The disclosure relates to an antenna matching circuit applied to an electronic device supporting wireless communication.
Along with the development of wireless communication technology, various electronic devices, such as smartphones, are commonly used in everyday life, and thus, use of contents is increasing. An electronic device may include an antenna for supporting various communication technologies. An electronic device may include various matching circuits to improve the performance of an antenna.
The electronic device may include a matching circuit to secure antenna performance according to various frequency bands or situations of the electronic device. An antenna matching topology may be applied to a matching circuit included in an electronic device. For example, in an electronic device supporting a broad frequency band (e.g., 1.7 GHz to 5 GHz), impedance matching of an antenna adapted for each frequency may be performed to obtain communication performance specified for each frequency in that frequency band. For example, for an embedded antenna patterned on a printed circuit board (PCB), the antenna matching topology may be selectively applied in consideration of power transfer and reflection loss.
The matching circuit in the electronic device may include a switch and a passive element. The passive element located between a port of the switch and a ground may generate a parasitic resonance.
Provided is an impedance matching circuit in an electronic device supporting wireless communication.
According to an aspect of the disclosure, An electronic device includes: an antenna radiator; a radio frequency (RF) circuit configured to process a RF signal; a feeding line electrically connecting the antenna radiator with the RF circuit; a plurality of points including one or more first points and one or more second points, the plurality of points being positioned on the feeding line; a switch circuit electrically coupled to the plurality of points, the switch circuit being disposed in a parallel structure with respect to the feeding line; a first lumped element disposed between the one or more first points and the one or more second points; and a second lumped element disposed between the one or more first points and at least one first terminal included in the switch circuit.
According to an embodiment of the disclosure, the electronic device may provide impedance matching topology of various antennas and obtain enhanced communication performance for each broadband characteristic and frequency of the antenna.
The above and other aspects, features, and advantages of certain embodiments of the disclosure will be more apparent from the following description taken in conjunction with the accompanying drawings, in which:
Hereinafter, various embodiments will be described in detail with reference to the accompanying drawings. In the following description, specific details such as detailed configurations and components will be provided only to help a general understanding of embodiments of the disclosure. Therefore, it would be apparent to those skilled in the art that various changes and modifications may be made without departing from the scope and spirit of the disclosure. Further, descriptions of well-known features and configurations may be omitted for clarity and brevity.
Referring to
The processor 120 may execute, for example, software (e.g., a program 140) to control at least one other component (e.g., a hardware or software component) of the electronic device 101 coupled with the processor 120, and may perform various data processing or computation. According to an embodiment, as at least part of the data processing or computation, the processor 120 may store a command or data received from another component (e.g., the sensor module 176 or the communication module 190) in a volatile memory 132, process the command or the data stored in the volatile memory 132, and store resulting data in a non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)), or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operable independently from, or in conjunction with, the main processor 121. For example, when the electronic device 101 includes the main processor 121 and the auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or to be specific to a specified function. The auxiliary processor 123 may be implemented as separate from, or as part of the main processor 121.
The auxiliary processor 123 may control at least some of functions or states related to at least one component (e.g., the display module 160, the sensor module 176, or the communication module 190) among the components of the electronic device 101, instead of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or together with the main processor 121 while the main processor 121 is in an active state (e.g., executing an application). According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., the camera module 180 or the communication module 190) functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., the neural processing unit) may include a hardware structure specified for artificial intelligence model processing. An artificial intelligence model may be generated by machine learning. Such learning may be performed, e.g., by the electronic device 101 where the artificial intelligence is performed or via a separate server (e.g., the server 108). Learning algorithms may include, but are not limited to, e.g., supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include a plurality of artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), deep Q-network or a combination of two or more thereof but is not limited thereto. The artificial intelligence model may, additionally or alternatively, include a software structure other than the hardware structure.
The memory 130 may store various data used by at least one component (e.g., the processor 120 or the sensor module 176) of the electronic device 101. The various data may include, for example, software (e.g., the program 140) and input data or output data for a command related thereto. The memory 130 may include the volatile memory 132 or the non-volatile memory 134.
The program 140 may be stored in the memory 130 as software, and may include, for example, an operating system (OS) 142, middleware 144, or an application 146.
The input module 150 may receive a command or data to be used by another component (e.g., the processor 120) of the electronic device 101, from the outside (e.g., a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).
The sound output module 155 may output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as playing multimedia or playing record. The receiver may be used for receiving incoming calls. According to an embodiment, the receiver may be implemented as separate from, or as part of the speaker.
The display module 160 may visually provide information to the outside (e.g., a user) of the electronic device 101. The display module 160 may include, for example, a display, a hologram device, or a projector and control circuitry to control a corresponding one of the display, hologram device, and projector. According to an embodiment, the display module 160 may include a touch sensor adapted to detect a touch, or a pressure sensor adapted to measure the intensity of force incurred by the touch.
The audio module 170 may convert a sound into an electrical signal and vice versa. According to an embodiment, the audio module 170 may obtain the sound via the input module 150, or output the sound via the sound output module 155 or a headphone of an external electronic device (e.g., an electronic device 102) directly (e.g., wiredly) or wirelessly coupled with the electronic device 101.
The sensor module 176 may detect an operational state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) external to the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.
The interface 177 may support one or more specified protocols to be used for the electronic device 101 to be coupled with the external electronic device (e.g., the electronic device 102) directly (e.g., wiredly) or wirelessly. According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.
A connecting terminal 178 may include a connector via which the electronic device 101 may be physically connected with the external electronic device (e.g., the electronic device 102). According to an embodiment, the connecting terminal 178 may include, for example, a HDMI connector, a USB connector, a SD card connector, or an audio connector (e.g., a headphone connector).
The haptic module 179 may convert an electrical signal into a mechanical stimulus (e.g., a vibration or a movement) or electrical stimulus which may be recognized by a user via his tactile sensation or kinesthetic sensation. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electric stimulator.
The camera module 180 may capture a still image or moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
The power management module 188 may manage power supplied to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).
The battery 189 may supply power to at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a primary cell which is not rechargeable, a secondary cell which is rechargeable, or a fuel cell.
The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and the external electronic device (e.g., the electronic device 102, the electronic device 104, or the server 108) and performing communication via the established communication channel. The communication module 190 may include one or more communication processors that are operable independently from the processor 120 (e.g., the application processor (AP)) and supports a direct (e.g., wired) communication or a wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules may communicate with the external electronic device via the first network 198 (e.g., a short-range communication network, such as Bluetooth™, wireless-fidelity (Wi-Fi) direct, or infrared data association (IrDA)) or the second network 199 (e.g., a long-range communication network, such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or wide area network (WAN)). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multi components (e.g., multi chips) separate from each other. The wireless communication module 192 may identify and authenticate the electronic device 101 in a communication network, such as the first network 198 or the second network 199, using subscriber information (e.g., international mobile subscriber identity (IMSI)) stored in the subscriber identification module 196.
The wireless communication module 192 may support a 5G network, after a 4G network, and next-generation communication technology, e.g., new radio (NR) access technology. The NR access technology may support enhanced mobile broadband (eMBB), massive machine type communications (mMTC), or ultra-reliable and low-latency communications (URLLC). The wireless communication module 192 may support a high-frequency band (e.g., the mmWave band) to address, e.g., a high data transmission rate. The wireless communication module 192 may support various technologies for securing performance on a high-frequency band, such as, e.g., beamforming, massive multiple-input and multiple-output (massive MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., the electronic device 104), or a network system (e.g., the second network 199). According to an embodiment, the wireless communication module 192 may support a peak data rate (e.g., 20 Gbps or more) for implementing eMBB, loss coverage (e.g., 164 dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each of downlink (DL) and uplink (UL), or a round trip of 1 ms or less) for implementing URLLC.
The antenna module 197 may transmit or receive a signal or power to or from the outside (e.g., the external electronic device) of the electronic device 101. According to an embodiment, the antenna module 197 may include an antenna including a radiating element including a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., array antennas). In such a case, at least one antenna appropriate for a communication scheme used in the communication network, such as the first network 198 or the second network 199, may be selected, for example, by the communication module 190 (e.g., the wireless communication module 192) from the plurality of antennas. The signal or the power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be additionally formed as part of the antenna module 197.
According to an embodiment, the antenna module 197 may be a mmWave antenna module. According to an embodiment, the mmWave antenna module may include a printed circuit board, a RFIC disposed on a first surface (e.g., the bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a designated high-frequency band (e.g., the mmWave band), and a plurality of antennas (e.g., array antennas) disposed on a second surface (e.g., the top or a side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of the designated high-frequency band.
At least some of the above-described components may be coupled mutually and communicate signals (e.g., commands or data) therebetween via an inter-peripheral communication scheme (e.g., a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)).
According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 via the server 108 coupled with the second network 199. Each of the electronic devices 102 or 104 may be a device of a same type as, or a different type, from the electronic device 101. According to an embodiment, all or some of operations to be executed at the electronic device 101 may be executed at one or more of the external electronic devices 102, 104, or 108. For example, if the electronic device 101 should perform a function or a service automatically, or in response to a request from a user or another device, the electronic device 101, instead of, or in addition to, executing the function or the service, may request the one or more external electronic devices to perform at least part of the function or the service. The one or more external electronic devices receiving the request may perform the at least part of the function or the service requested, or an additional function or an additional service related to the request, and transfer an outcome of the performing to the electronic device 101. The electronic device 101 may provide the outcome, with or without further processing of the outcome, as at least part of a reply to the request. To that end, a cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device 101 may provide ultra-low latency services using, e.g., distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an internet-of-things (IoT) device. The server 108 may be an intelligent server using machine learning and/or a neural network. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology or IoT-related technology.
Referring to
According to an embodiment, the processor 210 may perform an overall control to transmit or receive an RF signal through a wireless channel. The processor 210 may provide the RF circuit 220 with a baseband signal (hereinafter, referred to as a “BB signal”) desired to be transmitted. The processor 210 may perform a processing of reception for the BB signal received through the RF circuit 220. The processor 210 may perform a control for impedance matching of the antenna, based on at least one element to be considered to perform the wireless communication, such as, e.g., a frequency band and/or a communication scheme to be used for transmission/reception. The impedance matching of the antenna may control, for example, the matching network 230 to form an adaptive antenna matching topology for impedance matching between the antenna 240 and the feeding line.
According to an embodiment, the RF circuit 220 may receive a baseband signal (hereinafter, referred to as a “BB signal”) desired to be transmitted, from the processor 210, up-convert the received BB signal into an RF band signal (hereinafter, referred to as an “RF signal”) using an element such as e.g., a mixer, and thus, provide the RF band signal to the antenna 240 through the matching network 230 disposed on the feed line. The RF circuit 220 may receive an RF signal from the antenna 240 through the matching network 230 disposed on the feed line, up-convert the received RF signal into a BB signal using an element such as a mixer, and thus, provide the up-converted frequency of RF signal to the antenna 240 through the matching network 230 disposed on the feed line. The RF circuit 220 may include, for example, at least one RFIC including a front end module (FEM), or may include a separated FEM and RFIC.
According to an embodiment, the matching network 230 may include a circuit for providing impedance matching between the antenna 240 and the transmission line in between the antenna 240 and the RF circuit 220. The matching network 230 may provide, for example, an antenna matching topology to be applied in wireless communication under the control of the processor 210. The matching network 230 may be electrically connected to the antenna 240 at a terminal (a) corresponding to a feeding point located on the transmission line, and may be electrically connected to the RF circuit 220 at a terminal (b) located on the transmission line. The matching network 230 may form a plurality of paths electrically connecting the terminal (a) and the terminal (b) in parallel. The plurality of paths that may be formed by the matching network 230 may include, for example, a main path (or a primary path) and one or more matching paths (or an auxiliary path). While the matching network 230 is illustrated as having a separate independent configuration, it may be configured to be included in the RF circuit 220. For example, the matching network 230 may be provided in the RFIC included in the RF circuit 220 or may be provided in the FEM included in the RF circuit 220.
According to an embodiment, the antenna 240 may transmit an RF signal to a wireless network, or may receive an RF signal from a wireless network. An application type of the antenna 240 may be determined based on factors such as e.g., an available frequency band, a transmission/reception scheme and performance, transmission characteristics or the like. The antenna 240 may include, for example, a dipole antenna, a monopole antenna, a yagi antenna, a patch antenna, a horn antenna, a parabolic antenna, a helical antenna, a slot antenna or the like. For example, the patch antenna may be made by forming a metal pattern in a square or circular shape on a microstrip substrate. The antenna 240 may be an antenna radiator for radiating an RF signal.
Referring to
According to an embodiment, the matching network 230 may include a plurality of paths connected in parallel between the terminal (a) corresponding to the feeding point that electrically connects the feeding line with the antenna radiator (e.g., the antenna 240 in
According to an embodiment, the one or more second paths may be divided into a section 2-1 (350) electrically connecting the first point 330 and the tuner 310, and a section 2-2 (360) electrically connecting the second point 340 and the tuner 310. The number (l) of second paths in the section 2-1 (350) electrically connecting the first point 330 and the tuner 310 may be the same as or different from the number (n) of second paths in section 2-2 (360) electrically connecting the second point 340 and the tuner 310. The number (l) of second paths in the section 2-1 (350) and the number (n) of second paths in the section 2-2 (360) may be a positive integer.
According to an embodiment, within the tuner 310, the lumped element may or may not be disposed in at least one of l second paths present in the section 2-1 (350), or the lumped element may or may not be disposed in at least one of n second paths present in the section 2-2 (360). The tuner 310 may have, for example, any one of the structures shown in
Referring to
According to an embodiment, the switch circuit 410 may form impedance matching topologies of various antennas to improve energy transfer performance such as e.g., an RF signal between the feeding line and the antenna in consideration of the at least one lumped element 420 or 430. The various impedance matching topologies may provide multi-paths (e.g., matching paths) electrically connecting between the first point 330 and the second point 340. The switch circuit 410 may include at least two terminals 440 and 450. At least one of the at least two terminals 440 and 450 included in the switch circuit 410 may be used as an input terminal, and the other one of the at least two terminals may be used as an output terminal. For example, in case that the switch circuit 410 includes the first terminal 440 and the second terminal 450, upon transmitting an RF signal, the first terminal 440 may be used as an output terminal, and the second terminal 450 may be used as an input terminal. As another example, in case that the switch circuit 410 includes the first terminal 440 and the second terminal 450, upon receiving an RF signal, the first terminal 440 may be used as an input terminal, and the second terminal 450 may be used as an output terminal.
According to an embodiment, a switch element applicable as the switch circuit 410 may include, for example, a single pole double throw (SPDT), a single pole three throw (SP3T), a single pole four throw (SP4T), a single pole five throw (SPST), a single pole six throw (SP6T), or a double pole double throw (DPDT). The switch circuit 410 may include, for example, a switch element made of one component including a plurality of switches. For example, the switch circuit 410 of the remaining types (e.g., SP3T, SP4T, SPST, SP6T, or DPDT) other than the SPST type may have at least one pole terminal or at least two throw terminals.
According to an embodiment, the pole terminal in the switch circuit 410 may be used as a radio frequency common (RFC) terminal that may be connected to a transmission line (a feed line) through which wireless signals are transmitted and received. However, the pole terminal may be opened so that the parasitic resonance is not output to the antenna radiator, thereby preventing presence of the lumped element physically connected to the ground. At least one of the at least two throw terminals in the switch circuit 410 may be electrically connected to a connection point (e.g., at least one first point 330) between a terminal (a) (e.g., a feeding point (a) connecting the antenna 240 and the matching network 230 of
According to an embodiment, the type of the switch circuit 410 may be determined based on the number (l) of second paths present in the section 2-1 connecting the first point 330 and the tuner 310, and the number (n) of second paths present in the section 2-2 connecting the second point 340 and the tuner 310. For example, when both l and n are “1”, the switch circuit 410 may be a switch element of a type (e.g., SPDT, SP4T, SP5T, SP6T) including two or more terminals. As another example, when both l and n are “2”, the switch circuit 410 may be a switch element of a type (e.g., SP4T, SP5T, SP6T, DPDT) including four or more terminals. As another example, when l is “2” and n is “3”, the switch circuit 410 may be a switch element of a type (e.g., SP5T or SP6T) including five or more terminals.
As described above, the terminals (e.g., the throw terminals) of the switch circuit 410 are electrically connected to the feeding line, and any one (e.g., the pole terminal) of the terminals of the switch circuit 410 is made to be opened, so that there exists no lumped element physically connected to the ground. The switch circuit 410 may allow only internal capacitance to exist, thereby preventing parasitic resonance due to shunt matching from occurring in a frequency band of 6 GHz or less.
Referring to
According to an embodiment, the first lumped element 420 may be disposed in l second paths in the section 2-1 (350) connecting the first point 330 and the first terminal 440 of the switch circuit 410 included in the tuner 310. For example, when l is “2”, the first lumped element 420 may be disposed in each of the two second paths present in the section 2-1 (350), or may be disposed in only one of the two second paths. In an embodiment, when the first lumped element 420 is disposed in each of two second paths existing in the section 2-1 (350), the first lumped elements 420 disposed in each path may be the same as or different from each other.
Referring to
According to an embodiment, the second lumped element 430 may be disposed in n second paths in the section 2-2 (360) connecting the second terminal 450 of the switch circuit 410 included in the tuner 310 and the first point 330. For example, when n is “2”, the second lumped element 430 may be disposed on each of the two second paths present in the section 2-2 (360), or may be disposed on only one of the two second paths. In an embodiment, when the second lumped elements 430 are disposed in the two second paths existing in the section 2-2 (360), respectively, the second lumped elements 430 disposed in the respective paths may be substantially the same as or different from each other.
Referring to
According to an embodiment, the first lumped element 420 may be disposed in l second paths in the section 2-1 (350) connecting the first point 330 and the first terminal 440 of the switch circuit 410 included in the tuner 310. For example, when l is “2”, the first lumped element 420 may be disposed in each of the two second paths existing in section 2-1 (350), or may be disposed in only one of the two second paths.
According to an embodiment, the second lumped element 430 may be disposed in n second paths in the section 2-2 (360) connecting the second terminal 450 of the switch circuit 410 included in the tuner 310 and the first point 330. For example, when n is “2”, the second lumped element 430 may be disposed in each of the two second paths existing in the section 2-2 (360), or may be disposed on only one of the two second paths.
Referring to
According to an embodiment, the first element 320 may be positioned on a first path that electrically connects the antenna 240 and the RF circuit 220. The first element 320 may include a lumped element. The lumped element to be included in the first element 320 may be a passive element such as a resistor R, an inductor L, or a capacitor C, or a combination of those passive elements. The first path may include a first section 550a electrically connecting the antenna 240 and the first element 320, and a second section 550b electrically connecting the first element 320 and the RF circuit 220. A first point (e.g., the first point 330 of
According to an embodiment, the second element 420 and the switch circuit 410 may be disposed in series in a second path (matching path) connecting the first point 330 and the second point 340. The second path may include a third section 560a electrically connecting the first point 330 and the switch circuit 410 through the second element 420, and a fourth section 560b electrically connecting the switch circuit 410 and the second point 340. A lumped element to be included in the second element 420 may be a passive element such as a resistor R, an inductor L, or a capacitor C, or a combination of those passive elements.
According to an embodiment, the switch circuit 410 may operate with a control signal from a processor (e.g., the processor 210 of
Referring to
According to an embodiment, the switch circuit 410 may include one pole terminal and a plurality of throw terminals. The one pole terminal may be open or short-circuited. In case that the one pole terminal is opened, the tuner (e.g., the tuner 310 of
According to an embodiment, the first switch sw1 (610) and the second switch sw2 (620) may be connected in series between the first terminal 440 and the second terminal 450. The first switch sw1 (610) may have a (1-1)th terminal pa1 and a (1-2)th terminal pb1, and may electrically connect or disconnect the (1-1)th terminal pa1 to or from the (1-2)th terminal pb1. The second switch sw2 (620) may have a (2-1)th terminal pa2 and a (2-2)th terminal pb2, and may electrically connect or disconnect the (2-1)th terminal pa2 to or from the (2-2)th terminal pb2. The (1-1)th terminal pa1 of the first switch sw1 (610) may be connected to the first terminal 440, and the (1-2)th terminal pb1 of the first switch sw1 (610) may be connected to the (2-2)th terminal pb2 of the second switch sw2 (620). The (2-1)th terminal pa2 of the second switch sw2 (620) may be connected to the second terminal 450, and the (2-2)th terminal pb2 of the second switch sw2 (620) may be connected to the (1-2)th terminal pb1 of the first switch sw1 (610).
According to an embodiment, the first stopper sh1 (630) may be disposed between a point 650 between the first terminal 440 and the (1-1)th terminal pa1 of the first switch sw1 (610), and a ground. The second stopper sh2 (640) may be disposed between a point 660 between the second terminal 450 and the (2-1)th terminal pa2 of the second switch sw2 (620), and the ground. The first stopper sh1 (630) may have a (3-1)th terminal pb3 and a (3-2)th terminal pb3, and may electrically connect or disconnect the (3-1)th terminal pa3 to or from the (3-2)th terminal pb3. The second stopper sh2 (640) may have a (4-1)th terminal pa4 and a (4-2)th terminal pb4, and may electrically connect or disconnect the (4-1)th terminal pa4 to or from the (4-2)th terminal pb4. The (3-1)th terminal pa3 of the first stopper sh1 (630) may be connected to a point 650, and the (3-2)th terminal pb3 of the first stopper sh1 (630) may be connected to the ground. The (4-1)th terminal pa4 of the second stopper sh2 (640) may be connected to a point 660, and the (4-2)th terminal pb4 of the second stopper sh2 (640) may be connected to the ground.
According to an embodiment, the two switches sw1 and sw2 (610, 620) and the two stoppers sh1 and sh2 (630, 640) included in the switch circuit 410 may be opened (off) or shorted (on) under control of an external device (e.g., the processor 210 of
Referring to
According to an embodiment, the switch circuit 410 may be an SP4T type of including at least one pole terminal RFC (700) and at least four throw terminals RF1, RF2, RF3, and RF4 (440a, 440b, 450a, 450b). The one pole terminal 700 may be opened (or turned off) or shorted-circuited (or turned on). The four throw terminals (440a, 440b, 450a, 450b) may be connected to the feeding line. The SP4T type of switch circuit 410 may include four switches (sw1, sw2, sw3, sw4) (710, 720, 730, 740) and four stoppers (sh1, sh2, sh3, sh4) (750, 760, 770, 780).
According to an embodiment, the first switch sw1710 and the second switch sw2720 may be connected in series between the RF1 terminal 440a and the RF3 terminal 450a in the switch circuit 410. The first switch sw1710 may have a first terminal p11 and a second terminal p12, and may electrically connect or disconnect the first terminal p11 to or from the second terminal p12. The second switch sw2720 may have a first terminal p21 and a second terminal p22, and may electrically connect or disconnect the first terminal p21 to or from the second terminal p22. The third switch sw3730 may have a first terminal p31 and a second terminal p32, and may electrically connect or disconnect the first terminal p31 to or from the second terminal p32. The fourth switch sw4740 may have a first terminal p41 and a second terminal p42, and may electrically connect or disconnect the first terminal p41 to or from the second terminal p42.
According to an embodiment, the first terminal p11 of the first switch sw1710 may be connected to the RF1 terminal 440a, and the second terminal p12 of the first switch sw1710 may be connected to the second terminal p22 of the second switch sw2720. The first terminal p21 of the second switch sw2720 may be connected to the RF3 terminal 450a, and the second terminal p22 of the second switch sw2720 may be connected to the second terminal p12 of the first switch sw1710. The first terminal p31 of the third switch sw3730 may be connected to the RF2 terminal 440b, and the second terminal p32 of the third switch sw3730 may be connected to the second terminal p42 of the fourth switch sw4740. The first terminal p41 of the fourth switch sw4740 may be connected to the RF4 terminal 450b, and the second terminal p42 of the fourth switch sw4740 may be connected to the second terminal p32 of the third switch sw3730.
According to an embodiment, the first stopper sh1750 may be disposed between a point 791 between the RF1 terminal 440a and the first terminal p11 of the first switch sw1710, and the a ground. The second stopper sh2750 may be disposed between a point 793 between the RF3 terminal 450a and the first terminal p21 of the second switch sw2720, and the ground. The third stopper sh3770 may be disposed between a point 795 between the RF2 terminal 440b and the first terminal p 31 of the third switch sw3730, and the ground. The fourth stopper sh4780 may be disposed between a point 797 between the RF4 terminal 450b and the first terminal p41 of the fourth switch sw4740, and the ground.
According to an embodiment, the first stopper sh1750 may have a first terminal p51 and a second terminal p52, and may electrically connect or disconnect the first terminal psi to or from the second terminal p52. The second stopper sh2760 may have a first terminal p61 and a second terminal p62, and may electrically connect or disconnect the first terminal p61 to or from the second terminal p62. The third stopper sh3770 may have a first terminal p71 and a second terminal p72, and may electrically connect or disconnect the first terminal p71 to or from the second terminal p72. The fourth stopper sh4780 may have a first terminal p81 and a second terminal p82, and may electrically connect or disconnect the first terminal p81 to or from the second terminal p82.
According to an embodiment, the first terminal p51 of the first stopper sh1750 may be connected to a point 791, and the second terminal p52 of the first stopper sh1750 may be connected to the ground. A first terminal p61 of the second stopper sh2760 may be connected to a point 793, and a second terminal p62 of the second stopper sh2760 may be connected to the ground. The first terminal p71 of the third stopper sh3770 may be connected to a point 795, and the second terminal p72 of the third stopper sh3770 may be connected to the ground. The first terminal p51 of the fourth stopper sh4780 may be connected to a point 797, and the second terminal p82 of the fourth stopper sh4780 may be connected to the ground.
According to an embodiment, the pole terminal 700 that may be included in the switch circuit 410 may be connected to a point 701 between the second terminal p12 of the first switch sw1710 and the second terminal p22 of the second switch sw2720 and a point 703 between the second terminal p32 of the third switch sw3730 and the second terminal p42 of the fourth switch sw4740. The point 701 and the point 703 may be connected to each other.
According to an embodiment, the four switches (sw1, sw2, sw3, sw4) (710, 720, 730, 740) and the four stoppers (sh1, sh2, sh3, sh4) (750, 760, 770, 780) included in the switch circuit 410 may be opened (or turned off) or shorted (or turned on) under control of an external device (e.g., the processor 210 of
As described above, the antenna matching topologies may be variously implemented by a combination of on or off of the switches (sw1, sw2, sw3, sw4) (710, 720, 730, 740) and/or the stoppers (sh1, sh2, sh3, sh4) (750, 760, 770, 780) included in the switch circuit 410.
In the above description of
Referring to
According to an embodiment, the points a and b (e.g., at least one first point 330 of
According to an embodiment, the tuner 920 may include a plurality of lumped elements (C1, L1, C2, L2) and a switch circuit 930. The plurality of lumped elements may be disposed on a path electrically connecting points (a, b, c, d) (911, 913, 915, 917) located on the feeding line to the switch circuit 930. The capacitors C1 and C2 or inductors L1 and L2 may be used as the plurality of lumped elements. For example, the first capacitor C1 may be disposed on a line electrically connecting the point a 911 and a first terminal (e.g., the RF1 terminal 440a of
According to an embodiment, the switch circuit 930 of a DP4T type may include four throw terminals (first to fourth terminals) and one pole terminal (e.g., the RFC terminal 700 of
According to an embodiment, the four switches (sw1, sw2, sw3, sw4) and the four stoppers (sh1, sh2, sh3, sh4) included in the switch circuit 930 may be opened (or turned off) or short-circuited (or turned on) under the control of an external device (e.g., the processor 210 of
Referring to
According to an embodiment, the connection port 1010 (e.g., C-clip) may be a feeding point (e.g., the feeding point (a) of
According to an embodiment, the first matching circuit 1020 may include a first capacitor C1, a first inductor L1, or a second inductor L2. The first capacitor C1 may be positioned on a path electrically connecting the connection port 1010 and the second matching circuit 1030 in series. The first and/or second inductors L1 and L2 may be positioned between a point and a ground on a path electrically connecting the connection port 1010 and the first capacitor C1.
According to an embodiment, the second matching circuit 1030 may include a second capacitor C2, a third capacitor C3, a fourth capacitor C4, a third inductor L3, a fourth inductor L4, and/or a switch chip 1031. The second capacitor C2 may correspond to, for example, the lumped element 320 of
According to an embodiment, the second matching circuit 1030 may have the structure illustrated in
According to an embodiment, the power supply 1040 may include a fifth inductor L5, a fifth capacitor C5, or a sixth capacitor C6. The fifth inductor L5 may be connected in series between the sixth capacitor C6 and the supply voltage Vcc and the ground. The fifth capacitor C5 may be disposed between the supply voltage Vcc and the ground. A point between the fifth inductor L5 and the sixth capacitor C6 may be electrically connected to the second matching circuit 1030, in particular, the terminal V10 supplying a voltage for driving the switch chip 1031.
According to an embodiment, the clock data connector 1050 may be electrically connected to data and clock terminals of the switch chip 1031 included in the second matching circuit 1030, thereby supplying data and a clock signal to the switch chip 1031.
Referring to
According to an embodiment, a feeding unit in the electronic device may refer to only the feeding point 1140, or may refer to both the feeding point 1140 and the first and second matching circuits in an integrated manner.
While the disclosure has been particularly illustrated and described with reference to certain embodiments, it will be understood by those having ordinary skill in the art that various changes and modifications may be made in their form and details without departing from the idea and scope of the disclosure as defined by the appended claims and their equivalents.
According to an embodiment of the disclosure, an electronic device (e.g., the electronic device 101 of
According to an embodiment of the disclosure, the electronic device may further comprise a third lumped element (e.g., the second lumped element 430 of
According to an embodiment of the disclosure, a third terminal (e.g., the at least one pole terminal RFC 700 of
According to an embodiment of the disclosure, a third terminal (e.g., the at least one pole terminal RFC 700 of
According to an embodiment of the disclosure, the switch circuit may further comprise at least one second terminal (e.g., the second terminal 450 of
According to an embodiment of the disclosure, a third terminal (e.g., the at least one pole terminal RFC 700 of
According to an embodiment of the disclosure, the switch circuit may comprise four terminals (e.g., two first terminals RF1 and RF2 (440a, 440b) of
According to an embodiment of the disclosure, a third terminal (e.g., the at least one pole terminal RFC 700 of
According to an embodiment of the disclosure, the electronic device may further comprise a third lumped element (e.g., the lumped elements 420a and 420b of
According to an embodiment of the disclosure, the electronic device may further comprise a fourth lumped element (e.g., the lumped elements 430a and 430b of
According to an embodiment of the disclosure, the switch circuit may comprise: at least one first terminal (e.g., the first terminal 440 of
According to an embodiment of the disclosure, the switch circuit may further comprise a third terminal (e.g., at least one pole terminal RFC 700 of
According to an embodiment of the disclosure, the switch circuit may further comprise a third terminal (e.g., at least one pole terminal RFC 700 of
According to an embodiment of the disclosure, the electronic device may further comprise a third lumped element (e.g., the lumped elements 430a and 430b of
According to an embodiment of the disclosure, the switch circuit may comprise: (1-1)th and (1-2)th terminals (e.g., two first terminals RF1 and RF2 (440a, 440b) of
According to an embodiment of the disclosure, the switch circuit may further comprise a fifth terminal (e.g., the pole terminal 700 of
According to an embodiment of the disclosure, the switch circuit may further comprise a fifth terminal (e.g., the pole terminal 700 of
According to an embodiment of the disclosure, the electronic device may comprise a (1-1)th lumped element (e.g., the lumped element 420a of
According to an embodiment of the disclosure, the electronic device may comprise a (2-1)th lumped element (e.g., the lumped element 430a of
According to an embodiment of the disclosure, the electronic device may comprise a sub-impedance matching circuit (e.g., the first matching circuit 1020 of
The electronic device according to various embodiments may be one of various types of electronic devices. The electronic devices may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. According to an embodiment of the disclosure, the electronic devices are not limited to those described above.
It should be appreciated that various embodiments of the present disclosure and the terms used therein are not intended to limit the technological features set forth herein to particular embodiments and include various changes, equivalents, or replacements for a corresponding embodiment. With regard to the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It is to be understood that a singular form of a noun corresponding to an item may include one or more of the things, unless the relevant context clearly indicates otherwise. As used herein, each of such phrases as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C,” may include any one of, or all possible combinations of the items enumerated together in a corresponding one of the phrases. As used herein, such terms as “1st” and “2nd,” or “first” and “second” may be used to simply distinguish a corresponding component from another, and does not limit the components in other aspect (e.g., importance or order). It is to be understood that if an element (e.g., a first element) is referred to, with or without the term “operatively” or “communicatively”, as “coupled with,” “coupled to,” “connected with,” or “connected to” another element (e.g., a second element), it means that the element may be coupled to the other element directly (e.g., wiredly), wirelessly, or via a third element.
As used in connection with various embodiments of the disclosure, the term “module” may include a unit implemented in hardware, software, or firmware, and may interchangeably be used with other terms, for example, “logic,” “logic block,” “part,” or “circuitry”. A module may be a single integral component, or a minimum unit or part thereof, adapted to perform one or more functions. For example, according to an embodiment, the module may be implemented in a form of an application-specific integrated circuit (ASIC).
Various embodiments as set forth herein may be implemented as software (e.g., the program 140) including one or more instructions that are stored in a storage medium (e.g., internal memory 136 or external memory 138) that is readable by a machine (e.g., the electronic device 101). For example, a processor (e.g., the processor 120) of the machine (e.g., the electronic device 101) may invoke at least one of the one or more instructions stored in the storage medium, and execute it, with or without using one or more other components under the control of the processor. This allows the machine to be operated to perform at least one function according to the at least one instruction invoked. The one or more instructions may include a code generated by a complier or a code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Wherein, the term “non-transitory” simply means that the storage medium is a tangible device, and does not include a signal (e.g., an electromagnetic wave), but this term does not differentiate between where data is semi-permanently stored in the storage medium and where the data is temporarily stored in the storage medium.
According to an embodiment, a method according to various embodiments of the disclosure may be included and provided in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or be distributed (e.g., downloaded or uploaded) online via an application store (e.g., PlayStore™), or between two user devices (e.g., smart phones) directly. If distributed online, at least part of the computer program product may be temporarily generated or at least temporarily stored in the machine-readable storage medium, such as memory of the manufacturer's server, a server of the application store, or a relay server.
According to various embodiments, each component (e.g., a module or a program) of the above-described components may include a single entity or multiple entities, and some of the multiple entities may be separately disposed in different components. According to various embodiments, one or more of the above-described components may be omitted, or one or more other components may be added. Alternatively or additionally, a plurality of components (e.g., modules or programs) may be integrated into a single component. In such a case, according to various embodiments, the integrated component may still perform one or more functions of each of the plurality of components in the same or similar manner as they are performed by a corresponding one of the plurality of components before the integration. According to various embodiments, operations performed by the module, the program, or another component may be carried out sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be executed in a different order or omitted, or one or more other operations may be added.
Number | Date | Country | Kind |
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10-2021-0088150 | Jul 2021 | KR | national |
This application is a by-pass continuation application of International Application No. PCT/KR2022/008330, filed on Jun. 13, 2022, which is based on and claims priority to Korean Patent Application No. 10-2021-0088150, filed on Jul. 5, 2021, in the Korean Intellectual Property Office, the disclosures of which are incorporated by reference herein their entireties.
Number | Date | Country | |
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Parent | PCT/KR2022/008330 | Jun 2022 | US |
Child | 18405796 | US |