The present disclosure generally relates to apparatuses, systems, and methods for grinding wheels, and more specifically, to grinding wheels with aligned abrasive grains.
Traditional grinding is often used for precision finishing. Grinding operations typically have lower material removal rates than turning (e.g., lathe operations) and/or milling processes. Abrasive grinding wheels typically include abrasive particles that are added to a retention medium in a random fashion. In this regard, the abrasive particles are not oriented with respect to one another and/or the direction of rotation of the grinding wheel.
A method may comprise depositing a plurality of abrasive grains on a film, aligning the abrasive grains on the film, depositing a bond on the film (wherein the bond is configured to fill the void between the each of the plurality of abrasive grains) and curing the bond.
A grinding wheel is provided. The grinding wheel may be made from a process comprising: distributing a plurality of abrasive grains on a film; aligning the abrasive grains on the film with at least one of a magnetic field and an electrical current; wrapping the film into a about a hub; and firing the wrapped film to form the grinding wheel.
A grinding wheel is provided. The grinding wheel may comprise a plurality of layers. Each of the plurality of layers may comprise a film. Each of the plurality of layers may be bonded together by a firing process. The film may comprise a plurality of abrasive grains, each of the plurality of grains positioned in a cutting orientation in response to application of a magnetic field prior to the firing process.
The forgoing features and elements may be combined in various combinations without exclusivity, unless expressly indicated herein otherwise. These features and elements as well as the operation of the disclosed embodiments will become more apparent in light of the following description and accompanying drawings.
The subject matter of the present disclosure is particularly pointed out and distinctly claimed in the concluding portion of the specification. A more complete understanding of the present disclosure, however, may best be obtained by referring to the detailed description and claims when considered in connection with the drawing figures, wherein like numerals denote like elements.
The detailed description of exemplary embodiments herein makes reference to the accompanying drawings, which show exemplary embodiments by way of illustration. While these exemplary embodiments are described in sufficient detail to enable those skilled in the art to practice the inventions, it should be understood that other embodiments may be realized and that logical, chemical and mechanical changes may be made without departing from the spirit and scope of the inventions. Thus, the detailed description herein is presented for purposes of illustration only and not of limitation. For example, the steps recited in any of the method or process descriptions may be executed in any order and are not necessarily limited to the order presented. Furthermore, any reference to singular includes plural embodiments, and any reference to more than one component or step may include a singular embodiment or step. Also, any reference to attached, fixed, connected or the like may include permanent, removable, temporary, partial, full and/or any other possible attachment option. Additionally, any reference to without contact (or similar phrases) may also include reduced contact or minimal contact.
In various embodiments, multi-layer grinding wheels may have improved abrasive and/or material removal rates, where the grinding wheels comprise precision-shaped abrasive grains. These abrasive grains may be alignable during the manufacturing process. In this regard, the abrasive grains may be aligned such that they have material removal rates that are similar to milling and/or turning (e.g., lathe) processes. The abrasive grains may comprise particular cutting surfaces and/or particular shapes that improve material removal rates.
In various embodiments, and with reference to
In various embodiments, and with reference to
In various embodiments, the aligning may orient the plurality of abrasive grains 210 in a known and/or designed fashion. For example, the aligning may orient the plurality of abrasive grains 210 into a cutting orientation. Each of the cutting portions of the plurality of abrasive grains 210 may be aligned and/or oriented in a similar fashion. Moreover, the aligning may be accomplished by creating a conductive pattern in film 222. In this regard, the conductive pattern may be designed and applied to film 222 to organize and/or position abrasive grains 210 in a desired configuration. The cutting portions may be aligned based on the rotation of a grinding wheel, the type of grinding wheel being manufactured, the type of grinding and/or processing being done, and/or the like.
In various embodiments, abrasive grains 210 may be placed and/or positioned in film 222 by any suitable method. For example, abrasive grains 210 may be individually positioned on film 222. Abrasive grains 210 may also be dropped and/or propelled at high velocity (e.g., sprayed) to be positioned on film 222.
In various embodiments, a bond 224 may be deposited on film 222 (Step 430). An assembly 200 may be formed in response to the depositing of the bond 224. Assembly 200 may include film 222, the plurality of abrasive grains 210 and bond 224. Bond 224 may include filler 226. Bond 224 may coat and/or fill voids between each of the plurality of abrasive grains 210 on a first surface of film 222. In various embodiments, the plurality of abrasive grains 210 may be aligned in bond 224. In response to abrasive grains 210 and bond 224 being disposed on film 222 and the plurality of abrasive grains 210 being aligned, assembly 200 may be cured (Step 440).
In various embodiments, assembly 200 and/or film 222 may be wrapped (Step 450). For example, film 222 of assembly 200 may be rolled around a hub, rod or other suitable device for forming an axis of a grinding wheel. Wrapped film 222 may have any suitable shape including, for example, a cylindrical shape, a conical shape, and/or the like. Wrapped film 222 may be sized, shaped, cut and/or the like (Step 455).
In various embodiments and with reference to
In various embodiments, film 222 may be porous. The porous nature of film 222 may allow contact between a first layer of film 222 and a second layer of film 222. Moreover, film 222 may comprise and/or include a surface texture and/or bonding structure. The surface texture and/or bonding structure may promote bonding between a first layer of film 222 and a second layer of film 222, during the wrapping and/or firing processes.
In various embodiments and with reference to
In various embodiments, the systems and methods described herein may provide for increased tool life, improved surface finishing quality, improved machine part quality and/or reduced cost. In various embodiments, the systems and methods described herein may enable process changes from traditional turning and/or machining to grinding.
Benefits, other advantages, and solutions to problems have been described herein with regard to specific embodiments. Furthermore, the connecting lines shown in the various figures contained herein are intended to represent exemplary functional relationships and/or physical couplings between the various elements. It should be noted that many alternative or additional functional relationships or physical connections may be present in a practical system. However, the benefits, advantages, solutions to problems, and any elements that may cause any benefit, advantage, or solution to occur or become more pronounced are not to be construed as critical, required, or essential features or elements of the inventions. The scope of the inventions is accordingly to be limited by nothing other than the appended claims, in which reference to an element in the singular is not intended to mean “one and only one” unless explicitly so stated, but rather “one or more.” Moreover, where a phrase similar to “at least one of A, B, or C” is used in the claims, it is intended that the phrase be interpreted to mean that A alone may be present in an embodiment, B alone may be present in an embodiment, C alone may be present in an embodiment, or that any combination of the elements A, B and C may be present in a single embodiment; for example, A and B, A and C, B and C, or A and B and C.
Systems, methods and apparatus are provided herein. In the detailed description herein, references to “one embodiment”, “an embodiment”, “various embodiments”, etc., indicate that the embodiment described may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases are not necessarily referring to the same embodiment. Further, when a particular feature, structure, or characteristic is described in connection with an embodiment, it is submitted that it is within the knowledge of one skilled in the art to affect such feature, structure, or characteristic in connection with other embodiments whether or not explicitly described. After reading the description, it will be apparent to one skilled in the relevant art(s) how to implement the disclosure in alternative embodiments.
Furthermore, no element, component, or method step in the present disclosure is intended to be dedicated to the public regardless of whether the element, component, or method step is explicitly recited in the claims. No claim element herein is to be construed under the provisions of 35 U.S.C. 112(f), unless the element is expressly recited using the phrase “means for.” As used herein, the terms “comprises”, “comprising”, or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
This application is a continuation of, claims priority to and the benefit of, PCT/US2015/011178 filed on Jan. 13, 2015 and entitled “APPARATUSES, SYSTEMS AND METHODS FOR ALIGNED ABRASIVE GRAINS,” which claims priority from U.S. Provisional Application No. 61/930,222 filed on Jan. 22, 2014 and entitled “APPARATUSES, SYSTEMS AND METHODS FOR ALIGNED ABRASIVE GRAINS.” Both of the aforementioned applications are incorporated herein by reference in their entirety.
Number | Date | Country | |
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61930222 | Jan 2014 | US |
Number | Date | Country | |
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Parent | PCT/US2015/011178 | Jan 2015 | US |
Child | 15096672 | US |