna patches 21a, 21b, and 41a disposed in the dielectric layer 110, and a plurality of connections 11a, 11b, 12a, 12b, and 13 disposed under the dielectric layer 110.
The first antenna 100a may include the first feed via 111a and the second feed via 111b passing through the first dielectric layer 110a, the first antenna patch 21a disposed in the first surface 110a1 of the first dielectric layer 110a, and the third antenna patch 41a disposed in the second surface 110c2 of the third dielectric layer 110c and overlapping the first antenna patch 21a along the third direction DR3. Unlike the antenna devices 1000, 1001, and 1002 according to the above-described embodiments, in the antenna device 1003, according to the present embodiment, the second antenna patch 31a is disposed in the first surface 110c1 of the third dielectric layer 110c.
The first antenna patch 21a may be fed from the first feed via 111a and the second feed via 111b. The first antenna patch 21a may be a feed patch, and the third antenna patch 41a may be electromagnetically coupled to the first antenna patch 21a and may be a radiating patch.
The second antenna 100b may include the third feed via 112a and the fourth feed via 112b passing through the first dielectric layer 110a, and the fourth antenna patch 21b disposed on the first surface 110a1 of the first dielectric layer 110a.
The second dielectric layer 110b may have the first cavity 121 that overlaps with the fourth antenna patch 21b of the second antenna 100b, and may greatly increase the gain of the second antenna 100b by adjusting the dielectric constant of the interface in the dielectric layer 110 of the second antenna 100b to change the radiation pattern of the second antenna 100b.
The second dielectric layer 110b may have the second cavity 122 overlapping the first antenna patch 21a of the first antenna 100a, and the second cavity 122 of the second dielectric layer 110b may change the radiation pattern of the first antenna 100a by adjusting the dielectric constant of the interface in the dielectric layer 110 of the first antenna 100a to increase the gain of the first antenna 100a. The second cavity 122 of the antenna device 1003 according to the present embodiment may be larger than the second cavity 122 of the antenna device 1002 according to the embodiment shown in
The thickness of the third dielectric layer 110c and the thickness of the second dielectric layer 110b of the antenna device 1003, according to the present embodiment, may be greater than the thickness of the third dielectric layer 110c and the second dielectric layer 110b of the antenna device 1002 according to the embodiment shown in
By increasing the thickness of the third dielectric layer 110c, the entire dielectric constant of the dielectric layer 110 may be lowered, and as the dielectric constant of the dielectric layer 110 becomes smaller, the gain of the first antenna 100a may not decrease even if the second antenna patch 31a is omitted.
In addition, by increasing the thickness of the second dielectric layer 110b, it is possible to increase the straightness of the propagation direction transmitted from the first antenna patch 21a to the third antenna patch 41a disposed on the second surface 110c2 of the third dielectric layer 110c, and accordingly, even if the second antenna patch 31a is omitted, the gain of the first antenna 100a may not decrease.
The size of the third antenna patch 41a of the antenna device 1003, according to the present embodiment, may be different from the size of the third antenna patch 41a of the antenna device 1002, according to the embodiment shown in
Among a plurality of connections 11a, 11b, 12a, 12b, and 13, the first connection 11a and the second connection 11b may be connected to the first feed via 111a and the second feed via 111b, and the third connection 12a and the fourth connection 12b may be connected to the third feed via 112a and the fourth feed via 112b. A plurality of fifth connections 13 may be attached to the first dielectric layer 110a.
The antenna device 1003 may further include the connection substrate 200 disposed under the antenna 100, and the antenna 100 may be connected to the connection substrate 200 through a plurality of connections 11a, 11b, 12a, 12b, and 13.
The connection substrate 200 may include a ground plane 201 and a plurality of metal layers 202 and 203.
The first antenna 100a may transmit/receive the first polarized RF signal of the first bandwidth according to the electromagnetic signal fed through the first feed via 111a, and the first antenna 100a may transmit/receive the second polarized RF signal of the first bandwidth RF signal according to the electromagnetic signal fed through the second feed via 111b.
The second antenna 100b may transmit/receive the first polarized RF signal of the second bandwidth according to the electromagnetic signal fed through the third feed via 112a, and may transmit/receive the second polarized RF signal of the second bandwidth according to the electromagnetic signal fed through the fourth feed via 112b.
The center frequency of the first bandwidth may be lower than the center frequency of the second bandwidth, the first polarization wave may be a horizontally polarized wave, and the second polarization may be a vertically polarized wave. For example, the range of the first bandwidth may be about 24 GHz to about 30 GHz, and the range of the second bandwidth may be about 37 GHz to about 50 GHz.
According to the antenna device 1003 according to the present embodiment, since the first antenna 100a and the second antenna 100b that transmit and receive the RF signals of the different bandwidths may be formed together by using the same dielectric layer 110 to position them next to each other along the first direction DR1, which is the horizontal direction, compared to the case of integrating the dual band antenna in the vertical direction, the structure of the antenna 100 is not complicated, so the manufacturing process is easy, and compared to the case of separately forming two antennas with the different bandwidths, the manufacturing process is not complicated, so the manufacturing cost may be lowered.
The second dielectric layer 110b of the antenna device 1003, according to the present embodiment, may further have the second cavity 122 overlapping the first antenna patch 21a of the first antenna 100a, and the second antenna patch 31a disposed on the first surface 110c1 of the third dielectric layer 110c may be omitted.
The second cavity 122 of the antenna device 1003, according to the present embodiment, may be larger than the second cavity 122 of the antenna device 1002 according to the embodiment shown in
In addition, the size of the third antenna patch 41a of the antenna device 1003, according to the present embodiment, may be different from the size of the third antenna patch 41a of the antenna device 1002, according to the embodiment shown in
Many features of the antenna devices 1000, 1001, and 1002 according to the embodiments described above, apply to the antenna device 1003 according to the present embodiment.
The antenna device, including a plurality of antennas according to an embodiment, is described with reference to
An antenna device 1000a, according to the present embodiment, may include a plurality of antennas 100 disposed along the first direction DR1.
Each antenna 100 may be similar to the antenna 100 according to the embodiments previously described with reference to
As described above, since each antenna 100 includes the first antenna 100a and the second antenna 100b, compared to the case of separately attaching two antennas of the different bandwidths, the antenna device 1000a, according to the present embodiment, may reduce the number of antenna chips attached to the connection substrate 200 by half while implementing the multi-band.
The characteristics of the antenna devices 1000, 1001, 1002, and 1003 according to the embodiments described above are applicable to the antenna device 1000a, including a plurality of antennas according to the present embodiment.
The antenna device, including a plurality of antennas according to an embodiment, is described with reference to
The antenna device 1000b, according to the present embodiment, may further include a plurality of antennas 100 disposed along the first direction DR1 and a plurality of end-fire antennas 300 connected to a plurality of antennas 100 along the second direction DR2.
Each antenna 100 of the antenna device 1000b, according to the present embodiment, may be similar to the antenna 100 according to the embodiments described with reference to
As described above, since each antenna 100 includes the first antenna 100a and the second antenna 100b, compared to the case of separately attaching two antennas of the different bandwidths, the antenna device 1000a according to the present embodiment may reduce the number of antenna chips attached to the connection substrate 200 by half while implementing the multi-band.
A plurality of end-fire antennas 300 may further form a radiation pattern of the RF signal in the first direction DR1 and the second direction DR2 that are horizontal directions.
The characteristics of the antenna devices 1000, 1001, 1002, 1003, and 1000a, according to the embodiments described above, are all applicable to the antenna device 1000b, including a plurality of antennas according to the present embodiment.
The antenna device, including a plurality of antennas according to an embodiment, is described with reference to
The antenna device 1000c, according to the present embodiment, may further include a plurality of antennas 100 that are disposed along the first direction DR1 and a plurality of end-fire antennas 400 connected to a plurality of antennas 100.
Each antenna 100 of the antenna device 1000c, according to the present embodiment, may be similar to the antenna 100 according to the embodiments described with reference to
As described above, since each antenna 100 includes the first antenna 100a and the second antenna 100b, compared to the case of separately attaching two antennas of the different bandwidths, the antenna device 1000a, according to the present embodiment, may reduce the number of antenna chips attached to the connection substrate 200 by half while implementing the multi-band.
Each end-fire antenna 400 may include a first portion 400a and a second portion 400b formed in the form of a chip.
The first portion 400a and the second portion 400b of each end-fire antenna 400 may include a radiator and a dielectric material.
A plurality of end-fire antennas 400 may further form a radiation pattern of the RF signal in the first direction DR1, and the second direction DR2 that are horizontal directions.
The characteristics of the antenna devices 1000, 1001, 1002, 1003, 1000a, and 1000b, according to the embodiments described above, are applicable to the antenna device 1000c, including a plurality of antennas according to the present embodiment.
An electronic device, including the antenna device according to an embodiment, is described with reference to
The electronic device 2000, according to the embodiment, includes the antenna device 1000, and the antenna device 1000 is disposed to a set 20 of the electronic device 2000.
The electronic device 2000 may be a smart phone, a personal digital assistant, a digital video camera, a digital still camera, a network system, a computer, a monitor, a tablet, a laptop, a netbook, a television, a video game, a smart watch, an automotive part, and the like, but it is not limited thereto.
The electronic device 2000 may have polygonal sides, and the antenna apparatus 1000 may be disposed adjacent to at least a portion of a plurality of sides of the electronic device 2000.
A communication module 210 and a baseband circuit 220 may be disposed on the set 20, and the antenna apparatus 1000 may be electrically connected to the communication module 210 and the baseband circuit 220 through a coaxial cable 230.
The communication module 210 may include at least one among a memory chip such as a volatile memory (e.g., a DRAM), a non-volatile memory (e.g., a ROM), a flash memory to perform digital signal processing, an application processor chip such as a central processor (e.g., a CPU), a graphics processor (e.g., a GPU), a digital signal processor, an encryption processor, a microprocessor, a microcontroller, a logic chip such as an analog-digital converter, and an application-specific IC (ASIC).
The baseband circuit 220 may generate a base signal by performing analog-digital conversion, amplification of an analog signal, filtering, and frequency conversion. The base signal input and output from the baseband circuit 220 may be transmitted to the antenna apparatus through a cable. For example, the base signal may be transferred to an IC through an electrical connection structure, a core via, and wiring, and the IC may convert the base signal into an RF signal of a millimeter waveband.
Although not shown, each antenna apparatus 1000 may include a plurality of antennas 100, each antenna 100 may be similar to the antenna 100 according to the embodiment described with reference to
Embodiments provide a multi-band antenna device that may be manufactured without complicating the manufacturing process.
While this disclosure includes specific examples, it will be apparent after an understanding of the disclosure of this application that various changes in form and details may be made in these examples without departing from the spirit and scope of the claims and their equivalents. The examples described herein are to be considered in a descriptive sense only, and not for purposes of limitation. Descriptions of features or aspects in each example are to be considered as being applicable to similar features or aspects in other examples. Suitable results may be achieved if the described techniques are performed in a different order, and/or if components in a described system, architecture, device, or circuit are combined in a different manner, and/or replaced or supplemented by other components or their equivalents. Therefore, the scope of the disclosure is defined not by the detailed description, but by the claims and their equivalents, and all variations within the scope of the claims and their equivalents are to be construed as being included in the disclosure.
While this disclosure includes specific examples, it will be apparent after an understanding of the disclosure of this application that various changes in form and details may be made in these examples without departing from the spirit and scope of the claims and their equivalents. The examples described herein are to be considered in a descriptive sense only, and not for purposes of limitation. Descriptions of features or aspects in each example are to be considered as being applicable to similar features or aspects in other examples. Suitable results may be achieved if the described techniques are performed in a different order, and/or if components in a described system, architecture, device, or circuit are combined in a different manner, and/or replaced or supplemented by other components or their equivalents. Therefore, the scope of the disclosure is defined not by the detailed description, but by the claims and their equivalents, and all variations within the scope of the claims and their equivalents are to be construed as being included in the disclosure.
| Number | Date | Country | Kind |
|---|---|---|---|
| 10-2021-0194181 | Dec 2021 | KR | national |
| Number | Name | Date | Kind |
|---|---|---|---|
| 6556169 | Fukuura et al. | Apr 2003 | B1 |
| 11894614 | So | Feb 2024 | B2 |
| 20220320020 | Hsu | Oct 2022 | A1 |
| 20230072031 | Chen | Mar 2023 | A1 |
| 20240222869 | Fang | Jul 2024 | A1 |
| 20240222880 | Yang | Jul 2024 | A1 |
| Number | Date | Country |
|---|---|---|
| 2019-9544 | Jan 2019 | JP |
| 10-1014352 | Feb 2022 | KR |
| Number | Date | Country | |
|---|---|---|---|
| 20230216202 A1 | Jul 2023 | US |
