Antenna device

Information

  • Patent Grant
  • 6753815
  • Patent Number
    6,753,815
  • Date Filed
    Thursday, January 16, 2003
    21 years ago
  • Date Issued
    Tuesday, June 22, 2004
    20 years ago
Abstract
The present invention is an antenna apparatus attached to an electronic device and includes an antenna section (11) having an antenna element (18) provided with two or more power supply points (19) and two or more earth points (20); and an earth point switch (21) which is provided correspondingly to each earth point (20) and connects or disconnects the earth point (20) from a ground. Selectively turning on or off the earth point switch (21) selects the earth point to adjust the resonance frequency.
Description




BACKGROUND OF THE INVENTION




The present invention relates to an antenna apparatus. More specifically, the present invention relates to an antenna apparatus appropriately used for an ultra small communication module installed in various electronic devices such as personal computers, portable telephones, audio devices, etc. having an information communication capability, a data storage capability, etc.




Owing to digitization of information signals, various types of information such as audio information, image information, etc. can be easily handled on personal computers, mobile devices, etc. Audio and image codec technologies are used to promote the band compression of these types of information. The digital communication and the digital broadcasting are creating an environment to easily and efficiently deliver such information to various communication terminal devices. For example, audio video data (AV data) can be received on a portable telephone.




A system for sending and receiving data is being widely used in various places including homes in accordance with a proposal for simple communication network systems available in small areas. As a communication network system, special attention is paid to, for example, a 5 GHz band narrow-area wireless communication system proposed in the IEEE802.11a, a 2.45 GHz band wireless LAN system proposed in the IEEE802.11b, and a next-generation wireless communication system such as so-called Bluetooth and other short-range wireless communication systems.




The above-mentioned various electronic devices require interface specifications capable of connection to all communication networks. A wireless communication means is provided to even mobile electronic devices exclusively for personal use, enabling communication with various devices and systems in a mobile situation for interchanging data and the like. For connection with other devices, the mobile electronic device is provided with a wireless communication function such as a plurality of wireless communication ports, wireless communication hardware, etc. having interface functions compliant with the associated communication systems.




Digitization of AV data enables to easily record and store data on personal computer's storage devices using recording media such as hard discs, optical discs including magnet-optical discs, semiconductor memory, etc. The recording media used for these types of storage devices are generally being used in place of recording media according to conventional analog recording systems such as audio or video tape cassettes, video discs, etc. having proprietary formats. Particularly, semiconductor memory chips such as flash memory are characterized by a very small cubic volume per recording capacity and ease of attaching or detaching from devices. For example, semiconductor memory chips are used for various electronic devices such as digital still cameras, video cameras, portable audio devices, notebook computers, etc.




The semiconductor memory chip helps easily move, record, store, etc. data such as audio or image information between the electronic devices. In order to move, transport, or store data, however, the semiconductor memory chip generally needs to be attached or detached from the device, causing a troublesome operation.




As mentioned above, a plurality of wireless communication functions are provided to various electronic devices. Generally, it is enough to use one function according to the usage condition, environment, etc. There is hardly a case of using a plurality of functions at a time. Because of a plurality of functions provided, the electronic devices have been subject to a problem of a cross talk or a radio interference with each other in the same or different frequency bands. Particularly, a mobile electronic device impairs the portability by mounting wireless communication ports, wireless communication hardware, etc. to provide wireless communication functions corresponding to the above-mentioned plurality of communication systems.




The electronic device provides the wireless communication function by attaching a wireless communication module having the storage function and the wireless communication function using semiconductor memory. This type of mobile electronic devices can comply with various communication systems and decrease the structural complexity by attaching appropriately selected wireless communication modules compliant with various communication systems.





FIGS. 1 and 2

show a configuration of wireless communication module used for a mobile electronic device. A wireless communication module


200


as shown in

FIGS. 1 and 2

comprises a printed circuit board


201


where an appropriate wiring pattern is formed on one surface and a ground pattern


202


is formed on the other surface. There are mounted an RF module


203


, an LSI


204


constituting a signal processing section, a flash memory element


205


, a transmitter


206


, etc. The wireless communication module


200


is mounted with a connector


207


for connection with the device at one end on the other surface of the printed circuit board


201


. The wireless communication module


200


contains an antenna section


208


patterned at one end of the wiring pattern surface opposite the connector


207


on the printed circuit board


201


.




The wireless communication module


200


is attached to or detached from the main device such as a mobile device via the connector


207


to store data and the like supplied from the main device in the flash memory element


205


and transfer data and the like stored in the flash memory element to the main device. When attached to the main device, the wireless communication module


200


uses the externally protruded antenna section


208


to enable wireless interchange of signals between the main device and a host device or a wireless system for wireless connection with the main device.




The antenna section


208


is patterned on a principal plane of the printed circuit board


201


. For miniaturization of the wireless communication module


200


, the antenna section


208


comprises a monopole antenna as a built-in antenna having a relatively simple structure. For example, a so-called reverse F-shaped antenna as shown in

FIG. 1

is used for the antenna section


208


. The reverse F-shaped antenna comprises an antenna element


209


formed along the width direction of the printed circuit board


201


at one end, an earth pattern


210


, and a power supply pattern


211


. The earth pattern


210


is formed orthogonally to the antenna element


209


at its one end and is short-circuited to the ground pattern


202


. The power supply pattern


211


is formed parallel to the earth pattern


210


, orthogonally to the antenna element


209


, and is supplied with power from the RF module


203


, for example. The reverse F-shaped antenna allows the main polarized wave direction to cross the antenna element


209


at the right angle.




The antenna section


208


may use not only the stick antenna element


209


formed as a pattern on the printed circuit board


201


, but also a plate antenna element


215


as shown in FIG.


3


. The antenna element


215


may be patterned on the principal plane of the printed circuit board


201


, but also be mounted in a lifted manner from the principal plane of the printed circuit board


201


as shown in FIG.


3


. At one end of the antenna element


215


, there are provided an earth section


216


connected to the ground pattern


202


and a power supply point


217


.




As shown in

FIG. 4

, the antenna section


208


may be configured as a so-called reverse L-shaped antenna by forming a power supply section


219


orthogonally to one end of the antenna element


218


. The antenna section


208


may be configured to be, e.g., a loop pattern antenna, a micro-split pattern antenna, etc. as the other monopole antennas.




The wireless communication module


200


promotes miniaturization by providing the above-mentioned antenna section


208


, but may greatly change antenna characteristics depending on states of attaching the module to the main device. The wireless communication module


200


is attached to or detached from various electronic devices for use. States of the electromagnetic field near the antenna element vary with the ground surface size of the main device, a case material, a dielectric constant, etc. Accordingly, the wireless communication module


200


is subject to a large change in antenna characteristics such as a resonance frequency, a band, sensitivity, etc.




To solve these problems, the wireless communication module


200


needs to mount an antenna apparatus with wideband characteristics for providing the sufficient sensitivity in an intended frequency band corresponding to characteristics of all main devices used. Basic characteristics of the antenna apparatus depend on the cubic volume. It is very difficult to configure the antenna apparatus so as to provide the sufficient wideband characteristics while maintaining the miniaturization. Therefore, the antenna apparatus has been a hindrance to miniaturization of the wireless communication module with good radio characteristics.




SUMMARY OF THE INVENTION




The present invention has been made in consideration of the foregoing. It is therefore an object of the present invention to provide an antenna apparatus capable of eliminating the need for adjustment independently of usage conditions, implementing wideband characteristics for good wireless communication, and achieving the miniaturization.




To achieve the above-mentioned objects, the antenna apparatus according to the present invention provides an antenna section having an antenna element provided with at least two or more power supply points and at least two or more earth points; a power supply point selection switch which is provided for each of the power supply points and connects or disconnects each power supply point from a power supply section; and an earth point switch which is provided for each of the power supply points and connects or disconnects each earth point from a ground.




In the antenna apparatus according to the present invention, a resonance frequency is adjusted by allowing one of the power supply point and the earth point to be fixed and the other to be movable, and selecting the power supply point or the earth point which is made to be movable by a selection operation of the power supply point selection switch or the earth point switch.




The antenna apparatus according to the present invention varies the center resonance frequency for its optimization by changing a power supply point or an earth point even in case of a change in conditions for attachment to an electronic device to which the apparatus is attached, a change in environmental conditions, etc. When used for various electronic devices, the antenna apparatus can interchange data and the like under good conditions by eliminating the need for adjustment. This antenna apparatus can be also used for a so-called multiband communication device capable of compliance with various communication systems having different communication frequency bands and promote miniaturization and cost saving of the device.




The antenna apparatus according to the present invention comprises an antenna section having an antenna element provided with a power supply point and at least two or more earth points; an earth point switch means which is provided for each of the earth points and connects or disconnects each earth point from a ground; and an impedance adjustment means which is provided for the power supply point and performs impedance matching. In the antenna apparatus, a selection operation of the earth point switch means selects the earth points and adjusts a resonance frequency, and the impedance adjustment means performs optimal impedance matching corresponding to the adjusted resonance frequency.




This antenna apparatus also varies the center resonance frequency for its optimization by changing a power supply point or an earth point even in case of a change in conditions for attachment to an electronic device to which the apparatus is attached, a change in environmental conditions, etc. The antenna apparatus can interchange data and the like under good conditions by using an impedance adjustment means for optimal impedance matching. Even when a low-cost substrate is used, this antenna apparatus can implement miniaturization and provide optimal impedance matching. The antenna apparatus can be used for a so-called multiband communication device capable of compliance with various communication systems having different communication frequency bands and promote miniaturization and cost saving of the communication device itself. Further, the antenna apparatus according to the present invention can be attached to various electronic devices and configure a small, light-weight, and user-friendly wireless communication module for providing an excellent communication function in addition to a storage function and a wireless communication function.




The foregoing and other advantages and features of the present invention will become more apparent from the detailed description of the preferred embodiments of the invention given below with reference to the accompanying drawings.











BRIEF DESCRIPTION OF THE DRAWINGS





FIG. 1

is a top view showing a wireless communication module having a conventional antenna apparatus;





FIG. 2

is a side view showing the wireless communication module in

FIG. 1

;





FIG. 3

is a perspective view showing a wireless communication module having a flat antenna;





FIG. 4

is a perspective view showing a wireless communication module having a reverse L-shaped antenna;





FIG. 5

is a perspective view showing an antenna apparatus according to the present invention;





FIG. 6

is a characteristic chart showing a state of resonance frequency changes when an earth point position is changed on the antenna apparatus according to the present invention;





FIG. 7

is a top view showing a wireless communication module having an antenna apparatus according to the present invention;





FIG. 8

is a fragmentary perspective view showing an antenna section of the wireless communication module;





FIG. 9

is a characteristic chart showing a state of resonance frequency changes when each earth point selection switch is operated on the antenna apparatus according to the present invention;





FIG. 10

is a top view showing an antenna section constituting the antenna apparatus according to the present invention;





FIG. 11

is a longitudinal sectional view showing a wireless communication module having the antenna apparatus according to the present invention;





FIGS. 12A

to


12


E are process drawings showing a manufacturing process of the wireless communication module;





FIG. 13A

is a longitudinal sectional view showing a MEMS switch provided in the earth point selection switch;





FIG. 13B

is a longitudinal sectional view showing the MEMS switch turned off with its cover removed;





FIG. 13C

is a longitudinal sectional view showing the MEMS switch turned on;





FIG. 14

is a circuit diagram showing an antenna apparatus configured to be capable of switching between a power supply point and an earth point;





FIG. 15

is a characteristic chart showing a state of resonance frequency changes when a dielectric constant is changed for a printed circuit board;





FIG. 16

is a top view showing an antenna apparatus which forms a short-circuiting pin constituting an impedance matching section near a power supply point;





FIG. 17

is a characteristic chart showing a state of impedance changes when a distance between the power supply point and the short-circuiting pin is varied on the antenna apparatus according to the present invention;





FIG. 18

is a top view showing another example of the antenna apparatus according to the present invention which forms the short-circuiting pin near the power supply point;





FIG. 19

is a characteristic chart showing a state of impedance changes when a distance between an antenna element and the short-circuiting pin is varied on the antenna apparatus according to the present invention;





FIG. 20

is a characteristic chart showing a state of resonance frequency changes when a distance between the antenna element's open end and the short-circuiting pin is varied on the antenna apparatus according to the present invention;





FIG. 21

is a top view showing an antenna apparatus provided with a resonance frequency adjustment section and an impedance matching section; and





FIG. 22

is a top view showing another example of the antenna apparatus according to the present invention provided with a resonance frequency adjustment section and an impedance matching section.











BEST MODE FOR CARRYING OUT THE INVENTION




Embodiments of the antenna apparatus according to the present invention will be described in further detail with reference to the accompanying drawings.




The antenna apparatus according to the present invention is attached to an electronic device (hereafter referred to as a main device) such as a personal computer, for example. The antenna apparatus is used for a card-type wireless communication module which provides the main device with a storage function and a wireless communication function. An antenna apparatus


1


has a printed circuit board


2


configured as shown in FIG.


5


. There are formed a high-frequency circuit section, a power supply circuit section, etc. inside the printed circuit board


2


. As shown in

FIG. 5

, a ground pattern


3


is formed overall on one surface of the printed circuit board


2


. On the other surface, i.e., on the rear surface thereof, there are formed, though not shown, an RF module, an LSI chip constituting a signal processing section, a flash memory element, a transmitter, etc. A flat antenna element


5


is mounted on the printed circuit board


2


and is supported by a power supply pin


6


and a plurality of support pins


7


. Supported by the power supply pin


6


and the support pins


7


, the flat antenna element


5


is raised for a specified height H from the printed circuit board


2


. The flat antenna element


5


is supplied with power from the RF module etc. (not shown), as a power supply


8


, mounted on the rear surface of the printed circuit board


2


via the power supply pin


6


. The flat antenna element


5


is grounded to the ground pattern


3


via an earth pin


9


separated from the power supply pin


6


for a specified distance T. The earth pin


9


is attached to the flat antenna element


5


with the distance T which is variable with reference to the power supply pin


6


. The flat antenna element


5


forms a dipole corresponding to the ground pattern


3


on the printed circuit board


2


and radiates, from its principal plane, communication power supplied from the power supply pin


6


at a specified resonance frequency.




The antenna apparatus


1


varies a resonance frequency by changing the distance T between the earth pin


9


and the power supply pin


6


. On the antenna apparatus


1


according to the present invention, the flat antenna element


5


has lengths of 30 mm along the X axis and 20 mm along the Y axis. There is the 4 mm interval H between the flat antenna element


5


and the ground pattern


3


on the printed circuit board


2


. The position of the earth pin


9


is varied in a range indicated by dot-dash lines


9




a


and


9




b


to vary the distance T between the power supply pin


6


and the earth pin


9


within a range from 4 mm to 30 mm. Under these conditions,

FIG. 6

shows changes of a minimum center resonance frequency f


0


of return losses from the flat antenna element


5


. Here, the return loss signifies a ratio of transmission power applied to the flat antenna element


5


via the power supply pin


6


and returned therefrom.




As the return loss causes a large frequency toward the negative side, the antenna apparatus


1


according to the present invention generates the resonance on the flat antenna element


5


to efficiently radiate a radio wave. The antenna apparatus


1


provides a good antenna characteristic when the minimum center resonance frequency f


0


shows a “return loss value minus 10 dB” or less. Accordingly, as is apparent from

FIG. 6

, the antenna apparatus


1


according to the present invention can vary the minimum center resonance frequency f


0


for approximately 650 MHz from 1.55 GHz to 2.2 GHz by moving the position of the earth pin


9


with reference to the power supply pin


6


.




The following describes a wireless module


10


for an antenna section


11


implementing the basic configuration of the above-mentioned antenna apparatus


1


. As shown in

FIG. 7

, the wireless module


10


is formed rectangularly. On one principal plane


12




a


, there is provided a multilayer printed circuit board


12


on which a wiring pattern is formed (not shown). On the multilayer printed circuit board


12


, one end of the principal plane


12




a


is used as an antenna formation area


12




b


where the antenna section


11


is configured. Inside the board, there is formed a ground pattern


13


indicated by a shaded portion in

FIG. 7

except an area corresponding to the antenna formation area


12




b


. Though details are omitted, a high-frequency circuit section is formed in the multilayer printed circuit board


12


, and a power supply pattern section is formed on the other principal plane. A connector (not shown) is provided at one end of the other principal plane of the multilayer printed circuit board


12


. Via this connector, connection is made to the main device such as a mobile device. There are mounted an RF module


14


, an LSI


15


constituting the signal processing section, a flash memory element


16


, and a transmitter


17


on the wiring pattern section of the multilayer printed circuit board


12


. The antenna section


11


is basically formed to be a reverse L-shaped pattern and is patterned in the antenna formation area


12




b


on the multilayer printed circuit board


12


.




The wireless communication module


10


is attached to the main device to provide various main devices with the storage function and the wireless communication function. Via a wireless network system, the wireless communication module


10


enables wireless transmission of data signals and the like between constituent devices. The wireless communication module


10


, when unneeded, is detached from the main device. The wireless communication module


10


provides functions of sending and receiving data signals and the like through connection with the Internet, for example, and supplying the received data signals and music information to the main device and other devices constituting the wireless network. By using the high-performance antenna section


11


, the wireless communication module


10


can highly accurately perform the above-mentioned wireless transmission of information.




As shown in

FIG. 8

, the antenna section


11


comprises an antenna element pattern


18


, a power supply pattern


19


, four earth patterns


20


, and four earth selection switches


21


. The stick-shaped antenna element pattern


18


is formed along one edge of the multilayer printed circuit board


12


. The power supply pattern


19


is formed at one end of the antenna element pattern


18


orthogonally thereto. The four earth patterns


20


are formed at an opening end of the antenna element pattern


18


parallel to the power supply pattern


19


and orthogonally to the antenna element pattern


18


. The antenna section


11


supplies power to the antenna element pattern


18


by means of a pattern connection between the power supply pattern


19


and the RF module


14


.




In the antenna section


11


, as shown in

FIG. 8

, the earth pattern


20


comprises a first earth pattern


20




a


through a fourth earth pattern


20




d


parallel to each other. In the antenna section


11


, the first earth pattern


20




a


through the fourth earth pattern


20




d


are provided with a first earth selection switch


21




a


through a fourth earth selection switch


21




d


, respectively, so as to enable or disable connection with the ground pattern


13


. The antenna section


11


selectively opens or closes the first earth selection switch


21




a


through the fourth earth selection switch


21




d


to short-circuit or open the first earth pattern


20




a


through the fourth earth pattern


20




d


for the ground pattern


13


. The antenna section


11


selects the first earth pattern


20




a


through the fourth earth pattern


20




d


by means of the first earth selection switch


21




a


through the fourth earth selection switch


21




d


for a short circuit to the ground pattern


13


. This varies the distance T between the power supply pattern


19


and the earth pattern


20


as mentioned above for the antenna apparatus


1


. As shown in

FIG. 8

, the antenna section


11


is configured to specify distance x1 to be 8 mm between the power supply pattern


19


and the first earth pattern


20




a


, distance x2 to be 12 mm between the same and the second earth pattern


20




b


, distance x3 to be 16 mm between the same and the third earth pattern


20




c


, and distance x4 to be 20 mm between the same and the fourth earth pattern


20




d.






The antenna section


11


having the above-mentioned configuration individually turns on the first earth selection switch


21




a


through the fourth earth selection switch


21




d


and individually short-circuits the first earth pattern


20




a


through the fourth earth pattern


20




d


to the ground pattern


13


. In this case, return losses result as shown in FIG.


9


. The antenna section


11


adjusts the distance T between the earth pattern


20


and the power supply pattern


19


by selecting the first earth selection switch


21




a


through the fourth earth selection switch


21




d


. As shown in

FIG. 9

, the antenna section


11


adjusts the resonance frequency band in the range between 1.75 GHz and 2.12 GHz.




The wireless communication module


10


is attached to various types of electronic devices and the like as mentioned above to connect these devices to an applicable network system. The above-mentioned antenna section


11


adjusts the wireless communication module


10


when the resonance frequency changes due to a main device's case material, a substrate size, a ground surface configuration, etc. or when the wireless communication module


10


is used for a different wireless communication system. Using software processing, for example, the wireless communication module


10


controls operations of the first earth selection switch


21




a


through the fourth earth selection switch


21




d


according to a control signal supplied from a reception system and automatically adjusts the resonance frequency.




The following describes another example of the antenna apparatus according to the present invention. As shown in

FIG. 10

, an antenna apparatus


30


contains an antenna section


33


patterned on a printed circuit board


31


where a ground pattern


32


is formed. The antenna apparatus


30


contains a power supply pattern


35


formed orthogonally to an antenna element pattern


34


. There are patterned a fixed earth pattern


36


and three selection earth patterns


37




a


through


37




c


each short-circuited to the ground pattern


32


so as to sandwich the power supply pattern


35


therebetween. In the antenna apparatus


30


, each selection earth pattern


37


is short-circuited to the ground pattern


32


via the earth selection switches


38




a


through


38




c.






As mentioned above, the antenna apparatus


30


selects the earth selection switch


38


to short-circuit any of the three selection earth patterns


37


to the ground pattern


32


. This changes a distance between the selection earth pattern


37


and the power supply pattern


35


to adjust the resonance frequency. The antenna apparatus


30


uses, e.g., an MEMS switch (Micro-Electro-Mechanical-System switch)


38




a


(to be detailed later) for each of the earth selection switches


38


. The antenna apparatus


30


uses, e.g., a semiconductor switch


38




b


having a diode for each of the earth selection switches


38


. The antenna apparatus


30


uses, e.g., a semiconductor switch


38




c


having a transistor or the like as the other active elements for each of the earth selection switches


38


.




While the antenna apparatus


30


in

FIG. 10

is provided with the three selection earth patterns


37


and the three earth selection switches


38


, the present invention is not limited thereto. Any number of selection earth patterns


37


and earth selection switches


38


may be provided based on specifications such as adjustment ranges and adjustment phases of the resonance frequency, effects of the adjustment, costs, spaces, etc.





FIG. 11

shows another example of the wireless communication module


40


. As shown in

FIG. 11

, the wireless communication module


40


contains the above-mentioned antenna section


11


formed on a multilayer printed circuit board


41


. The wireless communication module


40


contains a wiring pattern


46


formed on one principal plane of the multilayer printed circuit board


41


comprising a first double-sided substrate


42


and a second double-sided substrate


43


bonded to each other with prepreg


44


therebetween. On this principal plane, there are mounted the RF module


14


, the LSI


15


constituting the signal processing section, the flash memory element


16


, etc. The wireless communication module


40


is provided with the above-mentioned antenna section


11


by patterning an antenna pattern


47


in an area at one end of the multilayer printed circuit board


41


. The wireless communication module


40


is provided with a power supply pattern


48


formed on the other principal plane of the multilayer printed circuit board


41


and a ground pattern


49


formed inside. The wireless communication module


40


supplies power to the above-mentioned mounted components via a plated through hole layer


51


of many through holes


50


formed by piercing through the multilayer printed circuit board


41


and provides connection to the ground.




With reference to

FIGS. 12A through 12E

, the following describes a manufacturing process of the wireless communication module


40


.




To manufacture the wireless communication module


40


, there are prepared the first double-sided substrate


42


and the second double-sided substrate


43


as shown in FIG.


12


A. The first double-sided substrate


42


has a copper foil


42




b


bonded on one principal plane of a substrate


42




a


. An internal circuit pattern


42




c


is formed on the other principal plane of the substrate


42




a


to be used as a laminating surface with the second double-sided substrate


43


. The first double-sided substrate


42


makes connection between the internal circuit pattern


42




c


and the copper foil


42




b


via many through holes formed in the substrate


42




a.






Likewise, the second double-sided substrate


43


has a copper foil


43




b


bonded on one principal plane of a substrate


43




a


. An internal circuit pattern


43




c


is formed on the other principal plane of the substrate


43




a


to be used as a surface bonded to the first double-sided substrate


42


. When the second double-sided substrate


43


is bonded to the first double-sided substrate


42


, the internal circuit pattern


43




c


comprises the ground pattern


49


formed all over the area except the portion corresponding to the antenna section


11


.




As shown in

FIG. 12B

, the first double-sided substrate


42


and the second double-sided substrate


43


are stacked with the prepreg


44


placed between the opposite laminating surfaces. With this state, these substrates are heat-pressed for an integrated combination to form an intermediate for the multilayer printed circuit board


41


. As shown in

FIG. 12C

, drilling, a laser process, etc. are applied to the intermediate for the multilayer printed circuit board


41


to form many through holes


50


piercing the first double-sided substrate


42


and the second double-sided substrate


43


. As shown in

FIG. 12D

, through hole plating is applied to an inner wall of each through hole


50


in the intermediate for the multilayer printed circuit board


41


to form the plated through hole layer


51


. Thus, connection is made between the copper foil


42




b


on the first double-sided substrate


42


and the copper foil


43




b


on the second double-sided substrate.




Specified patterning processes are applied to the copper foil


42




b


on the first double-sided substrate


42


and to the copper foil


43




b


on the second double-sided substrate


43


on the intermediate for the multilayer printed circuit board


41


. As shown in

FIG. 12E

, the specified wiring pattern


46


and the antenna pattern are formed on the first double-sided substrate


42


. The power supply pattern


48


is formed on the second double-sided substrate


43


. The intermediate for the multilayer printed circuit board


41


includes the above-mentioned components mounted on the wiring pattern


46


of the first double-sided substrate


42


to configure the wireless communication module


40


.




The manufacturing method of the wireless communication module


40


is not limited to the above-mentioned process. It is possible to use conventional manufacturing processes for various multilayer printed circuit boards. Much more double-sided substrates can be used for the multilayer printed circuit board


41


as needed. The use of a material having a large specific inductive capacity for the multilayer printed circuit board


41


shortens the equivalent wavelength and is effective for miniaturization of the wireless communication module


40


. According to impedance matching to be described later, it is also possible to use substrates of a material having a small dielectric constant.




As mentioned above, an MEMS switch


45


is used for the wireless communication module


40


for short-circuiting to the ground pattern


49


by selecting each selection earth pattern


37


. As shown in

FIG. 13A

, the MEMS switch


45


is entirely covered with an insulating cover


54


. In the MEMS switch


45


, there are formed a first contact


56




a


through a third contact


56




c


constituting a fixed contact


56


on a silicon substrate


55


. A thin-plate, flexible movable contact strip


57


is rotatively supported at the first contact


56




a


in a cantilever fashion. In the MEMS switch


45


, the first contact


56




a


and the third contact


56




c


are used as output contacts and are connected to output terminals


59


provided on the insulating cover


54


via leads


58




a


and


58




b


, respectively.




The MEMS switch


45


uses one end of the movable contact strip


57


together with a rotation support section to configure a normally closed contact


57




a


with the first contact


56




a


on the silicon substrate


55


. The other free end is configured to be a normally open contact


57




b


facing the third contact


56




c


. An electrode


57




c


is provided in the movable contact strip


57


corresponding to a second contact


56




b


at the center. In a normal state of the MEMS switch


45


, as shown in

FIG. 13B

, the movable contact strip


57


keeps the normally closed contact


57




a


contacting the first contact


56




a


and keeps the normally open contact


57




b


contacting the third contact


56




c.






When the specified selection earth pattern


37


is selected, as mentioned above, a drive voltage is applied to the second contact


56




b


and the internal electrode


57




c


in the movable contact strip


57


of the MEMS switch


45


. When the drive voltage is applied, the MEMS switch


45


generates a suction force between the second contact


56




b


and the internal electrode


57




c


in the movable contact strip


57


. As shown in

FIG. 13C

, the movable contact strip


57


is displaced toward the silicon substrate


55


pivoting on the first contact


56




a


. When the normally open contact


57




b


of the displaced movable contact strip


57


contacts the third contact


56




c


, the MEMS switch


45


short-circuits the selection earth pattern


37


and the ground pattern


49


.




The MEMS switch


45


maintains the short-circuiting state between the selection earth pattern


37


and the ground pattern


49


by maintaining the above-mentioned contact state between the fixed contact


56


and the movable contact strip


57


. When another selection earth pattern


37


is selected, the MEMS switch


45


is applied with a reverse bias voltage and restores the movable contact strip


57


to the initial open state. Thus, the MEMS switch


45


causes an open state between the selection earth pattern


37


and the ground pattern


49


. The MEMS switch


45


is a very micro switch and requires no holding current for retaining an operation state. When mounted on the wireless communication module


40


, the MEMS switch


45


prevents the module from becoming large and can save the power consumption.




Each of the above-mentioned antenna apparatuses is configured to fix the power supply point against the antenna element and make the earth point side variable. Like an antenna apparatus


60


as shown in

FIG. 14

, the apparatus may be configured to interchange the power supply point and the earth point through selection operations of a switch means. The antenna apparatus


60


comprises an antenna element


61


; a fixed earth strip


62


formed orthogonally to one end of the antenna element


61


; a first short-circuiting pin


63


through a third short-circuiting pin


65


formed orthogonally to the antenna element


61


; and a first selection


66


through a third selection switch


68


respectively connected to these short-circuiting pins.




The antenna apparatus


60


configures a so-called single-pole double-throw switch (SPDT) which provides a changeover operation by interlocking a first selection switch


66


connected to the first short-circuiting pin


63


with a second selection switch


67


connected to a second short-circuiting pin


64


or with a third short-circuiting pin


65


connected to a third selection switch


68


. In the antenna apparatus


60


, a power supply


69


connects with a normally closed contact


66




b


of the first selection switch


66


, a normally open contact


67




b


of the second selection switch


67


, and a contact


68




b


of the third selection switch


68


. In the antenna apparatus


60


, a normally open contact


66




c


of the first selection switch


66


, a normally closed contact


67




c


of the second selection switch


67


, and a contact


68




c


of the third selection switch


68


are grounded.




As shown in

FIG. 14

, the antenna apparatus


60


makes connection between a movable contact strip


66




a


and the normally closed contact


66




b


of the first selection switch


66


. In this state, a movable contact strip


67




a


of the second selection switch


67


is connected to the normally closed contact


67




c


thereof. Further, a movable contact strip


68




a


of the third selection switch


68


maintains a neutral position. Accordingly, the antenna apparatus


60


configures a power supply pin by connecting the first short-circuiting pin


63


to the power supply


69


via the first selection switch


66


. The antenna apparatus


60


configures an earth pin by grounding the second short-circuiting pin


64


via the second selection switch


67


. In this state, the antenna apparatus


60


adjusts the resonance frequency as mentioned above by selecting the second selection switch


67


and the third selection switch


68


.




When the antenna apparatus


60


maintains the above-mentioned state, the movable contact strip


66




a


of the first selection switch


66


changes from the normally closed contact


66




b


to the normally open contact


66




c


. In interlock with the first selection switch


66


, the movable contact strip


67




a


of the second selection switch


67


changes from the normally open contact


67




c


to the normally closed contact


67




b


. In the antenna apparatus


60


, the first short-circuiting pin


63


is grounded via the first selection switch


66


to work as an earth pin. In addition, the second short-circuiting pin


64


is connected to the power supply


69


via the second selection switch


67


to work as a power supply pin.




While the antenna apparatus


60


in

FIG. 14

has been described according to mechanical operations of the single-pole double-throw switch constituting each selection switch, electronic switch operations may be preferable under program control. The antenna apparatus


60


is not limited to have three sets of short-circuiting pins and selection switches and may contain any number of sets. The antenna apparatus


60


chooses between the power supply point and the earth point according to selection switch operations. In any case, one short-circuiting pin is used as a fixed pin and is connected to the power supply


69


or the ground. The remaining short-circuiting pins are used for selection of circuits to be connected, and connection and disconnection of the ground or the power supply


69


for adjusting the resonance frequency.




The above-mentioned antenna apparatuses use printed circuit boards of various types of materials. Generally, there is used a flame resistant glass-backed epoxy resin copper-clad multilayer substrate with FR (flame retardant) grade 4 as a backing material for printed circuit boards. Printing, etching, and other techniques are used to form specified circuit patterns and antenna patterns. In addition to the above-mentioned FR4 copper-clad multilayer substrate with the specific inductive capacity of approximately 4, there are used composite substrates of polytetrafluoro-ethylene (Teflon as a trade name) and ceramic, ceramic substrates, etc. for printed circuit boards. The antenna apparatus promotes miniaturization by shortening the equivalent wavelength and decreasing the resonance frequency through the use of backing materials with a high specific inductive capacity for printed circuit boards. The antenna apparatus uses Teflon (trade name) substrates with a specific inductive capacity and a low dielectric dissipation factor for a considerably high-frequency band, e.g., 10 GHz or more.





FIG. 15

shows return loss changes when the above-mentioned wireless communication module


10


uses the printed circuit board


12


with a different material, i.e., with a different dielectric constant E. As shown in

FIG. 15

, the antenna apparatus causes an impedance matching error because the rate of return loss changes decreases as the dielectric constant E increases. To solve this problem, the antenna apparatus may be largely lifted from the principal plane of the printed circuit board


12


like the flat antenna


5


as shown in

FIG. 1

or use the printed circuit board


12


of a material having a small dielectric constant ε. However, this makes it difficult to miniaturize the wireless communication module


10


.





FIG. 16

shows a wireless communication module


70


capable of adjusting an impedance matching error. The wireless communication module


70


forms an adjustment pin


77


for impedance matching on an antenna element


74


between a power supply pin


75


and an earth pin


76


. The wireless communication module


70


contains an antenna section


72


patterned on one end of a printed circuit board


71


and a ground pattern


73


on the rear surface. The antenna section


72


employs the basic form of a reverse F-shaped antenna. The antenna section


72


comprises the stick-shaped antenna element


74


formed along one edge of the printed circuit board


71


; the power supply pin


75


patterned orthogonally to the antenna element


74


therefrom and connected to a power supply


78


; the earth pin


76


patterned orthogonally to the antenna element


74


at one end thereof and short-circuited to the ground pattern


73


; and a short-circuiting pin


77


patterned orthogonally to the antenna element


74


between the power supply pin


75


and the earth pin


76


. Though not shown in

FIG. 16

, the wireless communication module


70


is provided with a plurality of selection earth pins and earth selection switches on the antenna element


74


for adjusting the resonance frequency.




In the wireless communication module


70


, there is distance a of 5 mm between the ground pattern


73


and the antenna element


74


. The printed circuit board


71


has backing dielectric constant ε of 6 and is 1 mm thick. The antenna element


74


is 1 mm wide. The power supply pin


75


, the earth pin


76


, and the short-circuiting pin


77


each are 0.25 mm wide. There is fixed distance s of 7.0 mm between the power supply pin


75


and the short-circuiting pin


77


.

FIG. 17

shows impedance changes using distance t between the earth pin


76


and the short-circuiting pin


77


as a parameter. To match the wireless communication module


70


to the 50 Ω antenna impedance, it is optimal to provide distance t of 6.5 mm between the earth pin


76


and the short-circuiting pin


77


as shown in FIG.


17


.




Like the wireless communication module


80


in

FIG. 18

, the antenna apparatus can match the antenna impedance also by divergently forming a short-circuiting pin


87


in the middle of a power supply pin


85


. The wireless communication module


80


comprises an antenna section


82


formed on one end of a printed circuit board


81


and a ground pattern


83


formed on the rear surface. The antenna section


82


employs the basic form of a reverse F-shaped antenna. The antenna section


82


comprises a stick-shaped antenna element


84


formed along one edge of the printed circuit board


81


; the power supply pin


85


patterned orthogonally to the antenna element


84


therefrom and connected to a power supply


88


; and an earth pin


86


patterned orthogonally to the antenna element


84


at one open end and short-circuited to the ground pattern


83


.




In the wireless communication module


80


, the short-circuiting pin


87


is patterned so that it extends toward the earth pin


86


in the middle of the power supply pin


85


parallel to the antenna element


84


and bends at right angles toward the ground pattern


83


halfway. The short-circuiting pin


87


contains a rear anchor


87




a


which is formed parallel to the antenna element


84


and maintains distance u against the antenna element


84


. Concerning each component, the wireless communication module


80


follows the same specifications as those of the above-mentioned wireless communication module


70


and specifies distance t of 6.5 mm between the earth pin


86


and the short-circuiting pin


87


.

FIG. 19

shows impedance changes using, as a parameter, distance u between the antenna element


84


and the rear anchor


87




a


of the short-circuiting pin


87


in the wireless communication module


80


. To match the wireless communication module


80


to the 50 Ω antenna impedance, it is optimal to provide distance u of 0.85 mm between the antenna element


84


and the rear anchor


87




a


of the short-circuiting pin


87


as shown in FIG.


19


.





FIG. 20

shows antenna resonance frequency changes by setting distance u of 0.85 mm between the antenna element


84


and the rear anchor


87




a


of the short-circuiting pin


87


and using distance t between the earth pin


86


and the short-circuiting pin


87


as a parameter in the wireless communication module


80


. As shown in

FIG. 20

, the wireless communication module


80


allows the impedance matching to change satisfactorily at an antenna resonance frequency approximately between 2.95 GHz and 2.98 GHz, i.e., within a 30 MHz range.





FIG. 21

shows another example of an wireless communication module


90


having the above-mentioned functions for antenna resonance frequency adjustment and impedance matching. The wireless communication module


90


optimally adjusts the antenna resonance frequency by controlling the impedance matching. The wireless communication module


90


contains an antenna section


92


patterned on one end of a printed circuit board


91


and a ground pattern


93


formed on the rear surface. The antenna section


92


employs the basic form of a reverse F-shaped antenna. The antenna section


92


comprises a stick-shaped antenna element


94


formed along one edge of the printed circuit board


91


; a power supply pin


95


patterned orthogonally to the antenna element


94


therefrom and connected to a power supply


97


; and an earth pin


96


patterned orthogonally to the antenna element


94


at one open end and short-circuited to the ground pattern


93


.




In the wireless communication module


90


, first to third impedance matching short-circuiting pins


98




a


through


98




c


are patterned so that they extend toward the earth pin


96


in the middle of the power supply pin


95


parallel to the antenna element


94


and bend at right angles toward the ground pattern


93


halfway. First to third impedance matching switches


99




a


through


99




c


are connected to the impedance matching short-circuiting pins


98




a


through


98




c


. Turning on or off the impedance matching switches


99




a


through


99




c


selectively short-circuits the impedance matching short-circuiting pins


98




a


through


98




c


to the ground pattern


93


.




The above-mentioned MEMS switch can be used for the first to third impedance matching switches


99




a


through


99




c


. It is also possible to use a switch comprising active elements such as diodes and transistors, other mechanical switches, etc. for the impedance matching switches


99




a


through


99




c.






In the wireless communication module


90


to which the present invention is applied, selectively turning on the impedance matching switches


99




a


through


99




c


selects the impedance matching short-circuiting pins


98




a


through


98




c


to be short-circuited to the ground pattern


93


as mentioned above. Accordingly, the wireless communication module


90


uses the selected impedance matching short-circuiting pins


98




a


through


98




c


to adjust a distance between the antenna element


94


and the earth pin


96


for providing the above-mentioned optimal impedance matching.




The wireless communication module


90


to which the present invention is applied includes first to third resonance frequency adjustment short-circuiting pins


100




a


through


100




c


formed at one open end of the antenna element


94


each orthogonally thereto and parallel to the power supply pin


95


. First to third earth selection switches


101




a


through


101




c


are connected to the resonance frequency adjustment short-circuiting pins


100




a


through


100




c


. Turning on or off the earth selection switches


101




a


through


101




c


selectively short-circuits the resonance frequency adjustment short-circuiting pins


100




a


through


100




c


to the ground pattern


93


. The earth selection switches


101




a


through


101




c


also use the same switches as for the impedance matching switches


99




a


through


99




c.






As mentioned above, the wireless communication module


90


to which the present invention is applied selectively turns on the earth selection switches


101




a


through


101




c


to select the resonance frequency adjustment short-circuiting pins


100




a


through


100




c


for short-circuiting to the ground pattern


93


. Accordingly, the wireless communication module


90


uses the selected resonance frequency adjustment short-circuiting pins


100




a


through


100




c


to adjust a distance between the power supply pin


95


and the earth pin


96


for the above-mentioned resonance frequency adjustment. When the wireless communication module


90


uses, e.g., control signals supplied from a software processing reception system to control operations of the above-mentioned impedance matching switches


99




a


through


99




c


and earth selection switches


101




a


through


101




c


, it is possible to automate the antenna resonance frequency adjustment and the impedance matching.





FIG. 22

shows another example of a wireless communication module


110


. Like the above-mentioned wireless communication module


90


, the wireless communication module


110


also has the functions for antenna resonance frequency adjustment and impedance matching, and optimally adjusts the antenna resonance frequency by controlling the impedance matching. The wireless communication module


110


in

FIG. 22

contains an antenna section


112


patterned on one end of a printed circuit board


111


and a ground pattern


113


formed on the rear surface. The antenna section


112


employs the basic form of a reverse F-shaped antenna. The antenna section


112


comprises a stick-shaped antenna element


114


formed along one edge of the printed circuit board


111


; a power supply pin


115


patterned orthogonally to the antenna element


114


and connected to a power supply


117


; and an earth pin


116


patterned orthogonally to the antenna element


114


at one open end and short-circuited to the ground pattern


113


.




Like the wireless communication module


90


, first to third impedance matching short-circuiting pins


118




a


through


118




c


are patterned in the wireless communication module


110


. The first to third impedance matching short-circuiting pins


118




a


through


118




c


connect with first to third impedance matching switches


119




a


through


119




c


, respectively. Turning on or off the impedance matching switches


119




a


through


119




c


selectively causes short-circuiting to the ground pattern


113


.




On the wireless communication module


110


, an antenna element


114


is directly provided with first to third earth selection switches


120




a


through


120




c


with different distances from the power supply pin


115


. The wireless communication module


110


adjusts an effective length of the antenna element


114


by turning on or off the earth selection switches


120




a


through


120




c


. The wireless communication module


110


selects the earth selection switches


120




a


through


120




c


to specify an effective length of the antenna element


114


and turns on and off the impedance matching switches


119




a


through


119




c


to determine a predefined impedance matching position. When the wireless communication module


110


also uses control signals supplied from a software processing reception system to control the impedance matching switches


119




a


through


119




c


and earth selection switches


120




a


through


120




c


, it is possible to automate the antenna resonance frequency adjustment and the impedance matching.




The antenna apparatus according to the present invention is not limited to the configuration of the antenna resonance frequency adjustment function and the impedance matching function using the above-mentioned wireless communication module


90


or


100


. It may be preferable to apply any combination of the above-mentioned individual configurations to each function.




Industrial Applicability




As mentioned above, the antenna apparatus according to the present invention optimally adjusts the resonance frequency by eliminating adjustment operations depending on changes in the condition of attachment to an electronic device to be mounted, the environmental condition, etc., making it possible to improve the operationality and send and receive data etc. in good condition. The antenna apparatus has the resonance frequency adjustment function and the impedance matching function so as to be applicable to a wireless communication module or the like which is attached to various electronic devices etc. to provide the storage function and the wireless communication function. In such a case, the antenna apparatus can apply to any electronic devices such as main devices with different communication systems or specifications and ensure optimal antenna characteristics, making it possible to highly precisely send and receive data etc. and contribute to the miniaturization of electronic devices themselves.



Claims
  • 1. An antenna apparatus comprising:an antenna section having an antenna element provided with at least two or more power supply points and at least two or more earth points; a power supply point selection switch means which is provided for each of the power supply points and connects or disconnects each power supply point from a power supply section; and an earth point switch means which is provided for each of the earth points and connects or disconnects each earth point from a ground, wherein a resonance frequency is adjusted by allowing one of the power supply point and the earth point to be fixed and the other to be movable, and selecting the power supply point or the earth point which is made to be movable by a selection operation of the power supply point selection switch means or the earth point switch means.
  • 2. The antenna apparatus according to claim 1, wherein the antenna section comprises a flat antenna patterned on a printed circuit board, and wherein the power supply point selection switch means or the earth point switch means is mounted on the printed circuit board.
  • 3. The antenna apparatus according to claim 2, wherein the flat antenna is a monopole antenna including a reverse F-shaped pattern, a reverse L-shaped pattern, a loop pattern, and a micro-split pattern.
  • 4. The antenna apparatus according to claim 1, wherein the antenna section comprises a chip-type antenna which has at least two or more power supply terminals and an earth terminal and is mounted on the printed circuit board; andthe power supply terminals and the earth terminal are connected to connection terminals correspondingly formed on the printed circuit board, and are correspondingly pattern-connected to the power supply point selection switch means or the earth point switch means mounted on the printed circuit board via these connection terminals.
  • 5. The antenna apparatus according to claim 1, wherein the power supply point selection switch means and the earth point switch means comprise semiconductor circuits.
  • 6. The antenna apparatus according to claim 1, wherein an MEMS (Micro-Electro-Mechanical-System) switch is used for the power supply point selection switch means and the earth point switch means.
  • 7. The antenna apparatus according to claim 1, wherein there is provided a selection switch means for interchanging the power supply point and the earth point.
  • 8. An antenna apparatus comprising:an antenna section having an antenna element provided with a power supply point and at least two or more earth points; an earth point switch means which is provided for each of the earth points and connects or disconnects each earth point from a ground; and an impedance adjustment means which is provided for the power supply point and performs impedance matching, wherein a selection operation of the earth point switch means selects the earth points and adjusts a resonance frequency, and the impedance adjustment means performs impedance matching.
  • 9. The antenna apparatus according to claim 8, wherein the antenna section comprises a flat antenna patterned on a printed circuit board, and wherein the earth point switch means are mounted on the printed circuit board.
  • 10. The antenna apparatus according to claim 8, wherein the flat antenna is a monopole antenna including a reverse F-shaped pattern, a reverse L-shaped pattern, a loop pattern, and a micro-split pattern.
  • 11. The antenna apparatus according to claim 8, wherein the antenna section comprises a chip-type antenna which has a power supply terminal and at least two or more earth terminals and is mounted on the printed circuit board; andthe power supply terminal and the earth terminals connected to connection terminals correspondingly formed on the printed circuit board, and are correspondingly pattern-connected to the earth point switch means mounted on the printed circuit board via these connection terminals.
  • 12. The antenna apparatus according to claim 8, wherein the impedance adjustment means comprises a short-circuiting point branched from the power supply point and an impedance adjustment switch means which is provided in pairs with each of the earth point switch means and changes a state of connection between the short-circuiting point and the power supply section; andthe impedance adjustment switch means is selected corresponding to the selected earth point switch means and is connected to the power supply section to perform resonance frequency adjustment and impedance matching.
  • 13. The antenna apparatus according to claim 12, wherein the earth point switch means and/or the impedance adjustment switch means comprise semiconductor circuits.
  • 14. The antenna apparatus according to claim 12, wherein an MEMS (Micro-Electro-Mechanical-System) is used for the earth point switch means and/or the impedance adjustment switch means.
  • 15. The antenna apparatus according to claim 8, wherein there is provided a selection switch means for interchanging the power supply point and the earth point.
Priority Claims (1)
Number Date Country Kind
2001-060788 Mar 2001 JP
PCT Information
Filing Document Filing Date Country Kind
PCT/JP02/02038 WO 00
Publishing Document Publishing Date Country Kind
WO02/07154 9/12/2002 WO A
US Referenced Citations (2)
Number Name Date Kind
6034636 Saitoh Mar 2000 A
6255994 Saito Jul 2001 B1
Foreign Referenced Citations (10)
Number Date Country
993 070 Apr 2000 EP
63-62402 Mar 1988 JP
06-284036 Jul 1994 JP
06-224618 Aug 1994 JP
08-321716 Mar 1996 JP
09-93030 Apr 1997 JP
10-190345 Jul 1998 JP
11-136025 May 1999 JP
2000-68726 Mar 2000 JP
2000-11485 Apr 2000 JP