Patent Application
20180243750
The present application is related to nanoparticles, and more specifically to an apparatus and method for forming nanoparticles.
A particle is a minute fragment or quantity of matter having physical and/or chemical properties. Particles can be classified according to diameter. Nanoparticles are generally between 1 and 100 nanometers in size. Particles larder than nano are generally described by two categories, micro and macro particles. Micro particles (fine) are typically sized between 100 and 2,500 nanometers, and macro particles (coarse) cover a range between 2,500 and 10,000 nanometers. Properties of a material can change as their size approaches the nanoscale because the ratio of surface area in relation to the volume of the material increases significantly. For coarse particles, the ratio of surface area in relation to the volume in the bulk of the material is typically insignificant. However, nanoparticles can have a high surface area to volume ratio where forces resulting from the high surface area dominate contributions to the nanoparticles physical and/or chemical properties. Conventional monolith nanoparticles are sphere shaped and have a small active surface area. Conventional nanoparticles tend to homogenize in small clusters that can easily become bonded. Conventional nanoparticles are unsuitable for high volume commercial production.
Conventional methods to manufacture nanomaterial composites, also known as synthetic nanoparticles, are both time and energy consuming even for small volume output. The methods rely on high energy input, or complicated chemical procedures and processes such as solvent extraction, spray drying, nano-precipitation, evaporation, and emulsion photo-crosslinking. Conventional methods typically require multistep procedures and often result in an unpredictable and wide distribution of particle sizes and/or a low reaction yield.
Conventional particle grinding methods include Tribomechanical Micronization and Activation (TMA). TMA has rotors and multiple extruding s that physically grind particles. This method produces micro to macro size pulver and cannot mill hard materials without a high probability of material contamination from physical impact. TMA involves rotors physically contacting particles and output particles can include residue and impurities from the rotors. The method is known to suffer “wear and tear” problems and TMA rotors require regular replacement, and in some cases, many times a day during the milling process.
Embodiments of the technology disclosed herein include methods to form substantially pure micro- and nanoparticles without requiring physical contact with a rotor. A nanoparticle collider including an aerodynamic vane can direct nanoparticles to a collision region without physical impact with the nanoparticles. The nanoparticle collider can mass produce monolith and composite nanomaterial from various materials including, for example, metal, minerals, and bio-material.
The nanoparticle collider can be configured to manufacture nanomaterial via a plurality of material processing phases including, for example, a milling phase, optical sensory phase, particle sampling phase, particle separation phase, particle programming phase, particle solidifying phase, particle storage phase, particle packing phase, or any combination thereof. The plurality of phases can be managed and coordinated by one or more electronic control units.
The nanoparticle collider can comprise a material input hopper, a core, also referred to as Rotor Chamber, Gas Tank for Atmosphere Control, Blower, Optical Sensor Array, Particle Sampling Array, Particle Separator Array, Membrane, Particle Storage Unit, Particle Programming Array, also referred to as Frequency Adjuster, Particle Solidifying Chamber, Compression Tank, Compressor, Drain Valve, Sampling Valve, Control Unit(s) and Production Exit Point, also referred to as Particle Packaging Unit.
The nanoparticle collider can include and/or operate inside of an atmospheric controlled chamber to regulate the exposure and influence of oxygen, humidity, temperature, bar pressure, sound, and luminous energy on material during and/or after processing. In another embodiment, the nanoparticle collider can operate in an unregulated environment regardless of the influence of oxygen, humidity, temperature, bar pressure, and luminous energy.
Embodiments of the technology disclosed herein include methods to form nanoparticles. A mechanical milling process induced by aerodynamic, centrifugal, and centripetal principles can be further augmented by ultrasound, magnetic pulse, and high voltage impact. The mechanical milling process can be performed in an atmosphere and luminance controlled environment. Methods include forming and regimenting particle design and properties such as size, shape, repulsion, and hardness. High volumes of monolith nanoparticles and nanoparticle compositions can be manufactured from macro or micro sourced minerals, metals, and/or organic matter. Some methods of forming nanoparticles include manufacturing nanoparticles on an industrial scale for a variety of applications.
Conventional methods to manufacture nanomaterial composites are time and energy intensive even for small volume output. Conventional methods can rely on complicated chemical procedures and processes and often require multistep procedures that result in an unpredictable and wide distribution of particle sizes, and a low reaction yield.
The technique disclosed herein provides a less energy intensive and high yield method for forming monolith and composite nanoparticles. The nanoparticles are generated through impact collision with adjacent particles and resulting in a chaotic nanoparticle structure. Nanoparticles formed by the method described herein have a significantly larger active surface area than the surface area of conventionally formed nanoparticles.
The apparatus and method utilize low energy aerodynamics in addition to centrifugal and centripetal forces augmented by ultrasound waves to process both soft and hard material down to nm size. The nanoparticle product can be specifically designed for a variety of applications and is scalable for mass production.
A device for producing nanoparticles is referred to as a “nano collider.” A plurality of nano colliders is referred to as a “nano collider farm.” A nano collider farm includes plurality of nano colliders operating in a parallel or serial progression, or a combination of both set-ups, to manufacture monolith and/or composite nanomaterial.
The nano collider apparatus and method is an improvement over conventional tribomechanical micronization and activation (TMA). TMA typically involves use of opposing rotors with multiple extruding pins which physically impact particles. Physical impact of the material particles with the rotors results in unpredictable micro and macro particle sizes and, over time, wears down the rotors. In addition to the physical wear and tear on rotors, resulting from particle impacts, nanoparticle yield produced using TMA is contaminated with rotor material residue. Impurities in the particle yield can cause unpredictable and undesirable nanoparticle behavior.
In contrast, the disclosed technique does not rely on physical impacts to produce nanoparticles. The disclosed nano collider includes aerodynamic vanes which manipulate particle flow to a collision region where they collide with one another without requiring direct impact with the aerodynamic vanes. By directing particles into a collision region downstream of the aerodynamic vane, the leading edge of the aerodynamic vanes do not suffer from erosional wear and tear from the bombardment of particle impact. Consequently, nanoparticle yield produced by the nano collider does not contain fragments or residue of aerodynamic vane material, i.e. from direct collision with its leading edge.
The TMA method produces micro to macro size granules, often yielding an unpredictable outcome when it comes to particle shape and size. In contrast, the nano collider uses micro or macro sized granules to produce designed conformities of predictable nanoparticle sizes and shapes. The nano collider can be configured to form a predictable nanoparticle yield, as well as physically structured and frequency adjusted nanoparticles. The nano collider does not destroy or damage the structure and integrity of the material yield. The nano collider can manipulate nanoparticle structures and form synthetic composites of said particles.
The nano collider has two flowing streams of particles that rotate in air stream channels in opposite directions pushed outward by a centrifugal force of each channel, intercepting the opposite flow and thus crushing the materials in the process. Outward migration from one air stream channel to another air stream channel can result in collisions between particles traveling in approximately opposite directions. A nano collider can include, for example, seven or more air stream channels. The flow of material in the air stream channels can collide at a speed of 1,000 to 10,000 revolutions per minute (RPM) and can exceed 100,000 RPM if needed. The force of impact depends on rotor speeds, the radius of the channels, pitch position of the vanes and the mass of the material.
The process of forming nanomaterials in the nano collider starts with placing granulated materials in a hopper and funneling them through a duct into the nano collider core. The granulated material can be macro and/or micro sized, or larger granules. Rotation of the rotors pull the material into a centrifugal spin outward. The pull is amplified by the aerodynamic vacuum generated by the aerodynamic vanes. The pull of the opposing rotating vanes generates particle collision as the material impacts against each other, fracturing into smaller particles. The materials exit the core in a smaller material size than when they entered the process. This process can be repeated until the selected nanometer size is achieved.
The nano collider process is an aerodynamic mechanical method where two opposing turbine elements having a plurality of aerodynamic vanes generate a vacuum effect, channeling and pulling macro and/or micro sized materials from two opposite directions and causing them to fracture by smashing them against each other. The pulling force accelerates towards the outer perimeter of the rotating elements and extrudes uniquely porous and cracked nanomaterials which are then automatically recycled through the nano collider again until the desired nanometer size is achieved.
The nano collider can process various materials down to a nanometer size. For example, the nano collider can process metals (e.g., tungsten), semiconductors (e.g., carbon, silicon, germanium, etc.), minerals (e.g., goethite), organic matter, or any combination thereof.
An internal portion of the nano collider can be sealable from the outside environment. A pressure, temperature, humidity, and gaseous composition of the internal portion of the nano collider can be adjusted. The nano collider can operate in a wide range of temperatures including, for example, below freezing for biological matter or elevated temperatures for metals (e.g., approximately 500° C. or higher). The nano collider can operate under various atmospheric pressures, including in total vacuum and high pressure (e.g., 2 atmospheres, 3 atmosphere, or a higher pressure). The nano collider can include a particular atmospheric composition (e.g., nitrogen and/or argon), for example, to avoid oxidation. The nano collider can include controlled humidity environment (e.g., no humidity or low humidity), for example, to reduce reactions with or catalyzed by the presence of water (e.g., oxidation).
The nanoparticle output can be predetermined to any nm size almost down to atomic level. A commercial nano collider unit, or a farm of nano collider units can manufacture hundreds of tons of nanomaterials per day. The nanoparticle output can be substantially free of impurities due to the internal aerodynamic design and atmospheric control of the nano collider.
Material can be inserted into the nano collider 100. For example, material can be inserted into a material input hopper 101. The material input hopper 101 can be located near or at a center of the nano collider 100. The material input hopper can be within a proximity of a common axis of rotation of a first rotor and a second rotor. The first and second rotors can rotate in opposite directions. Rotation of opposing rotors of the nano collider 100 can cause granulated material (e.g., minerals, metals, and/or biological matter) to be broken down to nanometer sizes. For example, the nano collider 100 can break down particles to ranges of approximately 1 nm to approximately 500 nm, and ranges therebetween. Different materials can result in different size ranges. For example, biomaterials can result in sizes ranging from approximately 50 nm to approximately 200 nm or more.
The nano collider 100 can be placed inside a sealed atmosphere controlled chamber capable of producing extreme heat and cold, humidity, bar pressure, light or darkness—all of which can be adjusted to achieve the desired outcome for various materials. The milling, intermediate processing steps, and the packaging process can take place inside the atmosphere controlled chamber.
The milling process takes place in a core of the nano collider 100. The core is a region between rotors (e.g., rotor 124a and rotor 124b) where aerodynamic vanes (e.g., aerodynamic vanes 122a and 122b) can turn in opposite directions. The rotors can rotate at various speeds including, for example, speeds of up to 100,000 RPMs. The time frame for a single run of the nano collider 100 is determined by the material being milled at each time. Achieving nanometer sizes can involve a single run or more than one run through the nano collider.
Aerodynamic vanes (e.g., aerodynamic vanes 122a and 122b) are held in place by a rotor (e.g., the rotor 124a or the rotor 124b). Alternating rows of aerodynamic vanes can be held in place by an opposing rotor. For example, a second row and a fourth row can be held in place by a first rotor (e.g., rotor 124a) and a first row, third row, and fifth row can be held in place by a second rotor (e.g., rotor 124b). The first rotor and the second rotor can be on opposing sides. The first rotor and the second rotor can spin in opposite directions causing the first, third, and fifth rows to spin in an opposite direction as the second and fourth row. Rows having aerodynamic vanes in an opposing spin can cause an air current pattern in the nano collider 100, as shown in
A single run through the nano collider 100 achieves a limited downgrading in size and shape but is increased with the number of rows inside the airflow chamber. Several runs can be done spontaneously by recycling the milled materials through an airflow duct. The milled materials can pass through a detector which determines the nanometer size of material passing by through the detector.
Once the desired size has been achieved, the nanomaterial is funneled into a resonance frequency adjuster and a process which is determined by harmonics algorithms. The hardening time for each milled nanomaterial dictates the waiting time for when it is ready for the next stage. A second stage can be adopted in order to synthesize the milled nanomaterial with other nanomaterials. This is a variant to the process where a separate nano collider 100 run of two or more materials can produce new nanomaterial designs.
In an embodiment, the synthesized materials are not milled again but glued or heated to achieve the synthesized format. Once the frequency of a nanomaterial run is established (or a synthesized run) the nanomaterials are placed in a second hopper. The nanoparticles are then processed. Processing can include, for example, preparing for analysis, sample gathering, and packing.
Packaged nanomaterials are conveyed to a neutralizing chamber where the packaged materials can be prepared for exposure to a non-controlled environment. Nanomaterials can be transported to either a storage or to a transport facility. Nanomaterials can be sealed in a protective environment throughout the processing steps to reduce a likelihood of human exposure.
In
In
Numbers of aerodynamic vanes in each row can vary among rows. In an embodiment, outer rows can include more vanes than inner rows. For example, 16 aerodynamic vanes can be included with a separation of 22.5 degrees in an outer row and 12 aerodynamic vanes can be included with a separation of 30 degrees in an inner row.
Granules can be placed in a hopper and collected into a central region of the nano collider core. Material can enter the center region of the nano collider core and be propelled outward. Arrows show a path of material flow from an inner portion of the nano collider core to an outer portion of the nano collider core. Material can, for example, begin in a central region 440, travel passed an inner row including aerodynamic vane 422a, one or more middle rows (e.g., a row including aerodynamic vane 422b, a row including aerodynamic vane 422c, and a row including aerodynamic vane 422d), and an outer row including aerodynamic vane 422e.
An aerodynamic force generated by a motion of the rotating aerodynamic vanes can propel material from the inner portion of the nano collider to the outer portion of the nano collider. A vacuum region can be created on either the inner or outer surface of an aerodynamic vane and thereby a region of high pressure can be created on the opposite aerodynamic vane (e.g., a side of the aerodynamic vane oriented away from or toward the central region). The vacuum region pulls material towards the aerodynamic vanes and the high pressure region pushes material away from aerodynamic vanes. Thus, the vacuum regions and high pressure regions result in complementary aerodynamic forces that both pull and push material, in conjunction with centrifugal and centripetal forces, towards the outer portion or towards the center of the nano collider, depending on vane orientation and pitch, eventually exiting the nano collider at the outer perimeter.
An impact region exists between aerodynamic vanes at systematic intervals in the rotating process. For example, an impact region exists between aerodynamic vanes of adjacent rows (e.g., aerodynamic vanes 422d and 422e) as the aerodynamic vanes pass by one another. Wake effect created by the motion of aerodynamic vanes direct particles to the impact region where the particles collide. Particle size is reduced by causing particle collisions in impact regions among the plurality of rows. Particle flow toward the impact region is discussed below, with reference to
A spacing between aerodynamic vanes can decrease from an inner row to an outer row. Particle sizes can be initially reduced by an inner collision and further reduced by subsequent outer collisions. Decreased spacing between aerodynamic vanes in outer rows can result in progressively smaller particle sizes as particles travel from an inner portion of a nano collider to an outer portion of the nano collider.
At the surface of the airfoil, the pressure exerts a force equal in magnitude and opposite in direction on the air. This pressure affects the air out to a distance of Δy, often many airfoil chord lengths from the surface. Newton's second law in differential form is
dFairfoil=ρ(ds/dt)·(dv/ds)dA dr
where
In
A tilt angle of an aerodynamic vane can be fixed or adjustable. A tilt angle can be adjustable by, for example, adjusting the aerodynamic vane tilt angle on a mechanical bearing. The mechanical bearing can enable the tilt angle to vary along a range of tilt angles. For example, the mechanical bearing can enable one or more aerodynamic vanes to be rotated along tilt angles ranging from approximately zero degrees to approximately 150 degrees (and ranges therebetween) measured from the centerline to the perpendicular line (i.e. 60 degrees to −60 degrees measured from the centerline to the direction of motion). Ranges therebetween measured from the centerline to the perpendicular line can include, for example, approximately 30 degrees to approximately 90 degrees, approximately 45 degrees to approximately 90 degrees, approximately 45 degrees to approximately 60 degrees, approximately 45 degrees to approximately 100 degrees, etc.
The tilt angle can be adjusted while the aerodynamic vane is in motion or while the aerodynamic vane is stationary. For example, a processor can control an actuator (e.g., including a piezoelectric bimorph and/or shape-memory alloy) configured to adjust the mechanical bearing to cause a tilt angle of the aerodynamic vane to change. The tilt angle can be changed based on, for example, a frequency of rotation of the aerodynamic vane (e.g., a revolution per minute), a speed of the aerodynamic vane, an acceleration of the aerodynamic vane, a row of the aerodynamic vane, a size of the aerodynamic vane, a shape of the aerodynamic vane (e.g., symmetric or cambered), a material type intended for milling, insertion of a quantity of material into a nano collider core, a size of a nano collider core, a number of rows of aerodynamic vanes in a nano collider core, or any combination thereof. For example, a steeper tilt angle (e.g., approximately 45 degrees) can be used at slow speeds and a more moderate tilt angle (e.g., approximately 60 degrees) can be used at higher speeds.
In an embodiment, the rotor is configured to receive a plurality of aerodynamic vanes in a plurality of circular rows. For example, the rotor 724 can include a fastener element configured to receive an aerodynamic vane and secure the aerodynamic vane into place. Any or all of the aerodynamic vanes can be secured by fastener elements. For example, fastener elements can be disposed along a plurality of rows to receive the plurality of aerodynamic vanes in the plurality of rows. Fastener elements can be attached to rotation mechanism (e.g., a mechanical bearing, hinge or swivel joint). The rotation mechanism can be used to adjust a tilt angle of an aerodynamic vane. An actuator (e.g., including a shape-memory alloy) can cause the rotation mechanism to rotate around a fixed axis to adjust the tilt angle of the aerodynamic vane.
A first rotor is positioned adjacent to a second rotor. The second rotor can include rows of aerodynamic vanes that fit between rows of aerodynamic vanes of the first rotor. The first rotor and the second rotor can be caused to rotate in different directions. Rotation of the rotors with the aerodynamic vanes can cause particles to travel from an inner region to an outer region on the nano collider core.
The outer region of the nano collider core 1204 includes an outer channel (e.g., outer channel 330). The outer channel directs material toward an exit duct. Material exiting the nano collider core through the exit duct can be redirected into the center region of the nano collider for further processing or directed into a particle programming array 1210.
The particle programming array 1210 can be managed by a particle programming control unit. The particle programming control unit can activate one or more particle programming devices. The particle programming array 1210 can include a plurality of particle programming devices including, for example, an ultrasound generator, a magnetic field generator, and a high voltage frequency generator. The particle programming array 1210 can be electrically connected to a high voltage frequency generator external to the particle programming array 1210. The particle programming devices are discussed further below with respect to
Programmed particles can exit the particle programming array 1210 and enter a particle solidifying chamber 1212. Particles can remain in the particle solidifying chamber for at least a threshold time period. The threshold time period can vary based on one or more particle attributes including, for example, a particle size, composition, temperature, mass, or any combination thereof.
A first nano collider unit includes material input hopper 1501a, nano collider core 1504a, particle sampling system 1506a, particle programming array 1510a, and a particle solidifying chamber 1512a. Output from the nano collider core 1504a can be programmed by the particle programming array 1510a. Programmed output can solidify in solidifying chamber 1512a. Solid programmed particles can leave the solidifying chamber 1512a and be merged with a product line of one or more other nano collider units.
A second nano collider unit includes material input hopper 1501b, nano collider core 1504b, particle sampling system 1506b, particle programming array 1510b, and a particle solidifying chamber 1512b. Output from the nano collider core 1504b can be programmed by the particle programming array 1510b. Programmed output can solidify in solidifying chamber 1512b. Solid programmed particles can leave the solidifying chamber 1512b and be merged with a product line of one or more other nano collider units.
A third nano collider unit includes material input hopper 1501c, nano collider core 1504c, and particle sampling system 1506c. The third unit can lack a particle programming array and a particle solidifying chamber. Accordingly, a crystal lattice structure of output from the third nano collider may not be changed by a particle programming array. Output from the third nano collider can be merged with programmed and/or unprogrammed particles from one or more other nano collider units.
Outputs from one or more nano collider units can be merged. The merged output can be conveyed to a particle programming array 1510d to form particles having a composite hybrid structure. Particles having a composite hybrid structure can be referred to as synthetic particles or as having a synthetic composition. Particles programmed by particle programming array 1510d can be conveyed to solidifying chamber 1512d.
A first nano collider unit includes material input hopper 1601a, nano collider core 1604a, particle sampling system 1606a, particle programming array 1610a, and a particle solidifying chamber 1612a. Output from the nano collider core 1604a can be programmed by the particle programming array 1610a. Programmed output can solidify in solidifying chamber 1612a. Solid programmed particles can leave the solidifying chamber 1612a and be merged with a product line of one or more other nano collider units.
A second nano collider unit includes material input hopper 1601b, nano collider core 1604b, particle sampling system 1606b, particle programming array 1610b, and a particle solidifying chamber 1612b. Output from the nano collider core 1604b can be programmed by the particle programming array 1610b. Programmed output can solidifying in solidifying chamber 1612b. Solid programmed particles can leave the solidifying chamber 1612b and be merged with a product line of one or more other nano collider units.
A third nano collider unit includes material input hopper 1601c, nano collider core 1604c, and particle sampling system 1606c. The third unit can lack a particle programming array and a particle solidifying chamber. Accordingly, a crystal lattice structure of output from the third nano collider may not be changed by a particle programming array. Output from the third nano collider can be merged with programmed and/or unprogrammed particles from one or more other nano collider units.
Outputs from one or more nano collider units can be merged. The merged particle output can be conveyed through one or more additional nano collider units in series. For example, the merged particle output from the first, second, and third nano collider units can be conveyed to a fourth nano collider unit. The fourth nano collider unit can include material input hopper 1601d, nano collider core 1604d, particle sampling system 1606d, particle programming array 1610d, and a particle solidifying chamber 1612d. Output from the nano collider core 1604d can be programmed by the particle programming array 1610d. Programmed output can solidifying in solidifying chamber 1612b. Solid programmed particles can leave the solidifying chamber 1612b and be merged with a product line of one or more other nano collider units. Conveying merged particles through the fourth nano collider unit can result in nanoparticles having a composite hybrid structure. Particles having a composite hybrid structure can be referred to as synthetic particles or as having a synthetic composition.
A portion of particles in a nano collider core (e.g., nano collider core 104 of
One or more suction tubes 1721a can direct particles from the particle sampling array 1761 to the optical sensor array 1706. The optical sensor array includes a group of sensors (e.g., deployed in a certain geometry pattern) that collect light from a group of opposing light sources. The sensors (e.g., electro-optical sensors) can convert light into an electronic signal. Electrical signals from the sensors of the optical sensor array can be transmitted to a computing device (e.g., control unit 1703). An absence of light detected by a sensor among the group of sensors can be determined to be obstructed by a particle. Adjacent sensors having a lack of light can be used to determine a size of a particle and/or a shape of a particle. For example, data indicative of a distance between adjacent sensors (e.g., a distance of 5 nm) can be stored in a database accessible to control unit 1703. Based on the data indicative of the distance between adjacent sensors and the identified sensors having an absence of light at a moment in time, the control unit 1703 can determine a size of a particle.
One or more suction tubes 1721b can direct particles from the optical sensor array 1706 to the particle separator 1762. The particle separator 1762 can extract particles from the passing flow.
The material exit hub distributes the material from the particle separator 1762 according to program specifications, i.e. either back to the nano collider for yet another run, or to storage unit 1709, particle programming, the particle solidifying chamber 1712, or particle packaging.
The remainder of the particle flow passing through the particle separator 1762 is either funneled back to the nano collider core, or directly to the particle programming array and possibly the particle solidifying chamber 1712. An additional option is to funnel particles directly to storage unit 1709 or packaging. An optional extraction route from the particle programming array is directly to storage unit 1709 or packaging.
A portion of the material in the nano collider core 1904 can be recycled back into the nano collider core 1904. Another portion of material in the nano collider core 1904 can be directed to a particle sampling system 1906. A blower 1905 can be used to cause material to flow from the nano collider core 1904 to the particle sampling system 1906. The particle sampling system 1906 can include an optical sensor array, particle sampling array, and a particle separator 1908. Control unit 1903 can manage components (e.g., any of the optical sensor array, the particle sampling array, and the particle separator array) of the particle sampling system 1906.
Material directed through the particle sampling system 1906 can be directed to the nano collider core 1904, a solidifying chamber, a storage chamber, the particle separator 1908 (e.g., a membrane), and/or a particle programming array 1910. Particle separator 1908 can be used to filter and separate constituents of a material. Portions of material (e.g., particles exceeding a particular size threshold) can be returned to material input hopper 1901 to cycle through the nano collider core 1904 again. For example, blower 1913 can utilize compressor 1914 to direct the portions of material toward material input hopper 1901. Other portions of material (e.g., particles under the particular size threshold) can be directed to a particle storage unit 1909 and/or the particle programming array 1910. For example, a blower powered by a compressor can direct the material toward the particle storage unit 1909 and/or the particle programming array 1910.
Particle programming array 1910 can include an ultrasound generator 1918, a magnetic field generator 1919, and a high voltage frequency generator 1920. Control unit 1911 can manage components (e.g., an ultrasound generator 1918, a magnetic field generator 1919, and a high voltage frequency generator 1920) of the particle programming array. Gas tank 1902 can be used to control atmospheric pressure and/or composition within the particle programming array 1910. Various embodiments of a particle programming array are discussed further below with reference to
In an embodiment, particles solidified in particle solidifying chamber 1912 can be packaged or integrated into a product via particle packaging unit 1917. In another embodiment, particles solidified in particle solidifying chamber 1912 can be further processed.
Material directed through the particle sampling system 2006 can be directed to the nano collider core 2004, a solidifying chamber, a storage chamber, and/or a particle programming array. Particle separator 2008 can be used to filter and separate constituents of a material. Portions of material (e.g., particles exceeding a particular size threshold) can be returned to material input hopper to cycle through the nano collider core 2004 again. For example, a compressor 2014 can direct the portions of material toward the nano collider core 2004. Other portions of material (e.g., particles under the particular size threshold) can be directed to a particle storage unit 2009 and/or the particle programming array. For example, a blower powered by a compressor can direct the material toward the particle storage unit 2009 and/or the particle programming array 2010. Other portions of material can be released through a sampling valve 2016, for example, for further testing and/or to be routed to other components in the system.
The shape of the nanoparticles produced by the nano collider core can be chaotic and not structurally organized. Increasing the electron charge potential can be achieved by crashing particles into nano sizes. The electrical potential and the zeta potential can be changed to reprogram the particles.
Immediately after crushing the material down to nanoparticles, the crystal lattice is soft for a brief time until it hardens, depending on the material. This is important for the processing the crystal lattice structure of the nanomaterials and changing their physical behavior.
The process can include applying a pulsating magnetic field based on a calculated algorithm from an adjustable frequency generator with a modulated pulse where the shape of the signal is adjusted through a signal generator.
The process can include applying sound waves which have a frequency and decibel level based on a material type and size. The material retains the structural changes as it hardens.
When two or more materials that have been treated this way and their frequency adjusted to specifications, a resonance frequency inside of the crystal structure lattice of the material is created. The material remembers this resonance frequency and when one or more materials are stacked, an interaction in the form of released electrons due to the instability of the designed frequencies. The material has a tendency to reach equilibrium and since each of the materials has a different frequency, they are constantly exchanging electrons.
The particle programming array can be equipped with an ultrasonic sound generator which is applied to the soft newly milled material to influence its crystal lattice as it hardens. The particle programming array can be equipped with a magnetic pulse generator which is applied to the soft newly milled material to influence its crystal lattice as it hardens. The particle programming array can be equipped with an high voltage generator which is applied to the soft newly milled material to influence its crystal lattice as it hardens.
The application of the three intrusive forces (e.g., sound, voltage, and magnetic pulse) interfere with the hardening process, influencing the form of the materials and manipulating their crystal lattice frequency. An exit point of the particle programming array can lead to a particle solidifying chamber where the particles are left to harden and bond.
Absorption of ultrasound in nano-composite materials during the application of an external magnetic field is considered in this interaction of acoustic waves with crystal lattices of a given material. Absorption depends on many factors such as the type of the crystal lattice, meaning the sum of physical characteristics of the bonds inside the crystal lattice of given material, for example, temperature, frequency, elasticity of lattice, and its sound absorbing properties. For measurement and calculation of the coefficient of ultrasound absorption it is necessary to estimate the interaction of acoustic phonons with thermal phonons and electrons of investigated crystalline material. Application of an external magnetic field on a given material leads to the appearance of magnons that interact with the crystal lattice. This results the ratio of “acoustic phonon Vs. thermal phonon” and, accordingly, sound absorption, both quantitatively increasing.
Ultrasound (high frequency acoustic wave) absorption in the crystal lattices occurs as result of phonon interactions and electron-phonon interactions.
In the first case, acoustic phonon interacts with thermal phonon of lattice oscillations of the crystal lattice. Sound absorption coefficient depends on the rate of decrease of the phonons of sound mode in the collision of acoustic and thermal phonons. During such interaction acoustic phonon disappears and a third phonon is formed.
In the second case, acoustic phonon is absorbed by free electron. Electron-phonon interactions take place in the crystal lattices of metals. For the latter phonon-phonon interactions also cannot be excluded.
Investigations showed that sound absorption has a different nature for the crystal lattices of dielectrics and metals. From the calculation of coefficient of ultrasound absorption in the crystal lattice based on phonon theory, it follows that the coefficient of ultrasound absorption and depends on the energy of the acoustic phonon, the number of thermal phonons of lattice vibrations, the temperature and the type of crystal lattice. It was found that an increase in temperature and type of crystal lattice appreciably affect ultrasound absorption.
Nano-composite materials are dependent on the temperature of the crystal lattice of nanoparticles. Sound absorbing properties of the nanoparticles can be controlled by changing or manipulating their composition. Application of an alternating magnetic field on nano-composite material leads to an additional increase in ultrasound absorption. A change in the composition of nanoparticles can in turn, affect their magnetic properties, such as magnetic viscosity.
Measurement of velocity of bulk acoustic waves on Nano-composite materials showed that applying an external magnetic field decreased the speed of applied acoustic waves. An increase in velocity of acoustic wave causes increase in sound absorption of given material. Application of an external magnetic field (on magnetic field dependent materials) changes their acoustic characteristics, including the material sound absorbing properties.
Quanta of magnetic energy (magnons) absorbed in the investigated material increase the vibrational heat energy of crystal lattice and, consequently, the number of thermal phonons. This, in turn, influences further interaction of acoustic phonons with thermal phonons, and results in an increase in sound absorption. Obtained results confirm an increase in velocity of the acoustic wave with frequency of sound and with an increase in the amount of external magnetic field.
An application of a pulsing magnetic field on given nanomaterial makes the crystal lattice pliable for manipulation by exposing the material to high frequency acoustic waves.
Using a given nanoparticle, the process described above does can affect the nanoparticle as a whole. It does not matter if the nanoparticle is monolithic or composite (i.e. synthesized). It is natural for the crystal lattice (i.e. the behavior of the sum of its bonds) to balance out outside influences (in this case the application of a high frequency acoustic wave) until it reaches a state of stability (equilibrium).
Application of a high frequency acoustic waves to a given material is used to modulate the vibration of the bonds inside its crystal lattice (which in turn can result with and be used for the purpose of changing the architecture of the crystal lattice of given material), but each materials crystal lattices bonds have a different spectrum of tolerance to vibrations that they can attain. This scale is linear—there is a highest and a lowest point on the numerical hertz scale that the bonds inside a given material can vibrate before it breaks, the breakage occurring when either the upper or lower limit has been passed. For this reason different materials (nanoparticles of different chemical compositions) are used as carriers for different “information” (i.e. information meaning a specific frequency at which to modulate a material).
Various applications for formed nanoparticles are contemplated. For example, nanoparticles formed by the process described herein can be used to comprise an electrochemical cell. Embodiments of various applications are described below.
Embodiments include forming an electrochemical cell using a nanoparticle-polymer mixture. Nanoparticles can be mixed with conductive polymers to form the nanoparticle-polymer mixture. The nanoparticle-polymer mixture may be applied to a porous material (e.g., paper or cloth). Porous material loaded with the nanoparticle-polymer mixture can be rolled to form a battery cell or contoured to form various shapes. The electrochemical cell including nanoparticles may have a low-toxicity due to reduced dependence on certain chemical formulations common in conventional electrochemical cells. The electrochemical cell including nanoparticles may be safer for consumers and more environmentally-friendly than conventional electrochemical cells.
Embodiments include incorporating nanoparticles in an electrochemical cell. Nanoparticles can be included in a primary and/or secondary battery cell. Improved batteries with nanomaterial ingredients last longer and take less time to charge and recharge as reduction—oxidation reaction is amplified (when applicable) due to the increased surface area of the chemical species.
Embodiments include a shape molding method to form an electrochemical cell designed for incorporation into a product (referred to as a “unibody battery”). The unibody battery can be formed, for example, as a structural component of a product or into any shape for use in a product. A unibody battery designed as part of a structure can be, for example, three-dimensionally (“3D”) printed into structural shapes. The unibody battery can be used as a structural component, for example, in a vehicle (e.g., chassis of a car, airframe of an airplane, superstructure of a ship, drone exoskeleton, primary structure and secondary fairings of a satellite, etc.) or a building (e.g., a cinder block, load-bearing beam, floor tile, etc.). The concept includes 3D printing a variety of building materials in, for example, residential, commercial, and industrial building construction. Unibody batteries can include mixing nanomaterials into the frame or fuselage of a vehicle or device which is powered by the battery. A unibody battery can be formed into any shape including, for example, stacked layers of nanomaterials designed to form a specific functional design or structural shape. Examples include stacked layers configured to fit into the floor compartment of an electric vehicle, form the structural body of a vehicle or a plurarity of body parts that collectively form a body of a vehicle or parts thereof, an enclosure of a cell phone, a frame or step pad of an electric scooter, or roof of a golf cart.
Brief definitions of terms, abbreviations, and phrases used throughout this application are given below.
Reference in this specification to “one embodiment” or “an embodiment” means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the disclosure. The appearances of the phrase “in one embodiment” in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Moreover, various features are described that may be exhibited by some embodiments and not by others. Similarly, various requirements are described that may be requirements for some embodiments but not others.
Unless the context clearly requires otherwise, throughout the description and the claims, the words “comprise,” “comprising,” and the like are to be construed in an inclusive sense, as opposed to an exclusive or exhaustive sense; that is to say, in the sense of “including, but not limited to.” As used herein, the terms “connected,” “coupled,” or any variant thereof, means any connection or coupling, either direct or indirect, between two or more elements. The coupling or connection between the elements can be physical, logical, or a combination thereof. For example, two devices may be coupled directly, or via one or more intermediary channels or devices. As another example, devices may be coupled in such a way that information can be passed therebetween, while not sharing any physical connection with one another. Additionally, the words “herein,” “above,” “below,” and words of similar import, when used in this application, shall refer to this application as a whole and not to any particular portions of this application. Where the context permits, words in the Detailed Description using the singular or plural number may also include the plural or singular number respectively. The word “or,” in reference to a list of two or more items, covers all of the following interpretations of the word: any of the items in the list, all of the items in the list, and any combination of the items in the list.
If the specification states a component or feature “may,” “can,” “could,” or “might” be included or have a characteristic, that particular component or feature is not required to be included or have the characteristic.
The term “module” refers broadly to software, hardware, or firmware components (or any combination thereof). Modules are typically functional components that can generate useful data or another output using specified input(s). A module may or may not be self-contained. An application program (also called an “application”) may include one or more modules, or a module may include one or more application programs.
The terminology used in the Detailed Description is intended to be interpreted in its broadest reasonable manner, even though it is being used in conjunction with certain examples. The terms used in this specification generally have their ordinary meanings in the art, within the context of the disclosure, and in the specific context where each term is used. For convenience, certain terms may be highlighted, for example using capitalization, italics, and/or quotation marks. The use of highlighting has no influence on the scope and meaning of a term; the scope and meaning of a term is the same, in the same context, whether or not it is highlighted. It will be appreciated that the same element can be described in more than one way.
Consequently, alternative language and synonyms may be used for any one or more of the terms discussed herein, but special significance is not to be placed upon whether or not a term is elaborated or discussed herein. A recital of one or more synonyms does not exclude the use of other synonyms. The use of examples anywhere in this specification, including examples of any terms discussed herein, is illustrative only and is not intended to further limit the scope and meaning of the disclosure or of any exemplified term. Likewise, the disclosure is not limited to various embodiments given in this specification.
In the example of
This disclosure contemplates the computer system 2200 taking any suitable physical form. As example and not by way of limitation, computer system 2200 can be an embedded computer system, a system-on-chip (SOC), a single-board computer system (SBC) (such as, for example, a computer-on-module (COM) or system-on-module (SOM)), a desktop computer system, a laptop or notebook computer system, an interactive kiosk, a mainframe, a mesh of computer systems, a mobile telephone, a personal digital assistant (PDA), a server, or a combination of two or more of these. Where appropriate, computer system 2200 can include one or more computer systems 2200; be unitary or distributed; span multiple locations; span multiple machines; or reside in a cloud, which can include one or more cloud components in one or more networks. Where appropriate, one or more computer systems 2200 can perform without substantial spatial or temporal limitation one or more steps of one or more methods described or illustrated herein. As an example and not by way of limitation, one or more computer systems 2200 can perform in real time or in batch mode one or more steps of one or more methods described or illustrated herein. One or more computer systems 2200 can perform at different times or at different locations one or more steps of one or more methods described or illustrated herein, where appropriate.
The processor can be, for example, a conventional microprocessor such as an Intel Pentium microprocessor or Motorola PowerPC microprocessor. One of skill in the relevant art can recognize that the terms “machine-readable (storage) medium” or “computer-readable (storage) medium” include any type of device that is accessible by the processor.
The memory is coupled to the processor by, for example, a bus. The memory can include, by way of example but not limitation, random access memory (RAM), such as dynamic RAM (DRAM) and static RAM (SRAM). The memory can be local, remote, or distributed.
The bus also couples the processor to the non-volatile memory and drive unit. The non-volatile memory is often a magnetic floppy or hard disk, a magnetic-optical disk, an optical disk, a read-only memory (ROM), such as a CD-ROM, EPROM, or EEPROM, a magnetic or optical card, or another form of storage for large amounts of data. Some of this data is often written, by a direct memory access process, into memory during execution of software in the computer system 2200. The non-volatile storage can be local, remote, or distributed. The non-volatile memory is optional because systems can be created with all applicable data available in memory. A typical computer system can usually include at least a processor, memory, and a device (e.g., a bus) coupling the memory to the processor.
Software is typically stored in the non-volatile memory and/or the drive unit. Indeed, storing an entire large program in memory may not be possible. Nevertheless, it should be understood that for software to run, if necessary, it is moved to a computer readable location appropriate for processing, and for illustrative purposes, that location is referred to as the memory in this paper. Even when software is moved to the memory for execution, the processor can typically make use of hardware registers to store values associated with the software, and local cache that, ideally, serves to speed up execution. As used herein, a software program is assumed to be stored at any known or convenient location (from non-volatile storage to hardware registers) when the software program is referred to as “implemented in a computer-readable medium.” A processor is considered to be “configured to execute a program” when at least one value associated with the program is stored in a register readable by the processor.
The bus also couples the processor to the network interface device. The interface can include one or more of a modem or network interface. It can be appreciated that a modem or network interface can be considered to be part of the computer system 2200. The interface can include an analog modem, ISDN modem, cable modem, token ring interface, satellite transmission interface (e.g., “direct PC”), or other interfaces for coupling a computer system to other computer systems. The interface can include one or more input and/or output devices. The I/O devices can include, by way of example but not limitation, a keyboard, a mouse or other pointing device, disk drives, printers, a scanner, and other input and/or output devices, including a display device. The display device can include, by way of example but not limitation, a cathode ray tube (CRT), liquid crystal display (LCD), or some other applicable known or convenient display device. For simplicity, it is assumed that controllers of any devices not depicted in the example of
In operation, the computer system 2200 can be controlled by operating system software that includes a file management system, such as a disk operating system. One example of operating system software with associated file management system software is the family of operating systems known as Windows® from Microsoft Corporation of Redmond, Wash., and their associated file management systems. Another example of operating system software with its associated file management system software is the Linux™ operating system and its associated file management system. The file management system is typically stored in the non-volatile memory and/or drive unit and causes the processor to execute the various acts utilized by the operating system to input and output data and to store data in the memory, including storing files on the non-volatile memory and/or drive unit.
Some portions of the detailed description can be presented in terms of algorithms and symbolic representations of operations on data bits within a computer memory. These algorithmic descriptions and representations are the means used by those skilled in the data processing arts to most effectively convey the substance of their work to others skilled in the art. An algorithm is here, and generally, conceived to be a self-consistent sequence of operations leading to a desired result. The operations are those requiring physical manipulations of physical quantities. Usually, though not necessarily, these quantities take the form of electrical or magnetic signals capable of being stored, transferred, combined, compared, and otherwise manipulated. It has proven convenient at times, principally for reasons of common usage, to refer to these signals as bits, values, elements, symbols, characters, terms, numbers, or the like.
It should be borne in mind, however, that all of these and similar terms are to be associated with the appropriate physical quantities and are merely convenient labels applied to these quantities. Unless specifically stated otherwise as apparent from the following discussion, it is appreciated that throughout the description, discussions utilizing terms such as “processing” or “computing” or “calculating” or “determining” or “displaying” or “generating” or the like, refer to the action and processes of a computer system, or similar electronic computing device, that manipulates and transforms data represented as physical (electronic) quantities within the computer system's registers and memories into other data similarly represented as physical quantities within the computer system memories or registers or other such information storage, transmission or display devices.
The algorithms and displays presented herein are not inherently related to any particular computer or other apparatus. Various general purpose systems can be used with programs in accordance with the teachings herein, or it can prove convenient to construct more specialized apparatus to perform the methods of some embodiments. The utilized structure for a variety of these systems can appear from the description below. In addition, the techniques are not described with reference to any particular programming language, and various embodiments can thus be implemented using a variety of programming languages.
In alternative embodiments, the machine operates as a standalone device or can be connected (e.g., networked) to other machines. In a networked deployment, the machine can operate in the capacity of a server or a client machine in a client-server network environment, or as a peer machine in a peer-to-peer (or distributed) network environment.
The machine can be a server computer, a client computer, a personal computer (PC), a tablet PC, a laptop computer, a set-top box (STB), a personal digital assistant (PDA), a cellular telephone, an iPhone, a Blackberry, a processor, a telephone, a web appliance, a network router, switch or bridge, or any machine capable of executing a set of instructions (sequential or otherwise) that specify actions to be taken by that machine.
While the machine-readable medium or machine-readable storage medium is shown in an exemplary embodiment to be a single medium, the term “machine-readable medium” and “machine-readable storage medium” should be taken to include a single medium or multiple media (e.g., a centralized or distributed database, and/or associated caches and servers) that store the one or more sets of instructions. The term “machine-readable medium” and “machine-readable storage medium” shall also be taken to include any medium that is capable of storing, encoding or carrying a set of instructions for execution by the machine and that cause the machine to perform any one or more of the methodologies or modules of the presently disclosed technique and innovation.
In general, the routines executed to implement the embodiments of the disclosure, can be implemented as part of an operating system or a specific application, component, program, object, module or sequence of instructions referred to as “computer programs.” The computer programs typically comprise one or more instructions set at various times in various memory and storage devices in a computer, and that, when read and executed by one or more processing units or processors in a computer, cause the computer to perform operations to execute elements involving the various aspects of the disclosure.
Moreover, while embodiments have been described in the context of fully functioning computers and computer systems, those skilled in the art can appreciate that the various embodiments are capable of being distributed as a program product in a variety of forms, and that the disclosure applies equally regardless of the particular type of machine or computer-readable media used to actually effect the distribution.
Further examples of machine-readable storage media, machine-readable media, or computer-readable (storage) media include but are not limited to recordable type media such as volatile and nonvolatile memory devices, floppy and other removable disks, hard disk drives, optical disks (e.g., Compact Disk Read-Only Memory (CD ROMS), Digital Versatile Disks, (DVDs), etc.), among others, and transmission type media such as digital and analog communication links.
In some circumstances, operation of a memory device, such as a change in state from a binary one to a binary zero or vice-versa, for example, can comprise a transformation, such as a physical transformation. With particular types of memory devices, such a physical transformation can comprise a physical transformation of an article to a different state or thing. For example, but without limitation, for some types of memory devices, a change in state can involve an accumulation and storage of charge or a release of stored charge. Likewise, in other memory devices, a change of state can comprise a physical change or transformation in magnetic orientation or a physical change or transformation in molecular structure, such as from crystalline to amorphous or vice versa. The foregoing is not intended to be an exhaustive list in which a change in state for a binary one to a binary zero or vice-versa in a memory device can comprise a transformation, such as a physical transformation. Rather, the foregoing is intended as illustrative examples.
A storage medium typically can be non-transitory or comprise a non-transitory device. In this context, a non-transitory storage medium can include a device that is tangible, meaning that the device has a concrete physical form, although the device can change its physical state. Thus, for example, non-transitory refers to a device remaining tangible despite this change in state.
The foregoing description of various embodiments of the claimed subject matter has been provided for the purposes of illustration and description. It is not intended to be exhaustive or to limit the claimed subject matter to the precise forms disclosed. Many modifications and variations will be apparent to one skilled in the art. Embodiments were chosen and described in order to best describe the principles of the invention and its practical applications, thereby enabling others skilled in the relevant art to understand the claimed subject matter, the various embodiments, and the various modifications that are suited to the particular uses contemplated.
While embodiments have been described in the context of fully functioning computers and computer systems, those skilled in the art will appreciate that the various embodiments are capable of being distributed as a program product in a variety of forms, and that the disclosure applies equally regardless of the particular type of machine or computer-readable media used to actually effect the distribution.
Although the above Detailed Description describes certain embodiments and the best mode contemplated, no matter how detailed the above appears in text, the embodiments can be practiced in many ways. Details of the systems and methods may vary considerably in their implementation details, while still being encompassed by the specification. As noted above, particular terminology used when describing certain features or aspects of various embodiments should not be taken to imply that the terminology is being redefined herein to be restricted to any specific characteristics, features, or aspects of the invention with which that terminology is associated. In general, the terms used in the following claims should not be construed to limit the invention to the specific embodiments disclosed in the specification, unless those terms are explicitly defined herein. Accordingly, the actual scope of the invention encompasses not only the disclosed embodiments, but also all equivalent ways of practicing or implementing the embodiments under the claims.
The language used in the specification has been principally selected for readability and instructional purposes, and it may not have been selected to delineate or circumscribe the inventive subject matter. It is therefore intended that the scope of the invention be limited not by this Detailed Description, but rather by any claims that issue on an application based hereon. Accordingly, the disclosure of various embodiments is intended to be illustrative, but not limiting, of the scope of the embodiments, which is set forth in the following claims.
This application is a continuation-in-part of U.S. patent application Ser. No. 15/712,856, entitled “APPARATUS AND METHOD FOR FORMING NANOPARTICLES”, filed on Sep. 22, 2017, and claims the benefit of U.S. Provisional Application No. 62/463,518, entitled “APPARATUS AND METHOD FOR FORMING NANOPARTICLES AND APPLICATIONS THEREOF,” filed on Feb. 24, 2017, both of which are incorporated herein by reference in their entirety.
| Number | Date | Country | |
|---|---|---|---|
| 62463518 | Feb 2017 | US |
| Number | Date | Country | |
|---|---|---|---|
| Parent | 15712856 | Sep 2017 | US |
| Child | 15814043 | US |
