Claims
- 1. An apparatus for processing materials under reducing conditions, said apparatus comprising:
- gasifier means for producing a hot reducing gas;
- reduction chamber means for receiving and treating said materials to be reduced with reducing gases, said reduction chamber means having an outlet therefrom;
- interface means connecting said gasifier means and said reduction chamber means for directing said reducing gas into said chamber means;
- enthalpy boost means connected to said reduction chamber means for providing an enthalpy boost and high temperature reducing gas into said reduction chamber means and for creating a well-stirred region within said reducing chamber means;
- first means for introducing said material to be reduced into said interface assembly means; and
- melter means at said outlet of said reduction chamber means for receiving particulate matter from said reduction chamber and for separating and depositing said particulate matter onto the wall thereof.
- 2. An apparatus as claimed in claim 1, further comprising second means for introducing said material to be reduced directly into said reduction chamber means.
- 3. An apparatus as claimed in claim 1, wherein said reduction chamber means is comprised of a cylindrical, vertically positioned chamber, said chamber having said well-stirred region at the upper end thereof.
- 4. An apparatus as claimed in claim 3, wherein said enthalpy boost means is positioned tangentially to said cylindrical chamber wall.
- 5. An apparatus as claimed in claim 4, wherein said enthalpy boost means into said chamber comprises at least two vertically spaced plasma generators directed into said well-stirred region of said chamber.
- 6. An apparatus as claimed in claim 4, wherein said plasma generators are vertically spaced apart.
- 7. An apparatus as claimed in claim 3, wherein said enthalpy boost means is comprised of at least two plasma generators positioned at 30.degree.-60.degree. angles through said chamber wall so that said high temperaure reducing gas therefrom into said chamber impinges at an angle of 30.degree.-60.degree..
- 8. An apparatus as claimed in claim 1, comprising additional enthalpy boost means connected to said interface means for introducing a high temperature reducing gas into said interface means.
- 9. An apparauts as claimed in claim 8, wherein said additional enthalpy boost means comprising a plasma generator.
Parent Case Info
This application is a divisional of application Ser. No. 320,737, filed Mar. 8, 1989.
US Referenced Citations (4)
Divisions (1)
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Number |
Date |
Country |
Parent |
320737 |
Mar 1989 |
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