Claims
- 1. An apparatus for treating wastewater from a chemical-mechanical polishing process used in chip fabrication, the wastewater containing particles having an abrasive effect and chemically active substances, comprising:an ultra-filtration facility receiving the wastewater and filtering out the particles having the abrasive effect without a substantial dissolution of the particles by the chemically active substances and resulting in ultrafiltrated wastewater; a device for flushing out the particles filtered out in said ultra-filtration facility at sufficiently short intervals so that the particles retained in the ultra-filtration facility are not substantially dissolved by the chemically active substances present in the wastewater, at least one sensor for measuring at least one parameter value of the wastewater after it has passed through said ultrafiltration facility; and a control system operable for selectively passing on the wastewater which has passed through the ultrafiltration facility to either one, both or neither of a reverse-osmosis facility and a micro-filtration facility.
- 2. The apparatus according to claim 1, including said reverse-osmosis facility disposed downstream of said ultra-filtration facility.
- 3. The apparatus according to claim 2, including said nano-filtration facility disposed downstream of said ultra-filtration facility.
- 4. The apparatus according to claim 1, including a regeneration facility disposed downstream of said ultra-filtration facility, said regeneration facility producing deionized water from the ultrafiltrated wastewater.
Priority Claims (1)
Number |
Date |
Country |
Kind |
197 17 865 |
Apr 1997 |
DE |
|
CROSS-REFERENCE TO RELATED APPLICATION
This is a division of U.S. application Ser. No. 09/428,582, filed Oct. 28, 1999, which was a continuation of copending International Application PCT/DE98/01164, filed Apr. 27, 1998, which designated the United States.
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Continuations (1)
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Number |
Date |
Country |
Parent |
PCT/DE98/01164 |
Apr 1998 |
US |
Child |
09/428582 |
|
US |