Claims
- 1. An anti-fogging film having a multilayer structure comprising at least two layers of a cured film formed on a substrate, said cured film comprising as main components (A) polyvinyl alcohol and (B) at least one member selected from the group consisting of (a) colloidal silica having an average particle size of 5 to 200 m.mu., (b) an organic silicon compound represented by the general formula R.sup.1 R.sup.2 SiX.sub.3-a in which R.sup.1 represents an organic group having 1 to 10 carbon atoms, R.sup.2 represents a hydrocarbon group having 1 to 6 carbon atoms, X represents a hydrolyzable group and a is 0 or 1, and (c) a hydrolysis product of an organic silicon compound represented by the general formula R.sup.1 R.sup.2 SiX.sub.3-a in which R.sup.1, R.sup.2, X and a are as defined above, wherein the ratio S.sub.2/ S.sub.1 of the weight ratio S.sub.2 of the component (A) to the component (B) in the layer contiguous to the topmost surface layer to the weight ratio S.sub.1 of the component (A) to the component (B) in the topmost surface layer is at least 1.05.
- 2. An anti-fogging film as set forth in claim 1, wherein the polyvinyl alcohol has an average polymerization degree of 250 to 3,000 and a saponification value of at least 70% by mole.
- 3. An anti-fogging film as set forth in claim 1, wherein in the topmost surface layer, the component contained in an amount of 100 to 2,000 parts by weight per 100 parts by weight of the component (A).
- 4. An anti-fogging film as set forth in claim 1, wherein in the layer contiguous to the topmost surface layer, the component (B) is contained in an amount of 5 to 150 parts by weight per 100 parts by weight of the component (A).
- 5. An anti-fogging film as set forth in claim 1, wherein the thickness of the topmost surface layer is 0.001 to 5 .mu.m.
- 6. An anti-fogging film as set forth in claim 1, wherein the thickness of the layer contiguous to the topmost surface layer is 2 to 100 .mu.m.
- 7. An anti-fogging film as set forth in claim 1, wherein the ratio S.sub.2 /S.sub.1 is at least 2.00.
Parent Case Info
This application is a continuation-in-part of application Ser. No. 460,789 filed Jan. 4, 1990, now abandoned.
US Referenced Citations (7)
Foreign Referenced Citations (2)
Number |
Date |
Country |
0123927 |
Nov 1984 |
EPX |
58-101164 |
Jun 1983 |
JPX |
Non-Patent Literature Citations (2)
Entry |
WPIL, File Supplier, No. 87-111632, Derwent Publications Ltd., London, GB; & JP-A-62 056 338 (Toray Ind. Inc.) Dec. 3, 1987. |
WPIL, File Supplier, No. 87-230689, Derwent Publications Ltd., London, GB; & JP-A-62 153 147 (Toray Ind., Inc.) Aug. 7, 1987. |
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
460789 |
Jan 1990 |
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