The present disclosure relates to an antireflection structure that suppresses the reflection of light from surface.
In optical elements, such as a camera and a liquid crystal display, a surface light reflection may become a problem. For example, although a fixed diaphragm that has a role of narrowing light beam to a constant amount of light and transmitting the light to an imaging sensor is provided in the lens unit of a camera, when a light reflection occurs on the surface of the diaphragm, the light becomes stray light, deteriorating a clear image, and thus a low reflectivity is necessary for the surface of the diaphragm. In addition, since the inner circumference end face, etc., of the fixed diaphragm is located on the optical path, when unnecessary light in the lens unit is reflected by the inner circumference end face, the reflected light enters the imaging sensor, causing improper image-pickup, such as a flare and a ghost. In order to prevent such improper image-pickup, a fixed diaphragm, etc., having the inner circumference end face subjected to an antireflection processing is desired.
Conventionally, a black covering film is known which has a titanium oxide film including a concavo-convex structure formed of microscopic columnar crystals, and formed on the surface of a resin-made substrate (see, for example, Patent Document 1).
Patent Document 1: WO 2010/026853 A
However, the concavo-convex structure is not a controlled structure, and is still insufficient in view of antireflection angle. In addition, a prevention of diffracted light by the concavo-convex structure is not taken into consideration.
Hence, an objective of the present disclosure is to provide an antireflection structure that is capable of further suppressing reflection of light.
In order to achieve the above objective, an antireflection structure according to the present disclosure includes a concavo-convex structure for antireflection formed on a surface of a base material formed of a material that absorbs light,
in which the concavo-convex structure satisfies P≧λ, where λ is a wavelength of light and P is an average pitch of the concavo-convex structure.
In this case, it is preferable that the material should contain a light absorbing component that absorbs the light, and an average particle diameter of the light absorbing component should be equal to or smaller than ½ of the wavelength of the light. In addition, it is preferable that the concavo-convex structure should satisfy P≧6λ. Still further, it is preferable that the concavo-convex structure should satisfy H/P≧1 where H is an average depth of the concavo-convex structure. Yet still further, it is preferable that L≧λ should be satisfied where L is a thickness of the base material. Moreover, the average pitch P of the concavo-convex structure should be equal to or smaller than 10 μm.
It is preferable that the concavo-convex structure should be in a form that does not cause diffraction light. For example, element structures of the concavo-convex structure may be disposed at random. In this case, it is preferable that either one of or both of a size and shape of the element structure should be adjusted in such a way that the number of plane parts is small in comparison with a case in which the size and shape of the element structure are constant.
The element structure of the concavo-convex structure may be in a bombshell shape with a rotated parabola or may be in a line-and-space shape. A cross-sectional shape of a convexity of the line-and-space shape may be a triangle.
In addition, the material of the base material should be a resin for imprinting.
The antireflection structure of the present disclosure can sufficiently suppress reflection of light by the controlled concavo-convex structure.
An antireflection structure 1 according to the present disclosure is, as illustrated in
The light in this case means light (electromagnetic wave) with a predetermined wavelength for which antireflection is desired. Hence, when the light contains several electromagnetic waves with different wavelengths, it is necessary to form the concavo-convex structure 3 that satisfies P≧λ for all wavelengths of light for which antireflection is desired. That is, what the maximum wavelength of the electromagnetic wave contained in the light is λmax, it is appropriate if the concavo-convex structure 3 is formed so as to satisfy P≧λmax. When, for example, as for visible light with the wavelength within the range of 380 nm to 780 nm, antireflection for all electromagnetic waves is desired, it is appropriate if the concavo-convex structure 3 is formed so as to satisfy P≧780 nm.
The base material 2 can be in any shape in accordance with the application and the purpose, but for example, a sheet shape and a substrate shape are applicable. In addition, the base material 2 is formed of a material capable of absorbing light. The material capable of absorbing light indicates a material that has a higher ratio of absorbing light than the ratio of reflecting the light, and an extinction coefficient k is preferably equal to or smaller than 0.4, more preferably, equal to or smaller than 0.2, and further preferably, equal to or smaller than 0.1. Such a material may contain light absorbing components which are likely to absorb light. Example light absorbing components are black colorants, such as carbon black, aniline black, titanium black, and acetylene black. In addition, it is preferable that the particle diameter of the light absorbing component should be sufficiently small relative to the wavelength of the light to be absorbed so as not to cause scattering and reflection. More specifically, it is appropriate if the average particle diameter of the particle contained in the material is equal to or smaller than ½ of the wavelength of light to be absorbed, more preferably, equal to or smaller than ¼. Note that the average particle diameter of the light absorbing component can be measured using a particle size distribution measuring device. As for a measurement principle of the particle size distribution measuring device, measurement can be made through, for example, an imaging scheme of directly obtaining the image of particles by electron microscope like transmission electron microscope (TEM), and converting the image into the size of the particle, a laser diffraction and scattering scheme of emitting laser light to the particle group, and obtaining the particle size distribution by calculation based on the intensity distribution pattern of the diffraction and scattering light emitted from the particle group, etc.
In addition, it is preferable that the material of the base should be a material suitable for processes capable of controlling the form of the concavo-convex structure 3, such as imprinting, embossing, and an injection molding. Example materials suitable for imprinting are thermoplastic resin, thermosetting resin, etc., and those resin that contain light absorbing components are applicable. When a thickness L of the base material 2 becomes too small in comparison with the wavelength λ of light, the light to be concerned is likely to pass the base material 2, and the light absorbing effect of the antireflection structure 1 decreases. Therefore, it is preferable that the thickness of the base material 2 should satisfy L≧λ.
The concavo-convex structure 3 includes multiple element structures capable of suppressing light reflection, and is formed on the surface of the base material 2. Example forms of the concavo-convex structure capable of suppressing light reflection are the shape of the element structure of the concavo-convex structure 3, the pitch of the adjoining element structures, the depth of the element structure, the aspect ratio that is the ratio between the pitch and the depth, etc. When those are controlled as appropriate, light reflection can be suppressed.
Still further, it is preferable that the concavo-convex structure 3 should be in the form that does not cause diffraction light. For example, the average pitch P of the concavo-convex structure 3 is formed so as to be larger than the wavelength λ of light. This is because diffraction light is caused by the concavo-convex structure 3 when the average pitch P of the concavo-convex structure 3 is smaller than the wavelength λ of light. In order to surely suppress the occurrence of diffraction light, a large setting, such as P≧2λ, P≧3λ, P≧4λ, P≧5λ, P≧6λ, P≧7λ, P≧8λ, P≧9λ, and P≧10λ. When, however, the average pitch P is too large, it becomes possible for a human eye to recognize the concavo-convex structure, the vertex and bottom of the concavo-convex structure become a size approximated as a plane relative to the wavelength of light and the reflection suppressing effect decreases. Hence, it is preferable that the average pitch P should be equal to or smaller than 10 μm.
In addition, another scheme of preventing occurrence of diffraction light is a scheme of disposing the element structures of the concavo-convex structure 3 at random. However, when the element structures of the concavo-convex structure 3 with the same size and shape are disposed at random, a gap is formed between the element structures, and there is a part that becomes a plane. Such a plane is likely to reflect light. Hence, it is preferable that there is no part that becomes a plane between the element structures. In order to do so, it is appropriate if either one of or both of the size and shape of the element structure are adjusted so as to reduce the number of plane parts in comparison with a case in which the element structures of the concavo-convex structure 3 have the same size and shape.
Although the concavo-convex structure 3 can be manufactured by sandblasting, etc. but under such processing, the form (disposition, size and shape of element structure) of the concavo-convex structure 3 is not controlled, and reflection light and diffraction light are caused in some cases. Hence, a method capable of controlling the random nature of the form of the concavo-convex structure and achieving the form that does not surely cause diffraction light is preferable. Example such manufacturing methods are imprinting, embossing, an injection molding, etc. Needless to say, the present disclosure is not limited to those methods.
Still further, the antireflection structure 1 has different reflection factors in accordance with the incident angle (an angle when the vertical direction to antireflection structure is 0 degree) of light relative to the concavo-convex structure 3.
n=1.5×(1−0.2)+2×0.2=1.6
k=0+1×0.2=0.2
As for the shape of the concavo-convex structure, as illustrated in
In addition, the depth H of the concavo-convex structure 3 was compared for the cases of 0.5 μm, 1 μm, 1.5 μm, 2 μm, 2.5 μm, 3 μm, 3.5 μm, 4 μm, 4.5 μm, and 5 μm. The thickness of the base material 2 was 100 μm. Still further, the wavelength λ of the light from a light source was 500 nm.
A software DiffractMOD available from synopsys corporation (synopsys, Inc) was applied for the simulation.
As is clear from
Still further, the concavo-convex structure 3 of the antireflection structure 1 may be a line-and-space shape as illustrated in
n=1.5×(1−0.2)+2×0.2=1.6
k=0+1×0.2=0.2
As illustrated in
In addition, the wavelength λ of the light from the light source was set to be four kinds that were 400 nm, 500 nm, 600 nm, and 700 nm.
Still further, as illustrated in
A software DiffractMOD available from synopsys corporation (synopsys, Inc) was applied for the simulation.
As is clear from
Number | Date | Country | Kind |
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2015-069349 | Mar 2015 | JP | national |
2015-161883 | Aug 2015 | JP | national |
Filing Document | Filing Date | Country | Kind |
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PCT/JP2016/060306 | 3/30/2016 | WO | 00 |