The present invention relates to embodiments of apparatus and methods for heating objects, such as foodstuffs, with microwaves. In particular, the present invention relates to the use of microwave heating for pasteurizing and/or sterilizing foodstuffs.
In food processing, foodstuffs can be pasteurized and/or sterilized to reduce the occurrence of food-borne diseases caused by harmful microorganisms. Pasteurization involves heating foodstuffs to a temperature, typically between 80° C. to 100° C., sufficient to kill certain pathogenic bacteria and microorganisms. In sterilization, foodstuffs are heated to a higher temperature, typically between 100° C. to 140° C., to ensure elimination of more resistant microorganisms. Sterilization allows normally perishable foodstuffs to be stored at room temperature for extended periods of time. Sterilized foodstuffs distributed for long-term preservation at room temperature are known as “shelf-stable” foods.
Traditional methods for pasteurizing and sterilizing foodstuffs involve the use of conventional heating processes (i.e., heating via the transfer of thermal energy from a high-temperature medium to a low-temperature substance), such as heating foodstuffs with hot air, hot water, or vapor. More recently, microwave heating has been employed for pasteurizing and sterilizing foodstuffs. Microwave heating is advantageous in that pasteurization and/or sterilization can be achieved in a much shorter time than is possible by conventional heating processes. By decreasing sterilization time, foodstuffs generally taste better and nutrient retention is improved. In addition, microwave systems typically are more energy-efficient than conventional heating systems.
However, attempts at commercializing microwave pasteurization and sterilization processes have had limited success. Some reasons for the lack of success in commercial operation are complexity, expense, non-uniformity of heating, and inability to ensure sterilization of the entire package. Thus, a need exists for new apparatus for pasteurizing and/or sterilizing foodstuffs, and methods for their use.
The present disclosure concerns microwave heating, and in particular, apparatus and methods for pasteurizing and/or sterilizing foodstuffs in the food processing industry.
In one representative embodiment, an apparatus for pasteurizing or sterilizing a packaged foodstuff includes at least one cavity in which the foodstuff to be pasteurized or sterilized is positioned. The cavity is configured such that, as microwave energy radiates into the cavity, the cavity operates as a single-mode cavity for sterilizing or pasteurizing the foodstuff.
In another representative embodiment, an apparatus for heating an object utilizing microwaves includes at least one cavity for receiving the object to be heated. The cavity comprises a liquid-tight cavity and has first and second microwave-transparent windows on opposing sides thereof. A first applicator is positioned adjacent the first microwave-transparent window for directing microwaves into the cavity in a first direction. A second applicator is positioned adjacent the second microwave-transparent window for directing microwaves into the cavity in a second direction opposite the first direction. A pressurized-liquid source is configured to deliver a pressurized liquid to the cavity for immersing the object in the liquid during microwave heating.
In still another representative embodiment, a system for pasteurizing or sterilizing a packaged foodstuff utilizing microwaves includes a pre-heating section for pre-heating the foodstuff using conventional heating. A microwave-heating section is provided for heating the foodstuff for a predetermined time period using microwave heating. The microwave-heating section includes at least one microwave cavity that is operable as a single-mode cavity when microwaves are directed into the cavity for heating the foodstuff. The system also includes a holding section and a cooling section downstream of the microwave-heating section. In the holding section, the foodstuff is heated to substantially maintain the pasteurization or sterilization temperature of the foodstuff until the foodstuff is pasteurized or sterilized. In the cooling section, the foodstuff is cooled to a reduced temperature (e.g., about room temperature) for further handling or processing.
In another representative embodiment, a method for pasteurizing or sterilizing a packaged foodstuff includes placing the foodstuff in a microwave cavity, propagating microwaves into the cavity so as to establish a single-mode microwave energy desposition in the cavity, and heating the foodstuff with the microwaves to either pasteurize or sterilize the foodstuff.
In another representative embodiment, a method for processing a packaged foodstuff includes placing the foodstuff in a microwave cavity and pressurizing the inside of the microwave cavity with a liquid. Microwaves are then simultaneously propagated into the cavity in first and second, opposing directions so that microwaves are absorbed on at least two sides of the foodstuff.
In another representative embodiment, an apparatus for heating an object utilizing microwaves comprises at least a first and a second microwave cavity. The first cavity is in communication with the second cavity. A first waveguides is configured to direct microwaves into the first cavity to establish a first mode therein. A second waveguide is configured to direct microwaves into the second cavity to establish a second mode therein. The first mode is different than the second mode. Thus, an object, such as a foodstuff, being conveyed through the cavities is exposed to two different modes or field configurations.
The foregoing and other features and advantages of the invention will become more apparent from the following detailed description of several embodiments, which proceeds with reference to the accompanying figures.
a is a schematic illustration showing the field distribution and wave-propagation characteristics of the fundamental mode of a rectangular waveguide.
b is a schematic illustration of a rectangular waveguide coupled to a rectangular microwave cavity having a greater cross-sectional area than the waveguide.
a-15f illustrate computer-simulated field-distribution characteristics in two different planes for various lengths of the cavity of
a-16f illustrate computer-simulated field-distribution characteristics in two different planes for various widths of the cavity of
a-17d illustrate computer-simulated field-distribution characteristics for various lengths and widths of the cavity of
a-18f illustrate computer-simulated field-distribution characteristics for various lengths and depths of the cavity of
a and 20b illustrate computer-simulated power-deposition profiles over the top surface of the load shown in
a and 21b show experimental power-deposition profiles over a wet piece of paper placed that was heated in the middle of a rectangular cavity having a depth of 150 mm (
a and 22b show experimental power-deposition profiles over a surface of a food package placed in a rectangular cavity when surrounded by air (
a-23d show the return loss of different cavities in the frequency range of 700 to 1200 MHz under different operating conditions.
a is a schematic illustration of a system having a horn-shaped applicator coupling a rectangular waveguide to a rectangular microwave cavity.
b is a computer simulation of the propagation characteristics of the fundamental mode in the applicator and waveguide shown in
a is a computer simulation of the power-deposition profile over the top surface of a load heated in the cavity of
b is a computer simulation of the power-deposition profile over the bottom surface of a load heated in the cavity of
a is a computer simulation of the propagation characteristics of the fundamental mode in the system shown in
b is a computer-simulated thermal representation of the fundamental mode in the system of
a is a computer simulation of the propagation characteristics of the fundamental mode in the system shown in
b is a computer-simulated thermal representation of the fundamental mode in the system of
a is a computer simulation of the propagation characteristics of the fundamental mode in the system shown in
b is a computer-simulated thermal representation of the fundamental mode in the system of
a and 31b are computer-simulated power-deposition profiles over the top surface (
a and 32b are computer-simulated power-deposition profiles over the top surface (
a and 33b are computer-simulated power-deposition profiles over the top surface (
a-38c are computer-simulated power-deposition profiles over the top surface of three differently sized loads heated in the system of
a-39d are computer-simulated power-deposition profiles over the top surface of a load at four different temperatures.
a and 40b show the return loss of the system of
As used herein, the singular forms “a,” “an,” and “the” refer to one or more than one, unless the context clearly dictates otherwise.
As used herein, the term “includes” means “comprises.”
As used herein, a group of individual members stated in the alternative includes embodiments relating to a single member of the group or combinations of multiple members. For example, the term “applicator, cavity, or waveguide,” includes embodiments relating to “applicator,” “cavity,” “waveguide,” “applicator and cavity,” “applicator and waveguide,” “cavity and waveguide,” and “applicator, cavity, and waveguide.”
System for Pasteurizing and/or Sterilizing Foodstuffs
In some embodiments, the system 10 is configured as a continuous-feed system, in which foodstuffs placed in the pre-heating section 12 are automatically conveyed by one or more conveyors or similar mechanism through the pre-heating section 12, the microwave-heating section 14, the holding section 16, the cooling section 18, and the unloading section where foodstuffs are removed from the system for further processing or packaging. The system 10 can include gates or doors positioned between adjacent sections to provide a barrier between the atmospheres in adjacent chambers. The gates of a chamber can be controlled to remain closed while a foodstuff is in the chamber, and to open long enough to allow the foodstuff to be conveyed into an adjacent chamber.
In the pre-heating section 12, a foodstuff is heated using conventional heating to raise the temperature of the foodstuff to a prescribed temperature, which can be, for example, a temperature in the range of about 40° C. to 90° C. In particular embodiments, the pre-heating section comprises a chamber (not shown), in which the foodstuff is exposed to a heating medium, such as hot water, steam, or hot air. In the microwave-heating section 14, the foodstuff is heated in a microwave cavity (described below) using microwave energy to further raise the temperature of the foodstuff to a prescribed end temperature at which pasteurization and/or sterilization can occur (e.g., 80° C. to 100° C. if the foodstuff is to be pasteurized or 100° C. to 140° C. if the foodstuff is to be sterilized). Of course, since sterilization occurs at a higher temperature than pasteurization, a foodstuff that is sterilized will also be pasteurized.
In the holding section 16, the temperature of the foodstuff is maintained at the end temperature for a period of time sufficient to ensure pasteurization or sterilization of the foodstuff. Microwave energy and/or conventional heating can be used to maintain the temperature of the foodstuff in the holding section 16. For example, in particular embodiments, the holding section comprises a chamber in which the foodstuff is exposed to a heating medium, such as hot water, steam, or hot air, and is irradiated with microwave energy.
In the cooling section 18, the foodstuff is exposed to a cooling medium (e.g., a flow of water or air) to bring the temperature of the foodstuff down to a reduced temperature (e.g., room temperature) for further processing or handling.
In particular embodiments, one or more of the pre-heating section 12, the microwave-heating section 14, the holding section 16, and the cooling section 18 comprise pressure-tight and fluid-tight chambers that are pressurized to balance the vapor pressure generated in the package containing the foodstuff, and therefore prevent bursting or opening of the package. In certain embodiments, chambers pressurized to about 30 psig were suitable to prevent bursting or opening of the food package. However, the pressure in each section can be varied depending on the temperature of the foodstuff in each section and other process variables.
Pressurization in any section of the system 10 can be achieved in any suitable manner. For example, the heating or cooling medium of a particular section of the system 10 can be used to pressurize that section of the system 10. In one embodiment, for example, the microwave-heating section 14 comprises a pressure-tight and fluid-tight chamber having an inlet for receiving a pressurized fluid (e.g., hot water, steam, or other heating medium) and an outlet for discharging the pressurized fluid. The pressurized fluid serves to pressurize the inside of the chamber, thereby preventing the foodstuff from bursting, and to assist in heating the foodstuff.
In other embodiments, the atmosphere inside a chamber can be pressurized with a compressed gas (e.g., air), in which case a separate heating/cooling medium may be used for heating/cooling the foodstuff. Also, in such embodiments, since a separate fluid is used to pressurize the chamber, the heating/cooling medium itself can be non-pressurized. In one implementation, for example, the pre-heating section 12 comprises an air-tight chamber that is pressurized with compressed air. To heat the foodstuff, the foodstuff is immersed in a heating medium (e.g., a pool of hot water) inside the chamber.
In alternative embodiments, one or more of the pre-heating section, holding section, or cooling sections can be eliminated. Also, additional sections can be added to the system 10. In particular embodiments, for example, foodstuffs can be heated in an equilibration section (not shown) following heating in the microwave-heating section 14 and prior to heating in the holding section 16. In the equilibration section, the foodstuff is exposed to a heating medium (e.g., hot air) to equilibrate the temperatures and reduced uniformities within the foodstuff.
Embodiments of Microwave-Heating Apparatus
Embodiments of microwave-heating apparatus that can be implemented in a pasteurization/sterilization system, such as the system 10 of
Referring to
In an alternative embodiment, the second waveguide 56 can be replaced with a reflector (e.g., a metal plate) positioned opposite the first waveguide 54. In this alternative embodiment, microwaves propagating into the cavity and not absorbed by the foodstuff 74 are reflected back in the opposite direction toward the first waveguide 54.
A single microwave source can be used for supplying microwaves to both the first and second waveguides 54, 56. Alternatively, a separate microwave source can be used for supplying each waveguide 54, 56. In any event, the microwave source(s) (not shown) can be any suitable mechanism that produces electromagnetic radiation in the microwave range. Without limitation, the microwave source(s) can be, for example, one or more magnetrons, klystrons, electronic oscillators, and/or solid-state sources.
The waveguide 54 includes a first waveguide section 58 and a second waveguide section 60, both coupled to respective sources or to a single source. The second waveguide section 60 has an enlarged end 62 adjacent one side of the cavity 52 (which is the top side of the cavity 52 in the illustrated embodiment). Similarly, the waveguide 56 includes a first waveguide section 64 coupled to the microwave source and a second waveguide section 66. The second waveguide section 66 has an enlarged end 68 adjacent the side of the cavity 52 opposite waveguide section 60 of the first waveguide 54 (which is the bottom side of the cavity 52 in the illustrated embodiment). The waveguide sections 60, 66 can be referred to as “microwave applicators” because they apply or direct microwaves into the cavity 52. As shown, the waveguide sections 60, 66 are positioned to direct microwaves into the cavity 52 in opposite directions so as to simultaneously irradiate the top and bottom of the foodstuff 74.
In particular embodiments, the waveguide sections 58, 64 have a generally rectangular transverse cross-sectional profile that is substantially constant along the lengths of the waveguide sections 58, 64. Alternatively, the waveguide sections 58, 64 can have circular transverse cross-sections, square transverse cross-sections, or various other geometric shapes.
The waveguide section 60 has a flare angle θx defined between a longitudinal axis L of the waveguide section 60 and each side wall 74a, 74b (
In particular embodiments, the cavity 52 is configured to operate as a single-mode cavity. As used herein, the phrase “single-mode cavity” refers to a microwave cavity in which the superposition of incident and reflected microwaves propagating through the cavity gives rise to a standing-wave pattern having only one field configuration. The wave pattern in a single-mode cavity can have multiple modes.
As demonstrated in the examples below, when foodstuff surrounded by air is heated with microwaves, there is a tendency for uneven heating of the foodstuff. Uneven heating likely is caused by the reflection and refraction of microwaves at the interfaces between the foodstuff and the surrounding air, and the discontinuity of the electric- and magnetic-field components at the food-air boundaries of the food package. In some cases, the periphery of the foodstuff absorbs more microwave energy than the center of the foodstuff. This phenomenon is known as “edge heating.” To improve heating uniformity and reduce the effects of edge heating, the foodstuff can be immersed during microwave heating in a fluid medium having a dielectric constant that is greater than air. Generally, heating uniformity improves as the dielectric constant approaches that of the foodstuff. Hence, it is desirable to select a fluid medium having a dielectric constant that is equal to or substantially equal to the dielectric constant of the foodstuff to be heated. The fluid medium can be, for example, a liquid such as water.
As shown in
In one implementation, the foodstuff 74 is partially or completely immersed in a pressurized fluid medium flowing through the cavity 52 from inlet 76 to outlet 78 as the foodstuff is being heated with microwaves. The fluid medium desirably is pre-heated to a temperature at or above the desired heating temperature (e.g., about 80° C. to about 100° C. for pasteurization or about 100° C. to about 140° C. for sterilization) to assist in heating the foodstuff 74. The cavity 52 desirably is fluid-tight up to a specified pressure above atmospheric pressure (e.g., 30 psig) so that the fluid medium can be used to pressurize the inside of the cavity 52 to prevent bursting of the foodstuff 74 during microwave heating. In an alternative implementation, instead of flowing a fluid medium through the cavity 52, the foodstuff 74 can be heated in a non-flowing bath or pool of the fluid medium.
The apparatus 50 can be used as the microwave-heating section in a larger pasteurization/sterilization system, such as the system 10 shown in
Referring to
The cavities 106, 108 in the illustrated configuration are in communication with each other to permit the foodstuff 74 to travel between the cavities during microwave heating. The apparatus 100 can have a conveyor 120 to automatically move the foodstuff 74 between the cavities 106, 108. The microwave apparatus 100 can have a fluid inlet 122 and fluid outlet 124 to permit a fluid medium to flow through the cavities 106, 108 for immersing the foodstuff 74. A pressure gauge 126 can be mounted at a convenient location for providing a visual indication of the pressure inside the cavities 106, 108.
In alternative embodiments, one of applicators of one or both of the microwave units 102, 104 can be replaced with a reflector.
The apparatus 100 can be expanded to include any number of microwave cavities with respective waveguides.
Referring to
A pressure vessel 410 forms an enclosure around the waveguide applicators 406, 408. The waveguide applicators 406, 408 are coupled to a microwave source (not shown) via the waveguides 412, 414, respectively, that extend through the walls of the pressure vessel 410. A container 416 extends between the waveguide applicators 406, 408 of the first and second microwave units 402, 404. A conveyor 418 can be positioned in the container 416 to move a foodstuff 74 between the microwave cavities defined between the microwave applicators 406, 408 during microwave heating. A fluid medium (e.g., water) can be introduced into the container 416 through an inlet-fluid conduit 420 to improve heating uniformity during microwave heating. The fluid medium can be discharged through an outlet-fluid conduit 422. The foodstuff 74 can be heated while immersed in a flow of the fluid medium or in a non-flowing pool of the fluid medium.
The illustrated pressure vessel 410 has a gas inlet 424 fluidly connectable to a source of a pressurized gas (e.g., compressed air) (not shown) for establishing a pressurized atmosphere (pressure indicated by a gauge 413) inside the pressure vessel 410. The container 416 is open to the atmosphere inside the pressure vessel 410 to prevent bursting of the packaging containing the foodstuff 74. After the foodstuff 74 is heated in the microwave apparatus 400, the pressurized gas can be released from the pressure vessel 410 through a gas outlet 426.
In another embodiment, the microwave apparatus 400 does not have a container 416, inlet-fluid conduit 420 or outlet-fluid conduit 422. Thus, in this alternative embodiment, the foodstuff 74 is not immersed in a fluid medium other than the gas used to pressurize the inside of the pressure vessel 410.
Referring now to
As best shown in
In certain embodiments, the microwave sources 516, 520 generate microwaves within the 915 MHz ISM band or lower. Advantageously, microwaves within this frequency band have a longer wavelength and therefore can penetrate deeper into the foodstuff to be heated than can higher frequency microwaves (e.g., microwaves in the 2450 MHz ISM band). However, the embodiments described herein are not limited to operation within the 915 MHz band or lower. Accordingly, microwaves within any available frequency may be used.
The waveguide assemblies 514, 518 can have any of various configurations. As shown in
The second waveguide assembly 518 can have a construction that is similar to the construction of the first waveguide assembly 514. For example, as shown in
The length of the waveguide sections between the T-shaped waveguide sections 560, 574 and the respective cavities 508 can be selected to introduce a controlled phase difference between the microwaves propagating into a cavity in opposite directions. In one embodiment, for example, the overall length of the waveguide sections between the T-shaped section 560 and the upper wall of the respective cavity 508 is the same as the overall length of the waveguide sections between the T-shaped section 560 and the lower wall of the respective cavity 508. Similarly, the overall length of the waveguide sections between the T-shaped section 574 and the upper wall of the respective cavity 508 is the same as the overall length of the waveguide sections between the T-shaped section 574 and the lower wall of the respective cavity 508. Thus, in this embodiment, there will be a 180° phase difference between the microwaves propagating into each cavity 508 from opposing applicators (e.g., applicators 510a and 512a).
In other embodiments, however, the lengths of the waveguide sections extending from opposing outlets of waveguide sections 560 and 574 can be varied to vary the phase difference between the microwaves directed into a cavity from opposing applicators. For example, increasing or decreasing the overall length between the waveguide section 560 and one side of the respective cavity 508 by one-quarter of a wavelength will create a 90° phase difference between microwaves propagating into the cavity from opposing applicators 510a and 512a, increasing or decreasing the overall length between the waveguide section 560 and one side of the respective cavity 508 by one-half of a wavelength will create a 0° phase difference, and so on.
In one specific implementation, for example, microwave sources 516, 520 generate microwaves within the 915 MHz ISM band (which have a free-space wavelength of about 33 cm), and the waveguide sections have a transverse cross-section of about 24.8 cm×12.4 cm. In this implementation, the microwaves propagating through the waveguide sections have a wavelength of about 44 cm. To maintain the 180° phase difference between waves applied by the microwave applicators 510a, 512a, the waveguide sections 584, 562, and 566 are provided with an overall length that is equal to the overall length of the waveguide sections 564 and 568. As another example, a 90° phase difference can be established by providing the waveguide sections 584, 562, and 566 with an overall length that is greater than the overall length of the waveguide sections 564 and 568 by one-fourth the wavelength, or about 11 cm. It can be appreciated that any phase difference can be established by selecting the appropriate lengths for the waveguide sections between the waveguide section 560 and the microwave applicators 510a, 512a. In another implementation, the phase difference between the opposing waves in the cavity of the first microwave unit 504 can be different from the phase difference between the opposing waves in the cavity of the second microwave unit 506. In this manner, a foodstuff being conveyed through the cavities can be exposed to different modes or field configurations. As illustrated in the examples below, creating a phase difference, or phase shift, between microwaves propagating into a cavity from opposite directions can improve heating uniformity of foodstuffs.
The microwave applicators 510a, 510b, 512a, and 512b and/or cavities 508 can be configured to be easily removable and replaceable with differently configured microwave applicators and/or cavities, such as a microwave applicator having different flare angles θx, θy or a differently sized cavity. In this manner, certain waveguide, applicator, and cavity configurations can be selected to achieve a desired heating effect for a particular foodstuff. In addition, the waveguide, applicator, and cavity configurations can be selected so that a foodstuff being conveyed or otherwise moved through the cavities are exposed to a different mode or field configuration in each cavity.
In one implementation, computer simulations are performed (described below) on a proposed cavity configuration to predict the field distribution in the cavity and the absorbed-power deposition profile in the foodstuff to be heated. In addition, computer simulations can be performed to determine the maximum allowable dimensions for a cavity that will still enable the cavity to operate as a single-mode cavity. Based on the computer simulations, the dimensions of the cavity are selected to achieve the desired heating effect for that foodstuff. If a differently sized foodstuff or a foodstuff having a different permittivity is to be pasteurized or sterilized in the system, then additional computer simulations can be performed to determine the optimum cavity dimensions for that foodstuff.
In one proposed use, a food-processing facility can stock multiple cavities, each one being useable in the same microwave system and optimized for pasteurizing or sterilizing a particular foodstuff. Thus, a microwave system that is presently configured for use with one type of foodstuff (e.g., macaroni and cheese) can be converted for use with another type of foodstuff (e.g., pizza) by removing the presently-installed cavities and installing the cavities optimized for the new foodstuff.
In addition, as demonstrated in the examples below, the absorbed-power distribution along the depth of the foodstuff to be heated can be varied by varying the phase difference between the opposing waves. Computer simulations (described below) can be performed for a particular foodstuff to determine the phase difference that will optimize heating uniformity of the foodstuff. In particular embodiments, the waveguide sections of the first and second waveguide assemblies 514 and 518 are configured to be easily removable and replaceable with other waveguide sections so that either of microwave units 504 or 506 can be operated with a selected phase difference to optimize heating for a particular foodstuff. In alternative embodiments, other suitable techniques can be employed to vary the phase difference, such as through dielectric loading of a waveguide.
In the illustrated embodiment, the cavities 508 of microwave units 504 and 506 are in communication with each other so that foodstuffs can be conveyed or otherwise moved between the cavities 508 during microwave heating. The cavities 508 desirably are fluid-tight up to a specified pressure (e.g., 30 psig) to contain a pressurized fluid medium (e.g., water) therein for preventing bursting of the foodstuffs and for improving heating uniformity of the foodstuffs, as described above.
As shown in
One side wall of the cavity 508 is formed with an opening 530. An adjacent side wall of the cavity 508 of the second microwave unit 506 (
In particular embodiments, a conveyor system 534 (
As shown in
In this example, computer modeling is used to demonstrate the effect of changing the dimensions of a rectangular microwave cavity on the field-distribution and wave-propagation characteristics in the cavity. The computer simulations were performed using Quick-Wave software, available from QWED of Warsaw, Poland, on a Pentium PC with an 850-MHz processor and 256-MB RAM under a Windows NT 4.0 operating system. Referring first to
The lowest-order propagating mode for the waveguide 702 is the TE10 mode (m=1, n=0), which is referred to as the “dominant” or “fundamental mode” of the waveguide. As shown in
b depicts a waveguide assembly comprising the waveguide 702 coupled to a larger rectangular cavity 704. The cavity 704 has a length a1 in the x direction, a width b1 in the y direction, and a depth z1 in the z direction, with the x, y, and z directions being indicated in
For the waveguide 704, the dominant or fundamental mode is the TE10 mode (m=1, n=0). To simulate the presence of the TE10 mode, the cavity 704 was excited through the waveguide 702 (
where c is the velocity of light in a vacuum, f is the frequency of the wave, and ε is the permittivity of the medium in the cavity and waveguide. In accordance with Equation (1), the cell sizes for the cavity and waveguide in an atmosphere of air should be less than 33 mm at 915 MHz. For the present example, the cell sizes were selected to be 10 mm in all three dimensions.
From a knowledge of the transverse electromagnetic field at the aperture of the first waveguide 702, it is possible to predict via computer simulations various characteristics of the cavity 704. One of such characteristics is the distribution of the dominant electric field (which is the Ey component in this example) in the cavity 704. The mode distributions were simulated as a function of the x, y, and z dimensions of the cavity 704. The findings from these simulations are discussed below.
In one series of computer simulations (shown in
In another series of computer simulations (shown in
a-17d illustrates the combined effect of varying the length and width of the cavity 704 on the mode distribution across the x-y plane at the middle of z1 (for a depth z1 of 200 mm, a waveguide length a of 247.65 mm, and a waveguide width b of 123.825 mm). Specifically,
As noted above, and as shown in
As both the length and width change, the wavefront emanating from the aperture of the waveguide 702 experiences a radial spread in the x-y plane, and a phase component is introduced between wavefronts at different axial locations along the z axis of the cavity 704. When this phase component becomes sufficiently large, the field distribution in the cavity 704 splits into two directions and its reflection from respective walls of the cavity forms two lobes. For example,
a-18f illustrate the effect of varying the depth of the cavity 704 on the field distribution of the Ey component over the x-y plane at the middle of the depth z1 of the cavity 704. In the simulations shown in
As the depth of the cavity 704 increases, a large phase component is introduced between the two wavefronts, causing the field distribution to split into two lobes, as shown in
Based on the foregoing simulations, one can easily tailor the dimensions of a cavity to achieve an energy/mode distribution required for a particular application. These simulations also demonstrate that a microwave cavity can operate with a multitude of different field configurations or distributions as a single-mode cavity by varying the x, y, and z dimensions of the cavity.
In this example, computer modeling was used to evaluate the performance of the assembly of
The power-deposition profile over top surface of the load 706 was calculated under two conditions. In the first case, the load 706 was positioned in the central region of the cavity 704 and exposed to air. In the second case, the load 706 was immersed in water having a complex permittivity value, ε*=ε′−jε″, of 71.207−j 16.757. Following the criterion of equation (1) above, the cell sizes of the cavity were 10 mm3 in the air-filled cavity and 3 mm3 in the water-filled cavity.
a and 20b show the power-deposition pattern over the top surface (in an x-y plane) of the load 706 in air and water, respectively. As shown in
As shown in
In this example, experiments were performed to verify the results of the computer simulations of Examples 1 and 2, above. In these experiments, loads were heated in rectangular microwave cavities constructed from aluminum plates. The cavities were coupled to a 20 kW, 915 MHz microwave power source manufactured by The Ferrite Company, Inc. of Hudson, N.H., with a rectangular waveguide having an a dimension of 247.65 mm and a b dimension of 123.825 mm (
To verify the field-distribution characteristics in the empty cavities, it was necessary to measure the y-polarized dominant electric-field component (the Ey component) strength, which is more than eight times stronger than the other electric-field components. To simplify this measurement, a thin, wet piece of paper was placed in an x-y plane in the middle of the cavities as an indirect way to measure the intensity of the electric-field pattern in an empty cavity. Microwave power was delivered to the cavities for 30 seconds, and the piece of paper was immediately taken out from the cavities for infrared imaging.
To find the absorbed power-deposition pattern for an actual food-engineering model, a whey-gel slab having dimensions of 140 mm in the x direction, 100 mm in the y direction, and 30 mm in the z direction was heated in a cavity having dimensions of a1=2.0a, b1=1.5b, and z1=100 mm. The experimental power-deposition characteristics over the top surface (in an x-y plane) of the whey-gel slab in air and immersed in water are shown in
Comparing
The S-parameter, S11, illustrates the return loss and efficiency of a cavity. The S11 parameter was computed using QuickWave-3D software in the frequency spectrum of 700 to 1200 MHz for cavities having a length a1 of 2.0a, a width b1 of 1.5b, and depths of 100 mm, 150 mm, and 200 mm. For each cavity, the S11 parameter was computed for the empty cavity, while heating a food package, and while heating a food package immersed in water.
a, which is a screen shot captured directly from the QuickWave-3D simulator, shows the return-loss behavior (the S11 parameter, in dB) within the frequency spectrum of 700 to 1200 MHz for each cavity depth when the cavities are empty. As shown, the resonant mode for each cavity is in the high end of the spectrum. As the depth of the cavity increases, the resonant frequency gradually shifts toward the lower end of the frequency spectrum.
b shows the return-loss behavior (the S11 parameter, in dB) within the frequency spectrum of 700 to 1200 MHz for each cavity depth when a load is placed in the middle of each cavity. As shown, the return loss decreases as the cavity depth decreases. For example, for the cavity having a depth of 100 mm, the reflected power at 915 MHz is 3.67 dB, which is 44% of the incident power. For the cavity having a depth of 200 mm, the reflected power at 915 MHz is 73% of the incident power.
c shows the return-loss behavior (the S11 parameter, in dB) within the frequency spectrum of 700 to 1200 MHz for each cavity depth when a load is placed in the middle of each cavity and the load is immersed in water. As illustrated in
d shows the return-loss behavior (the S11 parameter, in dB) in the cavity having a depth of 100 mm at 50° C., 80° C., and 110° C. when the load is surrounded by air. The complex permittivity values of the load at 50° C., 80° C., and 110° C. are 47−j38.547, 45.343−j48.568, and 42.597−j60.669, respectively. From
In this example, computer modeling is used to demonstrate the field-distribution and wave-propagation characteristics in various microwave systems having horn-shaped microwave applicators. Computer modeling is also used to demonstrate the power-distribution profile over a load (e.g., a food package) irradiated by microwaves in such systems.
In the computer simulations described in this example, rectangular waveguides having an a dimension of 247.65 mm and a b dimension of 123.825 mm (
The computer models for the systems in this example were incremented into cubic cells using Equation 1 above. The dimensions of the load in each simulation were 140 mm, 100 mm, and 30 mm in the x, y and z directions, respectively.
Referring to
a and 25b show the power-deposition profile over the top surface (the surface closest to the applicator 724) and the bottom surface (in respective x-y planes), respectively, of the load 728. As shown, the absorbed-power distribution is generally symmetrical with respect to the middle cell over the top and bottom surfaces in both the x and y directions.
Referring to
In one simulation, waves from opposing applications 754 were propagated through the system 750 (
In another simulation, waves were propagated through the system 750 (
In another simulation, waves were propagated through the system 750 (
If the relative amplitudes of the absorbed-power distributions are considered, the combined absorbed-power distribution is even more uniform. For example, the absorbed-power distribution resulting from a 180° phase difference has a relative amplitude of about 0.3 and the absorbed-power distribution resulting from a 0 phase difference has a relative amplitude of about 1.0. This results in a combined absorbed-power distribution profile having an absorbed-power ratio of about 1.4:1 along the depth of the load, which is significantly less than the absorbed-power ratios for the distribution profiles shown in
Hence, to improve heating uniformity, a load can be exposed to microwaves from a plurality of opposing applicators (e.g., as shown in
In this example, computer modeling is used to demonstrate the power-distribution profile over three differently sized loads irradiated by microwaves in the system 750 of
In the simulations of this example, two waves of the same frequency and equal power were excited from opposite directions into the cavity 752 in the TE10-mode, as in the previous example.
d shows simulated absorbed-power distributions along the depths of loads having thicknesses of 20 mm, 30 mm, and 45 mm when opposing waves are propagated toward each other in the same phase. As shown, the simulated absorbed-power distributions along the depths of the loads varied significantly between the different loads. For the load having a depth, or thickness, of 20 mm, the center region of the load absorbed the most power, nearly 4.4 times more power than the top and bottom surface of the load. For the load having a depth of 30 mm, the absorbed power was lowest between the center region and the top and bottom surfaces of the load, and the absorbed-power-deposition ratio was 3.0:1. For the load having a depth of 45 mm, the absorbed-power ratio was 7.3:1, and the absorbed power was greatest at the top and bottom surfaces of the load. The variations in absorbed power for the different loads can be attributed in part to the attenuation in power across the depth of the loads.
As the temperature of a foodstuff increases during microwave heating, the complex permittivity of the foodstuff changes with temperature. Computer simulations were performed to demonstrate the effect that the instantaneous temperature of a load has on the power-distribution profile of the load when heated in the system 750 (
a-39d show the distribution of absorbed-power deposition over the top and bottom surfaces of the load (having the dimensions 140 mm×100 mm×30 mm) at four different temperatures (20° C., 50° C., 90° C., and 121° C., respectively) and complex permittivity values. The complex permittivity values at 20° C., 50° C., 90° C., and 121° C. were 48.311−j 26.83, 47.447−j 38.547, 44.386−j 52.533, and 41.587−j 66.273, respectively. These figures show that that absorbed-power distribution remains almost the same at each temperature. For example, the absorbed-power-deposition ratio was 1.48:1 at 20° C. (
e shows the absorbed-power distribution across the depth of the load for all four temperatures when the opposing waves are in the same phase. The amount of power absorbed by each cell at the top and bottom surfaces of the load increased as the temperature increased, as illustrated in
In this example, the QuickWave-3D software program was used to calculate the return loss (the amount of reflected power in the system) of the systems discussed in Examples 5-6.
b shows a graph of the S11 parameter (in dB) for the system 750 shown in
The present invention has been shown in the described embodiments for illustrative purposes only. The present invention may be subject to many modifications and changes without departing from the spirit or essential characteristics thereof. We therefore claim as our invention all such modifications as come within the spirit and scope of the following claims.
The present application claims the benefit of U.S. provisional application No. 60/501,585, file Sep. 8, 2003, which is incorporated herein by reference.
This invention was developed with support under Grant Numbers DAAK60-97-P-4627, DAAN02-98-P-8380, and DAAD16-00-C-97240 from the U.S. Army Natick Soldier Center and Grant Number DAAD16-01-2-0001 from the U.S. Department of Defense.
Number | Date | Country | |
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60501585 | Sep 2003 | US |