Apparatuses for forming layers

Information

  • Patent Grant
  • 6409835
  • Patent Number
    6,409,835
  • Date Filed
    Wednesday, September 15, 1999
    24 years ago
  • Date Issued
    Tuesday, June 25, 2002
    22 years ago
Abstract
In one aspect, the invention includes a method of forming a layer of particulates on a substrate, comprising: a) fastening a first substrate to a second substrate; b) while the first substrate is fastened to the second substrate, submerging at least a portion of the first substrate in a liquid; c) suspending particulates on an upper surface of the liquid; d) moving the submerged first substrate relative to the suspended particulates to form a layer of the particulates supported on the first substrate; and e) removing the first substrate from the second substrate. In another aspect, the invention includes a layer forming apparatus, comprising: a) a vessel configured to retain a liquid; b) a pusher bar joined to the vessel and configured to compress particulates on an upper surface of the liquid; c) a conveyor which enters and exits the vessel, the conveyor being configured to removably retain substrates and to transport such substrates through the vessel, the conveyor having a front surface that faces the pusher bar and a back surface in opposing orientation relative to the front surface; and d) the vessel, conveyor and pusher bar being configured to form a layer of the particulates on substrates as the substrates are transported through the vessel by the conveyor.
Description




TECHNICAL FIELD




The invention pertains to methods of forming layers of particulates on substrates, to methods of forming field emission emitter tips, and to associated apparatuses.




BACKGROUND OF THE INVENTION




Field emitters are widely used in display devices. An exemplary display device is a flat panel display. Clarity, or resolution, of a field emission display is a function of a number of factors, including emitter tip sharpness. Specifically, sharper emitter tips can produce higher resolution displays than less sharp emitter tips. Accordingly, numerous methods have been proposed for fabrication of very sharp emitter tips (i.e., emitter tips having tip radii of 100 nanometers or less). Fabrication of very sharp tips has, however, proved difficult. It has proved particularly difficult to build large areas of sharp emitter tips using photolithography while maintaining resolution and stringent dimensional control over large area substrates used for display manufacture. In light of these difficulties, it would be desirable to develop alternative methods of forming emitter tips. Several methods have been proposed. Some utilize deposited particulates to form a non-photolithographic etch mask. A subsequent etching step, or series of steps, then forms emitter tips. The use of deposited particulates on a substrate as an etch mask can reduce complexity of an etching process and improve sharpness of emitter tips relative to photolithographic processing. It would, therefore, be desirable to develop alternative methods for utilizing deposited materials in etch masking processes.




In other aspects of the prior art, it is frequently desired to form uniform layers of particulates on substrates. Such can occur through, for example, Langmuir-Blodgett technologies. It would be desirable to develop methods and apparatuses for automating formation of uniform layers of particulates on substrates.




SUMMARY OF THE INVENTION




In one aspect, the invention encompasses a method of forming a layer of particulates on a substrate. A first substrate is fastened to a second substrate. While the first substrate is fastened to the second substrate, at least a portion of the first substrate is submerged in a liquid. Particulates are suspended on an upper surface of the liquid. The submerged first substrate is moved relative to the suspended particulates to form a layer of the particulates supported on the first substrate. The first substrate is subsequently removed from the second substrate.




In another aspect, the invention encompasses another method of forming a layer on a substrate. A liquid is provided in a vessel and particulates are suspended on an upper surface of the liquid. A pusher bar is provided to compress the particulates against one another. A conveyor having substrates fastened thereto is provided. The conveyor is drawn into the liquid and upwardly through the suspended particulates. The substrate is drawn upwardly through the suspended particulates with the conveyor. As the substrate is drawn upwardly, the suspended particulates adhere to it to form a layer of the particulates supported on the substrate.




In yet another aspect, the invention encompasses a layer forming apparatus. The apparatus comprises a vessel configured to retain a liquid, and a pusher bar joined to the vessel and configured to compress particulates on an upper surface of the liquid. The apparatus further comprises a conveyor which enters and exits the vessel. The conveyor is configured to removably retain substrates and to transport such substrates through the vessel. The vessel, conveyor and pusher bar are configured to form a layer of the particulates on substrates as the substrates are transported through the vessel by the conveyor.











BRIEF DESCRIPTION OF THE DRAWINGS




Preferred embodiments of the invention are described below with reference to the following accompanying drawings.





FIG. 1

is a diagrammatic, fragmentary, perspective view of a layer-forming apparatus encompassed by the present invention.





FIG. 2

is a diagrammatic, top-view of a second embodiment layer-forming apparatus encompassed by the present invention.





FIG. 3

is a diagrammatic, fragmentary, perspective view of a third embodiment layer-forming apparatus encompassed by the present invention.





FIG. 4

is a view of a backside of a substrate prepared in accordance with one aspect of the present invention.





FIG. 5

is a fragmentary, cross-sectional sideview of the substrate of

FIG. 4

fastened to a belt in accordance with a method of the present invention.





FIG. 6

is a fragmentary, perspective view of a substrate fastened to a belt in accordance with another aspect of the present invention.





FIG. 7

is a fragmentary view of a substrate fastened to a belt in accordance with yet another aspect of the present invention.





FIG. 8

is a fragmentary, perspective view of the substrate and belt assembly of

FIG. 7

processed according to a method of the present invention.





FIG. 9

a diagrammatic, fragmentary, cross-sectional view of a an exemplary substrate that can be processed according to a method of the present invention.





FIG. 10

is a view of the

FIG. 9

substrate shown at a processing step subsequent to that of FIG.


9


.





FIG. 11

is a view of the

FIG. 9

substrate shown at a processing step subsequent to that of FIG.


10


.





FIG. 12

is a view of the

FIG. 9

substrate shown at a processing step subsequent to that of FIG.


11


.





FIG. 13

is a view of the

FIG. 9

substrate shown at a processing step subsequent to that of FIG.


12


.





FIG. 14

is a view of the

FIG. 9

substrate shown at a processing step subsequent to that of FIG.


13


.











DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS




This disclosure of the invention is submitted in furtherance of the constitutional purposes of the U.S. Patent Laws “to promote the progress of science and useful arts” (Article 1, Section 8).




The present invention encompasses methods of forming layers of particulates on substrates. An exemplary apparatus


10


for accomplishing a method of the present invention is illustrated in FIG.


1


. Apparatus


10


comprises a vessel


12


having end walls


14


and side walls


16


. Vessel


12


further comprises a bottom


18


. Vessel


12


extends longitudinally between end walls


14


and laterally between side walls


16


.




A liquid


20


is provided within vessel


12


. Liquid


20


has an upper surface


22


. Liquid


20


can comprise, for example, water.




Particulates


24


are suspended on an upper surface of liquid


20


to form a monolayer. The term, “monolayer” refers to a layer of particulates


24


having a thickness of a single particulate. Particulates


24


can be macroscopic (such as, example, polystyrene beads), or microscopic (such as, for example, single molecules).




A dispenser


26


is provided to dispense particulates


24


onto upper surface


22


. Dispenser


26


can, for example, comprise a housing over a conveyer (not shown), with the conveyer being in communication with a storage container (not shown) of particulates


24


.




A pusher bar


28


is provided to compress particulates


24


against one another to form a “tightly packed” monolayer. The term “tightly packed” is defined to mean that particulates


24


physically contact one another throughout the monolayer, rather than being dispersed from one another. A “uniform tightly packed monolayer” is defined as a layer of particulates


24


wherein all of the particulates


24


are physically against other particulates and form a single layer atop liquid


20


.




Pusher bar


28


is connected to a mechanism (not shown) to push a surface of pusher bar


28


against particulates


24


(the surface pushed against particulates


24


can be referred to as a “pushing surface”). Preferably, the mechanism which pushes pusher bar


28


is configured to maintain a substantially constant pressure of pusher bar


28


against particulates


24


so as to maintain a uniform tightly packed monolayer of particulates


24


on upper surface


22


of liquid


20


. Pusher bar


28


is also preferably connected through a feedback loop to a mechanism (not shown) configured to measure a surface tension at surface


22


to ascertain that a tightly packed monolayer is obtained (i.e., configured in accordance with, for example, a Wilhelmy plate method or a Langmuir film balance method). Pusher bar


28


has a back surface in opposing orientation to the pushing surface. The liquid upper surface


22


proximate the pusher bar back surface is not be covered with particulates


24


.




A conveyor


30


extends into liquid


20


at one end of vessel


12


, and extends out of liquid


20


at another end of vessel


12


. In the shown preferred embodiment, conveyor


30


enters liquid


20


through the portion of liquid upper surface


22


that is not coated with particulates


24


. The exemplary shown conveyor


30


is a belt, but it is to be understood that the invention encompasses other embodiments (not shown) wherein conveyor


30


comprises other conveying structures such as, for example, moving cables or chains. Belt


30


is a preferably continuous belt attached to a mechanism (not shown) which pulls belt


30


through liquid


20


in the direction indicated by the arrows at the fragmentary ends of belt


30


. Only a portion of the preferred continuous belt


30


is shown to increase clarity in the drawings. Belt


30


can comprise, for example, rubber, fabric and/or metal. For example, belt


30


can comprise a flexible polymer film, such as Mylar™. As another example, belt


30


can comprise a thin metallic sheet, or a composite of assembly of materials comprising linked subsections.




A plurality of substrates


32


are fastened to belt


30


and pulled through liquid


20


by belt


30


. It is noted that belt


30


can, in one aspect, be considered as a first substrate to which second substrates


32


are fastened. Substrates


32


can comprise, for example, the construction illustrated in

FIG. 9

, which includes a glass backing


232


, a semiconductive material layer


234


overlying glass backing


232


, and a masking material layer


236


overlying semiconductive material layer


234


. Semiconductive material layer


234


can comprise, for example, monocrystalline silicon lightly doped with a p-type dopant. To aid in interpretation of this disclosure and the claims that follow, the term “semiconductor substrate” is defined to mean any construction comprising semiconductive material, including, but not limited to, bulk semiconductive materials (either alone or assemblies comprising other materials thereon), and semiconductive material layers (either alone or assemblies comprising other materials). The term “substrate” refers to any supporting structure including, but not limited to, the semiconductor substrates described above. Masking layer


236


of the

FIG. 9

substrate can comprise, for example, silicon dioxide. The illustrated substrate


32


of

FIG. 9

can be utilized for forming emitter tips, as will be discussed in more detail below with reference to

FIGS. 10-14

.




Referring again to

FIG. 1

, belt


30


comprises a frontside


38


which faces pusher bar


28


as belt


30


is drawn out of liquid


20


, and a backside


40


in opposing orientation to frontside


38


. Substrates


32


are attached to frontside


38


. In the shown embodiment, both frontside


38


and backside


40


are exposed to the monolayer of particulates


24


as belt


30


is drawn upwardly through the monolayer. Thus, both frontside


38


and backside


40


are coated with particulates, as are substrates


32


. Preferably, the pressure exerted by pusher bar


28


is sufficient to form a tightly packed monolayer of particulates on substrates


32


. In alternative embodiments (not shown) belt


30


can be configured such that particulates


24


do not adhere to belt


30


. Such configuration can comprise, for example, forming belt


30


of a material that will not stick to particulates


24


or covering belt


30


with a coating to which particulates


24


will not stick.




In subsequent processing (not shown), substrates


32


are removed from belt


30


. After such removal, particulates


24


can also be removed from belt


30


by, for example, a vacuum device (not shown) configured to draw the particulates off from belt


30


and return the particulates to dispenser


26


.




An exemplary substrate


32


is shown in

FIG. 10

after the treatment of FIG.


1


. The substrate


32


of

FIG. 10

is identical to that of

FIG. 9

in all respects, except that a monolayer of particulates


24


is now supported by masking material layer


236


.




In the shown preferred embodiment of

FIG. 1

, substrates


32


are substantially perpendicular to upper surface


22


of liquid


20


as the substrates are drawn through the monolayer of particulates


24


suspended on upper surface


22


. Such preferred configuration is found to more consistently yield tightly packed monolayers on substrates


32


than other configurations wherein substrates


32


are pulled through upper surface


22


at angles other than perpendicular.




A second embodiment apparatus of the present invention is illustrated in FIG.


2


. In referring to

FIG. 2

, similar numbering to that utilized above in describing the embodiment of

FIG. 1

will be used, with differences indicated by the suffix “a” or by different numerals.





FIG. 2

illustrates an apparatus


10




a


for forming a layer of particulates on a substrate. Apparatus


10




a


comprises a vessel


12




a


containing a fluid


20


. Apparatus


10




a


further comprises a particulate dispenser


26


and a pusher bar


28


. Particulate dispenser


26


dispenses particulates


24


onto an upper surface of fluid


20


. Pusher bar


28


compresses particulates


24


into a tightly packed monolayer. A belt


30


comprising a substrate


32


fastened thereto is pulled upwardly through the monolayer to form a monolayer of particulates


24


on a surface of substrate


32


. Belt


30


has a frontside


38


and a backside


40


.




Vessel


12




a


comprises laterally projecting grooves


41


into which peripheral portions of belt


30


extend. Additionally, vessel


12




a


comprises sealing members


42


within grooves


40


. Sealing members


42


can comprise, for example, gasket materials, such as, for example, rubber, TEFLON™ or plastic. Belt


30


is drawn upwardly between sealing members


42


. Sealing members


42


prevent particulates


24


from migrating to backside


40


of belt


30


.




It is noted that in the embodiment of

FIG. 2

pusher bar


28


defines a back surface of a monolayer of particulates


24


suspended on an upper surface of liquid


20


, and belt


30


defines a front surface of such monolayer. Specifically, there is no portion of the front surface of the monolayer of particulates


24


suspended on fluid


20


that is not against either belt


30


or the substrate


32


fastened thereon. Accordingly, an entirety of such front surface of particulates


24


is exposed to upward movement of belt


30


, which can alleviate formation of channels of non-moving particulates


24


on upper surface


20


. Such channels of non-moving particulates


24


can be problematic, as they can result in discontinuities in a monolayer formed over a substrate


32


as the substrate is pulled through the suspended particulates


24


.




Yet another embodiment of the invention is described with reference to FIG.


3


. In referring to the embodiment of

FIG. 3

, similar numbering to that utilized above in describing the embodiment of

FIG. 1

will be used, with differences indicated by the suffix “b” or by different numerals.





FIG. 3

illustrates an apparatus


10


b for forming a layer of particulates on a substrate. Apparatus


10


b comprises a vessel


12




b


, having endwalls


14




b


and sidewalls


16




b


. Vessel


12




b


further comprises a bottom


18




b


having an opening


60


formed therethrough. A liquid


20


is provided within vessel


12




b


, and a layer of particulates


24


is provided on an upper surface of liquid


20


.




A belt


30


having substrates


32


fastened thereto is pulled through opening


60


and upwardly through particulates


24


to form a monolayer of particulates


24


on substrates


32


.




Opening


60


can comprise a relatively flexible sealant material


62


provided against belt


30


to form a fluid-tight seal in conjunction with belt


30


. In the shown preferred embodiment, sealant material


62


is provided in the form of rollers. In alternative embodiments which are not shown, the sealant material can be provided in other forms, such as, for example, a gasket. In yet other alternative embodiments, the sealant can be eliminated, or else loosely provided, such that opening


60


leaks fluid


20


as belt


30


is pulled therethrough. The leaked fluid can then be captured in a holding reservoir (not shown) and transferred back to vessel


12




b


by a pumping mechanism (not shown).




In each of the above-discussed embodiments of

FIGS. 1-3

, a substrate


32


is fastened to belt


30


. Methods of fastening substrates


32


to belt


30


are discussed with reference to

FIGS. 4-8

.




Referring first to

FIG. 4

, a backside of a substrate


32


is illustrated in accordance with a first embodiment method of fastening the substrate to a belt


30


. The backside of substrate


32


comprises a peripheral region


90


, and a central region


92


surrounded by peripheral region


90


. In the shown embodiment, central region


92


is separated from peripheral region


90


by an imaginery boundary illustrated by dashed line


91


. An adhesive material


94


is provided within peripheral region


90


(shown as being provided at corners of square substrate


32


) and not within central region


92


. Adhesive material


94


can comprise, for example, a paste, glue or adhesive tape. An exemplary material for adhesive


94


is a double-sided adhesive tape. Adhesive


94


is preferably removable from substrate


32


. Such removability enables adhesive


94


to be removed prior to subsequent processing of substrate


32


.




Substrate


32


of

FIG. 4

is shown fastened to a belt


30


in FIG.


5


. Since adhesive


94


is provided only at the peripheral region


90


of substrate


32


, the fastening comprises fastening peripheral region


90


to belt


30


and not fastening central region


92


to belt


30


. The fastening of only peripheral region


90


of substrate


32


to belt


30


can allow belt


30


to loop around a curve without dislodging a planar substrate


32


.




Although in the shown embodiment substrate


32


comprises a square-shaped substrate, it is to be understood that the invention encompasses other embodiments (not shown) in which substrates have other shapes, such as, for example, rounded or rectangular. Although in the above-described embodiment adhesive is not provided within central region


92


, it is to be understood that the invention encompasses other embodiments wherein adhesive is provided in central region


92


either solely, or in addition to the adhesive provided in peripheral region


90


. Additionally, it is noted that while in the shown embodiment adhesive


94


is provided on substrate


32


before substrate


32


is fastened to belt


30


, the invention encompasses other embodiments (not shown) wherein an adhesive is provided on belt


30


prior to fastening substrate


32


to belt


30


, as well as embodiments wherein adhesive is provided to both substrate


32


and belt


30


prior to fastening substrate


32


to belt


30


.




It is noted that in various applications encompassed by the present invention a substrate


32


can be adhered to belt


30


without adhesive. Such applications can include, for example, applications in which electrostatic forces are utilized to adhere a substrate


32


to a belt


30


.




Another embodiment mechanism for removably fastening a substrate


32


to a belt


30


is shown in FIG.


6


. Specifically,

FIG. 6

shows a substrate


32


removably fastened to a belt


30


by clips


102


. Clips


102


are fastened to belt


30


by pins


130


which can comprise, for example, rivets. Each of clips


102


comprises clamping sections


106


configured to receive and retain substrate


32


. Specifically, clips


102


are configured such that clamping members


106


can be opened for removal of substrate


32


, and closed for retaining substrate


32


. Clamping members


106


can, for example, be spring loaded to enable clamping members to removably retain substrates


32


. Clips


102


can comprise for example, metal, and can be configured with compressible pads (not shown) to cushion a substrate that is retained within the clips. Such compressible pads can comprise, for example, rubber or plastic.




In the shown embodiment, two clips


102


are utilized. However, it is to be understood that the invention encompasses other embodiments (not shown) wherein less than two clips, or more than two clips are utilized. Also, although in the shown embodiment clips


102


are along only one side of substrate


32


, it is to be understood that the invention encompasses other embodiments (not shown) wherein clips


102


are provided along more than one side of substrate


32


.




Yet another embodiment mechanism for removably fastening a substrate


32


to a belt


30


is shown in FIG.


7


. Specifically,

FIG. 7

illustrates a belt


30


having an orifice


110


extending therethrough. A substrate


32


is fastened to belt


30


to have a surface exposed through orifice


110


. Substrate


32


comprises a peripheral portion


111


(shown in phantom in

FIG. 7

) fastened to belt


30


by means of, for example, an adhesive or a clip, to retain substrate


32


against belt


30


. The embodiment of

FIG. 7

, in contrast to embodiments of

FIGS. 4 and 6

, has substrate


32


retained against a backside of belt


30


, rather than against a frontside.





FIG. 8

illustrates the substrate-retaining mechanism of

FIG. 7

incorporated into an apparatus


10




c


of the present invention. In referring to the apparatus of

FIG. 8

, similar numbering to that utilized above in describing the embodiment of

FIG. 1

will be used, with differences indicated by the suffix “c” or by different numerals.




Apparatus


10




c


comprises a vessel


12




c


containing a fluid


20


. Apparatus


10




c


further comprises a particulate dispenser


26


and a pusher bar


28


. Particulate dispenser


26


dispenses particulates


24


onto an upper surface of fluid


20


. Pusher bar


28


compresses particulates


24


into a tightly packed monolayer. A belt


30




c


, comprising substrates


32


fastened thereto, is pulled upwardly through the monolayer to form a monolayer of particulates


24


on a surface of substrate


32


. Belt


30




c


has a frontside


38


, a backside


40


, and orifices


110


extending from frontside


38


to backside


40


.




Vessel


12




c


, like the vessel


12




a


of

FIG. 2

, comprises laterally projecting grooves


41


into which peripheral portions of belt


30




c


extend. Additionally, vessel


12




c


comprises sealing members


42


within grooves


40


. Sealing members


42


can comprise, for example, gasket materials, such as, for example, rubber or plastic. Belt


30


is drawn upwardly between sealing members


42


, and sealing members


42


prevent particulates


24


from migrating to backside


40


of belt


30




c


. Accordingly, only surfaces of substrates


32


that are exposed within orifices


110


are coated with particulates. The embodiments of

FIGS. 7 and 8

can be advantageous in applications wherein a substrate comprises a peripheral portion that is not to be coated with particulates, in that such peripheral portion is effectively masked by belt


30




c


as substrate


32


is coated with a monolayer of particulates


24


.




A substrate coated with particulates can be utilized in formation of emitter tips as described with reference to

FIGS. 10-14

. Referring first to

FIG. 10

, a substrate


32


is illustrated after formation of a monolayer of particulates


24


over an upper surface of substrate


32


. Exemplary particulates


24


can comprise for example, polystyrene beads or latex-comprising beads.




Referring to

FIG. 11

, substrate


32


is shown after particulates


24


have been exposed to conditions which decrease a dimension of the particulates. Particulates


24


now cover some portions of masking layer


236


, while leaving other portions of masking material between particulates


24


uncovered. An example condition for shrinking polystyrene-comprising particulates


24


is exposure to an oxygen plasma to oxidize the beads and shrink them at a controlled rate. Another example method for reducing a dimension of the beads is to heat them to a temperature which evaporates materials from the beads. Yet another example method for reducing a dimension of the beads is to etch them with, for example, a chemical wet etch. In embodiments in which particulates


24


are spherical, a diameter of such spherical particulates


24


is preferably reduced at least about 20%, and more preferably at least to about 50% in going from the stage shown in

FIG. 10

to that shown in FIG.


11


.




Referring to

FIG. 12

, substrate


32


is exposed to first etching conditions to remove portions of masking material


236


exposed between particulates


24


(FIG.


11


), and subsequently particulates


24


are removed. Etching of masking layer


236


(

FIG. 11

) converts the masking layer to a patterned mask


260


which covers portions of semiconductive material


234


and leaves other portions uncovered. The first etching conditions are preferably highly anisotropic to remove material of masking layer


236


along a vertical profile without substantially undercutting particulates


24


. Suitable etching processes can include, for example, plasma etching and reactive ion etching. In embodiments in which particulates


24


comprise latex and masking material


236


comprises silicon oxide, the first etching conditions can comprise, for example, an ion-assisted etch utilizing He and one or both of CHF


3


and CF


4


. Suitable conditions for removing particulates


24


can include, for example, one or more of physical cleaning, chemical cleaning, or dry etching. An example method for removing particulates


24


from masking material


236


is by vibration of substrate


32


in an ultrasonic bath.




Referring to

FIG. 13

, substrate


32


is exposed to second etching conditions to etch exposed portions of material


234


and form conical emitter tips


270


(only some of which are labeled in

FIG. 13

) under patterned masking layer


260


. In embodiments in which masking layer


260


comprises silicon dioxide and layer


234


comprises monocrystaline or amorphous silicon, second etching conditions can comprise isotropic etch processes known in the art.




Referring to

FIG. 14

, patterned masking layer


260


is removed from substrate


32


to form an emitter tip array. In embodiments in which masking


260


comprises silicon dioxide, it can be removed by, for example, wet etching utilizing buffered hydrofluoric acid. The emitter tip array of

FIG. 14

can be incorporated into, for example, a flat panel display device as an emitter assembly.




Although the invention is described with reference to conical tip formation from semiconductive substrates, it is to be understood that the invention can have application to etching of nonsemiconductive substrates, and can further have application to non-etch processes wherein particulate layers are formed over substrates.




It is noted that the invention encompasses embodiments wherein substrates are passed a single time through a suspended layer of particulates to form a layer of particulates on the substrates, as well as embodiments wherein the substrates make multiple passes through one or more suspended layers of particulates.




In compliance with the statute, the invention has been described in language more or less specific as to structural and methodical features. It is to be understood, however, that the invention is not limited to the specific features shown and described, since the means herein disclosed comprise preferred forms of putting the invention into effect. The invention is, therefore, claimed in any of its forms or modifications within the proper scope of the appended claims appropriately interpreted in accordance with the doctrine of equivalents.



Claims
  • 1. A layer forming apparatus, comprising:a vessel configured to retain a liquid; a pusher bar joined to the vessel and configured to compress non-fluid particulates on an upper surface of the liquid; a conveyor which enters and exits the vessel, the conveyor being configured to removably retain substrates and to transport such substrates through the vessel, the conveyor having a front surface that faces the pusher bar and a back surface in opposing orientation relative to the front surface; and the vessel, conveyor and pusher bar being configured to form a layer of the non-fluid particulates on substrates as the substrates are transported through the vessel by the conveyor, wherein the conveyor comprises lateral edges and wherein the vessel comprises a seal along the lateral edges of the conveyor to prevent the particulates from flowing around the conveyor and contacting the back surface of the conveyor.
  • 2. The apparatus of claim 1 wherein the conveyor is a belt.
  • 3. The apparatus of claim 1 wherein the pusher bar has a front surface oriented to push the particulates and a back surface in opposing orientation to the front surface, the conveyor entering the vessel behind the pusher bar back surface.
  • 4. The apparatus of claim 1 wherein the vessel comprises an opening configured to be beneath an upper surface of a retained liquid, and wherein the conveyor enters the vessel through said opening.
  • 5. The apparatus of claim 4 wherein the vessel comprises a bottom and wherein the opening is formed through the bottom of the vessel.
  • 6. The apparatus of claim 1 further comprising one or more substrates fastened to the front surface of the conveyor.
  • 7. The apparatus of claim 1 further comprising one or more substrates fastened to the back surface of the conveyor.
  • 8. The apparatus of claim 1 further comprising one or more substrates fastened to the conveyor with an adhesive.
  • 9. The apparatus of claim 1 further comprising one or more substrates fastened to the conveyor with an adhesive tape.
  • 10. The apparatus of claim 1 further comprising one or more substrates fastened to the conveyor with one or more clips.
  • 11. The apparatus of claim 1 wherein the conveyor comprises openings extending therethrough, and further comprising one or more substrates fastened to the conveyor with surfaces of the substrates exposed through the openings.
  • 12. A layer forming apparatus, comprising:a vessel configured to retain a liquid; a pusher bar joined to the vessel and configured to compress particulates on an upper surface of the liquid; a conveyor which enters and exits the vessel, the conveyor being configured to removably retain substrates and to transport such substrates through the vessel, the conveyor having a front surface that faces the pusher bar and a back surface in opposing orientation relative to the front surface, the conveyor comprising openings extending therethrough; one or more substrates fastened to the conveyor with surfaces of the substrates exposed through the openings; and the vessel, conveyor and pusher bar being configured to form a layer of the particulates on substrates as the substrates are transported through the vessel by the conveyor.
  • 13. A layer forming apparatus, comprising:a vessel configured to retain a liquid, the vessel having an opening configured to be beneath an upper surface of a retained liquid; a pusher bar joined to the vessel and configured to compress particulates on an upper surface of the liquid; a conveyor which enters and exits the vessel, wherein the conveyor enters the vessel through the opening, the conveyor being configured to removably retain substrates and to transport such substrates through the vessel, the conveyor having a front surface that faces the pusher bar and a back surface in opposing orientation relative to the front surface; and the vessel, conveyor and pusher bar being configured to form a layer of the particulates on substrates as the substrates are transported through the vessel by the conveyor.
  • 14. The apparatus of claim 13 wherein the vessel comprises a bottom and wherein the opening is formed through the bottom of the vessel.
RELATED PATENT DATA

This patent resulted from a divisional application of U.S. patent application Ser. No. 09/146,731, now U.S. Pat. No. 6,068,878 which was filed on Sep. 3, 1998.

PATENT RIGHTS STATEMENT

This invention was made with government support under Contract No. DABT63-97-C-0001 awarded by Advanced Research Projects Agency (ARPA). The government has certain rights in this invention.

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Entry
Product Information Brochure: “For tomorrow's world . . . KSV—Langmuir Instrument Specialists, KSV 5000”, KSV Instruments LTD., 7 pages.