The present disclosure relates to systems and methods for managing air flow through an electronics equipment enclosure, and more particularly to systems and methods that block air from flowing through a selected internal area of an electronics equipment enclosure.
The statements in this section merely provide background information related to the present disclosure and may not constitute prior art. Open enclosure specifications targeting the communications equipment market, such as the PICMG AdvancedTCA specification, describe mechanical building practices utilizing Rear Transition Modules (RTMs). The RTMs are printed circuit board (PCB) modules, also referred to in the art as “blades”, that are contained with a rear (i.e. RTM) card cage area of a chassis. The RTMs are physically located behind a rear surface of a midplane that is positioned within the chassis RTM. On the opposite surface of the midplane is a front board card cage area. The front board card cage area has a plurality of card slots where one or more front boards, also sometimes referred to as “blades”, are electrically coupled to the midplane. The RTMs are electrically coupled to the front boards through a connector zone known in the art as the “Zone-3” area, which is located above the midplane when the RTMs and front boards are arranged in a vertical orientation.
The main purpose of the RTMs is to support the rear input/output (I/O) interfaces, thus decoupling such interfaces from the processing activities of front boards and increasing the available PCB area for performing various functions. Cooling of the RTM card cage area of an AdvancedTCA specification chassis has been traditionally accomplished through natural convection cooling, that is, without the need for electrically powered cooling fans. However, as the power dissipation of the RTMs has increased, this has necessitated a move to forced convection cooling systems for the RTM card cage area. The associated mechanical specifications of an AdvancedTCA chassis have not been optimized with the goal of implementing optimal efficiency for the forced convection cooling of the RTM cardcage. Since some degree of variability is required to allow for variations in the thickness of the midplane due to differing midplane connectivity requirements, this has resulted in the creation of a relatively large gap. Thus, with present building practices for an AdvancedTCA chassis, the gap will typically exist between the midplane and the rear edges of the RTMs installed in the RTM card cage area of an enclosure.
The gap 2 leaves unwanted low impedance, lateral air flow paths between the RTMs 6 and the midplane rear surface 4a. The gap 2 essentially acts like a low air flow impedance bypass path that allows a cooling air flow directed through the RTM card slots of the RTM card cage area to be diverted away from the RTMs 6. The existence of the gap 2 thus forms unwanted lateral flow paths that make the air flow distribution between the RTMs highly unpredictable. The air flow distribution through the RTM card cage area also becomes configuration specific, meaning that the configuration of the RTMs and their surface mounted components will play a significant role in determining the air flow distribution through the RTM card cage area. This is highly undesirable in an AdvancedTCA chassis where RTMs may be provided from multiple vendors, and therefore are not generally designed to take these effects into account. This can give rise to the need to independently verify each configuration of RTMs within the RTM card cage area, which is both time-consuming and costly, and which will need to be repeated for each subsequent configuration change. Existence of a low impedance air flow bypass path within the RTM card cage area also leads to wasted air flow and potentially to an insufficient volume of cooling air flow for the RTMs.
In one aspect the present disclosure includes an air flow restrictor panel adapted for use in an electronics equipment enclosure to block a gap existing between a midplane and an electronics module positioned adjacent the midplane. The air flow restrictor panel may incorporate a main panel portion and a plurality of flanges extending from the main panel portion. The main panel portion may have a footprint sufficiently large in area to block the gap.
In another aspect the present disclosure includes an air flow restrictor panel adapted for use in an electronics equipment enclosure to block a gap existing between a midplane and an electronics module positioned adjacent the midplane. The air flow restrictor panel may include a main panel portion having a generally rectangular shape. A plurality of flanges may extend from the main panel portion. At least a subplurality of the flanges may each have a depth that is sufficient to substantially or entirely block a depth of the gap. The main panel portion may also have a footprint sufficiently large in length and height so as to block an area associated with the gap.
In another aspect the present disclosure includes a method for restricting a flow of air between a gap existing between a midplane and an electronics module within an electronics equipment enclosure. The method may involve providing an air flow restrictor panel having a planar main panel portion. A plurality of flanges may be formed on the main panel portion such that the plurality of flanges extend from the main panel portion. At least a subplurality of the flanges each have a depth that is sufficient to substantially or entirely block a depth of the gap. The main panel portion may be formed with a footprint that is sufficiently large in length and height so as to block an area associated with the gap when the air flow restrictor panel is installed in the gap.
Further areas of applicability will become apparent from the description provided herein. It should be understood that the description and specific examples are intended for purposes of illustration only and are not intended to limit the scope of the present disclosure.
The drawings described herein are for illustration purposes only and are not intended to limit the scope of the present disclosure in any way.
The following description is merely exemplary in nature and is not intended to limit the present disclosure, application, or uses. It should be understood that throughout the drawings, corresponding reference numerals indicate like or corresponding parts and features.
Referring to
The panel 10 may include a generally planar and generally rectangular shaped main panel portion 12 having a plurality of cutouts 14 along an upper area 16. The cutouts 14 in this example are each semi-circular in shape, but they could be of other shapes such as rectangular, square, elliptical, triangular, etc. The upper area 16 also includes flanges 18 that extend at approximately a ninety degree angle from the main panel portion 12 between the cutouts 14. Side areas 20 and 22 similarly include flanges 24 and 26 respectively that also extend at an angle of about ninety degrees from the main panel portion 12. Bottom area 28 likewise includes a flange 30 that extends at about a ninety degree angle from the main panel portion 12.
The side areas 20 and 22 each include pairs of tabs 32 and 34 having holes 32a and 34a, respectively, for enabling the panel 10 to be secured the sidewalls of an electronic equipment enclosure, such as for example an AdvancedTCA specification chassis (e.g., enclosure 8 in
The flanges 18, 24, 26 and 30 may all have the same depth, denoted by reference numeral 38 in
Referring to
Referring to
RTMs installed in the enclosure, is also shown in
The panel 10 thus provides a structure and method for eliminating the gap 2, and thus ensuring that the cooling air flow directed into the RTM card cage area will flow through the RTM card slots in a predictable manner. A particular advantage of the panel 10 is that it eliminates the need to perform RTM configuration specific testing to ensure that the desired air flow through the RTM card slots is being achieved. Furthermore, if the RTM configuration should be changed at a later date, no re-testing of the air flow through the RTM card cage area is required. The panel 10 further does not add appreciable cost, weight or complexity to the construction of an AdvancedTCA specification chassis, and can even enhance the structural properties of the chassis such as its rigidity and fire worthiness.
While various embodiments have been described, those skilled in the art will recognize modifications or variations which might be made without departing from the present disclosure. The examples illustrate the various embodiments and are not intended to limit the present disclosure. Therefore, the description and claims should be interpreted liberally with only such limitation as is necessary in view of the pertinent prior art.
The present application claims priority from U.S. Provisional patent application Ser. No. 61/106,302, filed Oct. 17, 2008, the entire contents of which are hereby incorporated by reference.
Number | Date | Country | |
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61106302 | Oct 2008 | US |