Patent Application
20250105486
The disclosure relates to a package structure, and in particular, relates to an antenna-in-package with a heat dissipation structure.
With the development of the 5G communication industry and low-orbit satellite applications, the introduction of high-power chips and the miniaturization trend of chips will cause the temperature of the antenna-in-package module to increase. Generally speaking, antenna-in-package modules transfer the heat generated by the chip to the air through thermal diffusion elements. However, due to the module structure, the air flow within the module is poor, making it difficult to dissipate heat such that the energy conversion efficiency of the chip is reduced and the system energy consumption is increased. Therefore, how to improve the heat dissipation efficiency of the antenna-in-package module is an urgent problem that needs to be solved.
The disclosure provides an antenna-in-package with a heat dissipation structure having a favorable heat dissipation capability to improve the reliability of the antenna-in-package with the heat dissipation structure.
An antenna-in-package with a heat dissipation structure according to an embodiment of the disclosure includes a circuit board, an antenna substrate, a chip, a plurality of heat dissipation fins, a chassis, and dielectric fluid. The circuit board has a first surface and a second surface opposite to the first surface. The antenna substrate is disposed above the first surface of the circuit board. The chip is disposed between the antenna substrate and the first surface of the circuit board and electrically connected to the antenna substrate. The plurality of heat dissipation fins protrude from the second surface of the circuit board. The chassis encapsulates the circuit board, the antenna substrate, the chip, and the plurality of heat dissipation fins. The dielectric fluid circulates and flows in the chassis through a cooling circulation device and is in direct contact with the plurality of heat dissipation fins.
An antenna-in-package with a heat dissipation structure according to another embodiment of the disclosure includes a circuit board, an antenna substrate, a chip, a chassis, and dielectric fluid. The circuit board has a first surface and a second surface opposite to the first surface. The antenna substrate is disposed above the first surface of the circuit board. The antenna substrate includes an antenna layer disposed on a surface of the antenna substrate. The chip is disposed between the antenna substrate and the first surface of the circuit board and electrically connected to the antenna substrate. The chassis encapsulates the circuit board, the antenna substrate, and the chip. The dielectric fluid circulates and flows in the chassis through a cooling circulation device and is in direct contact with the antenna layer.
An antenna-in-package with a heat dissipation structure according to another embodiment of the disclosure includes a chassis, a circuit board, an antenna substrate, a chip, a heat dissipation fin, and cooling fluid. The chassis includes a first space and a second space. The first space and the second space are isolated from each other by a heat dissipation plate. The circuit board is located in the first space and disposed on the heat dissipation plate. The antenna substrate is located in the first space and disposed above the circuit board. The chip is disposed between the antenna substrate and the circuit board and electrically connected to the antenna substrate. The heat dissipation fin is located in the second space and disposed on the heat dissipation plate. The cooling fluid is located in the second space and in contact with the heat dissipation fin. The cooling fluid absorbs heat from the heat dissipation fin to create a phase change.
Based on the above, the antenna-in-package with the heat dissipation structure of the disclosure improves the heat dissipation efficiency thereof through the provision of the dielectric fluid or the cooling fluid, so that the antenna-in-package with the heat dissipation structure is adapted to be applied in the 5G communication industry and low-orbit satellite ground stations.
In order to make the above-mentioned features and advantages of the disclosure clearer and easier to understand, the following embodiments are given and described in details with accompanying drawings as follows.
Illustrative embodiments of the disclosure will be fully described below with reference to the drawings, but the disclosure may also be embodied in many different forms and should not be construed as being limited to the embodiments described herein. In the drawings, for clarity's sake, the size and thickness of various regions, parts, and layers may not be drawn to scale.
Directional terms, such as “upper”, “lower”, “front”, “back”, “left”, “right”, etc., mentioned in the disclosure are only directions with reference to the drawings. Therefore, the used directional terms are used to illustrate, but not to limit, the disclosure.
In the following embodiments, the same or similar elements are denoted by the same or similar referential numerals, and descriptions of the same technical contents are omitted. Moreover, the features in the different exemplary embodiments may be combined with each other in case of no confliction, and the simple equivalent changes and modifications made in accordance with the scope of the specification or the claims are still within the scope of the patent.
It should be noted that although the terms “first,” “second,” “third,” etc. may be used herein for describing various elements, components, regions, layers, and/or portions, the elements, components, regions, and/or portions are not limited by these terms. These terms are used for separating one element, component, region, layer, or portion from another element, component, region, layer, or portion. Thus, the first element, component, region, layer, or portion discussed below may also be referred to as the second element, component, region, layer, or portion without departing from the scope of the invention.
Referring to
The detailed structures of the circuit board 100 and the antenna substrate 110 are omitted in
The circuit board 100 may be electrically connected to the antenna substrate 110 through a conductive connecting member 170. In some embodiments, the conductive connecting member 170 may be a solder ball, a conductive pillar, a conductive bump, or a similar conductive connecting member, but the disclosure is not limited thereto.
The antenna substrate 110 has an upper surface 110a and a lower surface 110b that are opposite to each other, and the lower surface 110b faces the first surface 100a of the circuit board 100. The antenna substrate 110 includes an antenna layer 112, which is disposed on the upper surface 110a of the antenna substrate 110.
The chip 120 is, for example, a radio frequency chip (RF IC), which includes a front surface 120a and a back surface 120b that are opposite to each other. The front surface 120a of the chip 120 faces the lower surface 110b of the antenna substrate 110 and may be electrically connected to the antenna substrate 110 through, for example, solder balls or other conductive structures.
In some embodiments, the chassis 140 includes at least one inlet portion IN and at least one outlet portion OUT serving as an inlet and outlet for the dielectric fluid 150 to enter and exit the inside and outside of the chassis 140. In
In some embodiments, the cooling circulation device 160 includes a pump 162 and a heat exchanger (fin, heat sink, etc.) 164 that are disposed on the outside of the chassis 140. The dielectric fluid 150 may be drawn out from the at least one outlet portion OUT of the chassis 140 by the pump 162 and passed through the heat exchanger 164 so as to dissipate the heat of the dielectric fluid 150 to the outside, and the dielectric fluid 150 flowing through the heat exchanger 164 is then returned to the inside of the chassis 140 through the at least one inlet portion IN. Such a cyclic operation may improve the heat dissipation efficiency.
The outlet portion OUT of the chassis 140 and the pump 162, the pump 162 and the heat exchanger 164, and the heat exchanger 164 and the inlet portion IN may be connected through pipes (not shown) to serve as channels for the dielectric fluid 150 to flow. In some embodiments, the heat exchanger 164 may be a fin heat sink or other suitable heat sinks, but the disclosure is not limited thereto.
In some embodiments, the antenna-in-package with the heat dissipation structure 10 further includes a heat dissipation plate 132, which is disposed on the second surface 100b of the circuit board 100, and the heat dissipation fins 130 are disposed on the heat dissipation plate 132. In this way, the heat of the circuit board 100 may be dissipated through the heat dissipation plate 132 and the heat dissipation fins 130. Then, through the dielectric fluid 150 being in direct contact with and the heat dissipation plate 132 and/or the heat dissipation fins 130, the heat energy thereof may be taken away and dissipated to the outside of the chassis 140 through the cooling circulation device 160.
In some embodiments, the surface of the heat dissipation plate 132 in contact with the dielectric fluid 150 may have a plurality of micro-bumps or micro-dimples (not shown) to increase the disturbance of the dielectric fluid 150 in the chassis 140.
In some embodiments, the circuit board 100 has a plurality of through holes TH, which are disposed corresponding to the chip 120.
In some embodiments, the antenna-in-package with the heat dissipation structure 10 further includes a heat dissipation block (heat slug) 134 disposed on the heat dissipation plate 132 and disposed in the through hole TH. In some embodiments, the heat dissipation block 134 penetrates the circuit board 100 and is in direct contact with the back surface 120b of the chip 120. In this way, the heat dissipation block 134 may conduct the heat generated by the chip 120 to the heat dissipation plate 132 and the heat dissipation fins 130, and then dissipate the heat energy to the outside of the chassis 140 through the dielectric fluid 150. However, the disclosure is not limited thereto. In other embodiments, a vapor chamber (not shown) or a thermal interface material (not shown) may be included between the chip 120 and the heat dissipation block 134 to enhance the heat dissipation effect of the chip 120.
In some embodiments, the antenna-in-package with the heat dissipation structure 10 further includes a baffle 141, which is disposed on an inner surface of the chassis 140, and the circuit board 100 is fixedly disposed on the baffle 141. In this way, the circuit board 100, the baffle 141, and the heat dissipation plate 132 may divide the chassis 140 into a first space S11 and a second space S12. The first space S11 includes the circuit board 100, the antenna substrate 110, and the chip 120 disposed therein, and the second space S12 includes the heat dissipation plate 132 and the heat dissipation fins 130 disposed therein. In some embodiments, the dielectric fluid 150 flows in the second space S12 to contact the heat dissipation fins 130. In other words, the dielectric fluid 150 is not in direct contact with the antenna substrate 110 and the chip 120.
In some embodiments, the dielectric fluid 150 may include a non-conductive fluid such as silicone oil, mineral oil, or fluorinated liquid. Fluorinated liquid may refer to fluorine-containing alkanes, ethers, or ketone liquids. For example, the fluorinated liquid may be selected from the group consisting of methyl perfluoropropane ether, methyl nonafluoroisobutyl ether, and methyl nonafluorobutyl ether, 1,1,1,2,2,3,4,5,5,5-decafluoro-3-methoxy4-(trifluoromethyl)-pentane, 1,1,1,2,2,4,5,5,5-nonafluoro-4-(trifluoromethyl)-3-pentanone and combinations thereof.
In some embodiments, the materials of the heat dissipation fins 130, the heat dissipation plate 132, and the heat dissipation block 134 may be copper, aluminum, or other suitable thermally conductive materials.
In some embodiments, the porosity of the second portion 130b may be greater than or equal to the porosity of the first portion 130a. For example, the first portion 130a may be a metal material without holes, or the first portion 130a may also be a foamed metal and have a similar porosity to the second portion 130b.
In the embodiment of
In the embodiment of
However, the heat dissipation fins 130 of the disclosure are not limited to the embodiments of
In some embodiments, the heat dissipation plate 132 and the heat dissipation block 134 may be metal heat dissipation materials without holes.
In some other embodiments, the heat dissipation plate 132, the heat dissipation block 134 and/or the heat dissipation fins 130 may be a heat dissipation structure filled with a working fluid inside having phase change characteristics. Specifically, the heat dissipation structure is a metal chassis that encapsulates the working fluid inside. The metal chassis has a vacuum or near-vacuum sealed space inside and a capillary structure on the internal wall surface thereof, and the working fluid is located in the sealed space. When the vapor chamber structure is in contact with the heat source, the liquid phase working fluid absorbs heat and boils and vaporizes. Therefore, a pressure difference is created in the sealed space, causing the steam to flow to a lower temperature area. When the vapor phase working fluid is in contact with a relatively cold area, condensation will occur. Since the internal wall surface of the metal chassis has a capillary structure, the condensed working fluid may be guided back to the heat source. In this way, the working fluid may operate cyclically in a sealed space to achieve the purpose of heat dissipation. In some embodiments, the working fluid may be a fluid with a boiling point less than 70° C. under vacuum, but the disclosure is not limited thereto.
In some embodiments, the chassis 140 may include a main body portion 142 and a top cover portion 144. The main body portion 142 has an accommodating space constructed of side walls and a bottom plate, and the accommodating space is for components such as the circuit board 100, the antenna substrate 110, the heat dissipation plate 132, and the heat dissipation fins 130 to be disposed therein. The main body portion 142 has an opening, which at least corresponds to the antenna layer 112 of the antenna substrate 110. The top cover portion 144 is disposed in the opening of the main body portion 142 and is connected to the main body portion 142 to seal the accommodating space and encapsulate components such as the circuit board 100, the antenna substrate 110, the heat dissipation plate 132, and the heat dissipation fins 130 therein. The antenna substrate 110 is closer to the top cover portion 144 than the circuit board 100, and the upper surface 110a of the antenna substrate 110 faces the top cover portion 144.
In some embodiments, the material of the top cover portion 144 is different from the material of the main body portion 142. For example, the main body portion 142 may be a metal material to protect the antenna structure and have a favorable shielding effect on noise; the top cover portion 144 may be plastic insulating material such as PP polypropylene or other suitable non-magnetic materials, so that the antenna layer 112 may receive or transmit electromagnetic wave signals through the top cover portion 144.
Referring to
In some embodiments, the dielectric fluid 150 may be in contact with the lower surface 110b of the antenna substrate 110 instead of the upper surface 110a of the antenna substrate 110. That is, the dielectric fluid 150 may not be in contact with the antenna layer 112.
In some embodiments, the heat dissipation plate 132 of the antenna-in-package with the heat dissipation structure 20 has a plurality of via holes V. The via holes V may be located around the heat dissipation block 134 and correspond to the through holes TH of the circuit board 100. Therefore, the dielectric fluid 150 may flow into the gap between the heat dissipation block 134 and the circuit board 100 through the plurality of via holes V, further allowing the dielectric fluid 150 to easily flow into the space between the circuit board 100 and the antenna substrate 110 (including the space between the chip 120 and the antenna substrate 110) so as to improve the heat dissipation efficiency of the conductive connecting member 170 and the chip 120. In other embodiments, the antenna-in-package with the heat dissipation structure 20 may not have the heat dissipation plate 132 and the heat dissipation block 134 such that the heat dissipation fins 130 of
In some embodiments, the heat dissipation fins 130 may be as shown in the foregoing embodiments of
In some embodiments, the antenna-in-package with the heat dissipation structure 20 further includes a flow disturbing object 180 disposed on the inner surface of the chassis 140 and located between the inlet portion IN and the outlet portion OUT of the chassis 140 and in contact with the dielectric fluid 150 to promote the disturbance of the dielectric fluid 150 in the chassis 140 and reduce the possibility of fluid bypass. In some embodiments, the flow disturbing object 180 may be a foamed metal, so that the dielectric fluid 150 may pass through the holes of the flow disturbing object 180. The dead zone generated on a side of the flow disturbing object 180 facing away from the flow direction of the dielectric fluid 150 may be reduced, while the disturbance of the dielectric fluid 150 may be promoted at the same time, so that the dielectric fluid 150 may flow uniformly in the second space S22, and the heat in the second space S22 may be effectively taken away.
Three flow disturbing objects 180 are schematically shown in
Referring to
In
In some embodiments, the dielectric fluid 150 may also be in direct contact with the vapor chamber 190.
In
Although there is no flow disturbing object shown in
Referring to
In
In some embodiments, the dielectric fluid 150 may fill up the chassis 140.
In some embodiments, a vertical distance between the antenna layer 112 and the top cover portion 144 of the chassis 140 is less than 2 cm, for example, between 1.0 cm and 2.0 cm.
In
Referring to
In some embodiments, a cooling circulation device 160a may be disposed on the outside of the chassis 140 between the outlet portion OUT1 and the inlet portion IN. A cooling circulation device 160b may be disposed on the outside of the chassis 140 between the outlet portion OUT2 and the inlet portion IN, so that the dielectric fluid 150 flowing out from different outlet portions may dissipate heat through different cooling circulation devices and then return to the inside of the chassis 140. However, the disclosure is not limited thereto. The dielectric fluid 150 flowing out from different outlet portions may also be merged into one through pipeline design and returned to the inside of the chassis 140 through a single cooling circulation device.
Referring to
Referring to
In some embodiments, the heat dissipation fins 130 may include foamed metals. For example, the heat dissipation fins 130 may be as shown in the embodiments of
In some embodiments, there is a gap between the heat dissipation fins 130 and the circuit board 100, so that the dielectric fluid 150 may flow therein, and the dielectric fluid 150 may easily flow into the space between the antenna substrate 110 and the circuit board 100.
In some embodiments, the back surface 120b of the chip 120 may include a thermal interface material layer 122 to facilitate the connection with the heat dissipation fins 130, but the disclosure is not limited thereto. In other embodiments, the heat dissipation fins 130 may be in direct contact with the back surface 120b of the chip 120. In yet some other embodiments, a vapor chamber (not shown) may be disposed between the heat dissipation fins 130 and the back surface 120b of the chip 120.
In some embodiments, the thermal interface material layer 122 may be thermally conductive glue, a thermal pad, or other suitable thermal interface materials.
Although there is no flow disturbing object shown in
Referring to
In some embodiments, the heat dissipation plate 132 may be a foamed metal to promote disturbance and heat conduction of the dielectric fluid 150 within the chassis 140.
In some embodiments, there is a gap between the heat dissipation plate 132 and the second surface 100b of the circuit board 100. Therefore, the dielectric fluid 150 may flow into the gap, thereby allowing the dielectric fluid 150 to flow through the gap between the circuit board and the heat dissipation fins 130 and further flow into the space between the antenna substrate 110 and the circuit board 100 so as to improve the heat dissipation efficiency of the chip 120.
Although there is no flow disturbing object shown in
Referring to
The cooling fluid 950 is in a state where the vapor phase and the liquid phase coexist in the second space S92. Specifically, the cooling fluid 950 may not fill up the second space S92, but may be in direct contact with at least part of the heat dissipation fins 930, so that part of the liquid phase cooling fluid 950 absorbs heat from the heat dissipation fins 930 and vaporizes to form steam 950v. The generation of steam creates a pressure difference in the second space S92, which prompts the steam to flow to a lower temperature area, and then to condense again into the liquid phase cooling fluid 950. Such a cyclic operation may effectively conduct heat quickly.
A pressure of the second space S92 may be less than one atmosphere. In some embodiments, the second space S92 may be in a near vacuum state. In some embodiments, the pressure of the second space S92 is less than the pressure of the first space S91.
In some embodiments, the cooling fluid 950 may be a volatile liquid with a low boiling point, such as ethanol, ammonia, perfluorocarbon, perfluoropolyether, or other suitable cooling fluid. In some embodiments, the boiling point of the cooling fluid 950 in the second space S92 may be less than 70° C., for example, between 50° C. and 60° C., so as to improve the heat dissipation effect of the chip 120.
In some embodiments, the antenna-in-package with the heat dissipation structure 90 further includes a heat dissipation block 934 disposed on the heat dissipation plate 932 and disposed in the through hole TH. In some embodiments, the heat dissipation block 934 penetrates the circuit board 100 and is in direct contact with the back surface 120b of the chip 120. In this way, the heat dissipation block 934 may conduct the heat generated by the chip 120 to the heat dissipation fins 930. Then, the cooling fluid 950 may continuously circulate in the second space S92 to perform phase changes between liquid and vapor, so as to effectively conduct away the heat generated by the chip 120.
In some embodiments, the heat dissipation plate 932, the heat dissipation fins 930, and the heat dissipation block 934 are metal materials without holes. In some embodiments, the material of the heat dissipation plate 132, the heat dissipation fins 930, and the heat dissipation block 934 may be copper, aluminum, or other suitable thermally conductive materials.
In some embodiments, a vapor chamber (not shown) may be included between the chip 120 and the heat dissipation block 934 to enhance the heat dissipation effect of the chip 120. In some embodiments, a thermal interface material (not shown) may be included between the chip 120 and the heat dissipation block 934 to enhance the connection between the chip 120 and the heat dissipation block 934.
In some embodiments, the antenna-in-package with the heat dissipation structure 90 further includes external fins 931, which are disposed on an outer surface of the chassis 140 and disposed corresponding to the second space S92. In this way, the heat of the cooling fluid 950 may further dissipate to the outside of the chassis 140 through the external fins 931.
In some embodiments, the surface of the heat dissipation fins 930 may have microstructures (not shown) for increasing the surface roughness thereof to assist the boiling of the cooling fluid 950, so that the vaporized steam may easily escape from the surfaces of the heat dissipation fins 930 to allow the cooling fluid 950 to smoothly undergo a phase change cycle. In some embodiments, the microstructures may be formed by laying metal micro particles on the surfaces of the heat dissipation fins 930, but the disclosure is not limited thereto.
In summary, the antenna-in-package with the heat dissipation structure of the disclosure improves the heat dissipation efficiency thereof through the provision of dielectric fluid or cooling fluid, so that the antenna-in-package with the heat dissipation structure is adapted for application in the 5G communications industry and low-orbit satellite ground stations.
Although the disclosure has been described with reference to the embodiments above, the embodiments are not intended to limit the disclosure. Any person skilled in the art can make some changes and modifications without departing from the spirit and scope of the disclosure. Therefore, the scope of the disclosure will be defined in the appended claims.
