Claims
- 1. An apparatus for treating wastewater from a chemical-mechanical polishing process used in chip fabrication, the wastewater containing particles having an abrasive effect and chemically active substances, comprising:
an ultra-filtration facility receiving the wastewater and filtering out the particles having the abrasive effect without a substantial dissolution of the particles by the chemically active substances and resulting in ultrafiltrated wastewater.
- 2. The apparatus according to claim 1, including a reverse-osmosis facility disposed downstream of said ultra-filtration facility.
- 3. The apparatus according to claim 2, including a nano-filtration facility disposed downstream of said ultra-filtration facility.
- 4. The apparatus according to claim 3, including:
sensors for measuring parameter values of the wastewater after passing through said ultra-filtration facility; and a control system for passing on and for not passing on the wastewater to one of said reverse-osmosis facility, to said nano-filtration facility and to said reverse-osmosis facility in combination with said nano-filtration facility, said control system receiving and evaluating the parameter values measured by said sensors.
- 5. The apparatus according to claim 1, including a regeneration facility disposed downstream of said ultra-filtration facility, said regeneration facility producing deionized water from the ultrafiltrated wastewater.
Priority Claims (1)
Number |
Date |
Country |
Kind |
197 17 865.0 |
Apr 1997 |
DE |
|
Cross-Reference to Related Application
[0001] This is a division of U.S. application Ser. No. 09/428,582, filed Oct. 28, 1999, which was a continuation of copending International Application PCT/DE98/01164, filed Apr. 27, 1998, which designated the United States.
Divisions (1)
|
Number |
Date |
Country |
Parent |
09428582 |
Dec 2000 |
US |
Child |
09829871 |
Apr 2001 |
US |
Continuations (1)
|
Number |
Date |
Country |
Parent |
PCT/DE98/01164 |
Apr 1998 |
US |
Child |
09428582 |
Dec 2000 |
US |