Patent Application
20230169030
The present application claims the benefit of Chinese Patent Application No. 202122977794.5 filed on Nov. 29, 2021, the contents of which are incorporated herein by reference in their entirety.
The present disclosure relates to the technical field of read/write devices for serial attached small computer system interface (SAS) hard disks, and in particular to an apparatus for read/write operations on an SAS hard disk through a universal serial bus (USB) interface.
A serial attached small computer system interface (SAS) hard disk usually uses an SAS interface to be in communication with a computer mainboard. But read/write operations on data of the SAS hard disk through the SAS interface of the mainboard have become increasingly complex for meeting various requirements of consumers.
During data conversion by an adapter, increase in read/write amount and prolongation of read/write time cause increase in heat of a chip in the adapter, rendering an adapter body overheated, and even resulting in adapter failure due to overheating. Some adapters lower a read/write speed to be cooled when being at high temperature, which also imposes a degraded actual use experience on consumers.
Therefore, an apparatus for read/write operations on an SAS hard disk through a universal serial bus (USB) interface is urgently needed for solving one or more of the problems.
In order to solve one or more problems in the prior art, the present disclosure provides an apparatus for read/write operations on a serial attached small computer system interface (SAS) hard disk through a universal serial bus (USB) interface. The technical solution used in the present disclosure for solving the problems is an apparatus for read/write operations on an SAS hard disk through a USB interface. The apparatus includes: a case, where the case is internally provided with a printed circuit board assembly (PCBA) mainboard, the PCBA mainboard is provided with a controller, a power management module, an SAS to serial advanced technology attachment (SATA) protocol conversion module, an SATA to USB protocol conversion module, a USB interface and an SAS hard disk access interface, and the controller controls the PCBA mainboard to conduct the read/write operations on the SAS hard disk.
Furthermore, the case is provided with an indicator light, a power interface and a button which are electrically connected to the PCBA mainboard.
Furthermore, the case includes: a bottom case, a top case and a heat dissipation case;
Furthermore, the mounting recess is internally provided with several stand columns, and the PCBA mainboard is mounted on the stand columns.
Furthermore, the clamping grooves are provided on tops of two symmetrical side walls of the bottom case correspondingly.
Furthermore, a top of the heat dissipation case is provided with a flange or a slot, and the flange and the slot are configured to improve heat dissipation efficiency.
Furthermore, the controller, the power management module, the SAS to SATA protocol conversion module and the SATA to USB protocol conversion module are integrated on the same chip.
The present disclosure has the beneficial effects that the present disclosure connects the PCBA mainboard, the bottom case, the top case, the heat dissipation case, the heat conduction silica gel pads and other components together by means of an ingenious structure, thus conducting the read/write operations on the SAS hard disk through the USB interface, so as to facilitate usage of a consumer; moreover, the heat dissipation case and the heat conduction silica gel pads are arranged to improve the heat dissipation efficiency of the apparatus, so that speed reduction caused by overheating is avoided, service life of the internal chip is prolonged; the heat dissipation case is capable of making close contact with an uneven top of the chip by means of the heat conduction silica gel pads and achieving insulation, and then heat conduction efficiency is effectively improved and short circuit due to metal contact is prevented; and the stand columns are arranged to form a cavity in a bottom of the PCBA mainboard after the PCBA mainboard is mounted, and the cavity generates convection by means of a gap at an interface to conduct heat dissipation on the bottom of the PCBA mainboard, so that mounting of a mainboard is facilitated. Practical value of the present disclosure is greatly improved through the above.
101 . . . Bottom case
102 . . . Mounting recess
103 . . . Stand column
104 . . . Clamping groove
110 . . . Button
111 . . . Indicator light
201 . . . PCBA mainboard
202 . . . USB interface
203 . . . Power interface
204 . . . SAS hard disk access interface
210 . . . Heat conduction silica gel pad
301 . . . Top case
302 . . . Protrusion
303 . . . Through groove
401 . . . Heat dissipation case
402 . . . Connecting protrusion
403 . . . Flange
In order to make the above objectives, features and advantages of the present disclosure more apparent and easily understood, specific embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to facilitate full understanding of the present disclosure. However, the present disclosure may be implemented in many other modes different from those described herein, similar improvements may be made by those skilled in the art without departing from the connotation of the present disclosure, and therefore the present disclosure is not limited by the specific embodiments disclosed below.
As shown in
It should be noted that the case is provided with an indicator light 111, a power interface 203 and a button 110 which are electrically connected to the PCBA mainboard 201. The apparatus may be supplied with power by means of the USB interface 202 or the power interface 203. Generally, the controller, the power management module, the SAS to SATA protocol conversion module and the SATA to USB protocol conversion module are integrated on the same chip.
As shown in
Specifically, as shown in
It should be noted that the bottom case 101 and the top case 301 are usually made of plastic, the heat dissipation case 401 is usually made of metal with excellent heat conduction property such as aluminum, aluminum alloy, copper and copper alloy, and the heat conduction silica gel pads 210 are made of insulating and high-heat-conductivity silica gel sheets with excellent heat conduction property. A cavity formed between the stand columns 103 and the PCBA mainboard 201 directly faces the USB interface 202 and/or the SAS hard disk access interface 204, the case may further be provided with a heat dissipation hole, and the heat dissipation hole matches the cavity formed between the stand columns 103 and the PCBA mainboard 201.
In conclusion, the present disclosure connects the PCBA mainboard 201, the bottom case 101, the top case 301, the heat dissipation case 401, the heat conduction silica gel pads 210 and other components together by means of an ingenious structure, thus conducting the read/write operations on the SAS hard disk through the USB interface, so as to facilitate usage of a consumer; moreover, the heat dissipation case and the heat conduction silica gel pads are arranged to improve the heat dissipation efficiency of the apparatus, so that speed reduction caused by overheating is avoided, service life of the internal chip is prolonged; the heat dissipation case is capable of making close contact with an uneven top of the chip by means of the heat conduction silica gel pads and achieving insulation, and then heat conduction efficiency is effectively improved and short circuit due to metal contact is prevented; and the stand columns are arranged to form a cavity in a bottom of the PCBA mainboard after the PCBA mainboard is mounted, and the cavity generates convection by means of a gap at an interface to conduct heat dissipation on the bottom of the PCBA mainboard, so that mounting of a mainboard is facilitated. Practical value of the present disclosure is greatly improved through the above.
The above embodiments are merely one or more embodiments of the present disclosure, and are specifically described in details, but may not be interpreted as limiting the patent for the present disclosure as a result. It should be noted that for those of ordinary skill in the art, they may also make several transformations and improvements on the premise of not deviating from the conception of the present disclosure, and these transformations and improvements shall fall within the scope of protection of the present disclosure. Hence, the scope of protection of the present disclosure should be subject to the appended claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 202122977794.5 | Nov 2021 | CN | national |
