This application claims the priority of British patent document 0801687.5, filed Jan. 31, 2008, the disclosure(s) of which is (are) expressly incorporated by reference herein.
The present invention relates to cryostats for retaining cooled equipment such as superconductive magnet coils. In particular, the present invention relates to vacuum chambers and radiation thermal radiation shields provided for reducing heat reaching a cryogen vessel from cryostat components which are at a higher temperature, and especially to cooling arrangements for initially cooling the thermal radiation shield prior to introduction of a working cryogen into the cryogen vessel.
A negative electrical connection 21a is usually provided to the magnet 10 through the body of the cryostat. A positive electrical connection 21 is usually provided by a conductor passing through the vent tube 20.
As is well known in the art, a difficulty arises when first cooling such a cryostat from ambient temperature. One option is to simply add working cryogen to the cryogen vessel until the cryogen vessel and the magnet settle at the temperature of the working cryogen. While this may be acceptable when using an inexpensive, non-polluting, essentially inexhaustible cryogen such as liquid nitrogen, it is not considered acceptable to use this approach for a working cryogen such as helium, which is relatively costly to produce, or to re-liquefy, and is a finite resource.
When cooling cryostats from ambient temperature to helium temperature, it is known to pre-cool the cryostat to a first cryogenic temperature by other means, before finally cooling the cryostat to operating temperature by the addition of liquid helium. One conventional method for pre-cooling the cryogen vessel to a first cryogenic temperature involves first adding an inexpensive sacrificial cryogen, typically liquid nitrogen, into the cryogen vessel. The cryostat is then left for some time for temperatures to settle. This may be known as ‘soaking’. The temperature of the cryogen vessel is then allowed to rise above the boiling point of the sacrificial cryogen, to ensure that it is completely removed from the cryogen vessel, before working cryogen is added.
Although the material of the cryogen vessel itself quickly cools on addition of a cryogen, an issue arises with the cooling of the thermal radiation shield(s) 16. In use, these thermal radiation shields must be cooled, typically to about 50K in the case of a single thermal radiation shield in a helium-cooled system. They must be thermally isolated from both the cryogen vessel 12 and the OVC 14, to reduce the thermal influx from the room-temperature OVC to the cryogen vessel when in operating condition. When pre-cooling the cryostat, the thermal isolation of the thermal radiation shield(s) prevents the shield(s) from cooling rapidly on introduction of cryogen into the cryogen vessel.
Known methods of pre-cooling a thermal radiation shield 16 include: operating the refrigerator 17 to cool the thermal radiation shields, or ‘softening’ the vacuum between the OVC and the cryogen vessel by the operation of an amount of gas, so allowing the thermal radiation shields to be cooled by convection heat transfer to the cryogen vessel. Each of these will now be discussed.
1) Operating the refrigerator 17 to cool the thermal radiation shields. This has the disadvantage that any sacrificial cryogen within the cryogen vessel would need to be removed beforehand, since otherwise the sacrificial cryogen will be liquefied or frozen in the cryogen vessel. In known methods, the cryogen vessel is pre-cooled with nitrogen, allowed to warm up to a temperature in excess of the boiling point of nitrogen to ensure that no liquid nitrogen remains, and then is flushed with gaseous helium and then evacuated to ensure no contamination remains, before turning on the refrigerator. The refrigerator then cools the thermal radiation shield at a rate of about 1K/hr.
2) ‘Softening’ the vacuum between the OVC and the cryogen vessel. This will allow some thermal conductivity by convection, allowing heat to be transferred from the thermal radiation shield to the cryogen vessel, where it is removed by boiling of the sacrificial cryogen. Further cooling of the thermal radiation shield may occur by radiation once the working cryogen has been added into the cryogen vessel. Vacuum softening has been found to cool the thermal radiation shield rapidly to about 150 K when the cryogen vessel is filled with liquid nitrogen. Typically, the thermal radiation shield warms to 200 K during the phase when the cryogen vessel is allowed to warm to 80 K to ensure all liquid nitrogen is removed prior to filling with a liquid helium working cryogen. The refrigerator is then used to cool the thermal radiation shield from 200 K to 50 K. This process takes approximately 6 days, during which time approximately 200 liters of liquid helium are typically lost in boil off, at a current cost of about GB£400 (about US$800).
While the financial cost of the lost helium is significant, the length of time required for cooling is also troublesome. Conventionally, the recondensing operation of the refrigerator is tested before the cryostat was shipped to a customer. This requires cooling of the thermal radiation shield to about 50K, since higher thermal radiation shield temperatures will radiate more heat to the cryogen vessel than the recondensing refrigerator can remove. However, more recently, the time taken to cool the thermal radiation shield has become the dominant factor in the time taken for magnet tests as a whole. This is particularly so in arrangements with a particularly low quench rate, which is otherwise most desirable. The pressure to ship completed cryostats and magnet systems to customers as soon has possible has led to the refrigerator recondensing test being omitted from some testing protocols. This, in turn, can lead to difficulties later. For example, if any of these cryostats or magnet systems exhibit boil-off issues on, or after, installation, rapid problem diagnosis and correction will be hindered as their baseline cryogenic performance is unknown.
The present invention addresses at least some of the drawbacks of the prior art.
The above, and further, objects, advantages and characteristics of the present invention will become more apparent from consideration of the following description of certain embodiments thereof, given by way of non-limiting examples only, in conjunction with the accompanying drawings wherein:
The present invention provides a decouplable thermal link between the thermal radiation shield and the cryogen vessel. This link is in place during pre-cool, and conducts heat from the thermal radiation shield to the cryogen vessel. After pre-cool, the thermal link is decoupled, removing the thermal path between the cryogen vessel and the thermal radiation shield.
In the illustrated embodiment, a sprung, thermally-conductive element 30 extends between the thermal radiation shield 16 and cryogen vessel 12. In the illustrated embodiment, the element 30 is attached to the thermal radiation shield 16 by rivets 32, but could equally be attached by any equivalent means: nuts and bolts, deformed tabs and through-holes, welding, brazing or soldering, and so on. The element 30 is resiliently biased toward the cryogen vessel 12 sufficiently to maintain effective thermal contact. An actuating lever 34, whose function will be discussed below, is mounted on a pivot 36 and is attached to a radially outer surface of the element 30 by a suitable mechanical link, such as a further pivot 38, or a hook, or any equivalent feature. This actuating lever may be thermally conductive, providing a second path for heat transfer from the thermal radiation shield. In this embodiment, in the position shown in
When the pre-cool stage is complete, the cryogen vessel 12 will be cooled to operating temperature, such as about 4K by methods such as those discussed above. In the operating state, it is important to reduce thermal conduction between the thermal radiation shield 16 and the cryogen vessel 12.
Operation of the actuating lever 34 will now be explained, since this effects the transition of the element 30 from the first, shield-cooling position of
Referring again to
With the thermally conductive element in its second position, spaced away from the cryogen vessel as shown in
In
In some embodiments, it may be preferred to omit the latching mechanism 46, 48, such that the element 30 returns to its first position in the absence of sufficient magnetic field to maintain the second position. For example, it may be preferred to provide a thermal link between the thermal radiation shield and the cryogen vessel during shipment of the cryostat, or following a quench. If shipping of a cryostat is unexpectedly delayed, the working cryogen in the cryogen vessel may boil dry, and the cryogen vessel and thermal radiation shield may warm up towards ambient temperature. Similarly, as a result of a quench event, the cryogen vessel may lose all of its working cryogen, and the cryogen vessel and thermal radiation shield may warm up towards ambient temperature. In either situation, a further pre-cool will be necessary, and it would be advantageous for the thermal link of the present invention to be re-established. This would not be possible if the link is latched in its decoupled position. Some known cryostat arrangements are provided with a refrigerator which only cools the thermal radiation shield. Following a magnet quench in such a cryostat, it would be advantageous to re-establish eth thermal link of the present invention between the thermal radiation shield and the cryogen vessel, to enable the refrigerator to assist with cooling of the cryogen vessel.
The thermally conductive element 30 should be of a material of relatively high thermal conductivity, such as copper or aluminum, to provide effective heat transfer from the thermal radiation shield 14 to the cryogen vessel 12. The inventors have calculated that a copper link of cross-sectional area 400 mm2 (e.g. a strip of copper 100 mm wide and 4 mm thick) and of thermal length 100 mm, being the length that the heat is conducted through between the thermal radiation shield 14 and the cryogen vessel 12 placed in good thermal contact between a thermal radiation shield 16 at 300K and a cryogen vessel at 77K would conduct heat at a rate of 368 W. This rate will reduce as the thermal radiation shield cools. When the thermal radiation shield is at 200K, with the cryogen vessel again at 77K, the heat will transfer at a rate of 200 W. Towards the end of the pre-cool process, liquid helium may be introduced into the cryogen vessel as a working cryogen. It will cool the cryogen vessel to 4K. When the thermal radiation shield is at 200K and the cryogen vessel is at 4K, heat will transfer at a rate of 480 W.
As an example, assuming an aluminum thermal radiation shield of mass 180 kg, the change in thermal radiation shield enthalpy between room temperature 300K and thermal radiation shield operating temperature 80K is 2.89×107 J. At an average cooling rate of 200 W, the arrangement of the present invention could cool the thermal radiation shield from 300K to 80K in 40 hours, neglecting heat influx through suspension arrangements. This reduction from 6 days to less than 2 days will shorten the time required for pre-cool, and reduce the temptation to ship magnets without having tested their refrigeration systems to recondensing temperatures.
The inventors also performed some modeling to indicate the typical forces which will act upon the ferrous component and so be available to lift the thermally conductive element 30 away from the cryogen vessel 12. A ferrous sphere of mass 33 g and radius 10 mm is assumed, positioned 0.93 m radially from the magnet axis A (
As can be seen from
A force of 25N would be insufficient to overcome the resilience of a solid copper strip of 400 mm2. Th is problem may be overcome by constructing the thermally conducting element 30 using a laminated section, comprising multiple layers of very thin copper sheet. Alternatively, several thermal links according to the present invention may be provided around the cryostat, to provide the required total cross-sectional area of thermally conductive links. A flexible thermally conducting element 30 may be employed, such as a copper rope or braid. Alternative embodiments also address this issue, as will now be explained.
Although the embodiments described above employ an element 30 which is resilient in itself, other arrangements may be provided. For example, the element 30 may be hinged at the thermal radiation shield 16, and biased into thermal contact with the cryogen vessel 12 by gravity alone. Alternatively, or in addition, a bias spring may be provided to urge the element 30 into contact with the cryogen vessel. Alternatively, or in addition, actuating lever 34 may be resiliently biased so as to urge the element 30 toward the cryogen vessel 12.
In other embodiments, a thinner, resiliently flexible, part of the element 30 is provided near the thermal radiation shield 16, while the main part of the element 30 comprises a thicker material. This compromise would allow effective thermal conduction, with only a relatively short portion of reduced thermal conductivity, in return for reduced axial force required to cause deflection of the conductive element.
The actuation lever 34 and the thermally conductive link 30 are preferably of a non-magnetic material.
In further embodiments, the arrangement of the present invention may be located at a position such that the ferrous component 40 is repelled by the magnetic field when the magnet is active. In such embodiments, the ferrous component 40 should be placed on the same side of pivot 36 as the second pivot 38 or equivalent. In such arrangements, it may not be necessary to provide hole 50 in the thermal radiation shield. In such embodiments, the actuating lever may not extend beyond the pivot 36. Actuating lever 34 and/or thermally conductive element 30 may be of a magnetic material, since the resultant force will repel the actuating lever and thermally conductive element towards the second position shown in
According to an aspect of the present invention, a thermally conductive link is provided during pre-cool, such that cooling of the cryogen vessel by sacrificial cryogen also serves to pre-cool the thermal radiation shield. On activation of the superconducting magnet, the resultant field causes the thermally conductive link to decouple, ensuring thermal isolation between the cryogen vessel and the thermal radiation shield while the magnet is in use. Optionally, the thermally conductive link may latch in its decoupled position, maintaining thermal isolation between the thermal radiation shield and the cryogen vessel even when the magnetic field ceases.
No specific user or service operation needs to be undertaken to decouple the thermal link, and access to the link of the present invention is generally not required. Should it become necessary to dismantle the cryostat for any reason, the thermally conductive element of the thermal link of the present invention may be unlatched from its second position and returned to its first position in preparation for a further pre-cool operation when the cryostat is rebuilt. In embodiments where no latch is provided, the thermally conductive element of the thermal link of the present invention will revert to its first position automatically as the magnetic field ceases.
While the present invention has been described with particular reference to the pre-cooling of superconducting magnets, the present invention may also be applied to precooling of other cryogenically cooled apparatus, provided that a strong magnetic field is provided after precooling to decouple the thermal link of the present invention between the thermal radiation shield and the cryogen vessel.
In
In some embodiments, the thermal link arrangement of
In the thermal link arrangement of
As described above, the thermally conductive element 30 in any of the described embodiments may comprise any one of: a flexible or hinged strip of thermally conductive non-magnetic material such as copper; a flexible or hinged strip of thermally conductive magnetic material such as steel; a thermally conductive laminate such as stacked sheets of copper; a flexible thermal conductor such as copper rope or braid, a bimetallic strip which deforms on cooling. An appropriate choice of material for the thermally conductive element will be made based upon the particular arrangement under consideration.
While the present invention has been described with reference to certain embodiments, by way of non-limiting examples only, numerous variations and modifications will be apparent to those skilled in the art. While the present invention has been particularly described with reference to superconducting magnets for MRI systems, it may be applied to cryogenically cooled magnets for any purpose, such as magnetic resonance spectroscopy or particle acceleration. While the present invention has been described with particular reference to cooling to liquid helium temperatures, it may be applied to cooling by any cryogen, such as nitrogen, hydrogen, neon and so on. While various embodiments of the invention are described as including ferrous materials of ferrous components, these parts need not be of iron or steel, but may be of any material which may be attracted or repelled by an applied static magnetic field.
Number | Date | Country | Kind |
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0801687.5 | Jan 2008 | GB | national |