Apparatus for measuring multiple pressures

Information

  • Patent Grant
  • 6220101
  • Patent Number
    6,220,101
  • Date Filed
    Tuesday, February 2, 1999
    25 years ago
  • Date Issued
    Tuesday, April 24, 2001
    23 years ago
Abstract
The apparatus includes a housing; a plurality of sensors mounted on the housing, each of the sensors including a sensing element and an electrical output connected to said sensing element. The apparatus also includes a plurality of inputs connected to the sensors, respectively, to transmit to the sensors. A circuit is mounted in the housing and in electrical connection with the electrical outputs to provide a common signal conditioner for the sensors.
Description




BACKGROUND OF THE INVENTION




The invention relates to measuring pressure, and particularly to using a series of sensors to measure a variety of different pressures in a system.




In many different systems, and particularly, in the braking system of an automobile, it is often necessary to measure a variety of different pressures in the system. These measurements are then used to indicate the operating condition of the system or to control the operation of the system. In the case of an automobile braking system, brake fluid pressures in each of the brake fluid lines are measured and these measurements are used to control the braking force of the brakes at each wheel end housing. In known systems for measuring brake fluid pressure, a pressure sensor is usually mounted in the wheel end housing in fluid communication with the break fluid to measure the pressure of the brake fluid. Each of these pressure sensors requires temperature compensation and signal conditioning, as well as an electrically conductive cable connecting the pressure sensor to the electrical system of the automobile.




SUMMARY OF INVENTION




The use of a different discrete sensor for each of the brake lines wherein each sensor has its own connecting cable, signal conditioning circuitry, and temperature compensation circuitry, adds to the cost of the brake system and can compromise the reliability of the system. Accordingly, the invention provides a housing having a plurality of mounting apertures and a plurality of sensors mounted in the mounting apertures, respectively. A plurality of lines are connected at one end to the sensors, respectively. The housing includes signal conditioning and temperature-compensating circuitry for each of the pressure sensors.











BRIEF DESCRIPTION OF THE DRAWINGS





FIG. 1

is a perspective view of the housing for the sensors.





FIG. 2

is a top view of the housing shown in FIG.


1


.





FIG. 3

is a view taken along line


3





3


in FIG.


2


.





FIG. 4

is a view taken along line


4





4


in FIG.


2


.





FIG. 5

is a schematic diagram of the sensors, the signal conditioning circuitry, and the temperature compensation circuitry embodying the invention.





FIG. 6

is a side perspective view of the sensors mounted within a vehicle.











Before one embodiment of the invention is explained in detail, it is to be understood that the invention is not limited in its application to the details of the construction and the arrangements of the components set forth in the following description or illustrated in the drawings. The invention is capable of other embodiments and of being practiced or being carried out in various ways. Also, it is to be understood that the phraseology and terminology used herein is for the purpose of description and should not be regarded as limiting.




DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT




Shown in

FIG. 1

of the drawings is a sensing system


10


embodying the invention. The system


10


includes a housing


14


. As shown clearly in

FIG. 4

, the housing


14


has a base


18


including seven apertures


22


,


26


,


30


,


34


,


38


,


42


, and


46


in the base


18


. A cap


50


fits over the base


18


to enclose a circuit board


54


. A custom ASIC


58


is mounted on the circuit board


54


and a pair of electrically conductive terminals


62


are mounted to the circuit board


54


and extend through a connector portion


66


of the cap


50


so that the housing


14


can be plugged into a socket (not shown), thereby connecting the sensing system


10


to a source of electrical power as well as instrumentation that receives an output.




The housing


14


also includes seven individually packaged sensors or transducers


70


,


74


,


78


,


82


,


86


,


90


, and


94


mounted in seven respective bosses


192


,


194


,


196


,


198


,


200


,


202


,


204


. The bosses


192


,


194


,


196


,


198


,


200


,


202


,


204


are of an appropriate size to be retained by the respective apertures,


22


,


26


,


30


,


34


,


38


,


42


, and


46


of the base


18


(shown in FIG.


4


). Preferably, the sensors


70


,


74


,


78


,


82


,


86


,


90


, and


94


are aligned with a common axis.




As shown in

FIG. 1

, each of the sensors is substantially similar, and accordingly, only one sensor


86


will be described in detail. Preferably, the sensor


86


includes a sensing chip


98


. While any appropriate semiconductor sensing chip or transducer is appropriate, the sensor of the preferred embodiment is a pressure sensor having a polysilicon surface micromachined pressure sensing chip as shown and described in U.S. Pat. No. 5,507,171, which is incorporated herein by reference.




As shown in

FIG. 3

, the pressure sensor


86


also includes a base portion


102


having a surface


106


defining a recess


110


. The polysilicon surface micromachined pressure sensing chip is mounted in the recess and is wire-bonded to a pair of electrically conducting shunts


114


that extend through the base portion


102


and that are connected to circuit board


54


. The recess is filled with a non-corrosive, pressure transmitting fluid or oil (not shown). The pressure sensor


86


also includes a cap portion


118


mounted on the base portion


102


. A diaphragm


122


is positioned between the cap portion


118


and the base portion


102


to seal the pressure sensing chip


98


and the fluid in the recess


110


.




As best shown in

FIG. 4

, the cap portion


118


also includes an outer surface


126


having an annular recess


130


in which is mounted an o-ring


134


. An inner surface


138


and a bore


142


extending between the outer surface


126


and the inner surface


138


allow a fluid pressure line (not shown) to be connected to the pressure sensor


86


to thereby transmit fluid pressure to the diaphragm. The diaphragm then transmits the fluid pressure to the fluid in the recess, which, in turn, transmits the fluid pressure to the pressure sensing chip.




Referring now to

FIG. 5

, the pressure sensors


70


,


74


,


78


,


82


,


86


,


90


and


94


are connected to the custom ASIC


58


. The custom ASIC


58


includes a pair of analog multiplexers


146


and


150


. The multiplexers


146


and


150


have outputs


158


and


162


, respectively, connected to inputs


166


and


170


, respectively, of a differential amplifier


174


. The output


178


of the differential amplifier


174


is input to a


12


bit analog to digital converter


182


which is connected to a microprocessor


186


. The custom ASIC amplifies the pressure sensor signals, provides temperature compensation for the pressure sensor signals and generates a composite output


190


that is representative of the pressures measured by each of the discrete pressure sensors.




In operation, the sensors or transducers,


70


,


74


,


78


,


82


,


86


,


90


and


94


can be installed in any structure or machine. In the motor vehicle


206


of

FIG. 6

, sensors can monitor either manual and antilock brakes, for example. Brake pressure is monitored by the sensing system


10


that preferably tracks brake pressure at each of the four wheels


208


and


210


(two wheels not shown). The sensing system


10


, provides a rapid synthesis of multiple inputs eliminating the additional processing delays that could lead to dangerous accidents.




Various features and advantages of the invention are set forth in the following claims.



Claims
  • 1. An apparatus for measuring fluid pressures, said apparatus comprising:a housing; a plurality of pressure sensors mounted on said housing, each of said pressure sensors including a pressure sensing element and an electrical output connected to said pressure sensing element; a plurality of fluid pressure inputs connected to said pressure sensors, respectively; and a circuit mounted in said housing and in electrical connection with said electrical outputs to provide a common signal conditioner for said pressure sensors.
  • 2. An apparatus as set forth in claim 1 wherein said signal conditioner includes a temperature compensating circuit.
  • 3. An apparatus as set forth in claim 1 wherein said signal conditioner includes a digitizing circuit.
  • 4. An apparatus as set forth in claim 1 wherein said housing is connected to a motorized vehicle having a brake system.
  • 5. An apparatus as set forth in claim 4 wherein at least one of said inputs is connected to said braking system.
  • 6. An apparatus as set forth in claim 1 wherein said circuit is mounted adjacent to said pressure sensors.
  • 7. An apparatus as set forth in claim 1 wherein said signal conditioner includes a digitizing circuit.
  • 8. An apparatus as set forth in claim 1 wherein said signal conditioner includes a temperature compensating circuit.
  • 9. An apparatus as set forth in claim 1 wherein said plurality of pressure sensors is mounted on said housing along a common axis.
  • 10. An apparatus for measuring fluid pressures, said apparatus comprising:a housing; a plurality of pressure sensors mounted on said housing along a common axis, each of said pressure sensors including a pressure sensing element and an electrical output connected to said pressure sensing element; a plurality of fluid pressure inputs connected to said pressure sensors, respectively; and a circuit mounted in said housing in electrical connection with said electrical outputs, said circuit including a digitizing circuit providing a common signal conditioner for said pressure sensors.
Parent Case Info

This application claims benefit to Provisional Application No. 60/073,487, filed Feb. 3, 1998.

US Referenced Citations (5)
Number Name Date Kind
4872349 Espiritu-Santo Oct 1989
5003818 Hoodenpyle et al. Apr 1991
5564434 Halperin et al. Oct 1996
5584543 Sawada Dec 1996
5592384 Wolf Jan 1997
Provisional Applications (1)
Number Date Country
60/073487 Feb 1998 US