Apparatus for using bubbles as virtual valve in microinjector to eject fluid

Information

  • Patent Grant
  • 6273553
  • Patent Number
    6,273,553
  • Date Filed
    Friday, March 24, 2000
    24 years ago
  • Date Issued
    Tuesday, August 14, 2001
    23 years ago
Abstract
An apparatus and method for forming a bubble within a microchannel of a microinjector to function as a valve mechanism between the chamber and manifold, that provides for a high resistance to liquid exiting the chamber through the manifold during fluid ejection through an orifice and that also provides a low resistance to refilling of liquid into the chamber after ejection of fluid and collapse of the bubble. This effectively minimizes cross talk between adjacent chambers and increases injection frequency of the microinjector. The formation of a second bubble within the chamber coalesces with a first formed bubble between the chamber and manifold to abruptly terminate the ejection of fluid, thereby eliminating satellite droplets.
Description




REFERENCE TO A MICROFICHE APPENDIX




Not Applicable




BACKGROUND OF THE INVENTION




1. Field of the Invention




This invention pertains generally to liquid injectors, and more particularly to an apparatus and method for ejecting liquid from a microdevice.




2. Description of the Background Art




Liquid droplet injectors are widely used for printing in inkjet printers. Liquid droplet injectors, however, can also be used in a multitude of other potential applications, such as fuel injection systems, cell sorting, drug delivery systems, direct print lithography, and micro jet propulsion systems, to name a few. Common to all these applications, a reliable and low-cost liquid droplet injector which can supply high quality droplets with high frequency and high spatial resolution, is highly desirable.




Only several devices have the ability to eject liquid droplets individually and with uniform droplet size. Among the liquid droplet injection systems presently known and used, injection by a thermally driven bubble has been most successful of such devices due to its simplicity and relatively low cost.




Thermally driven bubble systems, which are also known as bubble jet systems, suffer from cross talk and satellite droplets. The bubble jet system uses a current pulse to heat an electrode to boil liquid in a chamber. As the liquid boils, a bubble forms in the liquid and expands, functioning as a pump to eject a column of liquid from the chamber through an orifice, which forms into droplets. When the current pulse is terminated, the bubble collapses and liquid refills the chamber by capillary force. The performance of such a system can be measured by the ejection speed and direction, size of droplets, maximum ejection frequency, cross talk between adjacent chambers, overshoots and meniscus oscillation during liquid refilling, and the emergence of satellite droplets. During printing, satellite droplets degrade image sharpness, and in precise liquid control, they reduce the accuracy of flow estimation. Cross talk occurs when bubble jet injectors are placed in arrays with close pitch, and droplets eject from adjacent nozzles.




Most thermal bubble jet systems place a heater at the bottom of the chamber, which loses significant energy to the substrate material. Additionally, bonding is typically used to attach the nozzle plate to its heater plate, which limits nozzle spatial resolution due to the assembly tolerance required. Moreover, the bonding procedure may not be compatible with IC precess, which could be important if the integration of microinjector array with controlling circuit is desired to reduce wiring and to ensure compact packaging.




To solve cross talk and overshoot problems, it has typically been the practice to increase the channel length or adding chamber neck to increase fluid impedance between the chamber and reservoir. However, these practices slow the refilling of liquid into the chamber and greatly reduce the maximum injection frequency of the device.




The most troublesome problem with existing inkjet systems is satellite droplet because it causes image blurring. The satellite droplets that trail the main droplet hit the paper surface at slightly different locations than the main one as the printhead and paper are in relative motion. There is no known effective means or method to solve the satellite droplet problem that is readily available and economical.




Accordingly, there is a need for a liquid droplet injection system that minimizes cross talk without slowing down the liquid refilling rate, thereby maintaining a high frequency response while eliminating satellite droplets, all without adding complexity to the design and manufacturing. The present invention satisfies thess needs, as well as others, and generally overcomes the deficiencies found in the background art.




BRIEF SUMMARY OF THE INVENTION




The present invention pertains to an apparatus and method for forming a bubble within a chamber of a microinjector to function as a valve mechanism between the chamber and manifold, thereby providing high resistance to liquid exiting the chamber to the manifold during fluid ejection through the orifice and also providing a low resistance to refilling of liquid into the chamber after ejection of fluid and collapse of the bubble.




In general terms, the apparatus of the present invention generally comprises a microinjector having a chamber and a manifold in flow communication therethrough, an orifice in fluid communication with the chamber, at least one means for forming a bubble between the chamber and manifold and a means to pressurize the chamber




When the bubble is formed at the entrance of the chamber, the flow of liquid out the chamber to the manifold is restricted. The pressurization means, which pressurizes the chamber after formation of the bubble, increases chamber pressure such that fluid is forced out the orifice. After ejection of fluid through the orifice, the bubble collapses and allows liquid to rapidly refill the chamber.




As the chamber is pressurized while the bubble is blocking the chamber from the manifold and adjacent chambers, the cross talk problem is minimized as well.




In the preferred embodiment of the invention, the means for forming the bubble comprises a first heater disposed adjacent the chamber. The pressurization means comprises a second heater capable of forming a second bubble within the chamber. The heaters are disposed adjacent the orifice and comprise an electrode connected in series and having differing resistances due to variations in electrode width. The first heater has a narrower electrode than the second heater, thereby causing the first bubble to form before the second bubble, even when a common electrical signal is applied therethrough.




As the first and second bubble expand, they approach each other and ultimately coalesce, thereby distinctly cutting off the flow of liquid through the orifice and resulting in elimination or significant reduction of satellite droplets.




An object of the present invention is to provide a microinjector apparatus that eliminates satellite droplets.




Another object of the present invention is to provide a microinjector apparatus that minimizes cross talk.




Still another object of the present invention is to provide a microinjector apparatus that allows for the rapid refill of liquid into the chamber after fluid ejection.




Still another object of the present invention is to provide a method for ejecting liquid from a microinjector chamber that minimizes satellite droplets.




Still another object of the present invention is to provide a method for ejecting fluid from a microinjector chamber that minimizes cross talk.




Still another object of the present invention is to provide a method for ejecting fluid from a microinjector chamber that allows for the rapid refill of liquid into the chamber after fluid ejection.




Further objects and advantages of the invention will be brought out in the following portions of the specification, wherein the detailed description is for the purpose of fully disclosing preferred embodiments of the invention without placing limitations thereon.











BRIEF DESCRIPTION OF THE DRAWINGS




The invention will be more fully understood by reference to the following drawings which are for illustrative purposes only:





FIG. 1

is a perspective view of a section of a microinjector array apparatus in accordance with the present invention.





FIG. 2A

is a cross-sectional view of a chamber and manifold of the microinjector array apparatus shown in

FIG. 1







FIG. 2B

is a cross-sectional view of a chamber and manifold shown in

FIG. 2A

illustrating the formation of a first bubble followed by a second bubble to eject fluid out of an orifice.





FIG. 2C

is a cross-sectional view of a chamber and manifold shown in

FIG. 2A

illustrating the coalescence of a first and second bubble to terminate ejection of liquid from an orifice.





FIG. 2D

is a cross-sectional view of a chamber and manifold shown in

FIG. 2A

illustrating a collapse of a first bubble followed by a second bubble to allow fluid to refill into the chamber.





FIG. 3

is a top plan view of a silicon wafer used to fabricate a microinjector array apparatus of the present invention.





FIG. 4

is a cross-sectional view of a silicon wafer shown in

FIG. 3

taken along line


4





4


.





FIG. 5

is a top plan view of a silicon wafer shown in

FIG. 3

etched from its backside to form a manifold.





FIG. 6

is a cross-sectional view of a silicon wafer shown in

FIG. 5

taken along line


6





6


.





FIG. 7

is a top plan view of a silicon wafer shown in

FIG. 5

etched to enlarge the depth of a chamber.





FIG. 8

is a cross-sectional view of a silicon wafer shown in

FIG. 7

taken along line


8





8


.





FIG. 9

is a top plan view of a silicon wafer shown in

FIG. 7

with heaters deposited and patterned thereon.





FIG. 10

is a cross-sectional view of a silicon wafer shown in

FIG. 9

taken along line


10





10


.





FIG. 11

is a top plan view of a silicon wafer shown in

FIG. 9

with an orifice formed.





FIG. 12

is a cross-sectional view of a silicon wafer shown in

FIG. 11

taken along line


12





12


.











DETAILED DESCRIPTION OF THE INVENTION




Referring more specifically to the drawings, for illustrative purposes the present invention is embodied in the apparatus generally shown in FIG.


1


through FIG.


12


. It will be appreciated that the apparatus may vary as to configuration and as to details of the parts without departing from the basic concepts as disclosed herein.




Referring first to

FIG. 1

, an array


10


of a microinjector apparatus


12


is generally shown. Array


10


comprises a plurality of microinjectors


12


disposed adjacent one another. Each microinjector comprises a chamber


14


, a manifold


16


, an orifice


18


, a first heater


20


and a second heater


22


. First heater


20


and second heater


22


are typically electrodes connected in series to a common electrode


24


.




Referring also to

FIG. 2A

, chamber


14


is adapted to be filled with liquid


26


. Liquid


26


can include, but is not limited to, ink, gasoline, oil, chemicals, biomedical solution, water or the like, depending on the specific application. The meniscus level


28


of liquid


26


generally stabilizes at orifice


18


. Manifold


16


is adjacent to and in flow communication with chamber


14


. Liquid from a reservoir (not shown) is supplied to chamber


14


by passing through manifold


16


. First heater


20


and second heater


22


are situated adjacent orifice


18


and above chamber


14


to prevent heat loss to the substrate. First heater


20


is disposed adjacent manifold


16


while second heater


22


is disposed adjacent chamber


14


. As can be seen in

FIG. 2A

, the cross-section of first heater


20


is narrower than that of second heater


22


.




Referring also to

FIG. 2B

, since first heater


20


and second heater


22


are connected in series, a common electrical pulse can be used to activate both first heater


20


and second heater


22


simultaneously. Due to first heater


20


having a narrower cross-section there is a higher power dissipation of the current pulse, thereby causing the first heater


20


to heat up more quickly, in response to the common electrical pulse, than second heater


22


, which has a wider cross-section. This allows for simplifying the design by eliminating the need for a means to sequentially activate first heater


20


and second heater


22


. The activation of first heater causes a first bubble


30


to form between manifold


16


and chamber


14


. As first bubble


30


expands in the direction of arrows P, first bubble


30


begins to restrict fluid flow to manifold


16


, thereby forming a virtual valve that isolates chamber


14


and shielding adjacent chambers from cross talk. A second bubble


32


is formed under second heater


22


after formation of first bubble


30


, and as second bubble


32


expands in the direction of arrows P, chamber


14


is pressurized causing liquid


26


to be ejected through orifice


18


as a liquid column


36


in direction F.




Referring also to

FIG. 2C

, as first bubble


30


and second bubble


32


continue to expand, first bubble


30


and second bubble


32


approach each other and terminates ejection of liquid through orifice


18


. As first heater


20


and second heater


22


begin to coalesce, the tail


34


of liquid column


36


is abruptly cut off, thereby preventing the formation of satellite droplets.




Referring also to

FIG. 2D

, termination of the electrical pulse causes first bubble


30


to begin collapsing in the direction shown in P. The near instantaneous collapse of first bubble


30


allows fluid


26


to rapidly refill chamber


14


in the direction shown by arrows R, as there is no more liquid restriction between manifold


16


and chamber


14


.




As can be seen therefore, a method for ejecting fluid


26


from a microinjector apparatus


12


in accordance with the present invention, generally comprises the steps of:




(a) generating first bubble


30


in fluid-filled chamber


14


of microinjector apparatus


12


;




(b) pressurizing chamber


14


to eject fluid


26


from chamber


14


, wherein the pressurizing step comprises generating second bubble


32


in chamber


14


;




(c) enlarging first bubble


30


in chamber


14


to serve as a virtual valve for restricting fluid flow between chamber


14


and the manifold


16


;




(d) enlarging second bubble


32


in chamber


14


, whereby first bubble


30


and second bubble


32


approach each other to abruptly terminate the ejection of fluid from chamber


14


; and




(e) collapsing first bubble


30


to hasten refill of fluid into chamber


14


.




Referring also to FIG.


3


and

FIG. 4

, combined surface and bulk micromachine technology is used to fabricate a microinjector array


10


on a silicon wafer


38


without any wafer bonding process. The manufacturing process begins by depositing and patterning phosphosilicate-glass (PSG) as chamber sacrificial layer


40


and depositing approximately a low-stress silicon nitride


42


as chamber top layer.




Silicon wafer


38


is then etched from its backside


44


, as shown in FIG.


5


and

FIG. 6

, by potassium hydroxide (KOH) to form manifold


16


. The sacrificial PSG layer


40


is removed by hydroflouric acid (HF). As can be seen in FIG.


7


and

FIG. 8

, another KOH etching enlarges depth of chamber


14


by precise time control. Extra care must be undertaken during this step because the convex corners of chamber


14


are also attacked and rounded.




Referring also to FIG.


9


and

FIG. 10

, first heater


20


and second heater


22


are deposited and patterned. First heater


20


and second heater


22


are preferably platinum. Metal wires


44


are formed and an oxide layer


46


is deposited on top for passivation. An interconnection


48


between first heater


20


and common electrode


24


is disposed beneath oxide layer


46


. Referring finally to FIG.


11


and

FIG. 12

, orifice


18


is formed. assuming a lithography capability of 3 μm line width, orifice


18


may be as small as approximately 2 μm, and the pitch between orifices


18


may be as low as approximately 15 μm. It can be seen that convex corners


47


of chamber


14


become distinctly defined as a result of the etching.




Accordingly, it will be seen that this invention provides for a novel microinjector that uses a bubble to restrict fluid flow in a microchannel, thereby preventing the escape of liquid from chamber to the manifold during fluid ejection through the orifice. It will also be seen that a second bubble, in conjunction with a first bubble is used to abruptly cut off the liquid column being ejected through the orifice, thereby eliminating satellite droplets. Although the description above contains many specificities, these should not be construed as limiting the scope of the invention but as merely providing illustrations of some of the presently preferred embodiments of this invention. Thus the scope of this invention should be determined by the appended claims and their legal equivalents.



Claims
  • 1. An apparatus for using a bubble as virtual valve in a microinjector to eject fluid, comprising:(a) a chamber for containing liquid therein, said chamber including a top layer; (b) a passivation layer disposed adjacent said top layer; (c) an orifice in fluid communication with said chamber, said orifice disposed above said chamber and passes through both said passivation layer and said top layer; (d) means for generating a first bubble in said chamber to serve as a virtual valve when said chamber is filled with liquid, said first bubble generating means disposed proximately adjacent said orifice and between said passivation layer and said top layer; and (e) means for generating a second bubble in said chamber subsequent to generation of said first bubble when said chamber is filled with liquid to eject liquid from said chamber, said second bubble generating means disposed proximately adjacent said orifice and between said passivation layer and said top layer.
  • 2. An apparatus as recited in claim 1, wherein said first bubble generating means comprises a first heater.
  • 3. An apparatus as recited in claim 2, wherein said second bubble generating means comprises a second heater.
  • 4. An apparatus as recited in claim 3, wherein said first heater and said second heater are arranged such that said first bubble and said second bubble expand toward each other to abruptly terminate the ejection of liquid from said chamber.
  • 5. An apparatus as recited in claim 3, wherein said first heater and said second heater are adapted to be driven by a common signal.
  • 6. An apparatus as recited in claim 3, wherein said first heater and said second heater are connected in series.
  • 7. An apparatus as recited in claim 1, wherein generation of said first bubble to serve as a virtual valve, restricts flow of liquid out of said chamber.
  • 8. An apparatus for using bubble as virtual valve in a microinjector to eject liquid, comprising:(a) a chamber including a top layer disposed thereover; (b) a passivation layer covering said top layer; (c) an orifice in flow communication with said chamber; (d) a first bubble generator disposed proximately adjacent said orifice and embedded between said top layer and said passivation layer; and (e) a second bubble generator disposed proximately adjacent said orifice and embedded between said top layer and said passivation layer, wherein said first bubble generator is adapted to generate a first bubble in said chamber, said first bubble serving as a virtual valve to restrict flow of liquid out of said chamber.
  • 9. An apparatus as recited in claim 8, wherein said first bubble generator comprises a first heater and said second bubble generator comprises a second heater.
  • 10. An apparatus as recited in claim 9, wherein said first heater and said second heater are adapted to be driven by a common signal.
  • 11. An apparatus as recited in claim 9, wherein said first heater and said second heater are connected in series.
  • 12. An apparatus for using bubble as virtual valve in a microinjector to eject liquid, comprising:a chamber for containing liquid therein, said chamber including a top layer; an orifice in fluid communication with said chamber, said orifice disposed above said chamber and passes through said top layer; a first heater having a first power dissipation for generating a first bubble in said chamber to serve as a virtual valve when said chamber is filled with liquid, said first heater disposed proximately adjacent said orifice; and a second heater having a second power dissipation for generating a second bubble in said chamber subsequent to generation of said first bubble when said chamber is filled with liquid to eject liquid from said chamber, said second heater disposed proximately adjacent said orifice and said first power dissipation is substantially higher than said second power dissipation.
  • 13. An apparatus as recited in claim 12, wherein said first heater and said second heater are connected in series.
  • 14. An apparatus as recited in claim 13, wherein said first heater having a first resistance value and said second heater having a second resistance value, said first resistance value is substantially larger than said second resistance value.
  • 15. An apparatus as recited in claim 12, wherein said first heater and said second heater are adapted to be driven by a common signal.
  • 16. An apparatus as recited in claim 12, wherein said first heater and said second heater are arranged such that said first bubble and said second bubble expand towards each other to abruptly terminate the ejection of liquid from said chamber.
  • 17. An apparatus as recited in claim 12, further including a passivation layer disposed adjacent said top layer, said orifice passes through both said passivation layer and said top layer, said first heater and said second heater disposed between said passivation layer and said top layer.
CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No. 09/235,663, filed on Jan. 22, 1999 now U.S. Pat. No. 6,102,530, which claims priority from U.S. provisional application Ser. No. 60/073,293 filed on Jan. 23, 1998.

S

TATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT This invention was made with Government support under Contract N00014-94-1-0536 awarded by the Office of Naval Research. The Government has certain rights in the invention.

US Referenced Citations (4)
Number Name Date Kind
4580149 Domoto et al. Apr 1986
5053787 Terasawa Oct 1991
5479196 Inada Dec 1995
5841452 Silverbrook Nov 1998
Provisional Applications (1)
Number Date Country
60/073293 Jan 1998 US
Continuation in Parts (1)
Number Date Country
Parent 09/235663 Jan 1999 US
Child 09/535903 US