Apparatus for use in spinal interbody fusion

Information

  • Patent Grant
  • 9517140
  • Patent Number
    9,517,140
  • Date Filed
    Friday, November 21, 2014
    10 years ago
  • Date Issued
    Tuesday, December 13, 2016
    7 years ago
Abstract
An expandable interbody fusion device includes superior and inferior endplates that are configured to receive a sequentially inserted stack of expansion members or wafers in interlocking engagement. The expansion members are formed to each have a generally U-shaped rearward facing opening. The superior and inferior endplates have openings through their outer surfaces in at least partial alignment and communication with the rearward facing openings of the expansion members. The inferior endplate has a fully bounded cavity for telescoping receipt of the superior endplate. The inferior endplate also has a fully bounded channel extending through the rear endwall thereof in direct communication with the rearward facing opening of at least one expansion member for the receipt of bone graft material into the device to promote fusion between opposing vertebral bodies of the spine.
Description
FIELD OF THE INVENTION

The subject invention relates generally to the field of spinal implants and more particularly to expandable interbody fusion devices with graft chambers.


BACKGROUND OF THE INVENTION

Spinal implants such as interbody fusion devices are used to treat degenerative disc disease and other damages or defects in the spinal disc between adjacent vertebrae. The disc may be herniated or suffering from a variety of degenerative conditions, such that the anatomical function of the spinal disc is disrupted. Most prevalent surgical treatment for these conditions is to fuse the two vertebrae surrounding the affected disc. In most cases, the entire disc will be removed, except for a portion of the annulus, by way of a discectomy procedure. A spinal fusion device is then introduced into the intradiscal space and suitable bone graft or bone substitute material is placed substantially in and/or adjacent the device in order to promote fusion between two adjacent vertebrae.


Certain spinal devices for achieving fusion are also expandable so as to correct disc height between the adjacent vertebrae. Examples of expandable interbody fusion devices are described in U.S. Pat. No. 6,595,998 entitled “Tissue Distraction Device”, which issued on Jul. 22, 2003 (the '998 patent), U.S. Pat. No. 7,931,688 entitled “Expandable Interbody Fusion Device”, which issued on Apr. 26, 2011 (the '688 patent), and U.S. Pat. No. 7,967,867 entitled “Expandable Interbody Fusion Device”, which issued on Jun. 28, 2011 (the '867 patent). The '998 patent, the '688 patent and the '867 patent each discloses sequentially introducing in situ a series of elongate inserts referred to as wafers in a percutaneous approach to incrementally distract opposing vertebral bodies to stabilize the spine and correct spinal height, the wafers including features that allow adjacent wafers to interlock in multiple degrees of freedom. The '998 patent, the '688 patent and the '867 patent are assigned to the same assignee as the present invention, the disclosures of these Patents being incorporated herein by reference in their entirety.


Certain interbody fusion devices also include hollow portions or chambers that are filled with suitable material such as bone graft to promote fusion between vertebral bodies. The extent and size of the chambers establish areas of contact that are configured so as to assure maximum contact between the bone graft and the vertebral bodies. Sufficient surface area of the device surrounding the chambers needs to be maintained in order to provide an appropriate load bearing surface to withstand the compressive forces exerted by the opposing vertebral bodies. In addition, where expandable interbody fusion devices are used to correct height within the intradiscal space, the effect of shear forces on the expanded device due to torsional movement of the spine also needs to be considered.


Accordingly, there is a need to develop expandable interbody fusion devices with bone graft chambers that take into account and balance these factors, as well as to facilitate the introduction of bone graft into the device and through the graft chambers once expanded.


SUMMARY OF THE INVENTION

It is an object of the invention to provide an improved expandable device with openings serving as bone graft chambers for implantation into the intradiscal space between two opposing vertebral bodies of a spine having the facility for introducing bone graft thereinto upon expansion.





DESCRIPTION OF THE FIGURES


FIG. 1 is front perspective view of an expandable interbody fusion device in unexpanded condition in accordance with one embodiment of the present invention.



FIG. 2 is a perspective cross sectional view of the unexpanded device of FIG. 1 as seen along viewing lines II-II of FIG. 1.



FIG. 3 is a rear perspective view of the device of FIG. 1.



FIG. 4 is a top perspective view of an interlocking wafer serving as an expansion member to expand the interbody fusion device of FIG. 1.



FIG. 5 is a bottom perspective view of the interlocking wafer shown in FIG. 4.



FIG. 6 is front perspective view of the expandable interbody fusion device FIG. 1 expanded to an expanded condition.



FIG. 7 is a perspective cross sectional view of the expanded device of FIG. 6 is seen along viewing lines VI-VI of FIG. 6.



FIG. 8 is a top perspective view of an inserter for inserting wafers releasably connected to the unexpanded device of FIG. 1.



FIG. 9 is longitudinal cross sectional view of the inserter of FIG. 8.



FIG. 10 is a perspective view of the guide used with the inserter of FIG. 8 releasably connected to the expanded device of FIG. 6.



FIG. 11 is a top perspective view of an alternative lordotic expandable fusion device.





DESCRIPTION OF THE EMBODIMENTS

For the purposes of promoting and understanding of the principles of the invention, reference will now be made to the embodiments illustrated in the drawings and described in the following written specification. It is understood that no limitation to the scope of the invention is thereby intended. It is further understood that the present invention includes any alterations and modifications to the illustrated embodiments and includes further applications of the principles of the invention as would normally occur to one skilled in the art to which this invention pertains.


In accordance with one embodiment of the invention, an expandable interbody fusion device 10 includes a first superior endplate 12 and a second inferior endplate 14, as shown in FIGS. 1-3. The interbody fusion device 10 has a height across the superior and inferior endplates 12, 14 in the unexpanded condition as illustrated in FIGS. 1-3 that is less than the normal anatomic height of a typical intradiscal space. The invention contemplates that a series of expansion members, such as interlocking wafers 100 as will be described, are introduced into the device 10 to distract the opposing vertebrae by separating the superior and inferior endplates 12, 14 in situ. Insertion of the wafers 100 separates the endplates 12, 14 to expand the height of the device within the intradiscal space and to ultimately restore the normal anatomic height of the disc space. Expansion devices of this type are shown and described in the '998 patent, the '688 patent and the '867 patent described hereinabove and incorporated herein by reference.


The present invention contemplates an improved interbody fusion device 10 that particularly includes openings that define graft chambers for containment of materials that promote bone fusion through the device between opposing vertebral bodies.


The superior endplate 12 as shown in FIGS. 1-3 and 6-7 is elongate and comprises a hub 16 having pair of side surfaces 18 and 20 extending longitudinally on each side of the hub 16 and a pair of end surfaces 22 and 24 extending respectively at the proximal rear end and the distal front end of the superior endplate 12. The hub 16 is sized and configured to fit within a cavity of the inferior endplate 14 for telescoping movement therewithin, as will be described. The lower surface 26 of the hub 16 (FIG. 2) includes a shaped configuration defined by wafer mating features 28 that are substantially identical to the mating features on the lower surface of each wafer 100, as will be described. The hub 16 defines a series of grooves 30 as shown in FIG. 6 extending along each side surface 18 and 20 thereof that is configured to engage ribs (not shown) projecting interiorly of the inferior endplate 14. This engagement temporarily holds the superior and inferior endplates together in the expansion direction as the device 10 is introduced into the intradiscal space to be distracted.


As shown particularly in FIGS. 1-3 and 6-7, the superior endplate 12 includes a graft chamber defined by an opening 32 extending through the upper outer surface 12a and the lower surface 26. In a particular arrangement, the opening 32 is situated to lie more adjacent to the proximal surface 20 or rear end of the device 10. In accordance with one arrangement, the superior endplate 12 is formed of a biocompatible polymer such as polyethylethylketone (PEEK). PEEK is used in fusion applications for its combination of strength, biocompatibility, and elasticity which is similar to human bone. Other composites may include derivatives of PEEK such as carbon fiber reinforced PEEK and PEKK, respectively. In a particular aspect, the superior endplate 12 may further include an upper endcap 34 that defines the outer surface 12a. Endcap 34 may be a separate plate formed of material for the promotion of bone growth, such as titanium, and may be attached to the endplate 12 with suitable conventional techniques. As an alternative, the upper surface 12a may be defined by a coating of a suitable layer of bone growth promotion material, such as titanium, which may be deposited by conventional techniques such as, for example, by ion implantation as described in U.S. Pat. No. 4,743,493, entitled “Ion Implantation of Plastics”, issued on May 10, 1988 to Sioshansi et al., the contents of which are incorporated by reference herein.


The inferior endplate 14 of the interbody fusion device 10 as shown in FIGS. 1-3 and 6-7 is elongate and comprises a pair of opposing spaced apart sidewalls 36 and 38 extending along the longitudinal direction and projecting upwardly from the lower outer surface 14a. A pair of spaced apart endwalls 40 and 42 extend laterally across the device and project upwardly from outer surface 14a. Rear end wall 40 is disposed at the rear or proximal end of the device 10 and front end wall 42 is disposed at the front or distal end of the device 10. The side walls 36, 38 together with rear end wall 40 and front end wall 42 form an open, upwardly facing fully bounded interior cavity 44 as shown in FIGS. 1-2 and 7. The interior cavity 44 is sized and configured to receive the superior endplate 12 including the hub 16 and the endcap 34 in relatively close fit between the side walls 36 and 38 and the end walls 40 and 42 of the inferior endplate 14 in a non-expanded condition as shown in FIGS. 1 and 2. The hub 16 of superior endplate 12 remains fully contained within the inferior endplate 14 during telescoping expansion of the device 10 as shown in FIGS. 6 and 7, contributing to the torsional strength of the expanded device 10.


The inferior plate 14 as shown in FIG. 3 defines a fully bounded wafer channel 46 extending through the rear endwall 40 in communication with interior cavity 44 and through which the wafers 100 which serve as expansion members are introduced. The inferior endplate 14 includes a pair of opposite ledges 48 that define an upper support surface on which each wafer 100 is supported as it introduced into the wafer channel 46, as will be described. The ledges 48 define the bottom surface of the cavity 44. Wafers are introduced sequentially into wafer channel 46, as will be described. The rear endwall 40 further defines a threaded connection opening 50 for threaded releasable receipt of a guide pin for use in the introduction of wafers 100 and in the delivery of bone graft material into the device 10, as will also be described. Rear endwall 40 may also additionally include a pair of bilateral notches 52 adjacent the sidewalls 36 and 38 for use in attachment to portions of the wafer inserter for the establishment of a rigid connection to the device 10 for insertion into the intradiscal space.


As shown particularly in FIGS. 1-3 and 6-7, the inferior endplate 14 includes a graft chamber defined by an opening 54 extending through the lower outer surface 14a and the upper support surface 48 in communication with cavity 44. In a particular arrangement, the opening 54 is situated to lie more adjacent to the proximal surface 20 or rear end of the device 10 and at least in partial alignment with the opening 32 in superior endplate 12. In accordance with one arrangement, the inferior endplate 12 is formed of a material different from the material of the superior endplate 12. In this aspect, the inferior endplate 12 may be formed of a biocompatible metal, such as titanium, for its strength properties. Titanium is chosen for strength, biocompatibility, processing capability, and fluoroscopic imaging properties (radiolucency). Other alternative materials include cobalt chrome, stainless steel (both stronger than titanium but much less radiolucent), or biocompatible ceramics such as silicon nitride or zirconia, which are radiolucent. Titanium and silicon nitride have demonstrated good apposition to bone and superior to PEEK. In this regard where inferior endplate 14 is formed of titanium, the lower outer surface 14a would provide for the promotion of bone growth. Where inferior endplate 14 is not formed of a bone growth promotion material, lower outer surface 14a may be coated with a suitable layer of bone growth promotion material, such as titanium, and deposited in a conventional manner as described hereinabove.


Where inferior endplate 14 is formed of titanium or other suitable metal that is radiopaque, windows 56 may be formed through sidewalls 36 and 38 and/or through front endwall 42 as shown in FIGS. 1-3 and 6-7 so as to allow visual observation of the expansion of the device 10 upon insertion of the wafers 100 by suitable imaging techniques, such as fluoroscopy.


Details of an interlocking wafer 100 are shown in FIGS. 4-5. The wafer 100 is elongate and has an upper surface 102 and a lower surface 104, both of which are generally planar so that the wafers can form a stable stack within the interbody fusion device 10. Wafer 100 includes a trailing rear end 106 and a leading front end 108. The rear end 106 is formed substantially in the form of a horseshoe, with a pair of spaced opposing arms 112 and 114 defining an open rearward facing generally U-shaped opening 116. The surface 118 between the upper surface 102 and the lower surface 104 at the base of opening 116 defines a pushing surface, as will be described. The opening 116 at the rear end of each wafer 100 is provided to allow bone graft material to flow into the device 10 through the openings 116 and into the openings 32 and 54 extending through the superior endplate 12 and the inferior endplate 14, respectively.


The rear end 106 includes a downward-facing sloped surface 120 at the free end of each arm 112 and 114 that corresponds angularly to an upward-facing surface 122 on the leading front end 108 of the wafer 100. The sloped surfaces help displace an earlier inserted wafer 100 upon introduction of a new wafer. More specifically, when a first wafer 100a is introduced through the wafer channel 46, resting on the ledges 48, the downward-facing sloped surface 120 thereof is lifted upon contact with the upward-facing slope 122 of a newly inserted wafer 100b (FIG. 7). This allows the newly inserted wafer to ride along the ledges 48 until it is positioned fully underneath the previous wafer as more fully described in the '867 patent.


The wafer 100 includes several features for interlocking engagement to the hub 16 and to adjacent wafers 100 in a complementary interlocking mating interface. One particular feature includes a series of locking elements defined by resiliently deflectable prongs 124 that project outwardly above the upper surface 102 of the wafer 100 in the direction of expansion of device 10. A complementary series of locking surfaces 126 are defined in the lower surface 104 of the wafer 100 for resilient engagement with the prongs 124 as wafers are inserted into device 10 to form a stack. It should be appreciated that the prongs 124 and associated locking surfaces 126 may be formed on either the upper surface or the lower surface of a wafer 100 as desired. The lower surface 104 of each wafer 100 as shown in FIGS. 5 and 7 also defines a T-slot configuration 128 for mating with a T-bar configuration 130 on the upper surface 102 of a successive wafer 100 as shown in FIGS. 4 and 7. It should be appreciated that the respective T-bar and T-slot configurations may also be formed on either the upper surface or the lower surface of a wafer 100 as desired. In the illustrated arrangement, there are two prongs 124 extending generally linearly and substantially centrally along the elongate longitudinal direction adjacent the front end 108 of wafer 100. The structure and function of a wafer 100 and the prongs 124 are more fully described in the '867 patent, incorporated herein by reference.


The superior and inferior endplates 12 and 14 are configured to be initially releasably engaged by the ribs (not shown) and the grooves 30 when the device 10 is unexpanded, as shown in FIGS. 1 and 2. In this unexpanded condition, the device 10 is attached to an inserter 200 as shown in FIGS. 8 and 9. In this stage, the hub 16 is disposed within the cavity 44 of inferior endplate 14 with the ribs (not shown) on the interior surfaces of side walls 36, 38 engaging the grooves 30 extending along each side of the hub 16. The lower surface 26 of hub 16 is on or closely adjacent to the wafer support ledges 48 in facing relationship. This engagement temporarily holds the superior and inferior endplates together as the device 10 is introduced into the intradiscal space to be distracted. In this unexpanded condition the outer surface 12a of the superior endplate 12 is substantially flush with the upper surfaces of the sidewalls 36 and 38 as illustrated in FIGS. 1 and 2. In addition to providing strength for the device 10 as described hereinabove, such nesting of the superior endplate 12 within inferior endplate 14 allows for lower height of the unexpanded device 10.


The inserter 200 as illustrated in FIGS. 8 and 9 comprises a track assembly 202 and a handle 204 for individually sequentially inserting a plurality of wafers 100 supported linearly within the track assembly 202. A source of wafers 100 is provided in a cartridge 206 supported by the track assembly 202. A pair of opposing fingers 208 is provided at the distal end of the track assembly 202, fingers 208 releasably engaging the notches 52 in the rear endwall 40 for connection thereto. As depicted particularly in FIG. 9, the track assembly 202 supports an elongate guide pin 210 the distal end 210a of which is threaded for releasable threaded connection with threaded opening 50 in rear endwall 40 of the device 10. Inserter 200 comprises an elongate driver 212 that is translatably supported within the track assembly 202, the distal end of which is configured to enter the rearward facing opening 116 of each wafer 100 and engage the pushing surface 118. Upon actuation of the handle and translation of the driver 212, the wafer 100 is suitably moved through the channel 46 and into the device 10 by the force of the distal end of the driver 212 against the pushing surface 118. Inserter 200 further includes a quick disconnect member 214 which upon rotation allows the inserter 200 to be detached from the guide pin 210, thereby leaving the guide pin 210 releasably connected to the expanded device 10 after suitable insertion of the desired number of wafers, as shown in FIG. 10. With the guide pin 210 attached to the device 10 at opening 50, the channel 46 extending through the rear end wall 40 of device 10 is fully exposed and may be used for the introduction of suitable bone graft material into expanded device 10. For the introduction of a bone graft material, the guide pin 210 may be used as a locator for subsequent attachment to an apparatus containing such bone graft material whereby such apparatus may be supported by the guide pin 210 while allowing access into channel 46. Further details of the structure and operation of the inserter 200 are described in commonly assigned U.S. Pat. No. 6,997,929, entitled “Tissue Distraction Device”, and issued Feb. 14, 2006, the contents of which are incorporated by reference herein.


The manner in which the interbody fusion device 10 is expanded is illustrated in FIGS. 6-7. When the first wafer 100 is introduced, the interlocking features on the upper surface 102 of the wafer 100 engage the mating features 28 on the lower surface 26 of superior endplate 12 lifting the superior endplate 12 upwardly within the cavity 44 between sidewalls 36, 38 and breaking the initial releasable engagement. When the first inserted wafer 100 is introduced into the device 10 the rearward facing opening 116 in the wafer 100 is located to be in at least partial alignment and communication with the openings 32 and 54 extending through the superior endplate 12 and inferior endplate 14, respectively. This process continues with each successive wafer 100 inserted beneath a previously inserted wafer 100 until a complete stack is formed telescopically lifting the superior endplate 12 relative to the inferior endplate 14, as depicted in FIG. 7. As each subsequent wafer 100 is introduced, the prongs 124 lockingly engage the mating locking surfaces 126 features on the lower surfaces of each previously introduced wafer 100, with the openings 116 of each wafer 100 being disposed such that they are in at least partial alignment and communication with the openings 116 of each previously introduced wafer 100. The lowermost wafer 100 is supported on the support surfaces of ledges 48 with the rearward facing opening being in direct communication with the channel 46 extending through rear endwall 40 of inferior endplate 14. It should be noted that all the wafers 100 are contained within and constricted by the opposing side walls 36, 38 and the rear and front end walls 40, 42 so as to provide additional resistance against torsional movement of the spine. The inserter 200 is released from the expanded interbody fusion device 10 upon unthreading the guide pin 210 from opening 50.


Having described the interbody fusion device 10, a suitable bone filler or bone graft to promote fusion between opposing vertebral bodies may be inserted into the expanded device 10 as well as into the intradiscal space adjacent to device 10. With the inserter 200 used to insert inserts such as wafers 100 into device 10 having been removed from the expanded device 10, it can be appreciated that the wafer insertion channel 46 provides clear and unobstructed access into the expanded device 10 and into the rearward facing openings 116 of wafers 100, facilitating the introduction of bone graft material. A suitable graft insertion instrument using the guide pin 210 as a locator may be used to inject bone graft under pressure into the expanded device 10. Under an appropriate pressure, such bone graft will flow through into channel and openings 116 and into the openings 32 and 56 of superior endplate 12 and inferior endplate 14. Injection of the bone graft will continue until the graft is stress loaded against the endplates of the opposing vertebral bodies. In some instances, bone graft may be pre-loaded into an unexpanded device 10 prior to insertion of the device 10 into the intradiscal disc space. Suitable bone graft materials may include autograph bone, allograft bone, bone morphogenic protein (BMP) and xenograft and synthetic derived bone substitutes, as described for example, in the '998 patent. It should also be understood that a material with a bone fusion promoting substance, such as a sponge saturated with BMP, may be placed in the openings 32 and 54 suitably formed to support such a sponge. This will allow the fusion promoting substance to be pre-loaded into device 10 and not be disrupted upon expansion of device 10 by insertion of wafers 100 as described herein.


It is contemplated that the wafers 100 described herein, be formed of a biocompatible material that is sufficiently rigid to form a solid stack as the successive wafers are inserted into the device. Thus, in one specific embodiment, the wafers 100 are formed of PEEK or a carbon-fiber reinforced PEEK, or similar polymeric material.


In accordance with certain specific applications, the overall length of the device 10 as shown in FIGS. 1 and 6, as defined by the length of the inferior endplate 14, is about 25 mm. The width of the device is approximately 9 mm. The height of the unexpanded device 10 of FIGS. 1-2 with the superior endplate 12 fully nested within the inferior endplate 14 is approximately 7 mm. With the introduction of five wafers 100, each of which has a thickness of approximately 1.0 mm, the height of device 10 may be expanded from an unexpanded height of approximately 7 mm to an expanded height of approximately 12 mm. Of course, the number of wafers may vary depending upon the particular surgery and the initial height may also be different. For example, device 10 may be formed to have an initial unexpanded height of approximately 9 mm and with the addition of seven wafers 100, each having a thickness of 1 mm, the height of device 10 may be increased to approximately 16 mm. As such, it should be appreciated that these dimensions are only illustrative and that the dimensions of the device 10 and the number of wafers 100 to be inserted and their thicknesses may vary depending upon the application.


While the invention has been illustrated and described in detail in the drawings and foregoing description, the same should be considered as illustrative and not restrictive in character. It is understood that only the preferred embodiments have been presented and that all changes, modifications and further applications that come within the spirit of the invention are desired to be protected. For instance, as shown in FIG. 11, a device 300 embodying the features described herein may be formed to have a lordotic shape, whereby the leading front end 310 intended to be placed in the anterior portion of the intradiscal space may have a height greater than the trailing rear end 320, intended to be placed in the posterior portion of the intradiscal space.

Claims
  • 1. An expandable interbody fusion device for implantation into an intradiscal space between two opposing vertebral bodies of a spine, comprising: a first endplate having an outer surface configured to contact one of said vertebral bodies and an opening extending through said outer surface;a second endplate having an outer surface configured to contact the other vertebral body and an inner support surface, said second endplate having opposing spaced apart sidewalls and opposing spaced apart front and rear endwalls defining therewithin a fully bounded interior cavity, said support surface being within said interior cavity, said first endplate being received within said interior cavity, said second endplate having at least one opening extending through said outer surface and said support surface and communicating with said interior cavity, said rear endwall defining therethrough a fully bounded channel in communication with said interior cavity, said first endplate being movable in an expansion direction relative to said second endplate toward the opposing vertebral body;at least one insert having an upper surface, an opposite lower surface, a front end, a rear end and an open rearward facing opening extending through said upper surface, said lower surface and the rearmost surface of said rear end, said at least one insert being configured to be introduced between said first endplate and said second endplate through said channel into said interior cavity in an insertion direction that is substantially perpendicular to said expansion direction and supported by said support surface therewithin with the front end of said insert adjacent the front endwall of said second endplate and the rear end of said insert adjacent the rear endwall of said second endplate, said rearward facing opening communicating with said channel and being in at least partial alignment with said openings through said first endplate and said second endplate; anda locking surface on said at least one insert to lock said at least one insert in said device.
  • 2. The device of claim 1, wherein said first endplate and said second endplate are formed of different materials.
  • 3. The device of claim 1, wherein said first endplate is formed of a biocompatible polymer and said second endplate is formed of a biocompatible metal.
  • 4. The device of claim 3, wherein said first endplate is formed of PEEK and said second endplate is formed of titanium.
  • 5. The device of claim 4, wherein the outer surface of said first endplate and the outer surface of said second endplate each comprise material for the promotion of bone growth during fusion.
  • 6. The device of claim 5, wherein said outer surface of said first endplate further comprises a separate endcap formed of titanium and attached to said first endplate.
  • 7. The device of claim 5, wherein said outer surface of at least one of said first endplate and said second endplate comprises a coating adhered thereto.
  • 8. The device of claim 1, wherein the material of said second endplate is substantially radiopaque and said second endplate has at least one window therethrough for observation of one of said first endplate and said at least one expansion member during expansion of said device.
  • 9. The device of claim 1, wherein said locking surface comprises at least one interlocking element that is resiliently flexible in the expansion direction.
  • 10. The device of claim 9, wherein said at least one insert comprises an upper surface and a lower surface and wherein said interlocking element comprises a resiliently deflectable prong projecting outwardly from one of said upper surface and said lower surface.
  • 11. The device of claim 1, including at least two of said inserts, each being of substantially identical configuration.
  • 12. The device of claim 11, wherein said at least two inserts upon introduction into said device reside within said interior cavity.
  • 13. The device of claim 12, wherein each insert includes said locking surface extending into one of said upper surface and said lower surface.
  • 14. The device of claim 13, wherein each insert includes a plurality of prongs and locking surfaces adjacent the front end of each insert.
  • 15. The device of claim 1, wherein said second endplate includes a surface for attachment to an inserter for inserting said insert into said device between said first endplate and support surface of said second endplate.
  • 16. The device of claim 15, wherein said attachment surface includes a connection surface on said rear endwall.
  • 17. An expandable interbody fusion device for implantation into an intradiscal space between two opposing vertebral bodies of a spine, comprising: a first endplate having an outer surface configured to contact one of said vertebral bodies and an opening extending through said outer surface and said lower surface;a second endplate having an outer surface configured to contact the other vertebral body and an inner support surface, said second endplate having opposing spaced apart sidewalls and opposing spaced apart front and rear endwalls defining therewithin an interior cavity, said support surface being within said interior cavity, said first endplate being received within said interior cavity, said second endplate having at least one opening extending through said outer surface and said support surface and communicating with said interior cavity, said rear endwall defining therethrough a channel in communication with said interior cavity, said second endplate being movable in an expansion direction relative to said first endplate toward the opposing vertebral body;a plurality of elongate inserts each having a front end and a rear end and configured to be introduced through said channel into said interior cavity one below the other in an insertion direction that is substantially perpendicular to said expansion direction and supported by said support surface therewithin with the front end of each of said inserts adjacent the front endwall of said second endplate and the rear end of each of said inserts adjacent the rear endwall of said second endplate, each of said inserts having an open rearward facing opening extending through the rearmost surface of said rear end and communicating with each other upon introduction and in at least partial alignment with said openings through said first endplate and said second endplate, the rearward facing opening of at least said lowermost insert being in direct communication with said channel.
  • 18. The device of claim 17, further including a locking surface on each of said inserts to resist movement of said inserts in said device in a direction opposite said insertion direction.
  • 19. The device of claim 18, wherein each of said inserts comprises an upper surface and a lower surface and wherein said locking surface further includes a T-bar configuration on one of said upper surface and said lower surface and a T-bar configuration on the other of said upper surface and said lower surface to slidingly receive said T-bar configuration upon introduction of said inserts.
  • 20. The device of claim 19, wherein each insert includes a plurality of prongs and locking surfaces adjacent the front end of each expansion member so that upon sliding contact of one insert lengthwise relative to another insert, said prongs on said one insert progressively engage a locking surface on the other insert.
  • 21. The device of claim 18, wherein each of said inserts includes an upper surface and a lower surface and a pushing surface between said upper and lower surface within and communicating with said open rearward facing opening.
  • 22. The device of claim 21, wherein said locking surface of each said insert is disposed on said insert adjacent the front end thereof, and wherein said open rearward facing opening defines a U-shaped opening, the base of said opening defining said pushing surface.
  • 23. The device of claim 22, wherein each of said locking surfaces includes at least one resiliently interlocking element.
  • 24. The device of claim 22 wherein at least two of said inserts are of substantially identical configuration.
  • 25. The device of claim 24, wherein the material of said second endplate is substantially radiopaque and said second endplate has at least one window therethrough for observation of one of said first endplate and at least one insert of said plurality of inserts during expansion of said device.
  • 26. The device of claim 18, wherein said locking surface of each insert extends into each of said inserts.
  • 27. The device of claim 26, wherein a locking surface of at least one insert engages a cooperating locking surface on one of said first endplate or said second endplate to lock said at least one insert in said device.
  • 28. The device of claim 17, wherein said channel is fully bounded by said rear endwall.
  • 29. The device of claim 17, wherein said interior cavity is fully bounded by said opposing spaced apart sidewalls and said opposing spaced apart front and rear endwalls.
  • 30. The device of claim 17, further including a threaded opening through the rear endwall of said second endplate, said threaded opening being spaced from said channel and configured for threaded receipt of a guide pin of an inserter for inserting said device into the intradiscal space between said two opposing vertebral bodies.
CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. application Ser. No. 13/795,054, filed Mar. 12, 2013, now U.S. Pat. No. 8,900,312, the entire contents of which are incorporated by reference herein.

US Referenced Citations (115)
Number Name Date Kind
3486505 Morrison Dec 1969 A
4524766 Petersen Jun 1985 A
4683476 Ferrari et al. Jul 1987 A
4736738 Lipovsek et al. Apr 1988 A
4743493 Sioshansi et al. May 1988 A
4755797 Kanaya Jul 1988 A
4863476 Shepperd Sep 1989 A
4888024 Powlan Dec 1989 A
5059193 Kuslich Oct 1991 A
5192326 Bao et al. Mar 1993 A
5192327 Brantigan Mar 1993 A
5197971 Bonutti Mar 1993 A
5298254 Prewett et al. Mar 1994 A
5431658 Moskovich Jul 1995 A
5439684 Prewett et al. Aug 1995 A
5505732 Michelson Apr 1996 A
5514180 Heggeness et al. May 1996 A
5522899 Michelson Jun 1996 A
5571109 Bertagnoli Nov 1996 A
5591235 Kuslich Jan 1997 A
5645599 Samani Jul 1997 A
5702454 Baumgartner Dec 1997 A
5755797 Baumgartner May 1998 A
5756127 Grisoni et al. May 1998 A
5766252 Henry et al. Jun 1998 A
5836948 Zucherman et al. Nov 1998 A
5860977 Zucherman et al. Jan 1999 A
5891147 Moskovitz et al. Apr 1999 A
5951553 Betz et al. Sep 1999 A
5980522 Koros et al. Nov 1999 A
6033411 Preissman Mar 2000 A
6045579 Hochshuler et al. Apr 2000 A
6066154 Reiley et al. May 2000 A
6074390 Zucherman et al. Jun 2000 A
6110179 Flivik et al. Aug 2000 A
6110210 Norton et al. Aug 2000 A
6159211 Boriani et al. Dec 2000 A
6159244 Suddaby Dec 2000 A
6190414 Young et al. Feb 2001 B1
6200347 Anderson et al. Mar 2001 B1
6241771 Gresser et al. Jun 2001 B1
6273916 Murphy Aug 2001 B1
6279916 Stecher Aug 2001 B1
6287308 Betz et al. Sep 2001 B1
6287309 Baccelli et al. Sep 2001 B1
6290724 Marino Sep 2001 B1
6387130 Stone et al. May 2002 B1
6395034 Suddaby May 2002 B1
6402750 Atkinson et al. Jun 2002 B1
6419705 Erickson Jul 2002 B1
6432107 Ferree Aug 2002 B1
6436142 Paes et al. Aug 2002 B1
6478800 Fraser et al. Nov 2002 B1
6488710 Besselink Dec 2002 B2
6500205 Michelson Dec 2002 B1
6520993 James et al. Feb 2003 B2
6562074 Gerbec May 2003 B2
6595998 Johnson et al. Jul 2003 B2
6620196 Trieu Sep 2003 B1
6648917 Gerbec et al. Nov 2003 B2
6656178 Veldhuizen et al. Dec 2003 B1
6726691 Osorio et al. Apr 2004 B2
6740093 Hochschuler et al. May 2004 B2
6837904 Ralph et al. Jan 2005 B2
6852095 Ray Feb 2005 B1
6852126 Ahlgren Feb 2005 B2
6852129 Gerbec et al. Feb 2005 B2
6863673 Gerbec et al. Mar 2005 B2
6997929 Manzi et al. Feb 2006 B2
7094257 Mujwid et al. Aug 2006 B2
7118580 Beyersdorff et al. Oct 2006 B1
7591852 Prosser Sep 2009 B2
7918891 Curran et al. Apr 2011 B1
7931688 Landry et al. Apr 2011 B2
7967867 Barreiro et al. Jun 2011 B2
8062375 Glerum et al. Nov 2011 B2
8303663 Jimenez et al. Nov 2012 B2
8303879 Bertele et al. Nov 2012 B2
8308805 Lynn et al. Nov 2012 B2
8337562 Landry et al. Dec 2012 B2
8382842 Greenhalgh et al. Feb 2013 B2
8491658 Etminan Jul 2013 B1
8628578 Miller et al. Jan 2014 B2
8795369 Pimenta Aug 2014 B1
20020026195 Layne et al. Feb 2002 A1
20020147497 Belef et al. Oct 2002 A1
20020177897 Michelson Nov 2002 A1
20020183761 Johnson et al. Dec 2002 A1
20030171812 Grunberg et al. Sep 2003 A1
20040019354 Johnson et al. Jan 2004 A1
20040064144 Johnson et al. Apr 2004 A1
20040162618 Mujwid et al. Aug 2004 A1
20040220580 Johnson et al. Nov 2004 A1
20040230198 Manzi et al. Nov 2004 A1
20050027364 Kim et al. Feb 2005 A1
20050149194 Ahlgren Jul 2005 A1
20050283244 Gordon et al. Dec 2005 A1
20060058807 Landry et al. Mar 2006 A1
20060058880 Wysocki Mar 2006 A1
20060129244 Ensign Jun 2006 A1
20080154377 Voellmicke Jun 2008 A1
20080161927 Savage et al. Jul 2008 A1
20080172127 Perez-Cruet et al. Jul 2008 A1
20080300598 Barreiro et al. Dec 2008 A1
20090138086 Dewey May 2009 A1
20090198339 Kleiner et al. Aug 2009 A1
20100179594 Theofilos et al. Jul 2010 A1
20100292796 Greenhalgh et al. Nov 2010 A1
20100312347 Arramon et al. Dec 2010 A1
20120022653 Kirschman Jan 2012 A1
20120158144 Ullrich, Jr. et al. Jun 2012 A1
20120191190 Trieu Jul 2012 A1
20120253406 Bae et al. Oct 2012 A1
20130090735 Mermuys et al. Apr 2013 A1
20140148903 Pinto May 2014 A1
Foreign Referenced Citations (9)
Number Date Country
0621020 Oct 1994 EP
2639823 Jun 1990 FR
2719763 Nov 1995 FR
2004525692 Aug 2004 JP
2006517836 Aug 2006 JP
2011513001 Apr 2011 JP
9902214 Jan 1999 WO
02071921 Sep 2002 WO
2009114381 Sep 2009 WO
Non-Patent Literature Citations (7)
Entry
PCT Search Report for corresponding PCT Application No. PCT/US2008/064534.
Baddeley, S. and Cullen, J.C., “The Use of Methylmethacrylate in the Treatment of Giant Cell Tumours of the Proximal Tibia”, Aust. N.Z. J. Surg. vol. 49—No. 1, Feb. 1979, 3 pp.
Campanacci, M., Gui, L, Ranieri, L., Savini, R., “Treatment of Tibial Plateau Fractures”, Chi. Org. Mov. 72(3), Dec. 1975 (Italian text), pp. 234-256, English Translation, 15 pp.
Kyphon Inc., Surgical Technique Manual Nov. 16, 1999, pp. 5, 6, 9, 16-19.
Kyphon web page, www.kyphon.com, Mar. 13, 2001, 1 p.
Signus Medical, TETRIS, Sep. 2003, 1 p.
Blackstone Medical Inc., Construx™ PEEK VBR System, 2005, www.blackstonemedical.com, 1 p.
Related Publications (1)
Number Date Country
20150088260 A1 Mar 2015 US
Continuations (1)
Number Date Country
Parent 13795054 Mar 2013 US
Child 14550208 US