The subject matter relates to image capturing.
A prime lens in an image-capturing device is a lens with only one fixed focal length, which has characteristics of fast focusing speed and stable imaging quality. However, if the prime lens is fixed hard in place, when the prime lens is shaken or made to tremble, an image quality will be lowered.
Implementations of the present technology will now be described, by way of embodiments, with reference to the attached figures.
It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous components. In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures, and components have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein. The drawings are not necessarily to scale and the proportions of certain parts may be exaggerated to better illustrate details and features of the present disclosure.
The term “comprising,” when utilized, means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in the so-described combination, group, series, and the like.
In one embodiment, the SMA wire 33 has memory in respect of shape, with thermoelasticity and conductivity. When electric current passes through the SMA wire 33, the SMA wire 33 is deformed on heating. When no electric current passes through the SMA wire 33, the SMA wire 33 returns to its original shape upon cooling. A linear relationship exists between a resistance and a length of the SMA wire 33.
When in use, a prime lens 201 (shown in
In one embodiment, the conductive structure 31 and the carrier 10 are both substantially rectangular in the shape of a frame. The conductive structure 31 includes four first vertexes 311. The carrier 10 includes four second vertexes 101 corresponding in positions to the first vertexes 311. The driving element 30 includes four SMA wires 33. One end of each SMA wire 33 is connected to one first vertex 311 of the conductive structure 31, and another one end of each SMA wire 33 is connected to one second vertex 101 of the carrier 10. The first vertex 311 and the second vertex 101 connected to the same SMA wire 33 are staggered, thus the conductive structure 31 can be pulled along different directions by the four SMA wires 33 to rotate in the plane.
The driving element 30 further includes a negative pad 35 arranged on the carrier 10 and a conductive wire 36 electrically connected to the conductive structure 31 and the negative pad 35. Electric currents input from the positive pads 32 pass through the SMA wires 33, the conductive structure 31, the conductive wire 36 successively to flow into the negative pad 35. The SMA wires 33 are arranged, in parallel with each other, between the positive pads 32 and the negative pad 35. Each SMA wire 33 can be supplied with different values of electric currents to generate different traction forces F, thus the conductive structure 31 is driven to move and drives the support element 20 to move.
The carrier 10 includes a base body 102 and a plurality of protrusions 12 extending from a surface of the base body 102 away from the support element 20. The four second vertexes 101 are defined on the base body 102. The positive pads 32 and the negative pad 35 are arranged on surfaces of the protrusions 12.
A plurality of lead grooves 13 are defined between the second vertexes 101 and the protrusions 12. Conductive circuits 131 are arranged in the lead grooves 13. Part of the conductive circuits 131 are electrically connected to the positive pads 32 and the SMA wires 33, and another part of the conductive circuits 131 are electrically connected to the negative pad 35 and the conductive wire 36.
In one embodiment, materials of the carrier 10, the protrusions 12, and the support element 20 are polyamide, polycarbonate, polyester, or liquid crystal polymer, etc.
In one embodiment, the conductive structure 31 is formed on a side of the support element 20 away from the carrier 10 by a laser direct structuring process, the conductive circuits 131 are formed on a side of the carrier 10 and protrusions 12 adjacent to the support element 20.
The anti-tremble mechanism 100 further includes a cover 60. The cover 60 is connected to the support element 20 and the prime lens 201 and covers the housing 50.
Even though information and advantages of the present embodiments have been set forth in the foregoing description, together with details of the structures and functions of the present embodiments, the disclosure is illustrative only. Changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the present exemplary embodiments, to the full extent indicated by the plain meaning of the terms in which the appended claims are expressed.
Number | Date | Country | Kind |
---|---|---|---|
201911047098.5 | Oct 2019 | CN | national |
Number | Name | Date | Kind |
---|---|---|---|
10175499 | Howarth et al. | Jan 2019 | B2 |
20150049209 | Hwang | Feb 2015 | A1 |
20170285362 | Hu | Oct 2017 | A1 |
20220060610 | Sugiura | Feb 2022 | A1 |
Number | Date | Country |
---|---|---|
107077044 | Aug 2017 | CN |
109856891 | Jun 2019 | CN |
Number | Date | Country | |
---|---|---|---|
20210132406 A1 | May 2021 | US |