The invention relates to an apparatus for producing baked products, in particular edible crispy wafers or soft waffles, where at least one baking plate, preferably moved through the baking chamber during baking, is provided, whose baking surface can be heated to baking temperature.
Such apparatuses are in particular wafer baking ovens. Wafer baking ovens having circulating baking tongs have been known for a long time for the industrial production of wafers of any kind. Furthermore, it is also already known to measure and regulate the oven temperature in order to achieve a good baking process. However, the temperature measurements at the present time are always made only indirectly by infrared heat sensors which are disposed in the oven chamber and measure the temperature, for example, on the rear side of the baking plate. A disadvantage here is the great inertia of the system and this temperature measurement gives no information on the temperature profile during the baking process in the plate and certainly not at the baking surface.
The measurement of the pressure which occurs in the closed baking tongs has so far not been made at all in industrial baking processes and has not been used to control the baking process. This applies particularly to baking tongs which are guided through a baking chamber of the oven, where cabling is not possible as in stationary baking ovens.
The baking process can be varied or disturbed by many factors, resulting in defective baking processes and increased wastage. For example, the dough composition can vary in regard to water content or flour quality or other dough factors. Furthermore, as a result of contamination, e.g. by sticking baking residues, multiple injections can occur on the baking plates with the result that not only the baking product becomes unusable but also the baking plate and the mechanical parts of the tong carriage can become damaged.
Hitherto, many of these disturbances of the baking process could only be determined after the baking process by means of the defective baking products, with the result that particularly in the case of fast-running baking ovens, considerable wastage occurs.
It is therefore the object of the present invention to avoid the said disadvantages by taking measurements during the baking process by measuring pressure and/or temperature directly in the baking plate and as close as possible to the baking surface and thereby have the possibility of controlling the baking parameters in good time. In the event of a set-point value deviation, the operator of the baking oven should be able to regulate the parameters such as temperature, amount of dough, recipe and belt speed, for example, by means of the measurement data. Furthermore contaminations, wear effects and double injections thereby caused can be avoided. One aim is also the fully automatic regulation of the baking oven control by means of the measured parameters.
The apparatus according to the invention is intended to be used for all baking ovens in which regulation using the parameters temperature and pressure is appropriate. In particular, these are wafer baking ovens for the production of crispy flat wafers, wafer products having three-dimensional shaping, flat baking products which are shaped three-dimensionally in the heated state after the baking process, and also soft waffles. The industrial technical operating mode of these baking ovens is accomplished by means of circulating baking tongs which are arranged in a row, where the baking tongs each comprise an upper and a lower baking plate and the baking tongs are opened for receiving dough, pass through the baking chamber after closing, and after baking of the product are opened again to remove the baking product, then cleaned and supplied to the dough application station again. This prior art is already described, for example, in AT 378 470 B1 and the similar U.S. Pat. No. 4,438,685.
The invention solves the formulated object whereby at least one baking plate is provided whose baking surface can be heated to baking temperature, where the baking plate has a sensor device for detecting the temperature of the baking plate and/or of the pressure acting on the baking surface of the baking plate during the baking process. The sensor device contains at least one sensor. The sensor is preferably disposed in a sensor receiving opening in the baking plate so that the sensor lies with its sensor head in the baking surface or comes to lie in close proximity to the baking surface. The sensor receiving opening is configured to extend from the rear side of the baking plate to a measuring section in close proximity to the baking surface, where the baking surface and the measuring section run through continuously.
Alternatively the sensor receiving opening can penetrate from the rear side of the baking plate through the baking plate where the sensor head lies with its sensor membrane in the baking surface and is profiled the same as this.
The measuring section of the sensor receiving opening can have a stamp projecting towards the sensor head or the sensor membrane thereof for transmitting the measurement values acting on the measuring section. Alternatively, the sensor membranes can have a stamp projecting towards the measuring section. The measuring section has, for example approximately a wall thickness between 1 and 3 mm.
The sensor receiving opening can be configured as a blind hole projecting into the baking plate and the sensor with its sensor body can be cylindrically shaped and fastened in the baking plate by means of an annular clamping element. Furthermore, the sensor is a passive temperature-pressure sensor which can preferably be interrogated by means of an electromagnetic field, which on its rear side has a sensor antenna for transmission of energy and information. The sensor antenna is an H-slot antenna. A reflector plate is disposed below the sensor antenna which is fastened to the sensor body or its shaft.
One or more reading devices are assigned to the sensor, which produce and evaluate the electromagnetic field. The sensor is adapted to deliver information relating to pressure, temperature and an identification feature characteristic of the sensor. The baking plate can also have a plurality of sensors. The baking plate can be part of baking tongs circulating in the baking oven, which each comprise a lower and an upper baking plate where the baking tongs in the closed position loaded with dough are movable through the baking chamber. The sensor device can consist of one or more sensors on the upper and/or lower baking plate. At least one of the baking tongs circulating in the baking oven is provided with at least one sensor device. A plurality of or all the baking tongs of a baking oven can be provided with a sensor device. In the baking oven a position display displaying the position of each baking tong and its baking plates provided with the sensor device is preferably provided in order to be able to assign each measured value read by the reading device to a specific baking plate and baking tong and its position in the baking oven. One or a plurality of reading devices are provided consecutively in the baking chamber and the successively read measured values and the identification features of the sensor devices of the baking plate(s) are fed to an evaluation device. Advantageously SAW sensors based on piezoelectric substrate crystals are used as sensors. Furthermore, the apparatus is preferably a baking oven for producing baked products which are formed in a baking tong between two successively disposed baking plates, wherein the baking oven has an oven frame provided with an external thermal insulation and baking tongs circulating in the baking oven are provided, which are disposed along an orbit leading through the baking chamber of the baking oven and which are conveyed by the conveying device of the baking oven along the orbit through the baking oven, wherein in the oven frame on a part of the orbit of the baking tongs disposed outside the baking chamber, a device for opening the baking tongs, a dispensing station for the baked products, a loading station for loading the baking tongs and a device for closing the baking tongs in the running direction of the baking tongs are disposed consecutively and wherein there is provided a monitoring device integrated in the baking oven, which detects the work activity of the baking oven and the baking process taking place in the baking tongs, which is provided with:
a sensor device which comprises at least one sensor disposed on a baking tong, which detects the baking process taking place in the baking tong, which is configured as a passive sensor which can be interrogated by an electromagnetic field,
a transmitting and receiving device which is disposed fixedly in the baking oven and comprises at least one reading device disposed on the orbit of the baking tong chain, which communicates via the electromagnetic field with the sensor of the sensor device and
an evaluation device which processes the signals coming from the sensor via the reading device and produces monitoring signals.
Further features of the invention can be deduced from the claims, the following description and the drawings.
Other features which are considered as characteristic for the invention are set forth in the appended claims.
Although the invention is illustrated and described herein as embodied in a apparatus for producing baked products, it is nevertheless not intended to be limited to the details shown, since various modifications and structural changes may be made therein without departing from the spirit of the invention and within the scope and range of equivalents of the claims.
The construction and method of operation of the invention, however, together with additional objects and advantages thereof will be best understood from the following description of specific embodiments when read in connection with the accompanying drawings.
The invention is explained in detail hereinafter with reference to the drawings.
As shown in
As can also be seen in
As will be explained in further detail subsequently with reference to
Further details on the operating mode of such baking devices can be deduced, for example, from the prior art mentioned initially and reference is particularly made to this.
For the arrangement of the sensor 6 with the sensor antenna 11, it should also be said that this antenna and its reflector plate 15 should lie as close as possible to the baking plate without however restricting the functionality of the antenna. The sensor antenna 11 can also lie in a slight recess of the baking plate or the baking plate ribs.
The sensor is inserted in the sensor receiving opening 7 and is held by an annular clamping element 30 where this sensor receiving opening is configured as a stepped blind hole. The sensor comprises the sensor head 8 which is closed with the sensor membrane 16 towards the bottom. The sensor receiving opening 7 extends very close to the baking surface 3 of the baking plate, where a measuring section 10 exists between the baking surface and the sensor membrane 16 which is sufficiently thin to relay temperature and pressure relationships on the baking surface 3 rapidly to the sensor head 8.
For contact and relaying the parameters between the measuring section 10 and the sensor membrane 16, there is provided a stamp 17 which in the present exemplary embodiment is configured as a small continuation of the measuring section 10 which extends in the direction of the sensor membrane 16.
It is obviously at the discretion of the person skilled in the art to provide the stamp 17 alternatively as part of the sensor membrane 16 and let the stamp act downwards towards the measuring section 10, as shown in
The wall thickness of the measuring section 10 is indicated by the reference number 18 and in practice lies between 0.5 and 5 mm, preferably between 1 and 3 mm. The wall thickness of the measuring section depends on the material of the baking plate and the sensitivity of the sensor. It is essential that temperature and pressure can be determined by the sensor in sufficient time and to sufficient extent.
The measuring section 10 comprises a surface area which is approximately indicated by the arrow 29.
A cavity 19 is provided in the sensor head 8 for the actual measuring component of the sensor, in particular the substrate-supported piezocrystal, where the structure of this measurement-sensitive sensor arrangement inside the sensor forms a separate invention and is not shown further here. It is essential that the parameters pressure and temperature transmitted through the measuring section 10 or one of these parameters can be relayed with appropriate accuracy as a signal to the sensor antenna 11.
Located above the sensor head 8 is an insulation shaft 20 whose longitudinal extension overcomes the thickness of the baking plate. The reflector plate 15 sits on the insulation shaft 20. Not shown is the electrical lead which extends inside the sensor from the sensor head 8 as far as the antenna 11 and naturally must withstand the high temperatures of a baking oven.
The supporting frame is indicated as upper supporting frame 21 and lower supporting frame 22. The sensor 6 sits in its sensor receiving opening 7 in the upper baking plate 1. The sensor extends here so far upwards that it is protected by the supporting frame 21 but the effect of the sensor antenna 11 is not diminished.
The precise arrangement of the reading devices or a multiplicity of reading devices along the process section for the baking process can be arbitrary and selected according to the circumstances.
The following is a summary list of reference numerals and the corresponding structure used in the above description of the invention:
Number | Date | Country | Kind |
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A 660/2011 | May 2011 | AT | national |
This application is a divisional of patent application Ser. No. 14/116,443, filed on Nov. 8, 2013, which was a continuation, under 35 U.S.C. §120, of international application No. PCT/EP2012/058204, filed May 4, 2012, which designated the United States; this application also claims the priority, under 35 U.S.C. §119, of Austrian patent application No. AT A660/2011, filed on May 10, 2011; the prior applications are herewith incorporated by reference in their entirety.
Number | Date | Country | |
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Parent | 14116443 | Nov 2013 | US |
Child | 15399136 | US |