Claims
- 1. A process for dissipating an electrostatic charge on a static-prone natural and synthetic polymeric substrate comprising contacting said substrate with an antistatic composition containing a crosslinked thermosetting resin formed by reacting, in the presence of a water-soluble solvent, (a) a polyaminoamide having unreacted primary and secondary amine groups and (b) a polychlorohydrin derivative which is a chlorine-terminated alkoxylated polyol.
- 2. The process of claim 1 wherein said unreacted primary and secondary amine groups of said polyaminoamide are reacted with said polychlorohydrin derivative in a mole ratio of chlorine:unreacted amine groups of from about 1:1, respectively.
- 3. The process of claim 1 wherein said crosslinked thermosetting resin is present at a concentration of from about 0.1 to about 60% by weight, based on the weight of said resin.
- 4. The process of claim 3 wherein said crosslinked thermosetting resin is present at a concentration of from about 10 to about 35% solids, based on the total solids content of said resin.
- 5. The process of claim 1 wherein said polychlorohydrin derivative is a chlorine-terminated alkoxylated polyol having at least 1.5 chlorine end-groups on average and from at least 2 up to about 200 moles of an alkoxylate.
- 6. The process of claim 5 wherein said polyol is selected from the group consisting of glycerol, trimethylol propane, pentaerythritol, dipentaerythritol, and mixtures thereof.
- 7. The process of claim 5 wherein said alkoxylate is selected from the group consisting of ethylene oxide, propylene oxide, butylene oxide, and mixtures thereof.
- 8. The process of claim 7 wherein said alkoxylate has a ratio of ethylene oxide:propylene oxide in the range of about 25:1 to about 4:1, respectively.
- 9. The process of claim 1 wherein said polychlorohydrin derivative is prepared by reacting epichlorohydrin with a pentaerythritol ethoxylate in a molar ratio of about 1:1, respectively, using a boron trifluoride etherate catalyst to form a reaction product, followed by partially reacting said reaction product with a C6-20 amine at a chlorine:amine ratio of 5:1, respectively.
- 10. The process of claim 1 wherein said crosslinked thermosetting resin has a viscosity of about 20 cps at 25° C.
- 11. The process of claim 1 wherein said crosslinked thermosetting resin has a pH of less than 7.
- 12. The process of claim 1 wherein said crosslinked thermosetting resin has a pH of 4.
- 13. The process of claim 1 wherein said solvent is water.
- 14. The process of claim 2 wherein said mole ratio of chlorine:unreacted amine groups is 1:1, respectively.
- 15. The process of claim 1 further comprising reacting said crosslinked thermosetting resin with a C6-20 amine at a chlorine amine molar ratio of about 5:1.
- 16. A process for dissipating an electrostatic charge on a static-prone natural or synthetic article of manufacture comprising the steps of:(1) providing a hot melt natural or synthetic polymeric substrate used to form an article of manufacture; (2) blending said hot melt polymeric substrate with an antistatic composition, said antistatic composition containing a crosslinked thermosetting resin formed by reacting, in the presence of a water-soluble solvent, (a) a polyaminoamide having unreacted primary and secondary amine groups and (b) a polychlorohydrin derivative which is a chlorine-terminated alkoxylated golyol, thus forming a blended hot melt polymeric substrate; and (3) cooling said blended hot melt polymeric substrate to form an article of manufacture.
- 17. The process of claim 16 wherein from about 0.1 to about 10% by weight, based on the weight of said hot melt polymeric substrate, of said antistatic composition is blended with said hot melt polymeric substrate.
- 18. The process of claim 16 wherein said unreacted primary and secondary amine groups of said polyaminoamide are reacted with said polychlorohydrin derivative in a mole ratio of chlorine:unreacted amine groups of from about 1:1, respectively.
Parent Case Info
This application is a divisional application of application Ser. No. 08/519,324, filed Aug. 25, 1995, now U.S. Pat. No. 5,773,507.
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