Claims
- 1. A device for forming blister pack packaging, the device comprising(a) a female thermoforming die defining a cavity, the female die constructed to be maintained at a predetermined temperature sufficient to thermoform a thermoplastic material; and (b) a male die, in opposed spaced relation to said female thermoforming die cavity, the male die comprising side walls constructed of a thermally insulating material and a core of a thermally conductive material between the side walls, the core defining therein a cooling channel constructed for fluid flow of cooling fluid through the die to selectively chill the core, the side walls and core together defining a tip portion, the core defining a center region of the tip portion, and the side walls defining an outer region surrounding the center region, said selective chilling occurring entirely in the center region.
- 2. The device of claim 1 constructed to apply a vacuum to the cavity while the material is thermoformed.
- 3. The device of claim 1 wherein the core is arranged to contact said area of the thermoplastic material before the thermoplastic material contacts the female die in the cavity.
- 4. The device of claim 1 wherein the side walls have a thermal conductivity of from about 0.1 to 0.2 W/(m×K) and the core has a substantially higher thermal conductivity.
- 5. The device of claim 4 wherein the core is formed of metal and the side walls are formed of a laminate or composite material.
Parent Case Info
This is a divisional of U.S. patent application Ser. No. 08/664,353, filed Jun. 17, 1996, now issued as U.S. Pat. No. 5,840,243.
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