Patent Application
20100230155
Embodiments of the present invention relate to an apparatus comprising an electronics module and a method of assembling such an apparatus. In particular they relate to an apparatus comprising an electronics module and an injection molded layer.
In recent years there has been a trend to reduce the thickness of electronic devices. Problems arise during the formation of the housings of thin electronic devices. The housings are commonly formed by injection molding and the conditions required for injection molding, i.e. the high temperature of the material and the force with which the injection molded material enters the mold, may damage sensitive electronic modules.
The housings may be formed from attachable covers which are formed independently of the electronics modules and components of the device and thereby avoid damaging the electronics during injection molding. Such housings define a cavity for receiving the electronics modules and components. However, the cavity must be slightly oversized so that manufacturing tolerances do not result in a cavity that ‘pinches’ the modules and components. The housing also requires means for connecting the housing to the electronics modules and components which increase the volume of the device.
It would be desirable to enable assembly of an electronic device without damaging the electronic modules and without significantly increasing the thickness of the device.
According to one embodiment of the invention there is provided an apparatus comprising: a substrate; an electronics module mounted on the substrate; and an injection molded layer in contact with the substrate; wherein the substrate and the injection molded layer form a portion of a rigid housing.
This provides an advantage in that the substrate acts as a barrier to protect the electronics module during the formation of the injection molded layer so that the electronics module can be directly connected to the rigid housing. This reduces the number of components required and the number of connections between the components and thereby reduces the thickness of the apparatus.
According to another embodiment of the invention there is provided a method of assembling an apparatus comprising electronic components, the method comprising: positioning a substrate, supporting an electronics module, between the electronics module and a cavity to operate as a barrier during injection molding; forming an injection molded layer in contact with the substrate and thereby integrating the injection molded layer and the substrate to form a portion of a rigid housing.
For a better understanding of the present invention reference will now be made by way of example only to the accompanying drawings in which:
The Figures illustrate an apparatus 1 comprising: a substrate 15; an electronics module 13 mounted on the substrate 15; and an injection molded layer 27 in contact with the substrate 15; wherein the substrate 15 and the injection molded layer 27 form a portion of a rigid housing.
The apparatus 1 may be a hand portable electronic device such as, for example, a portable radiotelephone, a personal digital assistant, a digital camera, a personal media player, etc.
A ridge 5 extends around the perimeter of second interior surface 6 of the display window 3. In some embodiments the ridge 5 may extend around the entire of the perimeter of the display window 3 whilst in other embodiments the ridge 5 may extend around only a portion or portions of the perimeter.
The display window 3 is formed from a transparent material such as a plastic. In the illustrated embodiment the display window 3 is formed by injection molding. The two sides of the mold 7 and 9 form a cavity 11 into which molten plastic is injected. The plastic cools to form the display window 3.
In the second step of the process, illustrated in
In the illustrated embodiment the display module 13 is mounted on the substrate by means of an intervening frame 21 so that the display module 13 does not directly contact the substrate 15. The frame 21 is provided around the perimeter of the display module 13 and may be made of any suitable material such as plastic. The frame 21 is adhered to the display module 13 and the substrate 15 and contacts the second interior surface 6 of the display window 3 so as to create a gap 19 between the display window 3 and the display module 13. In this particular embodiment the gap 19 is an air gap.
In other embodiments the display module 13 may be mounted directly on to the substrate 15, in which case the substrate 15 may contact the second interior surface 6 of the display window 3, to provide the gap 19.
In the illustrated embodiment the display module 13 is located within the volume defined by the ridge 5. The ridge 5 provides a guide structure to assist in the positioning of the display module 13.
In the illustrated embodiment the substrate 15 is curved so that a gap 17 is formed between the substrate 15 and the display module 13. In this particular embodiment the gap 17 is an air gap.
The display module 13 may comprise any suitable type of display for example an LCD display or a polymer display.
In
The substrate 15 acts as a protective barrier that prevents the injected molding material directly contacting the display module 13. The injection molded layer 27 forms adjacent to and in contact with the substrate 15 so that the injection molded layer 27 and the substrate 15 are integrated to form at least a portion of a rigid housing for protecting the display module 13.
The rigid housing may form part of the exterior housing of the apparatus 1, in which case the outer surface 28 of the injection molded layer 27 forms part of the exterior surface of the apparatus 1.
When the plastics material is injected into the cavity 25 the gap 17 between the substrate 15 and the display module 13 protects the display module 13 from the heat and force of the injected plastic. For example, the substrate 15 may absorb the force of the plastic being injected into the cavity 25. In some embodiments the substrate 15 may deform under the force of the injection molding, however the gap 17 prevents the deformed substrate 15 from coming into contact with the display module 13. In the illustrated embodiment the gap 19 is an air gap which also insulates the display module 13 against the heat of the injected plastic.
The frame 21 comprises a second portion 22 which forms a continuous, uninterrupted rim around the edge of the substrate 15 and extends substantially perpendicularly to and abuts the second interior surface 6 of the display window 3.
During formation of the injection molded layer 27 the force of the plastic being injected into the cavity 25 causes the second portion 22 of the frame 21 to be pressed against the second interior surface 6 of the display window 3. This creates a seal with the display window 3 around the edge of the display module 13 and protects the display module 13 by preventing the molten plastic from coming into direct contact with it.
In this embodiment the substrate 15 is provided with a rim 43 which can be located within the recess 41. The rim 43 extends continuously around the edge of the substrate 15. During formation of the injection molded layer 27 the force of the hot plastic being injected into the cavity 25 presses the rim 43 into the recess 41 to form a seal. The substrate 15 prevents molten plastic from coming into direct contact with the display module 13.
The substrate 15 comprises a body portion 31, having an inner surface 32, an outer surface 34 and edges 36, 38 defining the perimeter of the body portion 31. The substrate 15 also comprises a sidewall 33. The sidewall 33 extends around the perimeter of the body portion 31. In the illustrated embodiment the sidewall 33 extends continuously around the entire perimeter of the body portion 31.
The frame 21 may be adhered to the sidewall 33 to enable the display module 13 to be mounted on to the substrate 15. In alternative embodiments the display module 13 may be adhered directly onto the sidewall 33.
In the illustrated embodiment the sidewall 33 comprises a rim 43 for cooperating with a corresponding recess 41 in the second interior surface 6 of the display window 3. The rim 43 extends continuously around the perimeter of the body portion 31 and may also form a protective seal during the formation of the injection molded layer 27.
In other embodiments there may be no rim 43 around the sidewall 33 of the substrate 15, for example, in embodiments where the interior surface 6 of the display window 3 is provided with a ridge 5.
The body portion 31 is curved so that the inner surface 32 and the outer surface 34 are both curved. In the embodiments illustrated the curvature is in one dimension only. In the illustrated embodiment the substrate 15 is rectangular so that a first two parallel edges 36 are shorter than the other two parallel edges 38. The body portion 31 curves along the width of the body portion 31 but not the length. Therefore the sidewall 33 has a constant depth along the longer edges 38 of the body portion 31 so that when either the frame 21 or the electronics module 13 is mounted on the substrate 15 the inner surface 32 of the body portion 31 is in contact with either the frame 21 or the electronics module 13 along the longer edges 38. Along the shorter edges 36, the depth of the side wall 33 varies so that sidewall 33 is deeper in the middle than at the edges 38 so that when an electronics module 13 is mounted on the substrate 15 inner surface 32 will not contact the electronics module 13 except at the longer edges 38, thus a gap is created between the electronics module 13 and the substrate 15.
In this embodiment the body portion 31 of the substrate 15 is provided with a plurality of corrugations 41 which extend in parallel across the width of the body portion 31. In this particular embodiment the corrugations 41 are provided as grooves 42 on the inner surface 32 of the body portion 31 and ridges 43 on the outer surface 34.
The corrugations 41 increase the rigidity of the substrate 15 so that the substrate is less susceptible to deformation during the formation of the injection molded layer 27. This allows the radius of curvature of the substrate 15 to be reduced which also reduces the width of the gap 17 between the substrate 15 and the display module 13 thereby reducing the overall thickness of the apparatus 1.
The substrate 15 may be made of any suitable material. For example, in one embodiment the substrate 15 may be made of a plastic sheet or film. In other embodiments the substrate 15 may be made of metal. Where the substrate 15 is made of metal the substrate 15 may be treated so as to ensure a good adhesion between the substrate 15 and the frame 21 and the injection molded layer 27.
In embodiments where the substrate 15 is made of a plastics material the substrate 15 may be provided with conductive traces for connection to an electronics module. In some embodiments the substrate 15 may be a multilayered PCB or may have electronics components embedded within it. This reduces the amount of wiring and connections needed within the apparatus 1 and thereby reduces the volume of the apparatus 1.
A plastics sheet 51 is fed through a first roller 53. The plastic sheet 51 may be formed from any suitable plastics material such as a thermosetting plastic, for example, polyethylene, polystyrene, polyurethane etc.
The plastics sheet 51 is then fed through a second roller 57 where ink traces 55 are printed on to the sheet 51. The ink traces 55 form a pattern indicating the eventual position of the conductive traces.
The ink may comprise a carrier material to form a seed for the subsequent electroplating of the conductive traces. Examples of suitable carrier materials include palladium or copper.
The ink may also comprise a binder material to ensure good adhesion between the conductive traces and the substrate 15. The ink may also have elastic properties so that it may be stretched during the molding process.
After the ink traces 55 have been printed, the plastics sheet 51 is passed through a molding arrangement 57 where it undergoes vacuum compression molding into the form of the substrate 15.
The substrate 15 then undergoes an electroplating process in which metallic particles are plated to the ink traces 55 to form the conductive traces.
The electroplating process may be a two step process. In the first step the carrier material in the ink traces 55 is activated 59. The carrier material may be activated 59 by, for example, rinsing with acid or irradiation. The second step is the electroplating step in which metal is plated 61 onto the ink traces 55.
Once the conductive traces have been formed an electronics module, such as a display module 13, can be mounted to the molded substrate.
In the above described embodiments the electronics module is a display module 13. Other types of electronics modules could be used for example a camera module or a user interface module.
Furthermore, in the above described embodiments only a single electronics module is mounted on the substrate 15, in other embodiments a plurality of electronics components may be mounted on the same substrate 15.
Although embodiments of the present invention have been described in the preceding paragraphs with reference to various examples, it should be appreciated that modifications to the examples given can be made without departing from the scope of the invention as claimed.
Whilst endeavoring in the foregoing specification to draw attention to those features of the invention believed to be of particular importance it should be understood that the Applicant claims protection in respect of any patentable feature or combination of features hereinbefore referred to and/or shown in the drawings whether or not particular emphasis has been placed thereon.
| Filing Document | Filing Date | Country | Kind | 371c Date |
|---|---|---|---|---|
| PCT/IB07/00595 | 3/1/2009 | WO | 00 | 6/1/2010 |
