Claims
- 1. An fluid ejecting apparatus, wherein the apparatus is connected to a fluid reservoir having the fluid, the apparatus comprising:
a chamber for containing the fluid, having a top surface and a bottom surface, the chamber is connected to the fluid reservoir by a manifold; an orifice for ejecting the fluid, located on the top surface in fluid communication with the chamber; a first bubble generator for generating a first bubble, the first bubble functioning as a virtual valve to isolate the chamber from the manifold, the first heater positioned at the bottom surface and located near the manifold, and; a second bubble generator for generating a second bubble, the second bubble subsequent to formation of the first bubble expelling the fluid out of the orifice, the second heater positioned at the bottom surface and located away from the manifold.
- 2. The apparatus according to claim 1, wherein the first bubble generator is a first heater and the second bubble generator is a second heater, and the first heater and the second heater are connected in series to a common electrode.
- 3. The apparatus according to claim 2, wherein the cross-sectional area of the second heater is larger than that of the first heater.
- 4. The apparatus according to claim 3, wherein the first heater has a higher resistance than the second heater.
- 5. The apparatus according to claim 4, wherein the first heater heats up more quickly than the second heater.
- 6. The apparatus according to claim 1, wherein the orifice is formed by Laser Ablation.
- 7. The apparatus according to claim 1, wherein the orifice is formed by electroforming.
- 8. A method for ejecting ink from an apparatus using bubble as virtual valve, wherein the apparatus connected to an ink reservoir having the ink comprises a chamber, the chamber has a top surface and a bottom surface, an orifice for ejecting the ink is formed on the top surface, a first heater adjacent to the manifold and a second heater away from the manifold are formed on the bottom surface, the method comprising the steps of:
(a) activating the first heater and the second heater for generating a first bubble and a second bubble respectively, wherein the first bubble and the second bubble are enlarged towards the top surface of the chamber; (b) expanding the first bubble in the chamber to function as a virtual valve for isolating the chamber from the manifold; and (c) expanding the second bubble for pressurizing the ink in the chamber with the first bubble, whereby the ink is ejected through the orifice and a droplet is formed.
- 9. The method according to claim 13, wherein after step (c), the first bubble collapses and breaks the isolation between the chamber and the manifold, and the ink refills the chamber.
- 10. A method for ejecting fluid from an apparatus using bubble as virtual valve, wherein the apparatus connected to a fluid reservoir having the fluid comprises a chamber, the chamber has a top surface and a bottom surface, an orifice for ejecting the fluid is formed on the top surface, a first bubble generator adjacent to the manifold and a second bubble generator away from the manifold are formed on the bottom surface, the method comprising the steps of:
(a) activating the first bubble generator and the second bubble generator for generating a first bubble and a second bubble respectively, wherein the first bubble and the second bubble are enlarged towards the top surface of the chamber; (b) expanding the first bubble in the chamber to function as a virtual valve for isolating the chamber from the manifold; and (c) expanding the second bubble for pressurizing the fluid in the chamber with the first bubble, whereby the fluid is ejected through the orifice.
- 11. The method according to claim 10, wherein after step (c), the first bubble collapses and breaks the isolation between the chamber and the manifold, and the fluid refills the chamber.
Priority Claims (1)
Number |
Date |
Country |
Kind |
90110879 |
May 2001 |
TW |
|
Parent Case Info
[0001] This application incorporates by reference of Taiwan application Serial No. 90110879, filed on May 7, 2001.