This application is based on and claims priority under 35 U.S.C. § 119 to Korean Patent Application No. 10-2023-0025291, filed on Feb. 24, 2023, and 10-2023-0055658, filed on Apr. 27, 2023, in the Korean Intellectual Property Office, the disclosure of each of which is incorporated by reference herein in its entirety.
The inventive concept relates to a container packaging apparatus and a container packaging method, and more particularly, to a container packaging apparatus configured to wrap a container with a vinyl member and a container packaging method using the container packaging apparatus.
In order to manufacture a semiconductor device, various semiconductor processes such as development, exposure, and cleaning are performed on a wafer. At this time, in order to efficiently manufacture semiconductor devices, various semiconductor processes may be performed by a plurality of manufacturing facilities deployed in different locations. When manufacturing a semiconductor device, a wafer may be transferred in a container between a plurality of manufacturing facilities. At this time, in order to prevent the wafer from being contaminated, various attempts have been made to block the wafer from external environments during transfer of the wafer.
The inventive concept provides a container packaging apparatus having sealing reliability.
The inventive concept provides a method of packaging a container so as to improve sealing reliability.
According to an aspect of the inventive concept, there is provided a container packaging apparatus includes a moving table supporting a container, a bag supply unit configured to supply a vinyl bag to cover the container on the moving table, wherein the vinyl bag has a sealed upper part and an opened lower part, a load port including a pair of support blocks that support a bottom surface of the container transferred from the moving table and are spaced apart with a gap through which the vinyl bag passes, and a thermosetting unit configured to form a sealing line on the lower part of the vinyl bag to seal the vinyl bag, the thermosetting unit including a heating block having a heating coil and an elastic pad in contact with the heating block while the vinyl bag is heated by the heating block, wherein a number of windings per unit length of the heating coil at an edge of the heating block is greater than a number of windings per unit length of the heating coil at the center of the heating block, wherein a thickness of the vinyl bag is in a range from about 0.03 mm to about 0.05 mm, wherein a thickness of the elastic pad is in a range from about 3 mm to about 7 mm, and wherein the pair of support blocks respectively support one side and another side of the bottom surface of the container.
According to another aspect of the inventive concept, there is provided a container packaging apparatus includes a load port including a pair of support blocks that support a container covered with a vinyl bag and are spaced apart from each other with a gap through which the vinyl bag passes, and a thermosetting unit configured to form a sealing line under the vinyl bag and including a heating block having a heating coil and an elastic pad contacting the heating block while the vinyl bag is heated by the heating block, wherein a number of windings per unit length of the heating coil at an edge of the heating block is greater than a number of windings per unit length of the heating coil at a center of the heating block, wherein the pair of support blocks respectively support one side and another side of the bottom surface of the container, and wherein the pair of support blocks are each a single piece.
According to an aspect of the inventive concept, there is provided a method of packing a container, the method includes mounting the container on a moving table, covering the container mounted on the moving table with a vinyl bag including a sealed upper part and an opened lower part, transferring the container covered with the vinyl bag onto a load port, and forming a sealing line on the lower part of the vinyl bag by heating the vinyl bag with the heating block after fixing the vinyl bag between a heating block and an elastic pad, wherein a thickness of the vinyl bag is in a range from about 0.03 mm to about 0.05 mm, and wherein a thickness of the elastic pad is in a range from about 3 mm to about 7 mm.
Embodiments will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings in which:
Hereinafter, embodiments of the technical idea of the inventive concept will be described in detail with reference to the accompanying drawings. Like reference numerals are used for like elements in the drawings, and duplicate descriptions thereof are omitted.
In the specification, the vertical direction may be defined as a Z direction, and a horizontal direction may be defined as a direction perpendicular to the Z direction. A first horizontal direction and a second horizontal direction may be perpendicular to each other, the first horizontal direction may be referred to as an X direction, and the second horizontal direction may be referred to as a Y direction. A vertical level may denote a position in the vertical direction.
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The container CT may be configured to accommodate a substrate WF for manufacturing a semiconductor device. For example, the container CT may include any one of a sealed container such as a front open unified pod (FOUP) configured to accommodate a plurality of substrates WF, a magazine configured to accommodate a plurality of substrates WF, and a tray configured to accommodate a plurality of substrates WF.
The container packaging apparatus 100 may include a moving table 110, a bag supply unit 120, a load port 130, and a thermosetting unit 140.
The moving table 110 may support the container CT. The moving table 110 may contact and support the central portion of a bottom surface of the container CT. The moving table 110 is configured to move in the vertical direction (Z direction) and the horizontal directions, and the movement of the moving table 110 may be controlled by an actuator connected to the moving table 110. The moving table 110 supports the container CT mounted on its mounting surface and may also transfer the container CT. For example, the container CT brought into the container packaging apparatus 100 from the outside is loaded on the moving table 110, and the moving table 110 may move the container CT that has undergone a series of processes above the load port 130.
The bag supply unit 120 may supply a vinyl bag 910 to cover the container CT mounted on the moving table 110. The vinyl bag 910 may have a shape and size suitable for sealing the container CT and may have a bag shape providing an internal space suitable for packaging the container CT. The vinyl bag 910 may include, for example, polyethylene or high density polyethylene (HDPE). The vinyl bag 910 provided from the bag supply unit 120 may have an upper part and a lower part, and the upper part may be closed or sealed, and the lower part may be opened. For example, an upper part of the vinyl bag 910 may have an upper bonding line 920 formed by bonding two surfaces, and a lower part of the vinyl bag 910 may have an opening 940. The lower part of the vinyl bag 910 may be sealed by a heat fusion process using the thermosetting unit 140 to be described below.
In embodiments, the bag supply unit 120 may include a supply roll 121, a guide roll 123, a holder 125, and a cutter 127.
The supply roll 121 may supply the vinyl fabric 900. The vinyl fabric 900 may be wound around the supply roll 121, and the supply roll 121 may transfer the vinyl fabric 900 along a predetermined path through winding and rewinding. The guide roll 123 is disposed on a transfer path of the vinyl fabric 900, and may guide the transfer of the vinyl fabric 900.
The holder 125 holds the end of the vinyl fabric 900 and moves while holding the end of the vinyl fabric 900 to move the vinyl fabric 900. The holder 125 may include a plurality of holding blocks 1251 configured to hold one side and another side of the end of the vinyl fabric 900, and each of the plurality of holding blocks 1251 may be configured to be moved in the horizontal direction and/or the vertical direction (Z direction) by an actuator. For example, the holder 125 may include two holding blocks 1251 spaced apart in the first horizontal direction (X direction), and each of the two holding blocks 1251 may have a bar shape linearly extending in the second horizontal direction (Y direction) in a plan view. One of the two holding blocks 1251 may hold one side of the end of the vinyl fabric 900, and the other of the two holding blocks 1251 may hold another side of the end of the vinyl fabric 900. As the two holding blocks 1251 hold one side and another side of the end of the vinyl fabric 900, the end of the vinyl fabric 900 may be deformed into a square shape.
The cutter 127 may cut the vinyl fabric 900. The cutter 127 may separate the vinyl bag 910 from the vinyl fabric 900 by cutting the vinyl fabric 900. The cutter 127 may cut the vinyl fabric 900 along the cutting lines 951.
The vinyl fabric 900 may include a plurality of upper bonding lines 920 separated from each other in a length direction of the vinyl fabric 900. Referring to
The load port 130 may support the container CT as it is transferred to the moving table 110. After the process of covering the container CT mounted on the moving table 110 with the vinyl bag 910 is completed, the moving table 110 may transfer the container CT covered with the vinyl bag 910 to the load port 130. After transferring the container CT to the load port 130, the moving table 110 may be moved away from the container CT. The load port 130 may include a pair of support blocks 131 spaced apart from each other.
The pair of support blocks 131 may be spaced apart in the first horizontal direction (X direction), and each pair of support blocks 131 may extend in the second horizontal direction (Y direction). The pair of support blocks 131 may be configured to be moved by an actuator. The pair of support blocks 131 may respectively support one side and another side of a bottom surface of the container CT. For example, the pair of support blocks 131 may be provided at opposite ends of the bottom surface of the container CT to support the container CT. When the container CT is mounted on the pair of support blocks 131, a portion of the vinyl bag 910 may pass through a gap or space between the pair of support blocks 131 and exit to a lower side of the pair of support blocks 131. In addition, when the container CT is mounted on the pair of support blocks 131, a portion of the vinyl bag 910 may extend between each of the pair of support blocks 131 and the container CT.
The pair of support blocks 131 may have a symmetrical shape. The pair of support blocks 131 may have mirror symmetry with respect to an arbitrary reference plane (e.g., a YZ plane). The pair of support blocks 131 may each be a single piece, and the pair of support blocks 131 may have the same material composition as each other. If one side of the bottom surface of the container CT is supported by a plurality of blocks, there may be a problem that a vinyl member may be torn due to friction between the plurality of blocks and the vinyl member between the plurality of blocks. However, according to embodiments, because one side of the bottom surface of the container CT is supported by one support block 131 having a single piece structure, the problem such as tearing of the vinyl bag 910 may be reduced.
Each of the pair of support blocks 131 may include polyethylene. In example embodiments, each of the pair of support blocks 131 may include ultra high molecular weight polyethylene (UHMW-PE).
The thermosetting unit 140 may perform a thermosetting process on a lower part of the vinyl bag 910 so that the vinyl bag 910 has a closed lower part. When the thermosetting process is completed, a sealing line 930 extending in the width direction of the vinyl bag 910 may be formed at the lower part of the vinyl bag 910. The sealing line 930 may be formed by fusing two surfaces of the vinyl bag 910 into one line. When the thermosetting process is completed, the upper part of the vinyl bag 910 may be sealed by the upper bonding line 920, and the lower part of the vinyl bag 910 may be sealed by the sealing line 930, and thus, the vinyl bag 910 may have an airtight space in which the container CT is accommodated.
The thermosetting unit 140 may include a heating block 141 and an elastic pad 145. The heating block 141 and the elastic pad 145 may be respectively disposed below the pair of support blocks 131 supporting the container CT. The heating block 141 may include a heating coil 1417 (refer to
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Next, the container CT sealed by the vinyl bag 910 is unloaded to the outside of the container packaging apparatus 100 (S160).
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The elastic pad 145 may provide a surface 1451 (refer to
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In embodiments, a thickness T2 of the vinyl bag 910 may be in a range from about 0.03 mm to about 0.05 mm. If the thickness T2 of the vinyl bag 910 is less than 0.03 mm, due to gas permeating the vinyl bag 910, a tearing phenomenon in the substrate WF in the container CT due to physical scratches may occur. If the thickness T2 of the vinyl bag 910 is greater than 0.05 mm, the total heating time for the thermosetting process is increased and holes may occur in the vinyl bag 910, thereby reducing the sealing reliability of the vinyl bag 910.
In example embodiments, when the thickness T2 of the vinyl bag 910 is in a range from about 0.03 mm to about 0.05 mm, a thickness T1 of the elastic pad 145 may be in a range from about 3 mm to about 7 mm. Here, the thickness T1 of the elastic pad 145 may denote a length of the elastic pad 145 in a direction perpendicular (for example, in the first horizontal direction (X direction)) to the surface 1451 of the elastic pad 145 in contact with the heating block 141. If the thickness T1 of the elastic pad 145 is less than 3 mm, the uniformity of heat applied to the vinyl bag 910 may decrease, and thus, sealing reliability may be decreased. If the thickness T1 of the elastic pad 145 is greater than 7 mm, the total heating time for the thermosetting process is increased and there may be a problem that the vinyl bag 910 is pierced, and thus, the sealing reliability of the vinyl bag 910 is reduced.
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In general, the heat applied to the vinyl bag 910 through the edge portion 141E of the heating block 141 is less than the heat applied to the vinyl bag 910 through the center portion 141C of the heating block 141, and thus, there is a problem in that uniformity of heat applied to the vinyl bag 910 is reduced. However, according to the embodiments, because the number of windings per unit length of the heating coil 1417 at the edge portion 141E of the heating block 141 is greater than the number of windings per unit length of the heating coil 1417 at the center portion 141C of the heating block 141, the uniformity of heat applied to the vinyl bag 910 through the heating block 141 may be improved, and thus the sealing reliability of the vinyl bag 910 may be improved.
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In some embodiments, the pair of support blocks 131 may include a front block 1332, a rear block 1333, and a connection block 1331 extended in the second horizontal direction (Y direction) between the front block 1332 and the rear block 1333. The front block 1332, the rear block 1333, and the connection block 1331 form one body and may have the same material composition.
The front block 1332 may extend from one end of the connection block 1331 to a direction bent with respect to the extension direction of the connection block 1331, and the rear block 1333 may extend from another end of the connection block 1331 in a direction bent with respect to the extension direction of the connection block 1331. A length of the front block 1332 in the first horizontal direction (X direction) and a length of the rear block 1333 in the first horizontal direction (X direction) respectively may be greater than a length of the connection block 1331 in the first horizontal direction (X direction). In a plane view, the pair of support blocks 131 may have a groove defined by sides of the front block 1332, sides of the connection block 1331, and sides of the rear block 1333.
In some embodiments, the bottom surface of the container CT may include a protrusion PP, and the bottom surface of the container CT may have a first surface BS1 and a second surface BS2 at different vertical levels. The second surface BS2 is a surface of the protrusion PP and may be lower than the first surface BS1. The pair of support blocks 131 may be spaced apart from the protrusion PP and support the first surface BS1 of the container CT in the vicinity of the protrusion PP. That is, in each of the pair of support blocks 131, the front block 1332, the connection block 1331, and the rear block 1333 contact and support the first surface BS1 of the container CT but do not contact with the second surface BS2 of the container CT. The first surface BS1 of the container CT may include a plane parallel to the mounting surface 1311 of each support block 131. A portion of the first surface BS1 of the container CT that contacts the mounting surface 1311 of each support block 131 may be flat as a whole. If the pair of support blocks 131 contact with the protrusion PP on the bottom surface of the container CT, a load may concentrate between the pair of support blocks 131 and the protrusion PP on the bottom surface of the container CT, and thus, the vinyl bag 910 may be torn. However, according to embodiments, because the pair of support blocks 131 may support the container CT by avoiding the protrusion PP on the bottom surface of the container CT, the tearing of the vinyl bag 910 may be reduced.
According to embodiments, the container packaging using a vinyl bag may be automatically implemented by a container packaging apparatus.
According to embodiments, it is possible to reduce physical damage such as tearing or puncture in a vinyl bag in the process of packaging a container with the vinyl bag, thereby improving the reliability of container packaging using a vinyl bag. Accordingly, the exposure of a substrate in the container to the external environment is blocked during transport of the container, and thus, contamination of the substrate may be prevented and accordingly, the reliability of a semiconductor device manufactured using the substrate may be improved.
While the inventive concept has been particularly shown and described with reference to embodiments thereof, it will be understood that various changes in form and details may be made therein without departing from the spirit and scope of the following claims.
Number | Date | Country | Kind |
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10-2023-0025291 | Feb 2023 | KR | national |
10-2023-0055658 | Apr 2023 | KR | national |