The present invention provides an apparatus and methods for simulating a mold cooling analysis for injection molding, which comprises automatically creating an independent, three dimensional moldbase solid mesh system for a real three dimensional flow analysis of the mold. With this method, the user does not need to spend a lot of time to build the mesh system, and can quickly obtain a cooling analysis results for the mold (which includes the cavity, the flow path, the moldbase, the cooling conduit, the heating rod, and various other elements).
Please refer to
In step S91, a cavity mesh system for simulating the geometrical shape of the cavity of a mold is created to obtain the geometrical shape of the cavity. In an embodiment of the present invention, the cavity mesh system is created with CAD modeling, or through a triangle mesh stereolithography (STL) file. Since CAD modeling and triangle mesh stereolithography (STL) files are well known technologies used for meshing, they will not be further explained in this application.
Please refer to
In one embodiment of the present invention, the mold 2 has a flow path, a moldbase, a cooling conduit, a heating rod and certain other elements, which can be treated as the cavity 22. Furthermore, in one embodiment of the present invention, the cavity 22 can be a shell model cavity, but the invention is not limited to such an embodiment.
Next, in step S92, a moldbase mesh system is created for simulating the geometrical shape of the moldbase to obtain the geometrical shape of the moldbase.
In step S92, the moldbase mesh system is automatically created based on the geometrical shape of the cavity 22 and independently from the cavity mesh system 220 in step 91; unlike the prior art technology, where the moldbase mesh system is created based on the cavity mesh system 220. Therefore, with the present invention, the user does not need to use the mesh generator to manually create the moldbase mesh system. Meanwhile, the moldbase mesh system of the present invention is independent of the cavity mesh system 220; therefore, there is no need to generate a large moldbase mesh system based on the cavity mesh system. The present invention is particularly suitable for a thin cavity 22 or for cavities 22 with complicated shapes. When the cavity 22 is thin, the number of meshes for the moldbase mesh system in the present invention will be significantly fewer than the number of meshes in the prior art technology, which can increase calculation efficiencies.
Please refer to
In step S92, the moldbase mesh system 210 has a plurality of solid meshes for a real three dimensional mold cooling analysis.
Moreover, in step S92, as shown in
As shown in
As shown in
First, in step S931, each cavity boundary mesh and each moldbase boundary mesh at the cavity mesh system 220 and the moldbase mesh system 210 is defined. Since the moldbase mesh system 210 is automatically generated and independent of the cavity mesh system 220, as shown in
Next, in step S932, each node of each moldbase boundary mesh falling into the cavity 22 or located at the boundary of the cavity 22 is ignored, to form independent and non-overlapped cavity mesh system 220 and moldbase mesh system 210.
Please refer to
Next, in step S933, a relative relationship between each node of each moldbase boundary mesh and each node of each cavity boundary mesh of the cavity mesh system 220 and the moldbase mesh system 210 is determined, and a numerical method can be utilized to perform the cooling analysis for the mold 2 based on this relative relationship. In step S933, a relative distance between each node of each cavity boundary mesh and each node of each moldbase boundary mesh is calculated, and the relative relationship between each node of each moldbase boundary mesh and each node of each cavity boundary mesh is defined based on the relative distance. For example, in step S933, the closest node or the relatively closer nodes of the cavity boundary mesh for nodes of the moldbase boundary mesh can be obtained. Similarly, the closest node or relatively closer nodes of the moldbase boundary mesh for nodes of the cavity boundary mesh can also be obtained.
As shown in
Finally, after step S93, the relative relationship between the cavity mesh system 210 and the moldbase mesh system 220 is obtained; in step S94, a numerical method can be utilized to perform the cooling analysis for the mold 2 based on the relative relationship.
As shown in
First, in step S941, an initial temperature of the moldbase is assumed (in other words, the initial temperature of the node of each moldbase boundary mesh is determined).
In step S942, the relative relationship obtained from step S93 is used to calculate the temperature or the heat flux of the closest or relatively closer nodes of each cavity boundary mesh based on the initial temperature of the nodes of each moldbase boundary mesh.
In step S943, the temperature or the heat flux of the node of each cavity boundary mesh are used as boundary conditions to calculate the cooling results of the cavity 22 after a predetermined cooling time.
Next, in step S944, according to the cooling results and the relative relationship obtained in step S93, the temperature or the heat flux introduced from the node of each cavity boundary mesh to the corresponding node of each moldbase boundary mesh is determined.
In step S945, the temperature or the heat flux is used as a boundary condition to calculate the temperature distribution of the moldbase 21 and to obtain a new temperature of the node for each moldbase boundary mesh.
Then, in step S946, according to the new temperature, a temperature difference value between the node of each moldbase boundary mesh and the corresponding node of each cavity boundary mesh is determined if it is less than a predetermined error value. If the temperature difference is not less than the predetermined error value, then based on the new temperature, step S941 to step S945 are repeatedly performed until the temperature difference value is less than the predetermined error value. The temperature distribution of the mold provides the three dimensional cooling analysis results for the mold obtained in step S947.
Although the present invention has been explained in relation to its preferred embodiment, it is to be understood that many other possible modifications and variations can be made without departing from the spirit and scope of the invention as hereinafter claimed.