The invention relates to an antenna structure, and more particularly to an antenna structure that is capable of switching its radiation pattern.
With the vigorous development of communication technologies, commercial mobile communication systems can achieve high-speed data transmission, and provide Internet service providers with a wide range of services, such as network services of multimedia video streaming, instant road reporting and navigation, and instant network communication that require huge data transmission quantity. For hardware, an antenna design affects the performance of the wireless signals transmitting and receiving. Further, the conventional antenna does not have radiation pattern switching functions, and therefore its performance tends to be limited due to its surrounding environment. Therefore, how to design a high-performance antenna is one of the goals in the related industries.
The objective of the invention is to provide an antenna structure that has radiation pattern switching functions of switching its radiation pattern based on its surrounding environment, thus achieving high transmission and reception performances under various environments.
One aspect of the invention relates to an antenna structure which includes a substrate, a horizontal radiator and a vertical radiator. The horizontal radiator on or in the substrate. The vertical radiator is in the substrate and includes a vertical conductor, plural planar metal structures and a switch. The planar metal structures are electrically connected through the at least one vertical conductor. The switch is in a gap of the planar metal structures and is coupled to at least one of the planar metal structures for switching a current distribution of the vertical radiator.
Another aspect of the invention relates to an antenna structure which includes a substrate, a horizontal radiator, a vertical radiator and a metal branch. The horizontal radiator is on or in the substrate. The vertical radiator is in the substrate and includes a vertical conductor and plural planar metal structures. The planar metal structures are electrically connected through the vertical conductor. The metal branch is selectively coupled to the vertical radiator.
Another aspect of the invention relates to an antenna structure which includes a substrate, a horizontal radiator, a vertical radiator and a metal branch. The horizontal radiator is on or in the substrate. The vertical radiator is in the substrate and includes a vertical conductor and plural planar metal structures. The planar metal structures are electrically connected through the vertical conductor. The switch is in a gap of the planar metal structures and is coupled to at least one of the planar metal structures for switching a current distribution of the vertical radiator. The metal branch is selectively coupled to the vertical radiator.
Embodiments and advantages thereof can be more fully understood by reading the following description with reference made to the accompanying drawings as follows:
The spirit of the disclosure is clearly described hereinafter accompanying with the drawings and detailed descriptions. After realizing preferred embodiments of the disclosure, any persons having ordinary skill in the art may make various modifications and changes according to the techniques taught in the disclosure without departing from the spirit and scope of the disclosure.
Terms used herein are only used to describe the specific embodiments, which are not used to limit the claims appended herewith. Unless limited otherwise, the term “a,” “an,” “one” or “the” of the single form may also represent the plural form. Further, the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The apparatus may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly.
The document may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.
Further, spatially relative terms, such as “over,” “on,” “under,” “below,” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures.
Referring to
The vertical radiator 320 may be vertically across multiple dielectric layers in the substrate 310. The vertical radiator 320 includes vertical conductors 320A, planar metal structures 320B and switches 320C. The vertical conductors 320A extend along the direction perpendicular to the planar direction of the substrate 310, and the planar metal structures 320B extend along the planar direction of the substrate 310 and are electrically connected through the vertical conductors 320A. In the embodiments, the distance between the adjacent vertical conductors 320A is less than a quarter of the equivalent wavelength of the electromagnetic wave in the substrate 310. As shown in
In some embodiments, the vertical conductors 320A are formed of through substrate via (TSV) conductors. In practical, the TSV conductors may be conductive by coating conductive liquid/paint or plating conductive metal in the fabricating process.
The conductive via structures 314 and the vertical conductors 320A may be formed of one or more types. As shown in
In addition, the conductive via structures 314 and the vertical conductors 320A may be plated conductive via structures, in which conductive material is plated onto the walls of the via holes, such as copper, gold, aluminum, nickel or another metal, and then a conductive material or an insulating material (e.g. air or epoxy resin) is filled or plugged into the remained spaces, or a conductive material or an insulating material is plugged to form plugged via structures, or a solder mask is disposed on the top and/or the bottom of the spaces to form tented via structures. In another embodiment, the conductive via structures 314 and the vertical conductors 320A may be non-plated conductive via structures, in which conductive material is directly filled into the via holes, such as metal of copper, gold, aluminum, nickel, but are not limited thereto.
The planar metal structures 320B may respectively belong to several metal layers in the substrate 310. The longitudinal direction of the planar metal structures 320B is the horizontal direction of the main beam of the vertical radiator 320. As shown in
The planar metal structures 320B may have one or more planar patterns. For the embodiments of
In accordance with the type and fabrication process of the substrate 310, each switch 320C may be a diode, a field effect transistor (FET), a metal oxide semiconductor (MOS) FET, or a combination thereof, but is not limited thereto.
The horizontal radiator 330 is a planar metal plate structure, and the length thereof may be approximately a quarter of the equivalent wavelength of the electromagnetic wave in the substrate 310. The horizontal radiator 330 and one of the planar metal structures 320B may be coplanar, i.e. belong to the same metal layer in the substrate 310, determining the vertical direction of the main beam of the vertical radiator 320.
As shown in
The vertical radiator 320 and the horizontal radiator 330 are electrically coupled to the conductive lines 312, the conductive via structures 314 and/or another component in the substrate 310 and in the center area 310A respectively through the feeding traces 322, 332. The feeding trace 322 and one of the planar metal structures 320B may belong to the same metal layer in the substrate 310, and the feeding trace 332 and the horizontal radiator 330 may belong to the same metal layer in the substrate 310. The feeding traces 322, 332 may be parallel microstrip line structures or other transmission line structures.
In addition, a chip 340 is further disposed over the center area 310A of the substrate 310, and the side surface of the chip 340 toward the substrate 310 has metal bumps 342 thereon. By bonding the metal bumps 342 to the bonding pads 316 on the substrate 310, the chip 340 can be mounted on the substrate 310 to have the components in the chip 340 and the conductive lines 312, the conductive via structures 314 and/or other components in the substrate 310 electrically connected with each other, such that the chip 340 is electrically connected with the vertical radiator 320 and the horizontal radiator 330. The metal bumps 342 may be gold bumps, tin bumps or other bumps formed from another metal or metal alloy.
The chip 340 has an RFIC and/or other active and/or passive components for constituting a transmitting and/or receiving circuit. The chip 340 may be bonded to the substrate 310 by such as ball grid array (BGA) packaging, chip scale packaging (CSP), flip chip packaging, wafer-level packaging, or another suitable packaging method, such that the components in the chip 340 and in and and/or on the substrate 310 are electrically connected with each other.
In another embodiment, the antenna structure 300 may only include the substrate 310 and the components in the substrate 310, e.g., the vertical radiator 320 and the horizontal radiator 330, without including the chip 340 and the metal bumps 342.
In addition, in some embodiments, a reflective wall structure (not shown) may be arranged between the area of the vertical radiator 320 and the horizontal radiator 330 and the center area 310A for increasing the directivity of the beam generated by the vertical radiator 320 and the horizontal radiator 330 and blocking radiation waves from interfering the components in the center area 310A. Similar to the structure formed of the vertical conductors 320A of the vertical radiator 320 and the planar metal structures 320B, the reflective wall structure may be formed of electrically conductive via structures, but the extending directions of the reflective wall structure are approximately parallel to the corresponding side edges 310E.
Furthermore, in some embodiments, a broadband antenna set (not shown) may further be disposed in the antenna structure 300 and be formed of phased array antennas arranged on a side of the chip 340 far away from the substrate 310 for generating a multi-beam array with angles with respect to the planar direction of the substrate 310. The broadband antenna set may be electrically connected with the conductive lines 312, the conductive via structures 314 and/or another component in the center area 310A.
In
It is noted that the arrangements of patterns, locations and quantities of the vertical conductors 320A, the planar metal structures 320B, the switches 320C and the metal branch 324 shown in
Summing up the above, the antenna structure of the invention has radiation pattern switching functions of switching its radiation pattern based on its surrounding environment, thus achieving high transmission and reception performances under various environments.
Although the invention is described above by means of the implementation manners, the above description is not intended to limit the invention. A person of ordinary skill in the art can make various variations and modifications without departing from the spirit and scope of the invention, and therefore, the protection scope of the invention is as defined in the appended claims.
This application is a continuation application of U.S. application Ser. No. 16/219,918, filed Dec. 13, 2018, which is incorporated herein by reference in its entirety.
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Number | Date | Country | |
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20220077578 A1 | Mar 2022 | US |
Number | Date | Country | |
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Parent | 16219918 | Dec 2018 | US |
Child | 17455206 | US |