Claims
- 1. Apparatus for molding articles from particulate material comprising:
- a mold having a cavity adapted to contain said particulate material to be formed into said article;
- at least one element adapted to closely fit the cavity of said mold and having a coefficient of thermal expansion higher than said mold;
- said mold adapted to constrain said element so as to cause plastic deformation of said element upon heating induced expansion of said element within said cavity with resulting compression of particulate material filling said cavity and bonding of said particles to form said article.
- 2. The apparatus of claim 1 wherein said element has a greater ductility than said mold at operative molding temperatures.
- 3. The apparatus of claim 1 wherein said element includes copper and said mold includes a body mass of molybdenum surrounding said cavity and said element.
- 4. The apparatus of claim 1 further including means for isolating said element within said mold from chemical reaction with material within said cavity.
- 5. The apparatus of claim 4 wherein said isolating means includes a disc.
- 6. The apparatus of claim 4 wherein said isolating means includes a foil.
- 7. The apparatus of claim 1 wherein said mold is fabricated substantially of molybdenum and said element is composed substantially of copper.
- 8. The apparatus of claim 1 wherein said mold includes means for controlling element deformation into said cavity to provide a substantially uniaxial force upon said material.
- 9. The apparatus of claim 8 wherein said controlling means includes a collar having a coefficient of thermal expansion lower than said element surrounding said cavity.
- 10. The apparatus of claim 8 further including a foil between said element and said cavity.
- 11. The apparatus of claim 1 wherein said element further includes means for producing a multiaxial compressive force to said cavity.
- 12. The apparatus of claim 11 wherein said element includes a collar having a coefficient of thermal expansion higher than said mold surrounding said cavity.
- 13. The apparatus of claim 2 wherein said operative molding temperatures are below 200.degree. C.
Parent Case Info
This is a division of application Ser. No. 058,530, filed July 18, 1979, now U.S. Pat. No. 4,260,582.
US Referenced Citations (4)
Divisions (1)
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Number |
Date |
Country |
Parent |
58530 |
Jul 1979 |
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