Patent Application
20250007182
The present disclosure relates to an antenna module and a communication device including the antenna module.
An antenna module in may have an antenna disposed on each of two surfaces having different normal directions of a substrate bent in a housing. The antenna module can radiate radio waves in two directions from the substrate.
In the antenna module described above, the substrate is bent along two surfaces of the housing. Therefore, there is a concern that a feed wiring line leading to an antenna in the substrate may break at a bent portion of the substrate. In particular, as the bend angle of the substrate is more acute to effectively utilize the volume inside the housing, a risk of breakage of the feed wiring line becomes higher.
The present disclosure addresses the problem described above and enables radiation of radio waves in two directions while avoiding a risk of breakage of the feed wiring line.
An antenna module according to a first aspect of the present disclosure includes a first radiating element; a second radiating element, a substrate having a first main surface and a second main surface facing away from each other in which the first radiating element is disposed closer to the first main surface than to the second main surface, a first antenna disposition member in which the second radiating element is disposed, and a feed circuit that supplies a high-frequency signal to the first radiating element and the second radiating element. The first antenna disposition member has a first disposition surface on which the substrate is disposed and a first intersecting surface that intersects the first disposition surface. The second main surface and the first disposition surface are joined to each other, and a feed wiring line that electrically connects the first radiating element or the second radiating element to the feed circuit includes a wiring line that spans the substrate and the first antenna disposition member in a first joint portion between the second main surface and the first disposition surface.
The antenna module according to the present disclosure can radiate radio waves in two directions while avoiding a risk of breakage of the feed wiring line.
Embodiments of the present disclosure will be described in detail below with reference to the drawings. It should be noted that identical or equivalent components in the drawings are denoted by identical reference numerals to omit the description.
Referring to
The RFIC 110 and the PMIC 150 are sealed in a system-in-package (SiP) 150. The PMIC 150 manages a power system of the RFIC 110. The RFIC 110 and the PMIC 150 are examples of feed circuits.
The communication device 10 up-converts, into a high-frequency signal, the signal transmitted from the BBIC 200 to the antenna module 100 and radiates the up-converted signal through the antenna device 120, and down-converts the high-frequency signal received through the antenna device 120 and processes the down-converted signal by using the BBIC 200.
The antenna device 120 includes a dielectric substrate 130 and an antenna disposition member 140. A radiating element 131 is disposed in the dielectric substrate 130. A radiating element 141 is disposed in the antenna disposition member 140. The radiating elements 131 and 141 are patch antennas having a substantially square flat-plate shape. The radiating element 131 is an example of the first radiating element, and the radiating element 141 is an example of the second radiating element.
The antenna disposition member 140 including the radiating element 141 is formed by a 3D printer, for example. However, the antenna disposition member 140, and the radiating element 141 it includes, may also be formed by any other process as will be recognized by one of ordinary skill in the art.
The number of radiating elements 131 disposed in the dielectric substrate 130 may be one or not less than two. Similarly, the number of radiating elements 141 disposed in the antenna disposition member 140 may be one or not less than two.
The RFIC 110 includes switches 111A to 111H, 113A to 113H, 117A, and 117B, power amplifiers 112AT to 112HT, low-noise amplifiers 112AR to 112HR, attenuators 114A to 114H, phase shifters 115A to 115H, signal combining/dividing units 116A and 116B, mixers 118A and 118B, and amplification circuits 119A and 119B.
Of these components, a circuit including the switches 111A to 111D, 113A to 113D, and 117A, the power amplifiers 112AT to 112DT, the low-noise amplifiers 112AR to 112DR, the attenuators 114A to 114D, the phase shifters 115A to 115D, the signal combining/dividing unit 116A, the mixer 118A, and the amplification circuit 119A is for a high-frequency signal radiated from the radiating element 131.
A circuit including the switches 111E to 111H, 113E to 113H, and 117B, the power amplifiers 112ET to 112HT, the low-noise amplifiers 112ER to 112HR, the attenuators 114E to 114H, the phase shifters 115E to 115H, the signal combining/dividing unit 116B, the mixer 118B, and the amplification circuit 119B is for a high-frequency signal radiated from radiating element 141.
When a high-frequency signal is transmitted, the switches 111A to 111H and 113A to 113H are switched to the power amplifiers 112AT to 112HT, and the switches 117A and 117B are connected to transmission amplifiers of the amplification circuits 119A and 119B. When a high-frequency signal is received, the switches 111A to 111H and 113A to 113H are switched to the low-noise amplifier 112AR to 112HR, and the switches 117A and 117B are connected to reception amplifiers of the amplification circuits 119A and 119B.
The signal transmitted from the BBIC 200 is amplified by the amplification circuits 119A and 119B and is up-converted by the mixers 118A and 118B. The transmitted signal, which is the up-converted high-frequency signal, is divided into four by the signal combiner/splitter 116A and 116B, and the four divided signals pass through corresponding signal paths and are fed to different radiating elements 131 and 141, respectively. The directivity of each of radio waves output from the radiating elements of dielectric substrates can be adjusted by individually adjusting the phase shifts of the phase shifters 115A to 115H disposed in the respective signal paths.
The reception signals, which are high-frequency signals received by the radiating elements 131 and 141, are transmitted to the RFIC 110, pass through four different signal paths, and are combined by the signal combining/dividing units 116A and 116B. The combined reception signals are down-converted by mixers 118A and 118B, amplified by the amplification circuits 119A and 119B, and transmitted to the BBIC 200.
The RFIC 110 is formed as, for example, a single-chip integrated circuit component having the circuit structure described above. Alternatively, devices (switches, power amplifiers, low-noise amplifiers, attenuators, and phase shifters) corresponding to the radiating elements 131 and 141 of the RFIC 110 may be formed as a single-chip integrated circuit component for each of the corresponding radiating elements.
As illustrated in the drawing, the normal direction of the first main surface 11 of the dielectric substrate 130 is also referred to as a Z-axis direction, the longitudinal direction of the dielectric substrate 130 that is orthogonal to the Z-axis direction is also referred to as a Y-axis direction, and the direction orthogonal to the Y-axis direction and the Z-axis direction is also referred to as an X-axis direction. In addition, in the following description, the positive direction of the Z-axis may be referred to as an upper surface side and the negative direction of the Z-axis may be referred to as a lower surface side.
The radiating element 131 is disposed in the dielectric substrate 130. The radiating element 131 is disposed near the first main surface 11 so as to face the first main surface 11. It should be noted that
The antenna disposition member 140 is formed in a substantially L-shape in plan view in the X-axis direction. The antenna disposition member 140 includes a disposition surface 14 on which a portion of the second main surface 12 of the dielectric substrate 130 is disposed and an intersecting surface 15 that intersects the disposition surface 14. In the exemplary embodiment, the intersection angle between the disposition surface 14 and the intersecting surface 15 is 90 degrees. However, the intersection angle is not limited to this angle. The antenna disposition member 140 has a projecting portion 145 that projects in the Y-axis direction from the intersecting surface 15. The disposition surface 14 is formed on the upper surface side of the projecting portion 145.
The radiating element 141 is disposed in the antenna disposition member 140. It should be noted that
The antenna module 100 is formed by a portion of the second main surface 12 of the dielectric substrate 130 being disposed on the disposition surface 14 of the antenna disposition member 140. The disposition surface 14 of the antenna disposition member 140 is joined to a portion of the second main surface 12 of the dielectric substrate 130 by, for example, solder.
When a portion of the second main surface 12 of the dielectric substrate 130 is disposed on the disposition surface 14 of the antenna disposition member 140, the radiating element 131 and the radiating element 141 are disposed such that the direction of a radio wave radiated by the radiating element 131 differs from the direction of a radio wave radiated by the radiating element 141. In the antenna module 100, the intersecting surface 15 of the antenna disposition member 140 faces a side surface 13 of the dielectric substrate 130 with a gap therebetween.
Next, referring to
The antenna module 100 includes the dielectric substrate 130, the antenna disposition member 140, and the SiP 160. The dielectric substrate 130 includes the radiating element 131, and the antenna disposition member 140 includes the radiating element 141. The radiating element 131 is an example of the first radiating element, and the radiating element 141 is an example of the second radiating element.
The dielectric substrate 130 is, for example, a low-temperature co-fired ceramic (LTCC) multilayer substrate. The dielectric substrate 130 may be formed of a multilayer resin substrate including a plurality of laminated resin layers made of a resin, such as epoxy or polyimide.
The dielectric substrate 130 may also be formed of a multilayer resin substrate including a plurality of laminated resin layers made of a liquid crystal polymer (LCP) having a lower dielectric constant. The dielectric substrate 130 may also be formed of a multilayer resin substrate including a plurality of laminated resin layers made of fluororesin, a multilayer resin substrate including a plurality of laminated resin layers made of a polyethylene terephthalate (PET) material, or a multilayer ceramic substrate made of a non-LTCC material.
The dielectric substrate 130 need not necessarily have a multilayer structure and may be a single-layer substrate. A structure corresponding to the dielectric substrate 130 may be formed by a 3D printer. Of course, the structure corresponding to the dielectric substrate 130 may be formed by methods other than by a 3D printer as one of ordinary skill would recognize.
In plan view in the normal direction (the Z-axis direction), the dielectric substrate 130 has a substantially rectangular shape. The radiating element 131 is disposed in the dielectric substrate 130 so as to face the first main surface 11. The radiating element 131 may be exposed to a surface of the dielectric substrate 130.
The SiP 160 is joined to the second main surface of the dielectric substrate 130 via many solder bumps including solder bumps 31 and 32.
The antenna disposition member 140 is formed in a substantially L-shape in plan view in the X-axis direction. The radiating element 141 is disposed in the antenna disposition member 140 so as to face the intersecting surface 15. The radiating element 141 may be disposed so as to be exposed to the surface of the antenna disposition member 140.
The second main surface 12 of the dielectric substrate 130 is disposed on the disposition surface 14 of the antenna disposition member 140. The dielectric substrate 130 is joined to the antenna disposition member 140 by many bumps including solder bumps 33 and 34.
The intersecting surface 15 of the antenna disposition member 140 faces the side surface 13 of the dielectric substrate 130. A gap that forms an air layer is present between the intersecting surface 15 of the antenna disposition member 140 and a side surface 3 of the dielectric substrate 130.
The radiating element 131 in the dielectric substrate 130 and the radiating element 141 in the antenna disposition member 140 are disposed such that the normal directions of these radiating elements differ from each other. Accordingly, the radiation direction of a radio wave from the radiating element 131 and the radiation direction of a radio wave from the radiating element 141 differ from each other. Specifically, the radiating element 131 radiates a radio wave substantially in the Z-axis direction, and the radiating element 141 radiates a radio wave substantially in the Y-axis direction.
In plan view in a direction normal to the radiating element 141, at least a portion of the radiating element 141 is disposed at a position that overlaps the intersecting surface 15.
Since the dielectric substrate 130 is disposed on the disposition surface 14 of the antenna disposition member 140 with the second main surface 12 therebetween, the dielectric substrate 130 and the antenna disposition member 140 can be stably joined to each other with high strength. It should be noted that the dielectric substrate 130 may be combined with the antenna disposition member 140 such that the side surface 13 of the dielectric substrate 130 is in contact with the antenna disposition member 140. In this case, the side surface 13 of the dielectric substrate 130 may be joined to the antenna disposition member 140.
The radiating element 131 is connected to feed circuits, such as the RFIC 110 and the PMIC 150 in the SiP 160, by a feed wiring line 21a that extends from the solder bump 31.
The radiating element 141 is connected to a feed wiring line 22. The feed wiring line 22 is connected to a feed wiring line 21b leading to the SiP 160 via the solder bump 33. The feed wiring line 21b is connected to feed circuits, such as the RFIC 110 and the PMIC 150 in the SiP 160, through the solder bump 32. Accordingly, the feed wiring lines that electrically connect the radiating element 141 and the feed circuits (such as the RFIC 110 and the PMIC 150) include a wiring line that spans the dielectric substrate 130 and the antenna disposition member 140 at the solder bump 33, which is a joint portion between the second main surface 12 and the disposition surface 14. The solder bump 33 serves as a joint member that joins the dielectric substrate 130 and the antenna disposition member 140 to each other and also as a connection member that electrically connects the feed wiring lines 21b and 22 to each other.
A wiring line 25 connected to a ground electrode GND1 and a wiring line 26 connected to a ground electrode GND2 are electrically connected to each other by the solder bump 34 disposed between the second main surface 12 and the disposition surface 14. The solder bump 34 serves as a joint member that joins the dielectric substrate 130 and the antenna disposition member 140 to each other and also as a connection member that electrically connects the wiring lines 25 and 26 to each other.
The antenna module 100 disclosed in
In
In the conventional antenna module, a radiating element is disposed on each of substrate surfaces that face the display of the mobile information terminal and face the side surface of the mobile information terminal. Accordingly, in the conventional antenna module, there is a concern that a feed wiring line that passes through a bent portion of the substrate may break. In particular, a risk of wire breakage increases as the bending angle of the substrate approaches 90 degrees to effectively use the volume in the housing of the mobile information terminal.
Accordingly, in the antenna module 100 according to exemplary embodiment 1, without the dielectric substrate 130 being bent, the antenna disposition member 140 in which the radiating element 141 can be disposed along the direction of the side surface 13 is provided at a position that faces the side surface 13 of the dielectric substrate 130. In the antenna module 100 according to exemplary embodiment 1, to prevent the feed wiring line from being bent between the dielectric substrate 130 and the antenna disposition member 140, in a portion of a surface in which the dielectric substrate 130 comes into contact with the antenna disposition member 140 in a relatively wide range, the feed wiring line 21b on a side closer to the dielectric substrate 130 and the feed wiring line 22 on a side closer to the antenna disposition member 140 are connected to each other.
As a result, according to exemplary embodiment 1, it is possible to provide the antenna module 100 that can radiate radio waves in two directions while avoiding a risk of breakage of the feed wiring line.
In particular, the antenna module 100 according to exemplary embodiment 1 adopts a structure that considers reduction in the thickness of the mobile information terminal. When the antenna module 100 is applied to the mobile information terminal, the antenna disposition member 140 is disposed to face a side surface of the mobile information terminal. Accordingly, the dimension of the antenna disposition member 140 in the Z-axis direction need be reduced as the thickness of the mobile information terminal is reduced.
Accordingly, in the antenna module 100, the radiating element 141 in the antenna disposition member 140 is disposed at a position that faces the side surface 13 of the dielectric substrate 130. Here, it is assumed that the position of the radiating element 141 is further lowered in the Z-axis direction such that an upper portion of the radiating element 141 in the Z-axis direction is located below the second main surface 12 of the dielectric substrate 130. In this case, since the radiating element 141 is located below the second main surface 12 of the dielectric substrate 130, the radiating element 141 does not face the side surface 13 of the dielectric substrate 130. The dimension of the antenna disposition member 140 in the Z-axis direction need be increased to accommodate, in the antenna disposition member 140, the radiating element 141 disposed as described above. This means an increase in the thickness of the side surface of the antenna module.
However, as illustrated in
The antenna disposition member 140 including the entire circuit of the antenna disposition member 140 including the radiating element 141, the feed wiring line 22, and the wiring line 26 is formed by a 3D printer. Accordingly, the antenna disposition member 140 including the circuit of the antenna disposition member 140 can be designed with a relatively high degree of freedom.
In the conventional technology that arranges radiating elements by bending a flexible substrate, since the length of a wiring line becomes long depending on the bent portion, a wiring loss may increase. However, in exemplary embodiment 1, since the antenna disposition member 140 including wiring lines is formed by a 3D printer, wiring patterns in the antenna disposition member 140 can be further optimized.
As illustrated in
In the antenna module 100A according to exemplary embodiment 2, the distance between the radiating element 141 and the ground electrodes GND21 and GND22 can be further increased than the distance in the antenna module 100 according to exemplary embodiment 1. Accordingly, the band width of the radiating element 141 of the antenna module 100A according to exemplary embodiment 2 can be further improved than the band width in the antenna module 100 according to exemplary embodiment 1.
Here, the structures of the ground electrodes GND21 and GND22 will be described with reference to
In the antenna module 100B according to exemplary embodiment 3, a distance S1 between the side surface 13 of the dielectric substrate 130 and the antenna disposition member 140a is greater than that of the antenna module 100A according to exemplary embodiment 2.
In the antenna module 100B according to exemplary embodiment 3, the effective dielectric constant between the radiating element 141 and the ground electrodes GND21 and GND22 can be smaller than that of the antenna module 100A according to exemplary embodiment 2 by increasing the thickness of the air layer between the radiating element 141 and the ground electrodes GND21 and GND22. Therefore, in the antenna module 100B according to exemplary embodiment 3, the band width of the radiating element 141 can be wider than that of the antenna module 100A according to exemplary embodiment 2.
In the antenna module 100B according to exemplary embodiment 3, the distance S1 between the side surface 13 of the dielectric substrate 130 and the antenna disposition member 140a may be the same as that of the antenna module 100A according to exemplary embodiment 2. As a result, the length in the Y-axis direction can be smaller than that of the antenna module 100A according to exemplary embodiment 2.
In the antenna module 100C, the feed wiring line 21b and the feed wiring line 22 are electrically connected to each other by the anisotropic conductive member 40. In the antenna module 100C, the wiring line 25 and the wiring line 26 are electrically connected to each other by the anisotropic conductive member 40.
When the dielectric substrate 130 and the antenna disposition member 140 are joined to each other by the anisotropic conductive member 40, these components can be joined via a wide area instead of a point like a solder bump. As a result, in the antenna module 100C according to exemplary embodiment 4, the dielectric substrate 130 and the antenna disposition member 140 can be joined to each other by the anisotropic conductive member 40 with higher strength while conductivity between the dielectric substrate 130 and the antenna disposition member 140 is maintained.
In the antenna module 100D according to exemplary embodiment 5, the gap between adjacent solder bumps at the joint surface between the dielectric substrate 130 and the antenna disposition member 140 is filled with the underfill member 50 having high adhesiveness. As a result, in the antenna module 100D according to exemplary embodiment 5, the dielectric substrate 130 and the antenna disposition member 140 can be joined to each other with higher strength. In addition, in exemplary embodiment 5, the surface of the solder bump 33 that electrically connects the feed wiring lines 21b and 22 and the surface of the solder bump 34 that electrically connects the wiring lines 25 and 26 are covered with the underfill member 50. In exemplary embodiment 5, this can prevent reduction in the conductivity of the solder bumps 33 and 34 because the solder bumps 33 and 34 are in contact with air.
In the antenna module 100E according to exemplary embodiment 6, the different dielectric 60 with a dielectric constant that differs from that of the antenna disposition member 140 provided on the radiation surface of the radiating element 141 can increase the spread of the electric field lines of the radiating element 141. As a result, the band width of the radiating element 141 can be improved.
In the antenna module 100F according to exemplary embodiment 7, the spread of the electric field lines in the Z-axis direction of the radiating element 141 can be further increased than in the antenna module 100E according to exemplary embodiment 6. As a result, the band width of the radiating element 141 can be further improved.
In the antenna module 100G according to exemplary embodiment 8, a loss of power fed to the radiating element 141 can be smaller than in the antenna module 100 according to exemplary embodiment 1.
When the feed wiring line 22b and the feed wiring line 22d are connected to each other, as illustrated by a broken line in
However, when the feed wiring line 22b and the feed wiring line 22d are connected to each other, the feed wiring line 22c can be used to reduce the length of connection rather than use of the feed wiring lines 221c and 222c. As described above, in exemplary embodiment 9, the length of the feed wiring line can be reduced by use of the feed wiring lines extending diagonally. As a result, the antenna module 100H according to exemplary embodiment 9 can further reduce a loss of power fed to the radiating element 141 than the antenna module 100 according to exemplary embodiment 1.
It should be noted that the feed wiring line from the solder bump 33 to the radiating element 141 in
The feed wiring lines 22a to 22d including other components of the antenna disposition member 140 are formed by a 3D printer, but other methods may be used without departing from the scope of the present disclosure. Accordingly, the wiring directions of the feed wiring lines 22a to 22d including can be flexibly determined to, for example, diagonal directions.
The antenna disposition members 140b and 140c according to exemplary embodiment 10 have the same structure as the antenna disposition member 140 according to exemplary embodiment 1 with the exception of the outer shape.
As illustrated in
In exemplary embodiment 11, the radiating element 141 is connected to the feed circuits, such as the RFIC 110 and the PMIC 150 in the SiP 160, by a feed wiring line 23a extending from a solder bump 38.
The radiating element 131 is connected to the feed wiring line 24. The feed wiring line 24 is connected to a feed wiring line 23b leading to the SiP 160 via the solder bump 33. The feed wiring line 23b is connected to the feed circuits, such as the RFIC 110 and the PMIC 150 in the SiP 160, by the solder bumps 36. Accordingly, the feed wiring lines that electrically connect the radiating element 131 and the feed circuits (such as the RFIC 110 and the PMIC 150) includes a wiring line that spans the dielectric substrate 130 and the antenna disposition member 140 at the solder bump 33, which is a joint portion between the second main surface 12 and the disposition surface 14.
In the antenna module 100J according to exemplary embodiment 11, a space can be effectively utilized by a component other than the SiP 160 being disposed below the second main surface 12 of the dielectric substrate 130.
The antenna disposition member 140d differs from the antenna disposition member 140 in the outer shape and the angle of the radiating element 141 disposed to face the side surface 13 of the dielectric substrate 130. The direction normal to the radiating element 141 disposed in the antenna disposition member 140 is parallel to the Y-axis. The direction normal to the radiating element 141 disposed in the antenna disposition member 140d intersects the Y-axis. The antenna disposition member 140d has a surface 16 orthogonal to the direction normal to the radiating element 141.
The antenna module 100K according to exemplary embodiment 12 can radiate a radio wave diagonally upward (in a beam direction B1) of the first main surface 11 of the dielectric substrate 130 from the radiating element 141 of the antenna disposition member 140d.
The position of the radiating element 141 in the antenna disposition member 140e is obtained by the radiating element 141 in the antenna disposition member 140d being rotated approximately 90 degrees counterclockwise about the X-axis. The antenna disposition member 140e has a surface 17 orthogonal to the direction normal to the radiating element 141. The angle formed by the disposition surface 14 of the antenna disposition member 140e and the intersecting surface 15 is an obtuse angle greater than 90 degrees.
The antenna module 100L according to exemplary embodiment 13 can radiate a radio wave diagonally downward (in a beam direction B2) of the second main surface 12 of the dielectric substrate 130 from the radiating element 141 of the antenna disposition member 140e.
In the antenna module 100B according to exemplary embodiment 3, in plan view of the dielectric substrate 130 in the X-axis direction, the ground electrode GND21 on the side closer to the dielectric substrate 130 and the ground electrode GND22 on the side closer to the antenna disposition member 140 are disposed on a straight line along the Z-axis. In the antenna module 100M according to exemplary embodiment 14, in plan view of the dielectric substrate 130 in the X-axis direction, the ground electrode GND21 on the side closer to the dielectric substrate 130 and the ground electrode GND22 on the side closer to the antenna disposition member 140 are not disposed on the same straight line along the Z-axis but deviate from each other in the Y-axis direction.
That is, in exemplary embodiment 14, the ground electrode GND21 and the ground electrode GND22 are connected to the solder bump 35 at positions at which a distances S11 between the radiating element 141 and the ground electrode GND21 differs from a distance S12 between the radiating element 141 and the ground electrode GND22.
In particular, in exemplary embodiment 14, the distance S11 between the radiating element 141 and the ground electrode GND22 is greater than the distance S12 between the radiating element 141 and the ground electrode GND21.
In exemplary embodiment 14, the asymmetry of the distance between the radiating element 141 and the ground electrode GND21 enables a radio wave to be radiated in a beam direction B3 from the radiating element 141. As described above, since the direction of a radio wave radiated from the radiating element 141 can be inclined toward the mounting surface of the SiP 160 in exemplary embodiment 14, the coverage of the entire antenna module 100M can be extended.
In exemplary embodiment 15, the asymmetry of the distance between the radiating element 141 and the ground electrode GND21 enables a radio wave to be radiated in a beam direction B4 from the radiating element 141. As described above, in exemplary embodiment 14, the direction of a radio wave radiated from the radiating element 141 can be inclined toward the first main surface 11, which is opposite to the mounting surface of the SiP 160. As a result, in exemplary embodiment 14, precise beam steering in the direction of the first main surface 11 (upper direction) can be performed in conjunction with the radiating element 131 mounted on the side closer to the dielectric substrate 130.
In the antenna module 100P according to exemplary embodiment 16, a portion of the structure of the antenna module 100B according to exemplary embodiment 3 has been changed. Specifically, the radiating element 141 of the antenna module 100P according to exemplary embodiment 16 faces the side surface 13 of the dielectric substrate 130 on the side closer to the lower surface of the antenna disposition member 140 than does the radiating element 141 of the antenna module 100B according to exemplary embodiment 3.
As a result, as illustrated in
The ground electrode GND21 is formed in a mesh pattern by combining many vias 91 and many flat electrodes 92. On the other hand, the ground electrode GND22 is formed of a solid flat plate. Accordingly, the effective conductivity of the ground electrode GND21 is lower than the effective conductivity of the ground electrode GND22. Accordingly, by eccentrically positioning the center of the radiating element 141 toward the ground electrode GND22, the ratio of a portion of the ground electrode GND22 having a high conductivity used as the ground electrode of the radiating element 141 can be increased. As a result, the radiation efficiency in exemplary embodiment 16 can be further increased than in exemplary embodiment 3.
In the antenna module 100R according to exemplary embodiment 17, the thickness of an antenna disposition member 140f is reduced by reversing the disposition between the radiating element 141 and the ground electrodes GND21 and GND22 of the antenna module 100P according to exemplary embodiment 16.
As illustrated in
It will be appreciated that the structures in exemplary embodiments 14 to 17 are also applicable to exemplary embodiment 2 in which the distances between the radiating element 141 and the ground electrodes GND21 and 22 are smaller than those in exemplary embodiment 3.
Modification 1 will be described with reference to
In the present disclosure, any two or any three or more of the exemplary embodiments described above may be combined with each other. For example, the structure in exemplary embodiment 2 is applicable to any exemplary embodiments subsequent to exemplary embodiment 3.
The exemplary embodiments disclosed here should be considered as illustrative and not restrictive in any way. The scope of the present disclosure is indicated by the appended claims not by the description of the exemplary embodiments described above and is intended to include all changes within the meaning and the scope equivalent to the appended claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2022-022338 | Feb 2022 | JP | national |
This application is a continuation of international application no. PCT/JP2022/040889, filed Nov. 1, 2022, and which claims priority to Japanese application no. 2022-022338, filed Feb. 16, 2022. The entire contents of both prior applications are hereby incorporated by reference.
| Number | Date | Country | |
|---|---|---|---|
| Parent | PCT/JP2022/040889 | Nov 2022 | WO |
| Child | 18793992 | US |
