The present disclosure relates to an antenna package structure.
Radiation loss from an antenna will increase with operating frequency of the electromagnetic signal. Given that a high-frequency electromagnetic signal is transmitted in 5G and 6G frequency bands, to increase the gain of the antenna, emission power of the antenna must be increased commensurately. However, this can cause overheating of the antenna, and with it chances of failure of the antenna. Current techniques dispose a frequency selective surface (FSS) in the antenna to improve the antenna gain and reduce possible overheating. However, when a high-frequency antenna and a low-frequency FSS are set in the same antenna package, the high-frequency FSS can interfere with low-frequency signals, and the low-frequency FSS can interfere with high-frequency signals. If the distance between the high-frequency FSS and the low-frequency FSS is extended to avoid such interference, miniaturization efforts for the antenna package are compromised.
In one aspect of the present disclosure, an antenna package structure is provided, which includes a first antenna and a first frequency selective surface structure. The first frequency selective surface structure is disposed above the first antenna, and includes a plurality of first patterns and a plurality of second patterns geometrically distinct from the plurality of the first patterns. The plurality of first patterns and the plurality of second patterns are configured to enhance gain and directivity of the first antenna.
In another aspect of the present disclosure, an antenna package structure is provided, which includes a first antenna and a first frequency selective surface structure. The first frequency selective surface structure is disposed above the first antenna, and includes a first group and a second group. The first group has a plurality of first patterns, and is configured to electrically couple to the first antenna. The second group has a plurality of second patterns. A combination of a portion of the plurality of second patterns is configured to be substantially equal to one of the plurality of first patterns, and is electrically coupled to the first antenna.
In yet another aspect of the present disclosure, an antenna package structure is provided, which includes a first antenna, configured to operate in a first frequency; a second antenna, configured to operate in a second frequency higher than the first frequency; and a frequency selective surface structure disposed above the first antenna and the second antenna, and comprising a plurality of first patterns electrically coupled to the first antenna and the second antenna.
Aspects of some embodiments of the present disclosure are best understood from the following detailed description when read with the accompanying figures. It is noted that various structures may not be drawn to scale, and dimensions of the various structures may be arbitrarily increased or reduced for clarity of discussion.
The following disclosure provides many different embodiments, or examples, for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to explain certain aspects of the present disclosure. These are, of course, merely examples and are not intended to be limiting. For example, the formation of a first feature over or on a second feature in the description that follows may include embodiments in which the first and second features are formed or disposed in direct contact, and may also include embodiments in which additional features may be formed or disposed between the first and second features, such that the first and second features may not be in direct contact. In addition, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.
Spatial descriptions, such as “above,” “below,” “up,” “left,” “right,” “down,” “top,” “bottom,” “vertical,” “horizontal,” “side,” “higher,” “lower,” “upper,” “over,” “under,” and so forth, are indicated with respect to the orientation shown in the figures unless otherwise specified. It should be understood that the spatial descriptions used herein are for purposes of illustration only, and that practical implementations of the structures described herein can be spatially arranged in any orientation or manner, provided that the merits of embodiments of this disclosure are not deviated from by such arrangement.
The term “layer” as used herein refers to a portion of material comprising a region having a certain thickness. A layer may extend across the entire underlying or superstructure, or may have an extent that is less than the extent of the underlying or superstructure. In addition, a layer may be a region of a homogeneous or heterogeneous continuous structure, the thickness of which is less than that of the continuous structure. For example, a layer may be located between the top and bottom surfaces of the continuous structure or between any pair of horizontal planes therebetween. Layers may extend horizontally, vertically and/or along the tapered surface. A substrate can be one layer, can include one or more layers therein, and/or can have one or more layers thereon, above, and/or below. A layer can include multiple layers. For example, a semiconductor layer may comprise one or more doped or undoped semiconductor layers, and may be of the same or different materials.
It should be noted that the structures, proportions, sizes, etc. shown in the drawings of the specification are only used to match the content recorded in the specification for the understanding and reading of those skilled in the art, and are not used to limit the implementation of this application, so it has no technical substantive meaning. Any modification of structure, change of proportional relationship or adjustment of size, without affecting the effect and purpose of this application, should still fall within the scope of this application. The disclosed technical content must be within the scope covered. At the same time, terms such as “above”, “first”, “second” and “one” quoted in this specification are only for the convenience of description and are not used to limit the scope of implementation of this application. The change or adjustment of the relative relationship shall also be regarded as the implementable scope of the present application without substantive change in the technical content.
It should also be noted that the longitudinal section corresponding to the embodiments of the present application can be a section corresponding to the front view direction, the transverse section can be a section corresponding to the right view direction, and the horizontal section can be a section corresponding to the direction of the top view.
In some embodiments, the antenna package structure 100 may be or include, for example, an antenna device or an antenna package. In some embodiments, the antenna package structure 100 may be or include, for example, a wireless device, such as user equipment (UE), a mobile station, a mobile device, an apparatus communicating with the Internet of Things (IoT), and others. In some embodiments, the antenna package structure 100 may support fifth generation (5G) communications, such as sub-6 GHz frequency bands and/or millimeter (mm) wave (mmWave) frequency bands. For example, the antenna package structure 100 may incorporate both sub-6 GHz devices and mmWave devices. In some embodiments, the antenna package structure 100 may support beyond-5G or 6G communications, such as terahertz (THz) frequency.
In an embodiment, the antenna package structure 100 may include an electromagnetic wave focusing structure 110 and a substrate 122. The electromagnetic wave focusing structure 110 may include a first dielectric element 112 and a second dielectric element 114. In some embodiments, the first dielectric element 112 and the second dielectric element 114 may be a first dielectric layer and a second dielectric layer, respectively.
The substrate 122 may be coupled to the second dielectric element 114 through a conductive layer 124. The substrate 122 may be a substrate composed of conductive material and dielectric material. Here, the dielectric material may include organic and/or inorganic substances, wherein the organic substances may be, for example, polyamide (PA) fiber, polyimide (PI), epoxy resin, poly-p-phenylene benzobisoxazole (PBO) fiber, FR-4 epoxy glass cloth laminate, prepreg (PP) (or semi-cured resin), Ajinomoto Build-up Film (ABF), etc. The inorganic substances may be, for example, Si, glass, ceramics, silicon oxide, silicon nitride, tantalum oxide, etc. The conductive material may include a seed layer and a conductive layer. Here, the seed layer can be, for example, titanium (Ti), tungsten (W), nickel (Ni), etc., while the conductive layer can be a metal layer such as gold (Au), silver (Ag), aluminum (Al), nickel (Ni), palladium (Pd), copper (Cu) or alloys thereof.
In some embodiments, the first dielectric element 112 and the second dielectric element 114 have a first elevation and a second elevation with respect to the substrate 122, with the first elevation higher than the second elevation. In some embodiments, the first dielectric element 112 and the second dielectric element 114 can be implemented by different dielectric materials as described here. It should be noted that a first dielectric constant (Dk1) of a first dielectric material of the first dielectric element 110 may be greater than a second dielectric constant (Dk2) of a second dielectric material of the second dielectric element 114.
In some embodiments, the first dielectric constant (e.g. Dk1) of the first dielectric material of the first dielectric element 112 is greater than the second dielectric constant (e.g., Dk2) of the second dielectric material of the second dielectric element 114. For example, the ranges of the first dielectric constant (e.g., Dk1) and the second dielectric constant (e.g., Dk2) can be as shown in formulae (1) and (2) as follows.
7≤Dk1≤100 (1)
1≤Dk2≤5 (2)
In addition, the first dielectric element 112 is substantially parallel to the second dielectric element 114. The thickness (i.e., heights) of the first dielectric element 112 and the second dielectric element 114 may be expressed as h1 and h2, respectively. The range of the thickness h2 can be expressed by formula (3) as follows.
0.1λg≤h2≤1λg (3)
wherein Δg denotes the wavelength in the medium for the operating frequency. In this case, the medium refers to the second dielectric material of the second dielectric element 114. The thickness h1 of the first dielectric element 112 is not particularly limited, and an appropriate thickness can be used.
As shown in
In the first group 150, the plurality of patterns 1111 are equally spaced apart in a first two-dimensional array so as to match a first operating frequency of the antennas 132. In addition, the size of the patterns 1111 and the gap between neighboring patterns 1111 correspond to the first operating frequency of the antennas 132. In the second pattern, the plurality of patterns 1112 are equally spaced apart in a second two-dimensional array so as to match a second operating frequency of the antennas 130. In addition, the size of the patterns 1112 and the gap between neighboring patterns 1112 correspond to the second operating frequency of the antennas 130.
For example, the first operating frequency of the antennas 132 may be lower than the second operating frequency of the antenna 130. In some embodiments, the antennas 132 and 130 can be regarded as low-band antennas and high-band antennas, respectively. In addition, the number of patterns 1111 is less than the number of patterns 1112 within a given unit area. In other words, the density of the patterns 1111 in the first group 150 is lower than that of the patterns 1112 in the second group 152. In addition, a total area of a predetermined number of the patterns 1112 is equal to an area of one of the first patterns 1111, and the predetermined number is an integer greater than one.
More specifically, the frequency selective surface is a thin, repetitive surface designed to reflect, transmit, or absorb electromagnetic fields based on the frequency of the field. In some embodiments, the patterns 1111 and the patterns 1112 may be square, hexagonal, circular, square, hexagonal loop, circular loop, anchor, or other, depending on practical needs of the antenna package structure 100, and the present disclosure is not limited thereto. In some embodiments, the frequency selective surface 111 may be implemented by a conductive layer with a plurality of first apertures and a plurality of second apertures, where the arrangement of the first apertures and second apertures is designed so that the resonant frequency of the first apertures and second apertures (i.e., FSS elements) matches the operating frequencies of the electromagnetic wave emitted from the antennas 130 and 132, respectively. For purposes of description, the patterns 1111 and patterns 1112 are square patches of different sizes.
In some embodiments, the antennas 132 and 130 may be included in the conductive layer 124, and each of the antennas 132 may refer to a standalone antenna or a plurality of antennas (e.g., patch antennas) arranged in a first antenna pattern (e.g., a first two-dimensional array, not shown in
In some embodiments, the geometric shape of a predetermined number of the patterns 112 may be substantially equal to the geometric shape of one first pattern 1111. The predetermined number may be two, four, or other numbers, but the present disclosure is not limited thereto. For purposes of description, the geometric shape of four second patterns 1112 arranged in a 2×2 array may be substantially equal to the geometric shape of one first pattern 1111. In some embodiments, the geometric center of the second group 152 may be located at point 161, as shown in
In
In
In some embodiments, for brevity, the size of one first pattern 1111 (e.g., a larger square patch) may be four times the size of one second pattern 1112 (e.g., a smaller square patch), but the present disclosure is not limited thereto. In other words, the size of four patterns 1112 arranged in a 2×2 array is substantially equal to the size of one first pattern 1111. Since the antenna 132 has a lower operating frequency, it indicates that the wavelength of the electromagnetic wave emitted by the antenna 132 is longer. As such, the gap between two neighboring patterns 1112 can be neglected in comparison with the relatively longer wavelength of the electromagnetic wave emitted by the antenna 132, and the second group 152 of the patterns 1112 can have resonance with the electromagnetic wave (i.e., a lower operating frequency) emitted by the antenna 132 in addition to the resonance with the electromagnetic wave (i.e., a higher operating frequency) emitted by the antenna 130.
Specifically, the size of the patterns 1111 and the gap between neighboring patterns 1111 in the first group 150 are designed to enhance the gain of the antenna 132. In addition, the second group 152 of the patterns 1112 can be resonant to the operating frequency of the electromagnetic wave emitted by the antenna 132, the gain of the antenna 132 (e.g., first antenna pattern) can be enhanced by the second group 152 of the patterns 1112. In other words, the first group 150 and the second group 152 can enhance gain of the antenna 132 (e.g., first antenna pattern). In addition, due to the design of the electromagnetic wave focusing structure 110 which includes two dielectric elements of different dielectric constants (i.e., the upper dielectric element has a higher dielectric constant, and the lower dielectric element has a lower dielectric constant) as shown in
In another aspect of the present disclosure, the size of the patterns 1112 and the gap between neighboring patterns 1112 in the second group 152 are designed to enhance gain of the antennas 130 (e.g., second antenna pattern). In addition, the second group 152 of the patterns 1112 can be resonant to the operating frequency of the electromagnetic wave emitted by the antenna 132, and thus gain of the antenna 132 (e.g., first antenna pattern) can be enhanced by the second group 152 of the patterns 1112. In other words, the second group 152 of the patterns 1112 can enhance gain of the antenna 132 (e.g., first antenna pattern) and antenna 130 (e.g., second antenna pattern). Similarly, due to the design of the electromagnetic wave focusing structure 110 which includes two dielectric elements of different dielectric constants (i.e., the upper dielectric element has a higher dielectric constant, and the lower dielectric element has a lower dielectric constant) as shown in
The antenna package structure 200 shown in
Specifically, the size of the patterns 1142 and the gap between neighboring patterns 1142 may be similar to those of the patterns 1112. In addition, the direction 206 of the electromagnetic wave emitted by the antenna 132 may target the third group 154 of the patterns 1142, and thus the third group 154 of the patterns 1142 can be resonant to the operating frequency of the electromagnetic wave emitted by the antenna 132 as the second group 152 described in the embodiment of
In some embodiments, the third group 154 is substantially equal to the second group 152, and the range of the second group 152 may cover the range of the third group 154 from the top view of the antenna package structure 200 (not shown). In addition, each of the patterns 1142 of the third group 154 may substantially align with each of the patterns 1112 of the second group 152. Alternatively, the patterns 1142 of the third group 154 and the patterns 1112 of the second group 152 may be arranged in an interleaved fashion from the top view, depending on practical needs.
Similarly, due to the design of the electromagnetic wave focusing structure 110 which includes two dielectric elements of different dielectric constants (i.e., the upper dielectric element has a higher dielectric constant, and the lower dielectric element has a lower dielectric constant) as shown in
The antenna package structure 300 shown in
The first electromagnetic wave focusing structure 110a includes a first dielectric element 112 and a second dielectric element 114. The second electromagnetic wave focusing structure 110b includes a third dielectric element 133 and a fourth dielectric element 134. For example, the patterns 1111 and 1112 are disposed on the top surface 1121 of the first dielectric element 112, and arranged in the first group 150 and the second group 152, similar to the electromagnetic wave focusing structure 110 in
A plurality of patterns 1322 are disposed on a top surface 1321 of the third dielectric element 133, and arranged in a third pattern. Thus, two sets of patterns (e.g., patterns 1112 and 1322) are disposed above the antennas 130. In addition, the third dielectric constant (Dk3) of the third dielectric material of the third dielectric element 133 is greater than the fourth dielectric constant (Dk4) of the fourth dielectric material of the fourth dielectric element 134. Furthermore, the second dielectric constant (Dk2) of the second dielectric material of the second dielectric element 114 is greater than or equal to the third dielectric constant (Dk3) of the third dielectric material of the third dielectric element 133. Therefore, the relationships between the first dielectric constant (Dk1), second dielectric constant (Dk2), third dielectric constant (Dk3), and fourth dielectric constant (Dk4) can be expressed by formula (1) as follows.
Dk4<Dk3≤Dk2<Dk1 (1)
Specifically, a dielectric element at a relatively low position may have a relatively low dielectric constant, and the electromagnetic wave emitted by the antenna 132 or 130 may travel from one dielectric element having a lower dielectric constant to another dielectric element having a higher dielectric constant. Thus, the electromagnetic wave is refracted by the dielectric element having a greater dielectric constant, and the refracted electromagnetic wave becomes closer to the normal of the boundary between these two dielectric elements of different dielectric constants. Therefore, the electromagnetic wave emitted by the antenna 132 or 130 can be focused by the electromagnetic wave focusing structure 110′ in the antenna package structure 300, thereby enhancing the directivity of the antennas 132 and 130. In some embodiments, the first electromagnetic wave focusing structure 110a and the second electromagnetic wave focusing structure 110b may be referred to as a first dielectric structure and a second dielectric structure, respectively, and a first equivalent dielectric constant of the first electromagnetic wave focusing structure 110a is greater than a second equivalent dielectric constant of the second electromagnetic wave focusing structure 110b.
It should be noted that the lower portion of the antenna package structure 300 in
Regarding the antenna 132, there is one resonant cavity 363 defined by the patterns 1111 and the substrate 122, and the low-frequency electromagnetic wave emitted by the antenna 132 can be enhanced by the resonant cavity 363.
Specifically, the size of the patterns 1322 and the gap between neighboring patterns 1322 may be similar to those of the patterns 1112. In addition, the direction 306 of the electromagnetic wave emitted by the antenna 132 may target the third group 154 of the patterns 1322, and thus the third group 154 of the patterns 1322 can be resonant to the operating frequency of the electromagnetic wave emitted by the antenna 132 as the second group 152 described in the embodiment of
In some embodiments, the third group 154 is substantially equal to the second group 152, and the range of the second group 152 may cover the range of the third group 154 from the top view of the antenna package structure 300 (not shown). In addition, each of the patterns 1322 of the third group 154 may be substantially aligned with each of the patterns 1112 of the second group 152. Alternatively, the patterns 1322 of the third group 154 and the patterns 1112 of the second group 152 may be arranged in an interleaved fashion from the top view, depending on practical needs.
Similarly, due to the electromagnetic wave focusing structure 110 including two dielectric elements of different dielectric constants (i.e., the upper dielectric element has a higher dielectric constant, and the lower dielectric element has a lower dielectric constant) as shown in
Please refer to
The first dielectric element 112 and the second dielectric element 114 in
Dk2<Dk3<Dk1 (2)
Therefore, the antenna package structure 400A in
Please refer to
Therefore, the antenna package structure 400B in
Please refer to
In addition, the dielectric constants (e.g., Dk1, Dk2, Dk4, and Dk3) of the dielectric elements 112, 116, 118, and 117 from top to bottom are decreased. In other words, the first dielectric constant (Dk1) of the first dielectric element 112 (i.e., the topmost dielectric element) is the highest among these dielectric constants, and the third dielectric constant (Dk3) of the third dielectric element 117 (i.e., the bottom dielectric element) the lowest. Specifically, a dielectric element at a relatively low position may have a relatively low dielectric constant, and the electromagnetic wave emitted by the antenna 132 or 130 may travel from one dielectric element having a lower dielectric constant to another dielectric element having a higher dielectric constant. It should be noted that electromagnetic wave emitted by the antennas 130 may travel through the dielectric elements 117, 118, 116, and 112 in sequence while the electromagnetic wave emitted by the antenna 132 may travel through the dielectric elements 117, 116, and 112 in sequence.
Specifically, the electromagnetic wave is refracted by the dielectric element having a greater dielectric constant, and the refracted electromagnetic wave moves closer to the normal of the boundary between these two dielectric elements of different dielectric constants. Therefore, the electromagnetic wave emitted by the antenna 132 or 130 can be focused by the electromagnetic wave focusing structure 110 in the antenna package structure 400C, thereby enhancing the directivity of the antennas 132 and 130. Moreover, the antenna package structure 400C in
The antenna package structure 500 in
The top view in
More specifically, the antenna package structures described in the embodiments of
While the present disclosure has been described and illustrated with reference to specific embodiments thereof, these descriptions and illustrations do not limit the present disclosure. It should be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the true spirit and scope of the present disclosure as defined by the appended claims. The illustrations may not be necessarily drawn to scale. There may be distinctions between the artistic renditions in the present disclosure and the actual apparatus due to manufacturing processes and tolerances. There may be other embodiments of the present disclosure which are not specifically illustrated. The specification and drawings are to be regarded as illustrative rather than restrictive. Modifications may be made to adapt a particular situation, material, composition of matter, method, or process to the objective, spirit and scope of the present disclosure. All such modifications are intended to be within the scope of the claims appended hereto. While the methods disclosed herein have been described with reference to particular operations performed in a particular order, it will be understood that these operations may be combined, sub-divided, or re-ordered to form an equivalent method without departing from the teachings of the present disclosure. Accordingly, unless specifically indicated herein, the order and grouping of the operations are not limitations of the present disclosure.