1. Field of the Invention
The invention relates to an antenna module and a manufacturing method thereof, and more particularly to an antenna module fixed via mechanical coupling and a manufacturing method thereof.
2. Description of the Related Art
A conventional antenna module comprises an antenna, an electronic element, and a plastic assembly. The electronic element may be a printed circuit board, a cable or another antenna. The antenna is electrically connected to the electronic element by soldering or adhesive. Then, the antenna and the electronic element are covered by a plastic assembly via injection molding for protecting the inner elements thereof. The above-mentioned steps form the antenna module.
During injection molding, high temperature and high pressure are generated. The soldering and adhesive areas on the antenna, which can not bear the high temperatures and high pressures are melted and then sealed off, resulting in an imperfect contact or no signal. Thus, the conventional antenna has low manufacturing yields.
The invention provides an antenna module comprising an electronic element, a first antenna and a connecting element. The first antenna comprises a first hole. The connecting element comprises a first connecting portion, a first propping portion and a second connecting portion. The first connecting portion passes through the first hole and is fixed to the first antenna by the first propping portion for fixation. The second connecting portion is electrically connected to the electronic element.
The invention further provides a manufacturing method of an antenna. The steps comprise: providing an antenna, and the antenna comprising a first hole; providing a connecting element with a first connecting portion and a second connecting portion; inserting the first connecting portion into the first hole; bending the first connecting portion to form a first propping portion for fixing the first connecting portion in the first hole; connecting the second connecting portion to the electronic element; and packaging the first antenna, the connecting element and the electronic element via injection molding.
The invention can be more fully understood by reading the subsequent detailed description and examples with references made to the accompanying drawings, wherein:
Referring to
Referring to
Note that soldering and adhesive areas on the antenna can not bear high temperatures and high pressures. Thus, if the electronic element 11 is a second antenna (not shown), the electronic element 11 is assembled with the first antenna by the fixing method such as the method that the first connecting portions 131a and 131b are connected to the first antenna 12. If the electronic element 11 is a second antenna, the electronic element 11 would not be soldered or adhered by the adhesive for connection to the second connecting portion 132.
Referring to
Because soldering and adhesive areas on the antenna can not bear high temperatures and high pressures generated by injection molding, the invention provides a connecting element 14 to connect the first antenna 12 to the electronic element 11 to avoid the soldering and the adhesive areas to be melted or sealed off. Thus, manufacturing yields effectively increases.
While the invention has been described by way of example and in terms of the preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments. To the contrary, it is intended to cover various modifications and similar arrangements (as would be apparent to those skilled in the art). Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.
Number | Date | Country | Kind |
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97201378 | Jan 2008 | TW | national |