The present disclosure relates to an antenna structure and an antenna array structure.
In recent years, commercial services by fifth generation (5G) mobile communication systems have been started, and it is expected to further accelerate sophistication of multimedia services and provide new value as a basic technology that supports industries and society.
5G is a mobile communication system that handles high frequency bands such as millimeter waves exceeding 10 GHz. As a transmission and reception antenna, a patch antenna (microstrip antenna), which is a type of planar antenna including a dielectric substrate, radiation elements with wiring formed on both surfaces of the dielectric substrate, and a ground conductor plate as components, is generally used.
Furthermore, in order to obtain a desired radiation directionality (radiation pattern), a multi-element antenna array is often used in which a plurality of patch antennas are regularly arrayed in a straight line or in a plane. The multi-element antenna array enables large-capacity communication. An antenna element such as a patch antenna is connected to various signal processing circuits and power feeding circuits to constitute an antenna structure (antenna module). Then, the antenna structure is housed in a housing such as a case or a cover, and is practically used as an antenna unit for communication.
For example, PTL 1 discloses an antenna structure and an antenna unit configured by an antenna element part and a circuit part that amplifies an electric signal converted by the antenna element part.
In PTL 1, the antenna element part and the circuit part are configured separately from each other, connected to each other by a cable, and disposed side by side and housed in an external case, thereby configuring an antenna unit.
In recent years, an antenna structure including a plurality of antenna elements is used to cope with large-capacity communication, but since an installation place thereof is limited, there is an increasing demand for downsizing of the antenna structure.
Therefore, for example, PTL 2 discloses an antenna structure for realizing downsizing of an antenna device. The antenna structure of PTL 2 includes a ground conductor, an antenna element part formed on an upper surface of the ground conductor via a first dielectric substrate, and a circuit part including a circuit pattern formed on a lower surface of the ground conductor via a second dielectric substrate, a circuit component to be mounted, and the like.
PTL 1: Unexamined Japanese Utility Model Publication No. H06-041220
PTL 2: Unexamined Japanese Patent Publication No. H06-152237
An antenna structure according to one aspect of the present disclosure includes: an antenna board including a first surface and a second surface that is opposite to the first surface; a plurality of patch antenna elements arrayed on the first surface of the antenna board; a feeding electrode formed on the second surface of the antenna board and electrically connected to each of the plurality of patch antenna elements; a power supply control board that is disposed away from the second surface of the antenna board, extends in a direction intersecting the second surface of the antenna board, and includes a third surface and a fourth surface that is opposite to the third surface; and a connection member disposed on a side of the second surface of the antenna board and on at least one of the third surface and the fourth surface of the power supply control board, the connection member electrically connecting the feeding electrode and the power supply control board, in which the power supply control board includes a connection terminal, and the connection member includes: a body having an insulation property; an electrode part formed on a surface of the body; a first joint that joins the electrode part and the feeding electrode by metal joining; and a second joint that joins the electrode part and the connection terminal by metal joining.
In the structure of the antenna structure of PTL 1, both the antenna element part and the circuit part are provided in a planar direction. In the configuration in which an area where the antenna element part and the circuit part are provided together is secured in the planar direction, it is difficult to downsize the device.
Furthermore, the overall size of the antenna structure is determined by the mounting area of the circuit component mounted on a surface opposite to a surface of the dielectric substrate on which the antenna element part is disposed. For this reason, in the structure of the antenna structure disclosed in PTL 2, even if the antenna element is downsized, it is difficult to realize a small antenna structure having a mounting area less than or equal to the mounting area of the circuit component.
Furthermore, even in a case where a plurality of the antenna elements is arranged to form an antenna array structure, since an interval at which the antenna elements are arranged is restricted by the mounting area of the circuit component mounted on the opposite surface side of the dielectric substrate from the surface on which the antenna element part is disposed, it is difficult to realize an antenna array structure in which a plurality of small antenna elements is arranged by narrow adjacent mounting.
Therefore, an object of the present disclosure is to provide an antenna structure that facilitates downsizing of an antenna device.
According to a first aspect of the present disclosure, provided is an antenna structure including: an antenna board including a first surface and a second surface that is opposite to the first surface; a plurality of patch antenna elements arrayed on the first surface of the antenna board; a feeding electrode formed on the second surface of the antenna board and electrically connected to each of the plurality of patch antenna elements; a power supply control board that is disposed away from the second surface of the antenna board, extends in a direction intersecting the second surface of the antenna board, and includes a third surface and a fourth surface that is opposite to the third surface; and a connection member disposed on a side of the second surface of the antenna board and on at least one of the third surface and the fourth surface of the power supply control board, the connection member electrically connecting the feeding electrode and the power supply control board, in which the power supply control board includes a connection terminal, and the connection member includes: a body having an insulation property; an electrode part formed on a surface of the body; a first joint that joins the electrode part and the feeding electrode by metal joining; and a second joint that joins the electrode part and the connection terminal by metal joining.
According to this aspect, it is possible to provide an antenna structure that facilitates downsizing of an antenna device.
According to a second aspect of the present disclosure, there is provided the antenna structure according to the first aspect, in which the connection member includes: a first connection member disposed on the third surface of the power supply control board; and a second connection member that is disposed on the fourth surface of the power supply control board and faces the first connection member with a gap between the first connection member and the second connection member, and the power supply control board includes an end disposed in the gap.
A third aspect of the present disclosure provides the antenna structure according to the second aspect, in which the gap has a width L in a direction in which the first connection member, the second connection member are arranged, and the power supply control board has a thickness T, (T+0.05 mm)<L<(T+1 mm) is satisfied.
According to a fourth aspect of the present disclosure, there is provided the antenna structure according to the first or second aspect, in which the connection member is disposed along a direction in which the plurality of patch antenna elements is arrayed.
A fifth aspect of the present disclosure provides the antenna structure according to the first or second aspect, in which the body of the connection member contains a resin material, and the resin material includes any one of LCP, PPA, ABS, PEEK, and PC.
A sixth aspect of the present disclosure provides the antenna structure according to the first or second aspect, in which the first joint has a composition different from a composition of the second joint.
According to a seventh aspect of the present disclosure, there is provided an antenna array structure including a plurality of the antenna structures according to the first or second aspect, in which the plurality of patch antenna elements is arrayed along a first direction on the first surface of the antenna board, and the plurality of antenna structures is arrayed along a second direction orthogonal to the first direction.
According to an eighth aspect of the present disclosure, there is provided the antenna array structure according to the seventh aspect, in which the antenna boards adjacent to each other include adjacent end surfaces between which an interval is greater than 0 mm and less than or equal to 10 mm in a direction of array of the plurality of antenna structures.
Note that by appropriately combining discretionary exemplary embodiments among the various exemplary embodiments described above, the effects of the respective exemplary embodiments can be achieved.
Hereinafter, exemplary embodiments will be described in detail with reference to the drawings as appropriate. However, descriptions more in detail than necessary may be omitted. For example, the detailed description of already well-known matters and the redundant description of substantially identical configurations may be omitted. This is to avoid unnecessary redundancy in the following description and to facilitate understanding of those skilled in the art.
An antenna structure, an antenna array structure, and a method of manufacturing the same according to a first exemplary embodiment of the present invention will be described with reference to
An overall configuration of an antenna structure according to a first exemplary embodiment of the present disclosure will be described with reference to
As illustrated in
In the present exemplary embodiment, a multilayer board material “MEGTRON7” manufactured by Panasonic Corporation is used as a base material of antenna board 1. “MEGTRON7” is a multilayer board material having low transmission loss characteristics. By using this, it is possible to realize highly efficient antenna performance and to design a board with a high degree of freedom. However, antenna board 1 is not limited to “MEGTRON7”, and may be, for example, other glass epoxy materials or ceramic materials. Furthermore, the shape and dimension of antenna board 1 can be produced according to the application. In the present exemplary embodiment, as illustrated in
As illustrated in
Note that the present disclosure does not limit the shape, number, array interval, or the like of the patch antenna elements included in the antenna structure. Patch antenna element 2 may have another shape such as a circular shape, for example, and the number of patch antenna elements constituting antenna structure 21 may be provided according to the application of the antenna structure. Moreover, the plurality of patch antenna elements 2 may be arrayed at equal intervals, or may be arrayed at different intervals.
As illustrated in
Power supply control board 6 can be configured by, for example, mounting circuit components (not illustrated) constituting a signal circuit and a power feeding circuit on double-sided printed boards. Power supply control board 6 includes connection terminal 7, and in the present exemplary embodiment, connection terminal 7 includes a plurality of terminals provided along the Y direction in the drawing. Each of the plurality of terminals is electrically connected to each of patch antenna elements 2 through electrode part 5A (described later) of connection member 11A and feeding electrode 3. As a result, power supply control board 6 can apply a predetermined excitation amplitude phase distribution to each of patch antenna elements 2 to realize a desired radiation directionality of antenna structure 21. Power supply control board 6 can be disposed so as to extend in a direction intersecting the upper surface of antenna board 1. In the present exemplary embodiment, power supply control board 6 is disposed on the Y-Z plane in parallel with the array direction of patch antenna elements 2. Thus, the antenna structure can be made more compact.
The shape and size of power supply control board 6 can be produced according to the application. In the present exemplary embodiment, as illustrated, power supply control board 6 is disposed on the Y-Z plane parallel to the array direction of patch antenna elements 2, and has a rectangular shape on the Y-Z plane. Furthermore, in the present exemplary embodiment, power supply control board 6 is produced to have a length of 22 mm in the Y direction, a length of 25 mm in the Z direction, and a thickness of 1.6 mm in the X direction in the drawing.
In antenna structure 21 of Example 1, antenna board 1 and power supply control board 6 are connected by a connection member. Hereinafter, configurations of connection members according to Example 1 and modifications will be described with reference to
Connection member 11A of antenna structure 21 of Example 1 can be disposed on one side of third surface 6A and fourth surface 6B of power supply control board 6. Connection member 11A according to Example 1 includes body 4 having insulating properties, electrode part 5A formed on a surface of body 4, first joint 8, and second joint 9. First joint 8 joins electrode part 5A and feeding electrode 3, and second joint 9 joins electrode part 5A and connection terminal 7 of the power supply control board. Furthermore, both first joint 8 and second joint 9 are formed by metal joining. In this manner, connection member 11A can support power supply control board 6 extending in a direction intersecting the upper surface of antenna board 1 by electrically connecting and mechanically joining power supply control board 6 and feeding electrode 3. Note that connection members 11B, 11C according to the modification of Example 1 illustrated in
The shapes and dimensions of connection members 11A, 11B, 11C can be produced according to the application. In the present exemplary embodiment, connection members 11A, 11B, 11C are disposed along the array direction of patch antenna elements 2 on the lower surface of antenna board 1, have a rectangular parallelepiped outer shape whose longitudinal direction extends in the Y direction in the drawing, and are disposed in parallel with power supply control board 6 disposed in parallel with the Y-Z plane. Thus, compact antenna structure 21 can be configured.
In the present exemplary embodiment, body 4 of each of connection members 11A, 11B, 11C is produced such that width Wc in the X direction in the drawing is 2.5 mm, height Hc in the Z direction is 3.0 mm, and length Lc in the Y direction (illustrated in
As illustrated in
End 6a of power supply control board 6 may be disposed in contact with upper surface 1a of antenna board 1, or may be disposed at a predetermined distance from upper surface 1a. In the present exemplary embodiment, as illustrated in
Body 4 of each of connection members 11A, 11B, 11C is made of an insulating resin material. In the present exemplary embodiment, liquid crystal polymer (LCP) having a dielectric constant of 4.3 and a dielectric loss tangent of 0.015 is used for body 4, but body 4 is not limited thereto, and may include any one of liquid crystal polymer (LCP), polyphthalamide (PPA), acrylonitrile-butadiene-styrene copolymer synthetic resin (ABS), polyetheretherketone resin (PEEK), and polycarbonate resin (PC).
Electrode parts 5A, 5B, 5C of connection members 11A, 11B, 11C can be formed on the entire surface of body 4 or an arbitrary part thereof. In the present exemplary embodiment, for example, electrode part 5A according to Example 1 illustrated in
In the present exemplary embodiment, electrode parts 5A, 5B, 5C are sequentially formed of copper (Cu) having a thickness of 10 μm, nickel (Ni) having a thickness of 0.2 μm, and gold (Au) having a thickness of 0.05 μm by a plating method. Electrode parts 5A, 5B, 5C are not limited to those formed by the plating method, and may be formed by other materials or methods such as printing of a conductive resin and dispensing coating.
First joint 8 that joins electrode parts 5A, 5B, 5C and feeding electrode 3 and second joint 9 that joins electrode parts 5A, 5B, 5C and connection terminal 7 of the power supply control board are both formed by metal joining. As a result, first joint 8 and second joint 9 can have both electrical conductivity and mechanical strength. In the present exemplary embodiment, first joint 8 is formed using a solder having a composition of Sn-3.0Ag-0.5Cu, and second joint 9 is formed using a Sn—Bi solder. Note that the metal joining material constituting first joint 8 and second joint 9 is not limited thereto, and for example, a conductive paste such as Ag or Cu, or another joining material may be used. Moreover, first joint 8 and second joint 9 can be made of metal joining materials having different compositions. This will be described in detail later.
A configuration of an antenna structure of Example 2 according to the first exemplary embodiment of the present disclosure will be described with reference to
Antenna structure 21a of Example 2 illustrated in
Each of first connection member 11A1 and second connection member 11A2 of connection member 11a of antenna structure 21a includes body 4 with insulation properties, electrode part 5A formed on the surface of body 4, first joint 8, and second joint 9. First joint 8 connects electrode part 5A and feeding electrode 3, and second joint 9 connects electrode part 5A and connection terminal 7 of the power supply control board. Furthermore, both first joint 8 and second joint 9 are formed by metal joining. As described above, connection member 11a can support power supply control board 6 extending in a direction intersecting the upper surface of antenna board 1 by electrically connecting and mechanically joining power supply control board 6 and feeding electrode 3.
As illustrated in
As illustrated in
In the present exemplary embodiment, the first connection member and the second connection member of each of connection members 11a, 11b, 11c have a rectangular parallelepiped outer shape whose longitudinal direction extends in the Y direction in the drawing, and are disposed along a direction in which patch antenna elements 2 are arrayed to form a gap parallel to the Y direction. Since end 6a of power supply control board 6 is disposed in the gap, compact antenna structure 21a can be configured.
A dimension of the gap between the first connection member and the second connection member of each of connection members 11a, 11b, 11c can be produced according to the application. Since end 6a of power supply control board 6 is disposed in the gap, width L of the gap in the direction in which the first connection member and the second connection member are arranged is larger than at least thickness T of power supply control board 6. For example, width L of the gap in the X direction in the drawing and thickness T of power supply control board 6 can be configured to satisfy (T+0.05 mm)<L<(T+1 mm). In the present exemplary embodiment, width L of the gap is 2 mm and thickness T of power supply control board 6 is 1.6 mm in the X direction in the drawings. Furthermore, as illustrated in the drawings, in antenna structure 21a according to Example 2, end 6a of power supply control board 6 is disposed away from upper surface 1a of antenna board 1 by distance d, similarly to antenna structure 21 according to Example 1. As a result, a path through which air flows is secured between power supply control board 6 and antenna board 1, and a temperature rise of power supply control board 6 or antenna board 1 due to heat generation of electronic components mounted on power supply control board 6 can be suppressed.
Body 4 of the first connection member and the second connection member, electrode parts 5A, 5B, 5C, first joint 8, and second joint 9 of each of connection members 11a, 11b, 11c according to Example 2 can be produced by substantially the same configurations, dimensions, methods, and the like as those of connection members 11A, 11B, 11C according to Example 1 described above. Here, detailed description is omitted.
As described above, antenna board 1 disposed in parallel with the X-Y plane and power supply control board 6 extending in the direction intersecting the upper surface of antenna board 1 are connected by connection members 11A, 11B, 11C or 11a, 11b, 11c to constitute antenna structures 21, 21a according to the first exemplary embodiment of the present disclosure.
According to such a configuration, since patch antenna element 2 and power supply control board 6 on which circuit components constituting a signal circuit and a power feed circuit are mounted are disposed in directions intersecting each other, it is possible to provide antenna structures 21, 21a that facilitate the downsizing of the antenna device without restricting the arrangement of the antenna elements due to the mounting area of the circuit components constituting the signal circuit and the power feeding circuit, for example.
Next, a configuration of an antenna array structure according to the first exemplary embodiment will be described with reference to
As illustrated in
The number of antenna structures 21 constituting antenna array structure 22 can be provided according to the application of the antenna array structure. In the present exemplary embodiment, as illustrated in
In antenna array structure 22, each of antenna structures 21 may be arrayed at equal intervals, or may be arrayed at different intervals. In the present exemplary embodiment, as illustrated in
According to the configuration of antenna structure 21 of the present disclosure, patch antenna element 2 and power supply control board 6 on which the circuit components constituting the signal circuit and the power feeding circuit are mounted are disposed in directions intersecting each other. Therefore, when the plurality of antenna structures 21 is disposed in antenna array structure 22, for example, the plurality of antenna structures 21 can be arrayed without restricting interval S by power supply control board 6 or the circuit components mounted on power supply control board 6. Therefore, antenna array structure 22 in which patch antenna elements 2 of the respective antenna structures are arranged on a matrix in a narrow adjacent manner can be configured, and thus, it is possible to provide a small antenna array device.
Similarly, the antenna array structure can be configured using the plurality of antenna structures 21a according to Example 2.
The antenna array structure can further constitute an antenna unit by assembling with a housing. A configuration of the antenna unit will be described with reference to
Antenna unit 23a illustrated in
Furthermore,
In the antenna unit, the strength of the antenna array structure can be secured by the configuration in which the antenna array structure and the housing are assembled, and the assemblability can be improved.
Next, a manufacturing process of the antenna structure will be described with reference to
As illustrated in
As illustrated in
As illustrated in
As illustrated in
Next, as illustrated in
Next, as illustrated in
Second cream solder 14 forms second joint 9 that joins connection terminal 7 and electrode part 5A by the subsequent heating reflow processing (subsequent step S6). During the subsequent heating reflow processing, first cream solder 13 constituting first joint 8 may be remelted due to heat conduction during the processing. In order to prevent this, the first joint and the second joint can be made of metal joining materials having different compositions. For example, second cream solder 14 has a lower melting point than first cream solder 13. For example, Sn—Bi composition can be used as second cream solder 14. Note that second cream solder 14 is not limited to the Sn—Bi based composition, and any composition having a melting point lower than that of first cream solder 13 can be applied.
Furthermore, the composition of second cream solder 14 does not necessarily have to have a melting point lower than a melting point of first cream solder 13. For example, in a case where remelting of first cream solder 13 due to heat conduction does not occur due to the manufacturing process, second cream solder 14 may be a material having the same melting point (composition) as first cream solder 13.
Next, as illustrated in
Through the above steps, antenna structure 21 can be manufactured. Note that the method of manufacturing antenna structure 21 through S1 to S6 described above is merely an example, and the manufacturing of antenna structure 21 is not limited to this method. Furthermore, in the manufacturing process of antenna structure 21, materials to be used or production conditions are also examples, and the manufacturing is not limited to the above contents.
Although the antenna structure in which the patch antenna elements are arrayed in a planar manner has been described in the above exemplary embodiment, the present disclosure is not limited thereto. For example, the antenna structure may include patch antenna elements arrayed in a curved shape.
Furthermore, in the above exemplary embodiment, the antenna array structure configured by the antenna structures having the similar configuration has been described. However, the present disclosure is not limited thereto. For example, the antenna array structure may include antenna structures having different configurations from one another.
As described above, the accompanying drawings and the detailed description have been provided to describe exemplary embodiment of the technique in the present disclosure. Thus, components described in the accompanying drawings and the detailed description may include not only components essential for solving the problem, but also components non-essential for solving the problem to illustrate the above techniques. For this reason, it should not be immediately recognized that these non-essential components are essential just because these non-essential components are described in the accompanying drawings and the detailed description.
Although the present disclosure has been fully described in connection with preferred exemplary embodiment with reference to the accompanying drawings, various modifications can be made within the scope of the claims. Such modifications and exemplary embodiments obtained by appropriately combining technical units disclosed in different exemplary embodiments are also included in the technical scope of the present disclosure.
The present disclosure is applicable to an antenna device including an antenna structure and an antenna array structure.
Number | Date | Country | Kind |
---|---|---|---|
2022-062576 | Apr 2022 | JP | national |
Number | Date | Country | |
---|---|---|---|
Parent | PCT/JP2023/005269 | Feb 2023 | WO |
Child | 18897135 | US |