Patent Application
20220173506
The present invention relates to an antenna installation structure in which a planar antenna is installed on another member, and an electronic device including the antenna installation structure.
Japanese Unexamined Patent Application Publication No. 2012-231386 discloses a communication device including an antenna substrate. In the communication device described in Japanese Unexamined Patent Application Publication No. 2012-231386, the antenna substrate is provided on one main surface of a housing. The antenna substrate includes a dielectric substrate and an antenna conductor formed on one surface of the dielectric substrate.
The surface of the antenna substrate on which the antenna conductor is formed is disposed parallel to the one main surface of the housing. The antenna substrate is installed in the housing such that the surface on which the antenna conductor is formed faces the housing.
As described in Japanese Unexamined Patent Application Publication No. 2012-231386, when the antenna substrate is installed in the housing, it is easy to use a double-sided tape for reasons such as easy temporary fixing and easy installation.
However, although the double-sided tape is easy to handle, it has the poor fluidity of a resin, and a void tends to be formed on the surface to be bonded to the antenna substrate. When there is a void as described above, the state of the electric field of the antenna conductor changes depending on the size of the void, and the antenna characteristics may change.
In particular, when the antenna conductor and the ground conductor are disposed on the surface of the antenna substrate to which the double-sided tape is bonded, the antenna characteristics change depending on the size of the void between the antenna conductor and the ground conductor.
Preferred embodiments of the present invention provide antenna installation structures in each of which a change in antenna characteristics is reduced or prevented.
An antenna installation structure according to a preferred embodiment of the present invention includes an antenna substrate, an insulation layer, and a bonding material. The antenna substrate includes a dielectric base including a first main surface and a second main surface, and an antenna conductor and a ground conductor, which are on the first main surface and are separated from each other. The insulation layer is in contact with the first main surface of the antenna substrate. The bonding material is disposed between the insulation layer and another component and is in contact with the insulation layer and the other component. The porosity of the insulation layer is lower than the porosity of the bonding material.
With this configuration, a change in coupling between the antenna conductor and the ground conductor is reduced or prevented, because the insulation layer having a low porosity is in contact with the antenna substrate. As a result, the antenna characteristics do not easily change.
The above and other elements, features, steps, characteristics and advantages of the present invention will become more apparent from the following detailed description of the preferred embodiments with reference to the attached drawings.
An antenna installation structure and an electronic device according to a first preferred embodiment of the present invention will be described with reference to the drawings.
As illustrated in
The housing 100 has a box shape and includes an internal space. The housing 100 includes a radiation side wall 101 with a predetermined area. A portion of the radiation side wall 101 of the housing 100 overlapping the antenna substrate 20 is made of a non-conductor. For example, this portion is made of a dielectric, an insulator, or the like.
The antenna substrate 20, the insulation layer 30, the bonding material 40, and the circuit substrate 50 are disposed in the internal space of the housing 100. The specific configuration of the antenna substrate 20 will be described later. The insulation layer 30 has a flat or substantially flat film shape and is made of an epoxy resin, for example. The bonding material 40 has a flat or substantially flat film shape and includes an acrylic resin (PMMA), for example.
The antenna substrate 20 is bonded to the inner wall surface of the radiation side wall 101 of the housing 100 with the bonding material 40 and the insulation layer 30 interposed therebetween. More specifically, the bonding material 40 having a flat or substantially flat film shape is in contact with the inner wall surface of the radiation side wall 101. The insulation layer 30 is in contact with the surface, which is opposite from the surface in contact with the radiation side wall 101, of the bonding material 40. The antenna substrate 20 is in contact with the surface, which is opposite from the surface in contact with the bonding material 40, of the insulation layer 30. In other words, the insulation layer 30 covers the entire or substantially the entire surface of the first main surface of the antenna substrate 20, and the bonding material 40 bonds, to the radiation side wall 101, the entire or substantially the entire surface of the insulation layer 30, which is opposite from the surface in contact with the antenna substrate 20. The antenna substrate 20, the insulation layer 30, and the bonding material 40 define an antenna installation structure 11.
The circuit substrate 50 is provided on a wall, which is opposite to the radiation side wall 101, of the housing 100, for example. The circuit substrate 50 includes a main substrate 51, an electronic component 52, and a pin connector 53. The electronic component 52 and the pin connector 53 are mounted on the circuit substrate 50. The circuit substrate 50 is connected to the antenna substrate 20 via the pin connector 53.
As illustrated in
The dielectric base 21 is formed by laminating a dielectric layer 211 and a dielectric layer 212 that have a flat or substantially flat film shape, and has a flat or substantially flat plate shape. The surface of the dielectric layer 211 opposite from the surface in contact with the dielectric layer 212 is the first main surface of the dielectric base 21 (first main surface of the antenna substrate 20), and the surface of the dielectric layer 212 opposite from the surface in contact with the dielectric layer 211 is the second main surface of the dielectric base 21 (second main surface of the antenna substrate 20).
The antenna conductor 22 and the ground conductor 23 are disposed on the first main surface of the dielectric base 21. The antenna conductor 22 has a rectangular or substantially rectangular shape in plan view. The ground conductor 23 has an annular or substantially annular shape in plan view, and is disposed outside the outer peripheral end of the antenna conductor 22. The ground conductor 23 is disposed along the outer periphery of the first main surface of the dielectric base 21. The ground conductor 23 surrounds the entire or substantially the entire circumference of the antenna conductor 22. That is, the ground conductor 23 is disposed over the entire or substantially the entire outer periphery of the antenna conductor 22 with the separation portion 24, in which no conductor is provided, interposed therebetween. By providing the ground conductor 23, unnecessary electromagnetic field coupling on the side portion of the antenna conductor 22 may be reduced or prevented.
The connection conductor 25 and the ground conductor 26 are disposed on the second main surface of the dielectric base 21. The connection conductor 25 has a rectangular or substantially rectangular shape in plan view. The connection conductor 25 has a smaller area than the antenna conductor 22, and overlaps the antenna conductor 22. The connection conductor 25 is connected to the antenna conductor 22 via an interlayer connection conductor VH21 provided in the dielectric layer 212 and an interlayer connection conductor VH11 provided in the dielectric layer 211. The above-described pin connector 53 is connected to the connection conductor 25.
The ground conductor 26 has an annular or substantially annular shape in plan view, and is disposed outside the outer peripheral end of the connection conductor 25. The ground conductor 26 surrounds the entire or substantially the entire circumference of the connection conductor 25. That is, the ground conductor 26 is disposed over the entire or substantially the entire outer periphery of the connection conductor 25 with the separation portion 27, in which no conductor is provided, interposed therebetween. The ground conductor 26 is connected to the ground conductor 23 via an interlayer connection conductor VH22 provided in the dielectric layer 212 and the interlayer connection conductor VH12 provided in the dielectric layer 211.
In such a configuration, the separation portion 24 is a dented portion because of the thicknesses of the antenna conductor 22 and the ground conductor 23. In this case, in the configuration of the related art, that is, in the configuration in which the bonding material is directly bonded to the antenna substrate 20, a void is easily provided in the separation portion, and a porosity also changes according to the bonding state. In the configuration of the related art, therefore, there is a problem that it is difficult to reduce or prevent a change in antenna characteristics.
However, the configuration of the present preferred embodiment may be provided to solve this problem.
Specifically, as illustrated in
With this, the porosity of the insulation layer 30 is lower than the porosity of the bonding material 40. In particular, when the insulation layer 30 is formed by applying a liquid epoxy resin to the first main surface of the antenna substrate 20 and curing the liquid epoxy resin, the insulation layer 30 fills the separation portion 24 as illustrated in
Accordingly, the relative permittivity between the antenna conductor 22 and the ground conductor 23 is substantially uniquely determined by the relative permittivity of the insulation layer. With this, the electromagnetic field coupling between the antenna conductor 22 and the ground conductor 23 is stabilized, and a change in antenna characteristics may be reduced or prevented.
As described above, with the antenna installation structure 11 having the configuration of the present preferred embodiment, it is possible to install the antenna substrate 20 in the housing 100 while reducing or preventing the change in antenna characteristics.
Further, in the antenna installation structure 11, the relative permittivity of the insulation layer 30 is preferably lower than the relative permittivity of the bonding material 40. With this, the change in antenna characteristics is further reduced or prevented. More preferably, the relative permittivity of the antenna substrate 20 (excluding the conductor pattern) is lower than the relative permittivity of the insulation layer 30, and the relative permittivity of the insulation layer 30 is lower than the relative permittivity of the bonding material 40. This further reduces or prevents the change in antenna characteristics.
Further, in this configuration, the antenna substrate 20 includes an interlayer connection conductor that connects the ground conductor 23 and the ground conductor 26 and that extends in the thickness direction of the antenna substrate 20. With this, the strength of the antenna substrate 20 may be increased. In particular, the interlayer connection conductor that connects the ground conductor 23 and the ground conductor 26 is disposed along the outer periphery of the antenna substrate 20 and in the vicinity of this outer periphery. This makes it possible to increase the strength of the outer peripheral portion where a breakage is likely to occur. The strength of the antenna substrate 20, then, may further be increased.
Similarly, the antenna substrate 20 includes an interlayer connection conductor that connects the antenna conductor 22 and the connection conductor 25 and that extends in the thickness direction of the antenna substrate 20. With this, the peeling off of the antenna conductor 22 in the antenna substrate 20 is unlikely to occur, and the reliability of the antenna installation structure 11 is further improved.
The electronic device 10 with this configuration is manufactured with the following non-limiting example of a manufacturing method.
First, the dielectric layer 211 on which the antenna conductor 22 and the ground conductor 23 are formed, and the dielectric layer 212 on which the connection conductor 25 and the ground conductor 26 are formed are laminated. At this time, in the dielectric layer 211, a conductive paste defining and functioning as the base of the interlayer connection conductor VH11 and a conductive paste defining and functioning as the base of the interlayer connection conductor VH12 are formed. In the dielectric layer 212, a conductive paste defining and functioning as the base of an interlayer connection conductor VH21 and a conductive paste defining and functioning as the base of the interlayer connection conductor VH22 are formed. Then, the dielectric layer 211 and the dielectric layer 212 are laminated with the portion of the interlayer connection conductor VH11 and the portion of the interlayer connection conductor VH21 being overlapped with each other, and with the portion of the interlayer connection conductor VH12 and the portion of the interlayer connection conductor VH22 being overlapped with each other. Further, by pressure bonding of the laminated body with heat, the dielectric layers are bonded to each other, and the interlayer connection conductors are solidified. Thus, the dielectric base 21 is formed, and the antenna substrate 20 is formed.
Next, a liquid resin material is applied to the first main surface of the antenna substrate 20, heated, and cured to form the insulation layer 30.
Next, the bonding material 40 such as a double-sided tape is temporarily fixed to the surface, which is opposite from the surface in contact with the antenna substrate 20, of the insulation layer 30. Thereafter, the antenna substrate 20 to which the bonding material 40 is temporarily fixed is installed on the inner wall surface of the radiation side wall 101 of the housing 100. Then, the bonding material 40 is cured by heating the bonding material 40. Note that, the bonding material 40 may temporarily be fixed in advance to the inner wall surface of the radiation side wall 101 of the housing 100. With this, the antenna substrate 20 may be easily installed in the housing 100.
Thereafter, a portion of the housing 100 on which the circuit substrate 50 is installed is laid over another portion, which includes the radiation side wall 101, of the housing 100, such that the pin connector 53 is brought into contact with the connection conductor 25. With this, the electronic device 10 is formed.
An antenna installation structure and an electronic device according to a second preferred embodiment of the present invention will be described with reference to the drawings.
As illustrated in
The antenna substrate 20A includes a wiring conductor 28. The wiring conductor 28 is disposed in a predetermined layer between the first main surface and the second main surface of a dielectric base 21A.
The wiring conductor 28 is a band-shaped (linear or substantially linear shape having a predetermined width) conductor. One end of the wiring conductor 28 in an extending direction overlaps the antenna conductor 22 in plan view (viewed in a direction orthogonal or substantially orthogonal to the first main surface). The one end of the wiring conductor 28 in the extending direction is connected to the antenna conductor 22 via an interlayer connection conductor VH1A. The other end of the wiring conductor 28 in the extending direction overlaps the connection conductor 25 in plan view. The other end of the wiring conductor in the extending direction is connected to the connection conductor 25 via an interlayer connection conductor VH3A.
A ground conductor 23A and a ground conductor 26A are disposed so as to sandwich the wiring conductor 28 therebetween. The ground conductor 23A and the ground conductor 26A are connected by an interlayer connection conductor VH2A. With this, the antenna substrate 20A includes a strip line in a portion different from the antenna conductor 22.
In the region where the strip line is provided, the antenna substrate 20A includes a bent portion Rc. As illustrated in
Also in such a configuration, with the electronic device 10A and an antenna installation structure 11A, the change in antenna characteristics may be reduce or prevented by providing the above-described antenna installation structure. Further, with this configuration, the flexibility of installation of the antenna substrate 20A with respect to a circuit substrate 50A is improved.
Further, the interlayer connection conductor VH2A is disposed at a portion, which surrounds the antenna conductor 22 and is close to the bent portion Rc, of the ground conductor 23A. With this, due to the residual stress generated in the bent portion Rc, it is possible to reduce or prevent the peeling off or the like (such as the peeling off of the ground conductor 23A or the peeling off between layers, for example) of each component in the portion (antenna function portion) of the antenna conductor 22. In addition, it is possible to reduce or prevent a change in antenna characteristics, disconnection, or the like caused by the breakage above.
In the second preferred embodiment, the antenna substrate 20A and the circuit substrate 50A are connected by using the connector 60 mounted on the antenna substrate 20A and a connector 53A mounted on the circuit substrate 50A. However, the connection conductor 25 and the ground conductor 26A may be directly bonded to a land conductor (not illustrated) of the circuit substrate 50A by soldering or the like, for example.
The antenna substrate 20A includes a coverlay 291 and a coverlay 292 that have insulation properties. The coverlay 291 covers the first main surface side of the antenna substrate 20A. The coverlay 291 is disposed in a region which does not overlap the antenna conductor 22 of the antenna substrate 20A. The coverlay 292 covers the second main surface side of the antenna substrate 20A. The coverlay 292 is disposed on the entire or substantially the entire surface of the antenna substrate 20A. With this configuration, the antenna substrate 20A is provided with the coverlay 291 and the coverlay 292 in the bent portion Rc. With the antenna substrate 20A, the ground conductor 23A and the ground conductor 26A may be protected in the bent portion Rc.
Further, as illustrated in
While preferred embodiments of the present invention have been described above, it is to be understood that variations and modifications will be apparent to those skilled in the art without departing from the scope and spirit of the present invention. The scope of the present invention, therefore, is to be determined solely by the following claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2019-174859 | Sep 2019 | JP | national |
This application claims the benefit of priority to Japanese Patent Application No. 2019-174859 filed on Sep. 26, 2019 and is a Continuation Application of PCT Application No. PCT/JP2020/035374 filed on Sep. 18, 2020. The entire contents of each application are hereby incorporated herein by reference.
| Number | Date | Country | |
|---|---|---|---|
| Parent | PCT/JP2020/035374 | Sep 2020 | US |
| Child | 17675443 | US |
